Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: Cooling , Thermofluids , Heat , Internet of things , Artificial intelligence , Blockchain technology , Carbon footprint , Coolants , Cooling systems , Data centers

Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

Bolape Alade, Deogratius Kisitu, May Battleson, Denver Schaffarzick, Alfonso Ortega

InterPACK 2024; V001T02A003https://doi.org/10.1115/IPACK2024-140105

Abstract

View Articletitled, Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

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Topics: Copper , Forced convection , Water , Compression , Flow (Dynamics) , Metal foams , Cooling , Heat , Computer cooling , Coolants

Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling

Yousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez

InterPACK 2024; V001T02A004https://doi.org/10.1115/IPACK2024-140277

Abstract

View Articletitled, Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling

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Topics: Cooling , Data centers , Flow (Dynamics) , Microchannels , Plates (structures)

Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack

Ali Heydari, Deogratius Kisitu, Alfonso Ortega, Bahareh Eslami, Pardeep Shahi, Mohammad Tradat, James Costello, Benjamin Margaritondo

InterPACK 2024; V001T02A005https://doi.org/10.1115/IPACK2024-140672

Abstract

View Articletitled, Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack

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Topics: Cooling , Data centers , Density , Plates (structures)

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright

InterPACK 2024; V001T02A006https://doi.org/10.1115/IPACK2024-141022

Abstract

View Articletitled, Passive Direct Liquid Cooling for High-Power Processors

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Topics: Cooling , Refrigerants , Cooling systems , Design , Computer cooling , Condensation , Density , Electronic equipment , Electronics , Energy dissipation

Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management

Faramarz Kahbandeh, Daniel Harris, Mehmet Arik

InterPACK 2024; V001T02A007https://doi.org/10.1115/IPACK2024-141130

Abstract

View Articletitled, Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management

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Topics: Electronics , Heat transfer , Numerical analysis , Thermal management

Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment

Russell Tipton, Ashley Wise, Srdan Mutabdzija, Craig Shores, Devdatta Kulkarni

InterPACK 2024; V001T02A008https://doi.org/10.1115/IPACK2024-141206

Abstract

View Articletitled, Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment

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Topics: Cooling , Refrigerants

Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs

Akshith Narayanan, Qingyang Wang, Serdar Ozguc, Richard W. Bonner, III

InterPACK 2024; V001T02A009https://doi.org/10.1115/IPACK2024-141261

Abstract

View Articletitled, Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs

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Topics: Cooling , Graphics processing units , Vehicles

Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology

Ali Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia

InterPACK 2024; V001T02A010https://doi.org/10.1115/IPACK2024-141342

Abstract

View Articletitled, Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology

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Topics: Cooling , Data centers , Density , Heat , Refrigerants , Thermal management

Bio-Analysis of Cross-Mixed Coolants in High Powered Liquid Cooled Data Center

Pardeep Shahi, Ali Heydari, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Anto Barigala, Sean Sivapalan, Harold Miyamura, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez

InterPACK 2024; V001T02A011https://doi.org/10.1115/IPACK2024-141343

Abstract

View Articletitled, Bio-Analysis of Cross-Mixed Coolants in High Powered Liquid Cooled Data Center

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Topics: Contamination , Coolants , Data centers

Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center

Pardeep Shahi, Ali Heydari, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Anto Barigala, Bahareh Eslami, Uschas Chowdhury, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez

InterPACK 2024; V001T02A012https://doi.org/10.1115/IPACK2024-141349

Abstract

View Articletitled, Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center

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Topics: Coolants , Data centers , Heat exchangers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman

InterPACK 2024; V001T02A013https://doi.org/10.1115/IPACK2024-141367

Abstract

View Articletitled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

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Topics: Cooling , Heat flux , Heat , Data centers , Design , Flux (Metallurgy) , Climate change , Construction , Design methodology , Energy consumption

Thermal Performance of Low GWP Dielectric Fluid for Two-Phase Immersion Cooling

Anil Yuksel, Gustavo Pottker, Abigail Van Wassen, Drew Brandt

InterPACK 2024; V001T02A014https://doi.org/10.1115/IPACK2024-141608

Abstract

View Articletitled, Thermal Performance of Low GWP Dielectric Fluid for Two-Phase Immersion Cooling

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Topics: Cooling , Fluids

Numerical Study of Two-Phase Immersion Cooling Limits for Bare Die Packages With Novec 649

Tanya Liu, Sadegh Khalili, Jorge Padilla, Madhusudan Iyengar

InterPACK 2024; V001T02A015https://doi.org/10.1115/IPACK2024-141718

Abstract

View Articletitled, Numerical Study of Two-Phase Immersion Cooling Limits for Bare Die Packages With Novec 649

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Topics: Cooling

Numerical Study of Single-Phase Immersion Cooling Limits for Bare Die Packages

Sadegh Khalili, Tanya Liu, Jorge Padilla, Madhusudan Iyengar

InterPACK 2024; V001T02A016https://doi.org/10.1115/IPACK2024-141750

Abstract

View Articletitled, Numerical Study of Single-Phase Immersion Cooling Limits for Bare Die Packages

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Topics: Cooling , Forced convection

Electronics Packaging

Topology Optimization of Electronic Line Using Computer Aided Engineering Software

Kotaro Miura, Hiromu Kudo, Kazuhiko Sasagawa, Kazuhiro Fujisaki

InterPACK 2024; V001T03A001https://doi.org/10.1115/IPACK2024-139338

Abstract

View Articletitled, Topology Optimization of Electronic Line Using Computer Aided Engineering Software

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Topics: Computer software , Computer-aided engineering , Steady state , Topology optimization

Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses

Mujahid Abbas Syed, Qiang Yu

InterPACK 2024; V001T03A002https://doi.org/10.1115/IPACK2024-139572

Abstract

View Articletitled, Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses

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Topics: Geometry , Printed circuit boards , Reliability , Stress , Thermomechanics

Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs

Natsumi Kimura, Takashi Fukue, Haruki Yoshihiro, Koichi Hirasawa

InterPACK 2024; V001T03A003https://doi.org/10.1115/IPACK2024-139742

Abstract

View Articletitled, Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs

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Topics: Anisotropy , Heat conduction , Jigs and fixtures , Steady state , Thermal conductivity

High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

Kaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2024; V001T03A004https://doi.org/10.1115/IPACK2024-140287

Abstract

View Articletitled, High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

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Topics: Composite materials , Copper , Gallium , Liquid metals , Nanowires , Polydimethylsiloxane , Thermal characterization , Thermal resistance , ASTM International , Contact resistance

Basic Study on Transient Flow Control Technique in Narrow Flow Passage With Flow Separation Region for Maximization of Cooling Performance of Heating Elements

Daiki Kobayashi, Takashi Fukue, Shin Wakitani

InterPACK 2024; V001T03A005https://doi.org/10.1115/IPACK2024-140314

Abstract

View Articletitled, Basic Study on Transient Flow Control Technique in Narrow Flow Passage With Flow Separation Region for Maximization of Cooling Performance of Heating Elements

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Topics: Cooling , Flow (Dynamics) , Flow separation , Forced convection , Heating , Pulsatile flow , Unsteady flow

Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application

Heungdong Kwon, Daeyoung Kong, Hyoungsoon Lee, James Palko, Ercan M. Dede, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2024; V001T03A006https://doi.org/10.1115/IPACK2024-140613

Abstract

View Articletitled, Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application

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Topics: Boiling , Computer cooling , Flow (Dynamics) , Heat , Manifolds , Microchannels , Microcoolers , Silicon

The Key Factors for Impedance Control in Embedded Trace Substrates

Ming-Han Zhuang, Ho-Chuan Lin, Chih-Yuan Shih, Andrew Kang, Yu-Po Wang

InterPACK 2024; V001T03A007https://doi.org/10.1115/IPACK2024-140700

Abstract

View Articletitled, The Key Factors for Impedance Control in Embedded Trace Substrates

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Topics: Disks , Signals

Capillary-Based Two-Phase Cooling for High Power Density Power Electronics

Yujui Lin, Heungdong Kwon, Yini He, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson

InterPACK 2024; V001T03A008https://doi.org/10.1115/IPACK2024-140766

Abstract

View Articletitled, Capillary-Based Two-Phase Cooling for High Power Density Power Electronics

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Topics: Cooling , Electronics , Power density , Thermal management

Fabrication and Passive Assembly of Compact, Broadband Substrate-To-Die Evanescent Couplers for Sustainable Pbps Co-Packaged Optics

Drew M. Weninger, Samuel Serna, Luigi Ranno, Lionel Kimerling, Anuradha Agarwal

InterPACK 2024; V001T03A009https://doi.org/10.1115/IPACK2024-140798

Abstract

View Articletitled, Fabrication and Passive Assembly of Compact, Broadband Substrate-To-Die Evanescent Couplers for Sustainable Pbps Co-Packaged Optics

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Topics: Manufacturing , Optics , Sustainability

Evaluation of Warpage Deformation in Semiconductor Device Packaging Process

Taiju Yagi, Qiang Yu, Haruyuki Shimada, Yuichi Yanaka, Takashi Masuko

InterPACK 2024; V001T03A010https://doi.org/10.1115/IPACK2024-140852

Abstract

View Articletitled, Evaluation of Warpage Deformation in Semiconductor Device Packaging Process

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Topics: Deformation , Finite element methods , Resins , Semiconductor device packaging , Semiconductors (Materials) , Warping , Packaging , Shrinkage (Materials) , Simulation , Anisotropy

Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration

Nozomi Shimamura, Qiang Yu

InterPACK 2024; V001T03A011https://doi.org/10.1115/IPACK2024-140880

Abstract

View Articletitled, Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration

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Topics: Fatigue life , Finite element methods , Random vibration

Comparing Wire Bonding Strategies for High Power Applications

Whit Vinson, Frida Torres, David Huitink

InterPACK 2024; V001T03A012https://doi.org/10.1115/IPACK2024-140965

Abstract

View Articletitled, Comparing Wire Bonding Strategies for High Power Applications

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Topics: Alloys , Aluminum , Current density , Electrical resistivity , Electrodiffusion , Failure , Heating , Intermetallic compounds , Joules , Nickel

Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity

Aniket Bharamgonda, Abhijit Dasgupta, Yaxiong Chen, Torsten Hauck

InterPACK 2024; V001T03A013https://doi.org/10.1115/IPACK2024-141036

Abstract

View Articletitled, Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity

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Topics: Anisotropy , Creep , Crystals , Modeling , Solder joints , Solders , Viscoplasticity

Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers

Daeyoung Kong, Heungdong Kwon, Haeun Lee, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2024; V001T03A014https://doi.org/10.1115/IPACK2024-141064

Abstract

View Articletitled, Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers

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Topics: Computational fluid dynamics , Manifolds , Microchannels , Microcoolers , Modeling , Optimization , Silicon

Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

Myunghoon Lee, Lindo Arimpoor Pallan Ouseph, Vamsi Krishna Yaddanapudi

InterPACK 2024; V001T03A015https://doi.org/10.1115/IPACK2024-141171

Abstract

View Articletitled, Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

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Topics: Computational fluid dynamics , Design , Evolutionary algorithms , Optimization , Workflow , Delays , Energy consumption , Intellectual property , Temperature , Thermal analysis

Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages

Ibaad Gandikota, Aniket Bharamgonda, Abhijit Dasgupta, Patrick McCluskey

InterPACK 2024; V001T03A016https://doi.org/10.1115/IPACK2024-141249

Abstract

View Articletitled, Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages

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Topics: Event history analysis , Fatigue , Gallium nitride , Solders , Failure , Creep , Delamination , Failure mechanisms , Fatigue life , Finite element analysis

Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures

Kaiying Jiang, Daeyoung Kong, Sreekant Narumanchi, James Palko, Ercan M. Dede, Chulmin Ahn, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2024; V001T03A017https://doi.org/10.1115/IPACK2024-141329

Abstract

View Articletitled, Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures

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Topics: Boiling , Copper , Corrosion , Erosion , Nickel

Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node

Shrinath Shrinivas Ramdas, Tushar Chauhan, Mark Patterson, Dwayne R. Shirley, Lijuan Zhang, Roberto Coccioli

InterPACK 2024; V001T03A018https://doi.org/10.1115/IPACK2024-141335

Abstract

View Articletitled, Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node

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Topics: Columns (Structural) , Copper , Delamination , Design , Finite element analysis , Fracture (Process) , Optimization , Risk , Silicon

Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging

Mahbub Alam Maruf, Golam Rakib Mazumder, Souvik Chakraborty, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2024; V001T03A019https://doi.org/10.1115/IPACK2024-141347

Abstract

View Articletitled, Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging

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Topics: Creep , High temperature , Lead-free solders , Mechanical properties , Nanoindentation , Scanning electron microscopy

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2024; V001T03A020https://doi.org/10.1115/IPACK2024-141356

Abstract

View Articletitled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

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Topics: Dimensions , Thermomechanics , Ball-Grid-Array packaging , Solder joints , Fatigue life , Finite element analysis , Solders , Boundary-value problems , Design , Energy consumption

Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder

Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2024; V001T03A021https://doi.org/10.1115/IPACK2024-141363

Abstract

View Articletitled, Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder

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Topics: Alloys , Creep , Elastic moduli , Lead-free solders , Nanoindentation , Stress

Additively Manufactured Cold Plate Integrated With Evaporator Wicks and Phase Separators for Thermal Management of Multiple High-Heat-Flux Heat Sources

Mohammad Reza Shaeri, Maksym Demydovych, Chien-Hua Chen

InterPACK 2024; V001T03A022https://doi.org/10.1115/IPACK2024-141775

Abstract

View Articletitled, Additively Manufactured Cold Plate Integrated With Evaporator Wicks and Phase Separators for Thermal Management of Multiple High-Heat-Flux Heat Sources

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Topics: Additive manufacturing , Cooling , Heat , Thermal management

Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

InterPACK 2024; V001T03A023https://doi.org/10.1115/IPACK2024-141845

Abstract

View Articletitled, Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

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Topics: Finite element analysis , High temperature , Lead-free solders , Reliability , Solders , Vibration

Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

InterPACK 2024; V001T03A024https://doi.org/10.1115/IPACK2024-141850

Abstract

View Articletitled, Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C

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Topics: Damage , Shock (Mechanics) , Solders , Temperature , Testing , Tin , Viscoplasticity

Evolution of Non-PFAS Underfill Properties Under High-Temperature Storage and Hygrothermal Exposure

Pradeep Lall, Madhu Kasturi, Leyton Janowsky, Edward Davis

InterPACK 2024; V001T03A025https://doi.org/10.1115/IPACK2024-141852

Abstract

View Articletitled, Evolution of Non-PFAS Underfill Properties Under High-Temperature Storage and Hygrothermal Exposure

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Topics: High temperature , Oxidation , Storage

Sequential High Temperature and Hygrothermal Exposure on the Evolution of Interfacial Fracture Toughness of TIM-Copper and EMC Interfaces

Pradeep Lall, Madhu Kasturi

InterPACK 2024; V001T03A026https://doi.org/10.1115/IPACK2024-141853

Abstract

View Articletitled, Sequential High Temperature and Hygrothermal Exposure on the Evolution of Interfacial Fracture Toughness of TIM-Copper and EMC Interfaces

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Topics: Copper , Fracture toughness , High temperature

Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives

Pradeep Lall, Sabina Bimali, Scott Miller

InterPACK 2024; V001T03A027https://doi.org/10.1115/IPACK2024-141856

Abstract

View Articletitled, Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives

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Topics: Additive manufacturing , Adhesives , Aerosols , Electronics , High temperature , Low temperature , Manufacturing , Printing

Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury

InterPACK 2024; V001T03A028https://doi.org/10.1115/IPACK2024-142108

Abstract

View Articletitled, Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity

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Topics: Delamination , Fracture (Materials) , Fracture toughness , High temperature , Stress

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury

InterPACK 2024; V001T03A029https://doi.org/10.1115/IPACK2024-142109

Abstract

View Articletitled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

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Topics: Delamination , Fracture toughness , High temperature , Reliability , Failure mechanisms , Semiconductors (Materials) , Automobiles , Ball-Grid-Array packaging , Durability , Electronics

State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation

Pradeep Lall, Ved Soni, Sabina Bimali

InterPACK 2024; V001T03A030https://doi.org/10.1115/IPACK2024-142117

Abstract

View Articletitled, State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation

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Topics: Batteries , Battery life , Knee , Lithium-ion batteries , Model development

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi

InterPACK 2024; V001T03A031https://doi.org/10.1115/IPACK2024-143308

Abstract

View Articletitled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

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Topics: Copper , Delamination , Diseases , Displacement , Electronics , Fracture (Materials) , High temperature , Liver , Reliability , Stress

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

InterPACK 2024; V001T03A032https://doi.org/10.1115/IPACK2024-143310

Abstract

View Articletitled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

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Topics: Damage , Delamination , Displacement , Failure , Fracture (Materials) , High temperature , Reliability , Stress

Warpage Prediction Improvements for Thin Package-on-Package Architectures

Nakul Kothari, Karthikeyan Dhandapani, Sangjae (Brandon) Lee, Manuel Aldrete, Nidheesh Puliyath

InterPACK 2024; V001T03A033https://doi.org/10.1115/IPACK2024-144090

Abstract

View Articletitled, Warpage Prediction Improvements for Thin Package-on-Package Architectures

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Topics: Architecture , Finite element analysis , Package on package , Warping

Enabling Reduced Footprint SMT Components in IC Packages: A Simulation-Based Approach for Solder Paste Volume Optimization

Nidheesh Puliyath, Huxiao Xie, Cecille Alcira, Nakul Kothari

InterPACK 2024; V001T03A034https://doi.org/10.1115/IPACK2024-149381

Abstract

View Articletitled, Enabling Reduced Footprint SMT Components in IC Packages: A Simulation-Based Approach for Solder Paste Volume Optimization

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Topics: Optimization , Simulation , Solders

Power/RF Electronics and Photonics

Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies

Husam Walwil, Daniel C. Shoemaker, Yiwen Song, Kyuhwe Kang, Nathaniel S. McIlwaine, Michael L. Schuette, James S. Tweedie, Scott T. Sheppard, Jon-Paul Maria, Sukwon Choi

InterPACK 2024; V001T04A001https://doi.org/10.1115/IPACK2024-140195

Abstract

View Articletitled, Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies

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Topics: Electrical conductance , Gallium nitride , High-electron-mobility transistors , Semiconductor wafers , Thermal conductivity , Thermoreflectance

Standardized Approach for Assessing Fiber Device Resiliency

Conor Galligan, Daniel Alves

InterPACK 2024; V001T04A002https://doi.org/10.1115/IPACK2024-141204

Abstract

View Articletitled, Standardized Approach for Assessing Fiber Device Resiliency

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Topics: Fibers , Resilience , Testing , Governments , Photonic equipment , Engineering prototypes , Failure , Lasers , Manufacturing , Photonics

Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity

Bidzina Kekelia, J. Emily Cousineau, Rajneesh Chaudhary, Jeff Tomerlin, Sreekant Narumanchi, Vandana Rallabandi, Jon Wilkins, Shajjad Chowdhury, Himel Barua, Mostak Mohammad, Burak Ozpineci

InterPACK 2024; V001T04A003https://doi.org/10.1115/IPACK2024-141631

Abstract

View Articletitled, Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity

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Topics: Cavities , Cooling , Electric motors , Electronics , Engines , Motors , Rotors , Thermal management , Traction

Multiscale Thermal Transport and Energy Storage

Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

Myriam Bouzidi, Junyoung Kim, Jonathan Goldman, Yogendra Joshi

InterPACK 2024; V001T05A001https://doi.org/10.1115/IPACK2024-140132

Abstract

View Articletitled, Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

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Topics: Batteries , Electric vehicles , Flexible structures , Thermal management , Temperature , Heat , Cooling , Energy dissipation , Battery life , Coolants

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

Mohammad Reza Najjari, Cam Turner, Kamal Mostafavi

InterPACK 2024; V001T05A002https://doi.org/10.1115/IPACK2024-140918

Abstract

View Articletitled, Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

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Topics: Boiling , Cooling , Two-phase flow , Refrigerants , Design , Health and safety , Innovation , Liabilities , Pressure drop

Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives

Joshua Kasitz, Muhammad Ghufran, David Huitink

InterPACK 2024; V001T05A003https://doi.org/10.1115/IPACK2024-141296

Abstract

View Articletitled, Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives

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Topics: Cooling , Phase change materials

Cooling Electronics by Direct Contact With Liquids

Amanie N. Abdelmessih, David F. Delgado, Ezry Lopez, Nathaniel P. Michael, Grant P. Napierala, Nicholas J. Ramos

InterPACK 2024; V001T05A004https://doi.org/10.1115/IPACK2024-141334

Abstract

View Articletitled, Cooling Electronics by Direct Contact With Liquids

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Topics: Computer cooling , Cooling , Electronics

Enhanced Pool Boiling Heat Transfer Using Re-Entrant Surfaces

Yimin Zhou, Solomon Adera

InterPACK 2024; V001T05A005https://doi.org/10.1115/IPACK2024-141425

Abstract

View Articletitled, Enhanced Pool Boiling Heat Transfer Using Re-Entrant Surfaces

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Topics: Heat transfer , Heat transfer coefficients , Nucleate boiling , Pool boiling , Thermal management

Flexible, Wearable, and Printed Electronics

Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman

InterPACK 2024; V001T06A001https://doi.org/10.1115/IPACK2024-140062

Abstract

View Articletitled, Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

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Topics: Temperature , Testing , Circuits , Failure , Failure mechanisms , Extruding , Polysulfone , Shock (Mechanics) , Silver , Accelerometers

Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current

Kazuki Hisasue, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Kotaro Miura, Yusuke Souma

InterPACK 2024; V001T06A002https://doi.org/10.1115/IPACK2024-141181

Abstract

View Articletitled, Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current

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Topics: Damage , Density , Electrodiffusion , Flexible electronics , Nanowires

Validation and Translation of Process Monitoring Tools for Commercial Aerosol Jet Printing Systems

Jeremy D. Rurup, Ethan B. Secor

InterPACK 2024; V001T06A003https://doi.org/10.1115/IPACK2024-141269

Abstract

View Articletitled, Validation and Translation of Process Monitoring Tools for Commercial Aerosol Jet Printing Systems

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Topics: Aerosols , Printing , Process monitoring

Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive

Pradeep Lall, Sabina Bimali, Scott Miller

InterPACK 2024; V001T06A004https://doi.org/10.1115/IPACK2024-141858

Abstract

View Articletitled, Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive

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Topics: Adhesives , Aerosols , Circuits , Printing , Reliability , Sustainability , Temperature , Water based printing inks

Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation

Pradeep Lall, Md Golam Sarwar, Scott Miller

InterPACK 2024; V001T06A005https://doi.org/10.1115/IPACK2024-141863

Abstract

View Articletitled, Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation

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Topics: Adhesives , Circuits , High temperature , Printing , Reliability , Signal processing

Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling

Pradeep Lall, Fatahi Musa, Scott Miller

InterPACK 2024; V001T06A006https://doi.org/10.1115/IPACK2024-141871

Abstract

View Articletitled, Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling

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Topics: Electronics , Flexible electronics , Low temperature , Manufacturing , Water based printing inks , Bonding , Electrical conductivity , Inks , Accelerated life testing , Additive manufacturing

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

Pradeep Lall, Fatahi Musa, Scott Miller

InterPACK 2024; V001T06A007https://doi.org/10.1115/IPACK2024-141874

Abstract

View Articletitled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

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Topics: Filters , Low-pass filters , Reliability , Automobiles , Durability , Electronics , Adhesives , Computer software , Cutting , Engineering simulation