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Proceedings Papers

Proceedings Volume Cover
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
October 27–29, 2020
Virtual, Online
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-8404-1
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Autonomous, Hybrid, and Electric Vehicles

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles
Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
InterPACK 2020; V001T01A001https://doi.org/10.1115/IPACK2020-2524
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Topics: Electric vehicles , Thermal management , Traction , Electronics , Machinery , Cooling , Cooling systems , Engines , Finite element analysis , Fluids
Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
InterPACK 2020; V001T01A002https://doi.org/10.1115/IPACK2020-2550
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Topics: Electric motors , Engines , Finite element analysis , Motors , Permanent magnets , Sensitivity analysis , Thermal management
The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
InterPACK 2020; V001T01A003https://doi.org/10.1115/IPACK2020-2555
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Topics: Bifurcation , Experimental methods , Gravity (Force) , Packaging , Semiconductor wafers , Warping
Real Time Prediction of Li-Ion Battery Pack Temperatures in EV Vehicles
Azita Soleymani, William Maltz
InterPACK 2020; V001T01A004https://doi.org/10.1115/IPACK2020-2609
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Topics: Lithium-ion batteries , Temperature , Vehicles
PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
InterPACK 2020; V001T01A005https://doi.org/10.1115/IPACK2020-2614
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Topics: Printed circuit boards , Thermomechanics , Stress , Ceramics , Control panels , Deformation , Electronic components , Experimental methods , Finite element analysis , Reliability
Twist Reliability Assessment of Flexible Battery in Wearable Applications
Pradeep Lall, Hyesoo Jang, Scott Miller
InterPACK 2020; V001T01A006https://doi.org/10.1115/IPACK2020-2647
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Topics: Batteries , Reliability
Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
InterPACK 2020; V001T01A007https://doi.org/10.1115/IPACK2020-2648
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Topics: Electronics , Reliability , Shock (Mechanics) , Vehicles , Manufacturing , Solder joints , Aerospace industry , Ball-Grid-Array packaging , Capacitors , Ceramics
Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading
Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T01A008https://doi.org/10.1115/IPACK2020-2655
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Topics: Creep , Nanoindentation , Solder masks
Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
InterPACK 2020; V001T01A009https://doi.org/10.1115/IPACK2020-2658
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Topics: Alloys , Temperature , Operating temperature , Solders , Avionics , Constitutive equations , Electronic equipment , Electronics , Energy dissipation , Engines
High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging
Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
InterPACK 2020; V001T01A010https://doi.org/10.1115/IPACK2020-2659
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Topics: Alloys , Avionics , Climate , Design , Electronic packages , Electronic packaging , High temperature , Lead-free solders , Low temperature , Low temperature materials
High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging
Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
InterPACK 2020; V001T01A011https://doi.org/10.1115/IPACK2020-2660
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Topics: High temperature , Mechanical properties , Testing , Alloys , Operating temperature , Solders , Stress , Aerospace industry , Biomedicine , Electronic components
Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation
Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling
InterPACK 2020; V001T01A012https://doi.org/10.1115/IPACK2020-2675
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Topics: Glass transition , High temperature , Mechanical properties , Optical microscopes , Oxidation , Viscoelasticity , Electronics , Operating temperature , Reliability , Storage
Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
InterPACK 2020; V001T01A013https://doi.org/10.1115/IPACK2020-2676
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Topics: Ball-Grid-Array packaging , Composite building materials , Crack propagation , Damage , Delamination , Displacement , Electronics , Failure , Flip-chip , Fracture (Materials)
Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C
Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling
InterPACK 2020; V001T01A014https://doi.org/10.1115/IPACK2020-2677
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Topics: Damage , Design , Elastic moduli , Electronic components , Electronic packaging , Elongation , High temperature , Mechanical properties , Mechanical testing , Operating temperature
Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application
Pradeep Lall, Sungmo Jung
InterPACK 2020; V001T01A015https://doi.org/10.1115/IPACK2020-2678
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Topics: Diffusion (Physics) , Electrolytic corrosion , High temperature , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Reliability
Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints
Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T01A016https://doi.org/10.1115/IPACK2020-2690
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Topics: Creep , Solder joints , Testing
Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling
Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T01A017https://doi.org/10.1115/IPACK2020-2692
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Topics: Lead-free solders , Recrystallization , Shear (Mechanics)
Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling
S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T01A018https://doi.org/10.1115/IPACK2020-2693
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Topics: Creep , Lead-free solders
Deformation Behavior of SAC305 Solder Joints With Multiple Grains
Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T01A019https://doi.org/10.1115/IPACK2020-2694
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Topics: Anisotropy , Deformation , Grain size , Solder joints
Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T01A020https://doi.org/10.1115/IPACK2020-2695
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Topics: Intermetallic compounds , Lead-free solders , Solders , Particulate matter , Tin , Alloys , Mechanical behavior , Diffusion (Physics) , High temperature , Mechanical properties

Flexible and Wearable Electronics

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices
Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov
InterPACK 2020; V001T02A001https://doi.org/10.1115/IPACK2020-2525
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Topics: Design , Electronics , Failure analysis , Temperature , Stress , Failure , Testing , Accelerated life testing , Chain , Failure data
Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition
Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel
InterPACK 2020; V001T02A002https://doi.org/10.1115/IPACK2020-2644
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Topics: Biometry , Fatigue life , Flexible electronics , Reliability , Sensors
Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink
Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
InterPACK 2020; V001T02A003https://doi.org/10.1115/IPACK2020-2664
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Topics: Aerosols , Failure , Inks , Nanoparticles , Printing , Shear (Mechanics) , Stress
Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology
Pradeep Lall, Kartik Goyal, Scott Miller
InterPACK 2020; V001T02A004https://doi.org/10.1115/IPACK2020-2680
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Topics: Aerosols , Electronics , Sintering

Heterogeneous Integration

Material Impact With Package Solution for 5G RF Application
Po Yuan (James) Su, Yu Po Wang, Yu Cheng Pai, Ying Wei Lu, Teny Shih, Andrew Kang, David Lai, Don Son Jiang
InterPACK 2020; V001T03A001https://doi.org/10.1115/IPACK2020-2507
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Topics: Design , Millimeter waves , Signals , System architecture
Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
InterPACK 2020; V001T03A002https://doi.org/10.1115/IPACK2020-2528
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Topics: Computers , Design , Diluents , Glass , Internet , Manufacturing , Packaging , Semiconductor wafers , Semiconductors (Materials) , Smart appliances
Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers
Sougata Hazra, Yashvi Singh, Mehdi Asheghi, Kenneth Goodson
InterPACK 2020; V001T03A003https://doi.org/10.1115/IPACK2020-2533
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Topics: Bonding , Flip-chip , Heat flux , Intermetallic compounds , Metals , Microcoolers , Packaging , Tin
Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
Mahsa Montazeri, David R. Huitink
InterPACK 2020; V001T03A004https://doi.org/10.1115/IPACK2020-2598
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Topics: Electrodiffusion , Solders , Stress , Reliability , Tension , Copper , Current density , Wire , Bonding , Electrical resistance
Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
InterPACK 2020; V001T03A005https://doi.org/10.1115/IPACK2020-2613
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Topics: Architecture , Coatings , Condensation , Condensed matter , Drops , Fluids , Hydrophilicity , Membranes , Metals , Nickel
Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure
Sougata Hazra, Tanya Liu, Mehdi Asheghi, Kenneth Goodson
InterPACK 2020; V001T03A006https://doi.org/10.1115/IPACK2020-2640
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Topics: Lasers , Surface roughness , Vapors
Molecular Dynamics Investigation of Water Behavior Through Nanopores
Kimia Montazeri, Penghui Cao, Yoonjin Won
InterPACK 2020; V001T03A007https://doi.org/10.1115/IPACK2020-2699
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Topics: Density , Molecular dynamics , Nanopores , Water , Nanoscale phenomena , Dimensions , Dynamics (Mechanics) , Energy storage , Engineering systems and industry applications , Fluids

Multiscale Energy Transport, Conversion, and Storage

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling
Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
InterPACK 2020; V001T05A001https://doi.org/10.1115/IPACK2020-2562
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Topics: Composite materials , Computer cooling , Heat flux , Heat sinks , Phase change materials , Thermal conductivity
A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers
Fabio Battaglia, Raphael Mandel, Amir Shooshtari, Michael M. Ohadi
InterPACK 2020; V001T05A002https://doi.org/10.1115/IPACK2020-2564
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Topics: Flow (Dynamics) , Heat exchangers , Heat transfer , Manifolds , Microchannels , Modeling , Porous materials
An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow
E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik
InterPACK 2020; V001T05A003https://doi.org/10.1115/IPACK2020-2569
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Topics: Air flow , Computer cooling , Cooling , Design , Fins , Flow (Dynamics) , Forced convection , Heat flux , Heat sinks , Heat transfer
Personal Heating/Cooling System Using Peltier
Amanie Abdelmessih, Andre Alvarez, Joshua Gonzalez, Timothy Gooch, Adrian Gutierrez, Kristoffer Magana, Jonathan Nakamura, Joseph van Haaster
InterPACK 2020; V001T05A004https://doi.org/10.1115/IPACK2020-2625
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Topics: Cooling , Cooling systems , Heating
Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates
Pradeep Lall, Ved Soni, Scott Miller
InterPACK 2020; V001T05A005https://doi.org/10.1115/IPACK2020-2661
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Topics: Lithium-ion batteries , Batteries , Industrial research , Reliability , Stress , Battery life , Bending (Stress) , Biomedical equipment , Cycles , Electronics

Optics and Photonics

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors
Mei-Chien Lu
InterPACK 2020; V001T06A001https://doi.org/10.1115/IPACK2020-2526
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Topics: Architecture , Bonding , Density , Packaging , Sensors
Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams
Shungo Okamoto, Naomichi Saito, Kotaro Ito, Bei Ma, Ken Morita, Daisuke Iida, Kazuhiro Ohkawa, Yoshihiro Ishitani
InterPACK 2020; V001T06A002https://doi.org/10.1115/IPACK2020-2570
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Topics: Gallium , Gallium nitride , Heat , Imaging , Irradiation (Radiation exposure) , Laser beams

Power Electronics

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules
Raj Sahu, Emre Gurpinar, Burak Ozpineci
InterPACK 2020; V001T07A001https://doi.org/10.1115/IPACK2020-2516
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Topics: Energy gap , Heat sinks , Optimization , Cooling , Heat , Energy conversion , Power semiconductor devices , Reliability , Semiconductor devices , Steady state
Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics
Darryl Jennings, Jr., Sonya Smith
InterPACK 2020; V001T07A002https://doi.org/10.1115/IPACK2020-2527
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Topics: Computational fluid dynamics , Cooling , Friction , Heat sinks , Microchannels , Nanofluids , Nanostructures
Performance Analysis of Heat Sinks Designed for Additive Manufacturing
Andrew Scott White, David Saltzman, Stephen Lynch
InterPACK 2020; V001T07A003https://doi.org/10.1115/IPACK2020-2532
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Topics: Additive manufacturing , Heat sinks
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
InterPACK 2020; V001T07A004https://doi.org/10.1115/IPACK2020-2556
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Topics: Electrodiffusion , Intermetallic compounds , Solder joints , Stress
Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs
Damon Gresham-Chisolm, Sonya Smith
InterPACK 2020; V001T07A005https://doi.org/10.1115/IPACK2020-2565
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Topics: Composite materials , Graphite , Lithium-ion batteries , Thermal analysis , Thermal management , Cooling , Design , Heat , Batteries , Stress
Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics
Hayden Carlton, Ange Iradukunda, David Huitink, Sarah Myane, Noah Akey, Asif Imran, Fang Luo
InterPACK 2020; V001T07A006https://doi.org/10.1115/IPACK2020-2576
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Topics: Electronics , Nanocomposites
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
InterPACK 2020; V001T07A007https://doi.org/10.1115/IPACK2020-2581
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Topics: MOSFET transistors , Risk assessment , Traction , Temperature , Failure , Reliability , Capacitors , Risk , Boundary-value problems , Cycles
Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments
Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink
InterPACK 2020; V001T07A008https://doi.org/10.1115/IPACK2020-2589
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Topics: Gallium , Gallium nitride , Hall effect , High temperature , Magnetic fields , Reliability , Sensors
CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid
Amirreza Niazmand, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, Dereje Agonafer
InterPACK 2020; V001T07A009https://doi.org/10.1115/IPACK2020-2595
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Topics: Computational fluid dynamics , Cooling , Electronics , Fluids , Simulation
Additive Fabricated Compliant Interconnects: Design, Fabrication and Reliability Effects
Tumininu Olatunji, David Huitink
InterPACK 2020; V001T07A010https://doi.org/10.1115/IPACK2020-2596
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Topics: Additive manufacturing , Design , Electronic packaging , Manufacturing , Reliability , Solder joints
Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications
Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
InterPACK 2020; V001T07A011https://doi.org/10.1115/IPACK2020-2603
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Topics: Boiling , Cooling , Copper , Design , Heat flux , Manufacturing , Critical heat flux , Heat , Modeling , Permeability
Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
InterPACK 2020; V001T07A012https://doi.org/10.1115/IPACK2020-2605
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Topics: Thermal conductivity , Two-phase flow , Flow (Dynamics) , Additive manufacturing , Army , Boundary-value problems , Bubbles , Buoyancy , Capacitance , Collaboration
Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)
Peter deBock, Rinaldo Miorini, Cathleen Hoel, Darin Sharar, Bryan Whalen
InterPACK 2020; V001T07A013https://doi.org/10.1115/IPACK2020-2606
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Topics: Electronics , Experimental characterization , Heat transfer , Swirling flow , Thermal energy storage , Transients (Dynamics) , Two-phase flow
Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
InterPACK 2020; V001T07A014https://doi.org/10.1115/IPACK2020-2608
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Topics: Silicon , Steady state , Transients (Dynamics) , Additive manufacturing , Flow (Dynamics) , Army , Bubbles , Buoyancy , Capacitance , Collaboration
Investigation Regarding Thermal Resistance of Surface Mount Type Discrete Power Semiconductor Package
Koji Nishi
InterPACK 2020; V001T07A015https://doi.org/10.1115/IPACK2020-2631
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Topics: Power semiconductor devices , Surface mount packaging , Thermal resistance
Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging
KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2020; V001T07A016https://doi.org/10.1115/IPACK2020-2691
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Topics: Ball-Grid-Array packaging , High temperature , Lead-free solders , Particulate matter

Servers of the Future, Edge, and Cloud Computing

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
InterPACK 2020; V001T08A001https://doi.org/10.1115/IPACK2020-2541
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Topics: Cooling systems , Design , Engineering simulation , Simulation , Cooling , Flow (Dynamics) , Heat , Architecture , Boiling , Computer cooling
Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
InterPACK 2020; V001T08A002https://doi.org/10.1115/IPACK2020-2542
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Topics: Heat exchangers , Microscale devices , Thermal management , Cooling , Heat , Pressure drop , Density , Flow (Dynamics) , Heat transfer , Refrigerants
High Performance Computing Package With Chip Module on Substrate Solutions
Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
InterPACK 2020; V001T08A003https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging , Bridges (Structures) , Cloud computing , Corners (Structural elements) , Data centers , Deformation , Elongation , Flip-chip , Flip-chip devices , Fracture (Materials)
Partitioned Heat Sinks for Improved Natural Convection
Todd Salamon, Roger Kempers, Brian Lynch, Kevin Terrell, Elina Simon
InterPACK 2020; V001T08A004https://doi.org/10.1115/IPACK2020-2553
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Topics: Heat sinks , Natural convection
CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware
Satyam Saini, Kaustubh K. Adsul, Pardeep Shahi, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
InterPACK 2020; V001T08A005https://doi.org/10.1115/IPACK2020-2590
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Topics: Computational fluid dynamics , Contamination , Data centers , Hardware , Modeling , Particulate matter
Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
InterPACK 2020; V001T08A006https://doi.org/10.1115/IPACK2020-2591
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Topics: Additive manufacturing , Computational fluid dynamics , Computers , Cooling , Heat exchangers , Urethane elastomers , Sealants , Wire , Fluids , Calibration
CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles
Pardeep Shahi, Sarthak Agarwal, Satyam Saini, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
InterPACK 2020; V001T08A007https://doi.org/10.1115/IPACK2020-2592
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Topics: Computational fluid dynamics , Copper , Data centers , Nanoparticles
Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
InterPACK 2020; V001T08A008https://doi.org/10.1115/IPACK2020-2627
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Topics: Cooling , Fins , Heat sinks , Microchannels , Pressure drop , Thermal resistance
Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid
Amirreza Niazmand, Prajwal Murthy, Satyam Saini, Pardeep Shahi, Pratik Bansode, Dereje Agonafer
InterPACK 2020; V001T08A009https://doi.org/10.1115/IPACK2020-2662
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Topics: Cooling , Mineral oil , Nanofluids , Numerical analysis , Temperature , Thermal conductivity
Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants
Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
InterPACK 2020; V001T08A010https://doi.org/10.1115/IPACK2020-2670
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Topics: Coolants , Cooling , Cooling systems , Fluids , Graphics processing units , Power density , Data centers , Temperature , Decision making , Density
Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads
Pradeep Lall, Tony Thomas, Ken Blecker
InterPACK 2020; V001T08A011https://doi.org/10.1115/IPACK2020-2679
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Topics: Alloys , Stress , Temperature , Vibration
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