Reflow parameters during assembly are ramp rate, soak time, soak temperature, peak temperature, time above liquidus, and cooling rate. These reflow parameters constructs the temperature profile of reflow process and determine the quality of interconnects in the electronics products. To investigate the effect of reflow parameters on solder interconnect wetting, the wetting rate of a single liquid solder sphere on a metal substrate with variation of reflow parameters were experimentally measured and the constitutive model for the dynamics of solder wetting was suggested.
- Electronic and Photonic Packaging Division
Effect of Reflow Parameters on Solder Wetting
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Kang, SC, & Baldwin, DF. "Effect of Reflow Parameters on Solder Wetting." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 177-182. ASME. https://doi.org/10.1115/IPACK2003-35193
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