This paper concentrates on the characterization of a novel curable fillet forming ball attach flux. This polymer based material is expected to improve 2nd level interconnet solder joint reliability on ball grid array packages. The evaluations reported in this paper consist of the characterization of their physical and thermal properties. With the understanding of the materials physical properties, the failing mechanism, and material robustness can be predicted.

Volume Subject Area:
Materials, Processes, and Technologies
Topics:
Ball-Grid-Array packages, Hardening (Curing), Reliability, Solder joints, Polymers, Robustness, Thermal properties
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Copyright © 2003
 by ASME
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