We fabricate metal thin film thermocouples (TFTCs). Au-Pt, Cu-Ni, and W-Ni are deposited on a glass plate using standard thin film processes. The dimension of thermocouple junction is 300μm × 300μm. The thermoelectric powers of TFTCs are different from those of bulk because diffusion of electrons is restricted by the very thin film. The film thickness of TFTCs is of the same order as the mean free path of electrons. However TFTCs are still useful for temperature measurements because the thermoelectric voltage is proportional to measured temperature at thermocouple junction. The response time of Au-Pt TFTCs is about 30ns when the surface of the glass is heated by a YAG pulsed laser. The result compares favorably with measurements by a thermoreflectance method. We also describe W-Ni nano-TFTCs fabricated by Focused Ion Beam for the measurement of temperature distribution in a sub-micron area. In order to reduce the size of the TFTCs we employ a 3-dimensional structure.
Skip Nav Destination
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Temperature Measurement by Using Metal Thin Film Thermocouples
Koji Miyazaki,
Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Japan
Search for other works by this author on:
Hiroshi Tsukamoto,
Hiroshi Tsukamoto
Kyushu Institute of Technology, Kitakyushu, Japan
Search for other works by this author on:
Takahiro Miike,
Takahiro Miike
Nikon Corporation, Yokohama, Japan
Search for other works by this author on:
Toshiaki Takamiya
Toshiaki Takamiya
Kyushu Institute of Technology, Kitakyushu, Japan
Search for other works by this author on:
Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Japan
Hiroshi Tsukamoto
Kyushu Institute of Technology, Kitakyushu, Japan
Takahiro Miike
Nikon Corporation, Yokohama, Japan
Toshiaki Takamiya
Kyushu Institute of Technology, Kitakyushu, Japan
Paper No:
IPACK2003-35042, pp. 219-223; 5 pages
Published Online:
January 5, 2009
Citation
Miyazaki, K, Tsukamoto, H, Miike, T, & Takamiya, T. "Temperature Measurement by Using Metal Thin Film Thermocouples." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 219-223. ASME. https://doi.org/10.1115/IPACK2003-35042
Download citation file:
10
Views
Related Proceedings Papers
Related Articles
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
J. Heat Transfer (April,2002)
A Fractional-Diffusion Theory for Calculating Thermal Properties of Thin Films From Surface Transient Thermoreflectance Measurements
J. Heat Transfer (December,2001)
Criteria for Cross-Plane Dominated Thermal Transport in Multilayer Thin Film Systems During Modulated Laser Heating
J. Heat Transfer (August,2010)
Related Chapters
Thermotriples
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Insulating Properties of W-Doped Ga2O3 Films Grown on Si Substrate for Low-K Applications
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Glass Laser Materials Testing at Naval Research Laboratory
Damage in Laser Glass