Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: Cooling , Design , Graphics processing units , Energy consumption , Artificial intelligence , Cloud computing , Energy dissipation , Heat , Heat pipes , Heat sinks

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

InterPACK 2021; V001T02A005https://doi.org/10.1115/IPACK2021-72612

Abstract

View Articletitled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

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Topics: Cooling systems , Cooling , Heat , Heat flux , Computer cooling , Containment systems , Coolants , Copper , Density , Design

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

John Kim, Raffaele L. Amalfi

InterPACK 2021; V001T02A006https://doi.org/10.1115/IPACK2021-72618

Abstract

View Articletitled, Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

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Topics: Computer cooling , Heat transfer , Machine learning , Machinery , Refrigerants , Two-phase flow

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome

InterPACK 2021; V001T02A007https://doi.org/10.1115/IPACK2021-72620

Abstract

View Articletitled, Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

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Topics: Cooling systems , Heat flux , Simulation

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome

InterPACK 2021; V001T02A008https://doi.org/10.1115/IPACK2021-72621

Abstract

View Articletitled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

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Topics: Computer cooling , Computers , Cooling systems , Cooling , Energy consumption , Climate change , Condensers (steam plant) , Flow (Dynamics) , Fluids , Heat

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay

InterPACK 2021; V001T02A009https://doi.org/10.1115/IPACK2021-72682

Abstract

View Articletitled, A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

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Topics: Boilers , Carbon , Condensers (steam plant) , Cooling , Cooling systems , Emissions , Energy consumption , Film thickness , Fluids , Gases

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff

InterPACK 2021; V001T02A010https://doi.org/10.1115/IPACK2021-73015

Abstract

View Articletitled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

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Topics: Contact resistance , Cooling , Data centers , Electronics , Foams (Chemistry) , Plates (structures) , Bonding , Heat transfer , Metal foams , Modeling

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani

InterPACK 2021; V001T02A011https://doi.org/10.1115/IPACK2021-73253

Abstract

View Articletitled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

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Topics: Dimensions , Errors , Failure , Failure analysis , Flow (Dynamics) , Manufacturing , Optical interconnections , Optics , Photonics , Resolution (Optics)

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff

InterPACK 2021; V001T02A012https://doi.org/10.1115/IPACK2021-73269

Abstract

View Articletitled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

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Topics: Compression , Cooling , Data centers , Heat recovery , Vapors

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff

InterPACK 2021; V001T02A013https://doi.org/10.1115/IPACK2021-73270

Abstract

View Articletitled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

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Topics: Compression , Condensers (steam plant) , Cooling , Heat recovery , Modeling , Thermal management , Vapors

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff

InterPACK 2021; V001T02A014https://doi.org/10.1115/IPACK2021-73271

Abstract

View Articletitled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

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Topics: Compression , Compressors , Cooling , Heat recovery , Modeling , Thermal management , Vapors

Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

Deogratius Kisitu, Alfonso Ortega

InterPACK 2021; V001T02A015https://doi.org/10.1115/IPACK2021-73283

Abstract

View Articletitled, Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

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Topics: Cooling , Flow (Dynamics) , Microchannels , Plates (structures)

Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages

Arunima Panigrahy, Prabhakar Subrahmanyam, Ying-Feng Pang, Ridvan Sahan, Amy Xia

InterPACK 2021; V001T02A016https://doi.org/10.1115/IPACK2021-73954

Abstract

View Articletitled, Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages

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Topics: Cooling , Heat exchangers , Power density

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin

InterPACK 2021; V001T02A017https://doi.org/10.1115/IPACK2021-74016

Abstract

View Articletitled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

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Topics: Cooling , Data centers , Heat sinks , Power density , Heat , Semiconductors (Materials) , Temperature , Density , Energy consumption , Flow (Dynamics)

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

Alec Nordlund, Rachel McAfee, Rebecca Ledsham, Joshua Gess

InterPACK 2021; V001T02A018https://doi.org/10.1115/IPACK2021-74108

Abstract

View Articletitled, Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

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Topics: Additive manufacturing , Cooling , Graphics processing units , Nitrogen , Plates (structures)

Flexible and Wearable Electronics

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

InterPACK 2021; V001T03A001https://doi.org/10.1115/IPACK2021-68902

Abstract

View Articletitled, Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

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Topics: Damage , Electrodiffusion , Flexible electronics , Stress

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

InterPACK 2021; V001T03A002https://doi.org/10.1115/IPACK2021-74060

Abstract

View Articletitled, Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

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Topics: Electronics , Reliability , Surface preparation , Stress , Adhesives , Biometry , Diluents , Dust , Finite element model , Flexible electronics

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill

InterPACK 2021; V001T03A003https://doi.org/10.1115/IPACK2021-74063

Abstract

View Articletitled, Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

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Topics: Copper , Electronics , Inks , Sintering

Reliability and SOH Degradation of Thin Li-ion Batteries Under Various Flexing Conditions

Pradeep Lall, Hyesoo Jang, Ved Soni, Scott Miller

InterPACK 2021; V001T03A004https://doi.org/10.1115/IPACK2021-74065

Abstract

View Articletitled, Reliability and SOH Degradation of Thin Li-ion Batteries Under Various Flexing Conditions

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Topics: Batteries , Lithium-ion batteries , Reliability

Additively Printed Flexible Temperature Sensor for Wearable Applications

Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Kartik Goyal, Curtis Hill

InterPACK 2021; V001T03A005https://doi.org/10.1115/IPACK2021-74071

Abstract

View Articletitled, Additively Printed Flexible Temperature Sensor for Wearable Applications

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Topics: Reliability , Temperature sensors

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller

InterPACK 2021; V001T03A006https://doi.org/10.1115/IPACK2021-74073

Abstract

View Articletitled, Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

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Topics: Adhesives , Filters , Printing , Silver , Sintering

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

InterPACK 2021; V001T03A007https://doi.org/10.1115/IPACK2021-74074

Abstract

View Articletitled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

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Topics: Performance characterization , Strain gages , Stress , Temperature , Inks , Printing , Sensors , Printed circuit boards , Silver , Vibration

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

InterPACK 2021; V001T03A008https://doi.org/10.1115/IPACK2021-74086

Abstract

View Articletitled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

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Topics: Adhesives , Flexible electronics , Inks , Low temperature , Printing , Solders , Surface mount components

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller

InterPACK 2021; V001T03A009https://doi.org/10.1115/IPACK2021-74088

Abstract

View Articletitled, Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

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Topics: Accelerated life testing , Flexible electronics , Lamination , Lithium-ion batteries

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Pradeep Lall, Ved Soni, Scott Miller

InterPACK 2021; V001T03A010https://doi.org/10.1115/IPACK2021-74115

Abstract

View Articletitled, Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

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Topics: Batteries , Bending (Stress) , Biomedical equipment , Electronics , Flexible electronics , Industrial research , Lithium-ion batteries , Regression models , Stress

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze

InterPACK 2021; V001T03A011https://doi.org/10.1115/IPACK2021-74570

Abstract

View Articletitled, Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

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Topics: Failure , Gages , Inks , Printing , Shear (Mechanics) , Stability , Strain gages , Stress

Power Electronics

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar

InterPACK 2021; V001T04A001https://doi.org/10.1115/IPACK2021-68870

Abstract

View Articletitled, Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

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Topics: Cooling , Design , Electric vehicles , Hybrid electric vehicles , Vehicles , Compressors , Batteries , Electrification , HVAC equipment , Internal combustion engines

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz

InterPACK 2021; V001T04A002https://doi.org/10.1115/IPACK2021-69270

Abstract

View Articletitled, Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

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Topics: Aluminum , Copper , Electronics , Sprays , Ceramics , Manufacturing , Additive manufacturing , Bonding , Deformation , Electrical properties

Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics

Adrian Olivera, Jhonathan Rosales, Pedro O. Quintero

InterPACK 2021; V001T04A003https://doi.org/10.1115/IPACK2021-69321

Abstract

View Articletitled, Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics

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Topics: Design , Electronics , Heat , Phase change materials , Thermal management , Transients (Dynamics)

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink

InterPACK 2021; V001T04A004https://doi.org/10.1115/IPACK2021-72726

Abstract

View Articletitled, Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

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Topics: Bridges (Structures) , Cooling , Gallium nitride , Gates (Closures) , Optimization

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink

InterPACK 2021; V001T04A005https://doi.org/10.1115/IPACK2021-73252

Abstract

View Articletitled, Transient Performance and Melt Front Characterization of Phase Change Materials

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Topics: Phase change materials , Transients (Dynamics) , Matlab , Temperature , Computation , Computer simulation , Convection , Finite element analysis , Heat , Heat flux

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

InterPACK 2021; V001T04A006https://doi.org/10.1115/IPACK2021-73313

Abstract

View Articletitled, Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

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Topics: Coatings , Coolants , Cooling , Design , Durability , Electric fields , Electronics , Flow (Dynamics) , Fluids , Heat

Lightweight, Cost-Effective Power Modules Using Polymer Baseplates With Integrated Microconvective Cooling

David Earley, Jordan Mizerak, Chris May, Bernard Malouin

InterPACK 2021; V001T04A007https://doi.org/10.1115/IPACK2021-74015

Abstract

View Articletitled, Lightweight, Cost-Effective Power Modules Using Polymer Baseplates With Integrated Microconvective Cooling

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Topics: Cooling , Electronics , Polymers , Power density , Silicon , Thermal management

Multiscale Heat Transfer in Optics and Energy Systems

A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

Farid Soroush, Tanya Liu, Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin

InterPACK 2021; V001T05A001https://doi.org/10.1115/IPACK2021-73309

Abstract

View Articletitled, A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

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Topics: Boiling , Copper , Liquid films

Microchannel Heat Sink for Thermal Management of Concentrated Photovoltaic Cells

Dinumol Varghese, Ahmed Sefelnasr, Mohsen Sherif, Fadi Alnaimat, Bobby Mathew

InterPACK 2021; V001T05A002https://doi.org/10.1115/IPACK2021-74010

Abstract

View Articletitled, Microchannel Heat Sink for Thermal Management of Concentrated Photovoltaic Cells

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Topics: Heat sinks , Microchannels , Photovoltaic cells , Thermal management , Thermal resistance

Autonomous, Hybrid, and Electric Vehicles

A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles

Nicholas Choi, Nhi V. Quach, Yoonjin Won

InterPACK 2021; V001T06A001https://doi.org/10.1115/IPACK2021-69751

Abstract

View Articletitled, A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles

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Topics: Batteries , Cooling , Electric vehicles , Energy dissipation , Heat , Thermal management

Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

Shinya Kawakita, Yuki Ishizaka, Kazuyoshi Fushinobu

InterPACK 2021; V001T06A002https://doi.org/10.1115/IPACK2021-70410

Abstract

View Articletitled, Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

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Topics: Composite materials , Copper , Thermal conductivity

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder

InterPACK 2021; V001T06A003https://doi.org/10.1115/IPACK2021-73100

Abstract

View Articletitled, Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

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Topics: Damage , Failure , Modeling , Solder joints , Thermomechanics , Finite element analysis , Simulation , Stress , Deformation , Solders

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

Marta Kuczynska, Ulrich Becker, Youssef Maniar, Steffen Weihe

InterPACK 2021; V001T06A004https://doi.org/10.1115/IPACK2021-73319

Abstract

View Articletitled, Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

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Topics: Computer simulation , Finite element analysis , Recrystallization , Simulation , Solders , Stress , Tin

Reliability of Electronic Packages and Systems

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa

InterPACK 2021; V001T07A001https://doi.org/10.1115/IPACK2021-69101

Abstract

View Articletitled, Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

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Topics: Measurement uncertainty , Temperature , Thermocouples , Temperature measurement , Electrical components , Evaluation methods , Heat , Heat transfer , Uncertainty

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink

InterPACK 2021; V001T07A002https://doi.org/10.1115/IPACK2021-69511

Abstract

View Articletitled, Module-Level TIM Degradation in HALT

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Topics: Aluminum , Cooling , Cycles , Electronics , Energy dissipation , Heating , Junctions , Life testing , Maintenance , Random vibration

Mechanical Behavior of Heat Activated Film Adhesives

Prabhat Janamanchi, Abhijit Dasgupta, Narendra Singh

InterPACK 2021; V001T07A003https://doi.org/10.1115/IPACK2021-69719

Abstract

View Articletitled, Mechanical Behavior of Heat Activated Film Adhesives

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Topics: Adhesives , Heat , Mechanical behavior , Mechanical properties , Phase transitions

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

InterPACK 2021; V001T07A004https://doi.org/10.1115/IPACK2021-69882

Abstract

View Articletitled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

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Topics: Electrodiffusion , Intermetallic compounds , Solder joints , Stress

Reliability of Electronic Drivers: An Industrial Approach

P. Watté, G. van Hees, R. Engelen, W. D. van Driel

InterPACK 2021; V001T07A005https://doi.org/10.1115/IPACK2021-72293

Abstract

View Articletitled, Reliability of Electronic Drivers: An Industrial Approach

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Topics: Reliability

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka

InterPACK 2021; V001T07A006https://doi.org/10.1115/IPACK2021-72975

Abstract

View Articletitled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

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Topics: Flow (Dynamics) , Heat sinks , Modeling , Thermal resistance , Electronic equipment , Cooling , Design , Forced convection , Heat transfer , Network analysis

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi

InterPACK 2021; V001T07A007https://doi.org/10.1115/IPACK2021-72976

Abstract

View Articletitled, CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

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Topics: Computational fluid dynamics , Cooling , Flow (Dynamics) , Impellers , Density , Electronic equipment , Packaging , Fans , Flow visualization , Pressure

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines

InterPACK 2021; V001T07A008https://doi.org/10.1115/IPACK2021-73197

Abstract

View Articletitled, Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

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Topics: Aerosols , Electronics , Finite element methods , Finite element model , Modeling , Printing , Silver , Temperature

Characterization of High-Density Aircraft Electronic and Thermal Management Systems

Joshua Kasitz, David Huitink

InterPACK 2021; V001T07A009https://doi.org/10.1115/IPACK2021-73287

Abstract

View Articletitled, Characterization of High-Density Aircraft Electronic and Thermal Management Systems

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Topics: Aircraft , Aviation , Density , Reliability , Thermal management

Contact Angle Tuning of Copper Microporous Structures

Farid Soroush, Tanya Liu, Qianying Wu, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin

InterPACK 2021; V001T07A010https://doi.org/10.1115/IPACK2021-73334

Abstract

View Articletitled, Contact Angle Tuning of Copper Microporous Structures

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Topics: Copper

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2021; V001T07A011https://doi.org/10.1115/IPACK2021-73348

Abstract

View Articletitled, Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

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Topics: Intermetallic compounds , Lead-free solders , Solder joints , Alloys , Reliability , Copper , Elastic moduli , Electronic packaging , Nanoindentation , Polishing

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey

InterPACK 2021; V001T07A012https://doi.org/10.1115/IPACK2021-73367

Abstract

View Articletitled, Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

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Topics: Additive manufacturing , Sintering , Tension-leg platforms , Transients (Dynamics)

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven

InterPACK 2021; V001T07A013https://doi.org/10.1115/IPACK2021-73456

Abstract

View Articletitled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

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Topics: Alloys , Fatigue , Melting point , Reliability , Solders , Temperature , Ball-Grid-Array packaging , Contamination , Failure , Failure analysis

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2021; V001T07A014https://doi.org/10.1115/IPACK2021-73548

Abstract

View Articletitled, Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

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Topics: Alloys , Creep , Lead-free solders , Stress-strain curves , Temperature

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

InterPACK 2021; V001T07A015https://doi.org/10.1115/IPACK2021-73970

Abstract

View Articletitled, Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

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Topics: Design , Finite element analysis , Reliability , Simulation , Thermomechanics

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

InterPACK 2021; V001T07A016https://doi.org/10.1115/IPACK2021-74044

Abstract

View Articletitled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

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Topics: Lead-free solders , Mechanical properties , Solder joints , Solders , Tensile strength , Thermal shock , Yield strength , Stress , Cycles , High temperature

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

InterPACK 2021; V001T07A017https://doi.org/10.1115/IPACK2021-74061

Abstract

View Articletitled, Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

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Topics: High temperature , Relaxation (Physics) , Reliability , Storage , Temperature , Viscoelasticity , Electronics , Glass transition , Materials properties , Mechanical properties

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

InterPACK 2021; V001T07A018https://doi.org/10.1115/IPACK2021-74062

Abstract

View Articletitled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

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Topics: Delamination , Epoxy adhesives , Epoxy resins , Fracture toughness , High temperature , Reliability , Shock (Mechanics) , Stress , Fracture (Materials) , Electronic components

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker

InterPACK 2021; V001T07A019https://doi.org/10.1115/IPACK2021-74066

Abstract

View Articletitled, Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

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Topics: Solders , Temperature , Vibration , Failure , Signals , Service life (Equipment) , Time series , Complex systems , Dimensions , Maintenance

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

InterPACK 2021; V001T07A020https://doi.org/10.1115/IPACK2021-74067

Abstract

View Articletitled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

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Topics: Alloys , High temperature , Mechanical properties , Shock (Mechanics) , Solders , Temperature , Testing , Vibration , Viscoplasticity

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

InterPACK 2021; V001T07A021https://doi.org/10.1115/IPACK2021-74068

Abstract

View Articletitled, Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

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Topics: Alloys , High temperature , Low temperature materials , Solders , Storage

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

InterPACK 2021; V001T07A022https://doi.org/10.1115/IPACK2021-74069

Abstract

View Articletitled, Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

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Topics: Low temperature , Mechanical properties , Storage , Temperature , Alloys , Solders , Avionics , Climate , Design , Electronic packages

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson

InterPACK 2021; V001T07A023https://doi.org/10.1115/IPACK2021-74075

Abstract

View Articletitled, Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

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Topics: Epoxy adhesives , Epoxy resins , High temperature , Molding , Viscoelasticity

Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis

InterPACK 2021; V001T07A024https://doi.org/10.1115/IPACK2021-74076

Abstract

View Articletitled, Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging

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Topics: High temperature , Reliability

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

S. W. R. Lee, J. C. C. Lo, X. Qiu, N. Tu

InterPACK 2021; V001T07A025https://doi.org/10.1115/IPACK2021-74199

Abstract

View Articletitled, Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

PDF

Topics: Additive manufacturing , Reliability

Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications

Pradeep Lall, Sungmo Jung

InterPACK 2021; V001T07A026https://doi.org/10.1115/IPACK2021-75890

Abstract

View Articletitled, Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications

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Topics: High temperature , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Reliability

Nano-Scale Thermal Transport and Materials

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng

InterPACK 2021; V001T08A001https://doi.org/10.1115/IPACK2021-66842

Abstract

View Articletitled, Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

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Topics: Electrical conductance , Thermoreflectance , Transducers , Thermal resistance , Architecture , Computer simulation , Electronic packaging , Fittings , Flow (Dynamics) , Geometry

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan

InterPACK 2021; V001T08A002https://doi.org/10.1115/IPACK2021-69254

Abstract

View Articletitled, Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

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Topics: Agglomeration (Materials) , Coal , Computer cooling , Electronic packages , Electronic packaging , Energy dissipation , Graphene , Graphite , Heat , Heat sinks

Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

Tanvir Ahmed Chowdhury, Shawn A. Putnam

InterPACK 2021; V001T08A003https://doi.org/10.1115/IPACK2021-69317

Abstract

View Articletitled, Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

PDF

Topics: Cooling , Impingement cooling

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Taher Meydando, Nazli Donmezer

InterPACK 2021; V001T08A004https://doi.org/10.1115/IPACK2021-73648

Abstract

View Articletitled, Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

PDF

Topics: Phonons , Spectroscopy , Thermal conductivity , Thin films

Thermal Transport Across Al-(Al_xGa_1-x)₂O₃ and Al-Ga₂O₃ Interfaces

InterPACK 2021; V001T08A005https://doi.org/10.1115/IPACK2021-74116

Abstract

View Articletitled, Thermal Transport Across Al-(AlxGa1-x)2O3 and Al-Ga2O3 Interfaces

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Topics: Alloys , Aluminum , Cathode rays , Chemical reactions , Cooling , Electrical conductance , Electron beams , Electronics , Energy dissipation , Gallium

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