Holographic interferometry is an accurate and important technolngy. Through the application of recording and reconstructing light waves, one can solve a wide variety of mechanical or engineering problems caused by internal stresses, mechanical, electrical or thermal effects. The mechanical properties of composite materials, such as, deflection, strain and stress will be determined by the fiber types, the cross-section of specimens ans the fiber orientation of composite laminate. The purpose of this investigation will discuss the holographic technique and its application of measurement of transverse deflection for various composite laminates. The analysis for both theoretical and experimental results will be presented, and the effect of fiber orientation for composite laminate will be studied in this paper.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Measurement of Transverse Deflection for Composite Laminates Using Holographic Interferometry
Jin-Chein Lin,
Jin-Chein Lin
Kuang Wu Institute of Technology, Taipei, Taiwan
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T. Y. Yang,
T. Y. Yang
Kuang Wu Institute of Technology, Taipei, Taiwan
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L. C. Chang
L. C. Chang
Kuang Wu Institute of Technology, Taipei, Taiwan
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Jin-Chein Lin
Kuang Wu Institute of Technology, Taipei, Taiwan
T. Y. Yang
Kuang Wu Institute of Technology, Taipei, Taiwan
L. C. Chang
Kuang Wu Institute of Technology, Taipei, Taiwan
Paper No:
IPACK2003-35261, pp. 191-195; 5 pages
Published Online:
January 5, 2009
Citation
Lin, J, Yang, TY, & Chang, LC. "Measurement of Transverse Deflection for Composite Laminates Using Holographic Interferometry." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 191-195. ASME. https://doi.org/10.1115/IPACK2003-35261
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