Recently, advanced material used as a bio-ceramic is developed. These materials have one of the important features that characteristics of biocompatibility are improved considerably. However, these advanced materials include some problems that the strength of bio-ceramics decreases in accordance with improvement of biocompatibility. In this paper, it is the main purpose to accurate the acoustic emission characteristics of bio-ceramics on the breaking test, which has never been discussed enough. Therefore, AE parameters are calculated with the wave form of AE signal emitted on the breaking test. Next, the relation between AE parameters and material property of bio-ceramics are discussed in order to accurate the effectiveness of micro-structure elements to mechanical characteristics. As a result, it is found that AE parameters have remarkable dependence on micro-structure element in the body of bio-ceramics. Consequently, it is clarified that the acoustic emission method gives good agreement with the mechanical characteristics.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Analysis on Acoustic Emission Produced by Strength Test of Bio-Ceramics: Dependency of AE Parameters on the Material Property
Mitusyuki Nakayama,
Mitusyuki Nakayama
Oyama National College of Technology, Oyama, Japan
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Hideto Suzuki
Hideto Suzuki
Ibaraki University, Hitachi, Japan
Search for other works by this author on:
Mitusyuki Nakayama
Oyama National College of Technology, Oyama, Japan
Hideto Suzuki
Ibaraki University, Hitachi, Japan
Paper No:
IPACK2003-35012, pp. 687-691; 5 pages
Published Online:
January 5, 2009
Citation
Nakayama, M, & Suzuki, H. "Analysis on Acoustic Emission Produced by Strength Test of Bio-Ceramics: Dependency of AE Parameters on the Material Property." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 687-691. ASME. https://doi.org/10.1115/IPACK2003-35012
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