Thermoelectric cooling modules (TECs) are widely used within electronic equipment for both temperature reduction and control of individual components. The techniques presented in this paper demonstrate that it is possible to construct a simple three-zone model, that represents the transient and 3D properties of a typical TEC, and can be easily built within existing CFD software packages for a known electric current or voltage input. A comparison of compact model results, detailed model results, and experimental results is presented for a typical electronics cooling setup, including a heat source (from which heat is absorbed by the TEC), TEC device, and air-cooled heat sink. Variables examined include heat source power dissipation, TEC current, and heat sink airflow. Finally, the response of the setup to a step function in current is examined to investigate the transient performance of the compact model.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Three-Dimensional Simulation of Thermoelectric Devices With Compact Numerical Models Available to Purchase
Eric Prather,
Eric Prather
Applied Thermal Technologies LLC, Santa Clara, CA
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Bhalchandra Puranik
Bhalchandra Puranik
Applied Thermal Technologies LLC, Santa Clara, CA
Search for other works by this author on:
Eric Prather
Applied Thermal Technologies LLC, Santa Clara, CA
Bhalchandra Puranik
Applied Thermal Technologies LLC, Santa Clara, CA
Paper No:
IPACK2003-35110, pp. 335-342; 8 pages
Published Online:
January 5, 2009
Citation
Prather, E, & Puranik, B. "Three-Dimensional Simulation of Thermoelectric Devices With Compact Numerical Models." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 335-342. ASME. https://doi.org/10.1115/IPACK2003-35110
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