This paper deals with the application of dynamic compact thermal models of packages. First an algorithm and a methodology is presented, that was developed for the inclusion of compact electrical RC thermal models of packages into field solvers, to enable fast board level simulation with compact models of packages. Application examples demonstrate the advantages of the method. In the second part of the paper a method is presented for the generation of nonlinear compact models. Simulation experiments comparing linear and nonlinear compact models show that for small temperature excursions the use of linear models is acceptable, but in case of larger than 80°C temperature increases the use of linear models results in an about 20–30% regular error for the usual package structures.

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