The disturbed state concept (DSC) presented herein represents a unified and powerful approach for constitutive modeling of materials and interfaces in electronic packaging. Together with the computer finite element procedure it provides an analysis tool for calculation of stresses, strains, disturbance and cycles to failure. The accelerated procedure allows economical approximation of cycles to failure and distribution of disturbance at different cycles for design and reliability.
Volume Subject Area:
Modeling and Characterization
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