Three-Dimensional Simulation of Thermoelectric Devices With Compact Numerical Models

Thermoelectric cooling modules (TECs) are widely used within electronic equipment for both temperature reduction and control of individual components. The techniques presented in this paper demonstrate that it is possible to construct a simple three-zone model, that represents the transient and 3D properties of a typical TEC, and can be easily built within existing CFD software packages for a known electric current or voltage input. A comparison of compact model results, detailed model results, and experimental results is presented for a typical electronics cooling setup, including a heat source (from which heat is absorbed by the TEC), TEC device, and air-cooled heat sink. Variables examined include heat source power dissipation, TEC current, and heat sink airflow. Finally, the response of the setup to a step function in current is examined to investigate the transient performance of the compact model.