Because of its rapid pace of developments and interdisciplinary nature the microelectronic packaging technology poses enormous challenges to educators and learners alike. The education in campus is only a starting point of long learning process that spans the entire professional career of engineers. For post-college education, we need some channels that facilitate continuous exchanges between industry engineers and academia. The present paper describes such channels that have been incorporated in the projects sponsored by the Japan Society of Mechanical Engineers and the Japanese government.

This content is only available via PDF.
You do not currently have access to this content.