In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.

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