To select a lead-free solder system, factors such as eutectic/peritectic point, electron negativity, abundance, cost, toxicity of elements, world production capacity, segregation during solidification, possibility to form low melting phases with Pb, among others must be carefully considered. On the basis of thorough analysis of binary phase diagrams of Sn-X-systems (X represents other elements) and the properties of the element X, the Sn-Co-Cu eutectic ternary alloy system has been chosen as a new lead-free solder candidate. In order to find the eutectic point for the Sn-Co-Cu system, the Sn-Co binary system was thoroughly assessed with CALPHAD (CALculation of PHAse Diagram) methods. The ternary phase diagram of Sn-Co-Cu system was extrapolated with the assessed thermodynamic parameters of Sn-Co, Sn-Cu, and Co-Cu system. The eutectic point for L–Sn2Co+(Sn)+Cu6Sn5 is 224.4°C and 0.37%Co and 0.68%Cu and 98.95%Sn.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy Available to Purchase
Libin Liu,
Libin Liu
Chalmers University of Technology, Mo¨lndal, Sweden
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Cristina Andersson,
Cristina Andersson
Chalmers University of Technology, Mo¨lndal, Sweden
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Johan Liu,
Johan Liu
Chalmers University of Technology, Mo¨lndal, Sweden
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Y. C. Chan
Y. C. Chan
City University of Hong Kong, Hong Kong
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Libin Liu
Chalmers University of Technology, Mo¨lndal, Sweden
Cristina Andersson
Chalmers University of Technology, Mo¨lndal, Sweden
Johan Liu
Chalmers University of Technology, Mo¨lndal, Sweden
Y. C. Chan
City University of Hong Kong, Hong Kong
Paper No:
IPACK2003-35126, pp. 141-145; 5 pages
Published Online:
January 5, 2009
Citation
Liu, L, Andersson, C, Liu, J, & Chan, YC. "Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 141-145. ASME. https://doi.org/10.1115/IPACK2003-35126
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