An integrated arrayed waveguide grating multi/demultiplexer (AWG) with a micro-electro-mechanical systems (MEMS) based variable optical attenuator (VOA) is reported. The device consists of an AWG based on silica and a MEMS-VOA chip. The MEMS chip includes 100 μm × 100 μm polysilicon shutter plates coated with gold and electrostatic comb-drive actuators. The MEMS chip is interposed in a trench located in the middle of the I/O waveguides of the AWG to tune the optical transmitting power intensity through the waveguides continuously. The MEMS-VOA shutters have more than a 10 μm displacement. Using those shutters, 30 dB optical contrast from 5 dB at the transmit state to 35 dB at the isolation state is achieved. The obtained attenuation contrast is greater than that of a conventional waveguide-based Mach-Zehnder interferometer VOA and sufficient to adjust and equalize the optical signal power in the wavelength division multiplexing (WDM) network systems.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
8CH AWG Multi/Demultiplexer With MEMS Variable Optical Attenuator
K. Ishikawa,
K. Ishikawa
Yokohama National University, Yokohama, Japan
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Q. Yu
Q. Yu
Yokohama National University, Yokohama, Japan
Search for other works by this author on:
K. Ishikawa
Yokohama National University, Yokohama, Japan
Q. Yu
Yokohama National University, Yokohama, Japan
Paper No:
IPACK2003-35145, pp. 239-244; 6 pages
Published Online:
January 5, 2009
Citation
Ishikawa, K, & Yu, Q. "8CH AWG Multi/Demultiplexer With MEMS Variable Optical Attenuator." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 239-244. ASME. https://doi.org/10.1115/IPACK2003-35145
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