Multilayer packages are extensively used and designed in high-speed and wireless applications. An approach to achieve the controlled S-parameters with 15% less degradation than the original multilayer package design at 5 GHz was presented. The substrate dimension budget was determined to meet the manufacturing capability using 3-D full wave simulator. Controlling the return loss is the domination of the overall controlled S-parameters.

This content is only available via PDF.
You do not currently have access to this content.