This paper presents a new methodology for the mechanical characterisation of solders used in integrated circuit (IC) packages. The methodology is formulated on the basis of package-level solder joints (BGA packages) to properly account for the effects of microstructure and intermetallic compound distribution. The methodology is implemented on the lead-free Sn-3.5Ag solder. In the indentation tests, the lead-free solder is found to be sensitive to the applied strain rates as well as the thermal cycling conditions. Finite element analyses, together with the experimental results are used to extract the elastic modulus and the elastic-plastic constitutive relations. The methodology has shown that the extracted properties are in good agreement with other publications.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
New Methodology for Mechanical Characterisation of Solders for IC Packaging Available to Purchase
Siew Lok Toh,
Siew Lok Toh
National University of Singapore, Singapore
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Fook Siong Chau,
Fook Siong Chau
National University of Singapore, Singapore
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Beng Kuan Lim,
Beng Kuan Lim
National University of Singapore, Singapore
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Ee Hua Wong
Ee Hua Wong
Institute of Microelectronics, Singapore
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Siew Lok Toh
National University of Singapore, Singapore
Fook Siong Chau
National University of Singapore, Singapore
Beng Kuan Lim
National University of Singapore, Singapore
Ee Hua Wong
Institute of Microelectronics, Singapore
Paper No:
IPACK2003-35328, pp. 551-558; 8 pages
Published Online:
January 5, 2009
Citation
Toh, SL, Chau, FS, Lim, BK, & Wong, EH. "New Methodology for Mechanical Characterisation of Solders for IC Packaging." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 551-558. ASME. https://doi.org/10.1115/IPACK2003-35328
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