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ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

October 27–29, 2020

Virtual, Online

Conference Sponsors:

ISBN:

978-0-7918-8404-1

In This Volume

Autonomous, Hybrid, and Electric Vehicles (20)
Flexible and Wearable Electronics (4)
Heterogeneous Integration (7)
Multiscale Energy Transport, Conversion, and Storage (5)
Optics and Photonics (2)
Power Electronics (16)
Servers of the Future, Edge, and Cloud Computing (11)

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Autonomous, Hybrid, and Electric Vehicles

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury

InterPACK 2020; V001T01A001doi:https://doi.org/10.1115/IPACK2020-2524

Abstract

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Topics: Electric vehicles , Thermal management , Traction , Electronics , Machinery , Cooling , Cooling systems , Engines , Finite element analysis , Fluids

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

InterPACK 2020; V001T01A002doi:https://doi.org/10.1115/IPACK2020-2550

Abstract

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Topics: Electric motors , Engines , Finite element analysis , Motors , Permanent magnets , Sensitivity analysis , Thermal management

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes

InterPACK 2020; V001T01A003doi:https://doi.org/10.1115/IPACK2020-2555

Abstract

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Topics: Bifurcation , Experimental methods , Gravity (Force) , Packaging , Semiconductor wafers , Warping

Real Time Prediction of Li-Ion Battery Pack Temperatures in EV Vehicles

Azita Soleymani, William Maltz

InterPACK 2020; V001T01A004doi:https://doi.org/10.1115/IPACK2020-2609

Abstract

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Topics: Lithium-ion batteries , Temperature , Vehicles

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

InterPACK 2020; V001T01A005doi:https://doi.org/10.1115/IPACK2020-2614

Abstract

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Topics: Printed circuit boards , Thermomechanics , Stress , Ceramics , Control panels , Deformation , Electronic components , Experimental methods , Finite element analysis , Reliability

Twist Reliability Assessment of Flexible Battery in Wearable Applications

Pradeep Lall, Hyesoo Jang, Scott Miller

InterPACK 2020; V001T01A006doi:https://doi.org/10.1115/IPACK2020-2647

Abstract

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Topics: Batteries , Reliability

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep

InterPACK 2020; V001T01A007doi:https://doi.org/10.1115/IPACK2020-2648

Abstract

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Topics: Electronics , Reliability , Shock (Mechanics) , Vehicles , Manufacturing , Solder joints , Aerospace industry , Ball-Grid-Array packaging , Capacitors , Ceramics

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T01A008doi:https://doi.org/10.1115/IPACK2020-2655

Abstract

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Topics: Creep , Nanoindentation , Solder masks

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

InterPACK 2020; V001T01A009doi:https://doi.org/10.1115/IPACK2020-2658

Abstract

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Topics: Alloys , Temperature , Operating temperature , Solders , Avionics , Constitutive equations , Electronic equipment , Electronics , Energy dissipation , Engines

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

InterPACK 2020; V001T01A010doi:https://doi.org/10.1115/IPACK2020-2659

Abstract

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Topics: Alloys , Avionics , Climate , Design , Electronic packages , Electronic packaging , High temperature , Lead-free solders , Low temperature , Low temperature materials

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

InterPACK 2020; V001T01A011doi:https://doi.org/10.1115/IPACK2020-2660

Abstract

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Topics: High temperature , Mechanical properties , Testing , Alloys , Operating temperature , Solders , Stress , Aerospace industry , Biomedicine , Electronic components

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling

InterPACK 2020; V001T01A012doi:https://doi.org/10.1115/IPACK2020-2675

Abstract

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Topics: Glass transition , High temperature , Mechanical properties , Optical microscopes , Oxidation , Viscoelasticity , Electronics , Operating temperature , Reliability , Storage

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson

InterPACK 2020; V001T01A013doi:https://doi.org/10.1115/IPACK2020-2676

Abstract

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Topics: Ball-Grid-Array packaging , Composite building materials , Crack propagation , Damage , Delamination , Displacement , Electronics , Failure , Flip-chip , Fracture (Materials)

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling

InterPACK 2020; V001T01A014doi:https://doi.org/10.1115/IPACK2020-2677

Abstract

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Topics: Damage , Design , Elastic moduli , Electronic components , Electronic packaging , Elongation , High temperature , Mechanical properties , Mechanical testing , Operating temperature

Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application

Pradeep Lall, Sungmo Jung

InterPACK 2020; V001T01A015doi:https://doi.org/10.1115/IPACK2020-2678

Abstract

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Topics: Diffusion (Physics) , Electrolytic corrosion , High temperature , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Reliability

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T01A016doi:https://doi.org/10.1115/IPACK2020-2690

Abstract

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Topics: Creep , Solder joints , Testing

Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T01A017doi:https://doi.org/10.1115/IPACK2020-2692

Abstract

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Topics: Lead-free solders , Recrystallization , Shear (Mechanics)

Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T01A018doi:https://doi.org/10.1115/IPACK2020-2693

Abstract

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Topics: Creep , Lead-free solders

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T01A019doi:https://doi.org/10.1115/IPACK2020-2694

Abstract

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Topics: Anisotropy , Deformation , Grain size , Solder joints

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T01A020doi:https://doi.org/10.1115/IPACK2020-2695

Abstract

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Topics: Intermetallic compounds , Lead-free solders , Solders , Particulate matter , Tin , Alloys , Mechanical behavior , Diffusion (Physics) , High temperature , Mechanical properties

Flexible and Wearable Electronics

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov

InterPACK 2020; V001T02A001doi:https://doi.org/10.1115/IPACK2020-2525

Abstract

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Topics: Design , Electronics , Failure analysis , Temperature , Stress , Failure , Testing , Accelerated life testing , Chain , Failure data

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel

InterPACK 2020; V001T02A002doi:https://doi.org/10.1115/IPACK2020-2644

Abstract

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Topics: Biometry , Fatigue life , Flexible electronics , Reliability , Sensors

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

InterPACK 2020; V001T02A003doi:https://doi.org/10.1115/IPACK2020-2664

Abstract

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Topics: Aerosols , Failure , Inks , Nanoparticles , Printing , Shear (Mechanics) , Stress

Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

InterPACK 2020; V001T02A004doi:https://doi.org/10.1115/IPACK2020-2680

Abstract

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Topics: Aerosols , Electronics , Sintering

Heterogeneous Integration

Material Impact With Package Solution for 5G RF Application

Po Yuan (James) Su, Yu Po Wang, Yu Cheng Pai, Ying Wei Lu, Teny Shih, Andrew Kang, David Lai, Don Son Jiang

InterPACK 2020; V001T03A001doi:https://doi.org/10.1115/IPACK2020-2507

Abstract

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Topics: Design , Millimeter waves , Signals , System architecture

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan

InterPACK 2020; V001T03A002doi:https://doi.org/10.1115/IPACK2020-2528

Abstract

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Topics: Computers , Design , Diluents , Glass , Internet , Manufacturing , Packaging , Semiconductor wafers , Semiconductors (Materials) , Smart appliances

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

Sougata Hazra, Yashvi Singh, Mehdi Asheghi, Kenneth Goodson

InterPACK 2020; V001T03A003doi:https://doi.org/10.1115/IPACK2020-2533

Abstract

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Topics: Bonding , Flip-chip , Heat flux , Intermetallic compounds , Metals , Microcoolers , Packaging , Tin

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink

InterPACK 2020; V001T03A004doi:https://doi.org/10.1115/IPACK2020-2598

Abstract

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Topics: Electrodiffusion , Solders , Stress , Reliability , Tension , Copper , Current density , Wire , Bonding , Electrical resistance

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won

InterPACK 2020; V001T03A005doi:https://doi.org/10.1115/IPACK2020-2613

Abstract

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Topics: Architecture , Coatings , Condensation , Condensed matter , Drops , Fluids , Hydrophilicity , Membranes , Metals , Nickel

Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure

Sougata Hazra, Tanya Liu, Mehdi Asheghi, Kenneth Goodson

InterPACK 2020; V001T03A006doi:https://doi.org/10.1115/IPACK2020-2640

Abstract

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Topics: Lasers , Surface roughness , Vapors

Molecular Dynamics Investigation of Water Behavior Through Nanopores

Kimia Montazeri, Penghui Cao, Yoonjin Won

InterPACK 2020; V001T03A007doi:https://doi.org/10.1115/IPACK2020-2699

Abstract

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Topics: Density , Molecular dynamics , Nanopores , Water , Nanoscale phenomena , Dimensions , Dynamics (Mechanics) , Energy storage , Engineering systems and industry applications , Fluids

Multiscale Energy Transport, Conversion, and Storage

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

InterPACK 2020; V001T05A001doi:https://doi.org/10.1115/IPACK2020-2562

Abstract

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Topics: Composite materials , Computer cooling , Heat flux , Heat sinks , Phase change materials , Thermal conductivity

A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers

Fabio Battaglia, Raphael Mandel, Amir Shooshtari, Michael M. Ohadi

InterPACK 2020; V001T05A002doi:https://doi.org/10.1115/IPACK2020-2564

Abstract

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Topics: Flow (Dynamics) , Heat exchangers , Heat transfer , Manifolds , Microchannels , Modeling , Porous materials

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik

InterPACK 2020; V001T05A003doi:https://doi.org/10.1115/IPACK2020-2569

Abstract

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Topics: Air flow , Computer cooling , Cooling , Design , Fins , Flow (Dynamics) , Forced convection , Heat flux , Heat sinks , Heat transfer

Personal Heating/Cooling System Using Peltier

Amanie Abdelmessih, Andre Alvarez, Joshua Gonzalez, Timothy Gooch, Adrian Gutierrez, Kristoffer Magana, Jonathan Nakamura, Joseph van Haaster

InterPACK 2020; V001T05A004doi:https://doi.org/10.1115/IPACK2020-2625

Abstract

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Topics: Cooling , Cooling systems , Heating

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller

InterPACK 2020; V001T05A005doi:https://doi.org/10.1115/IPACK2020-2661

Abstract

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Topics: Lithium-ion batteries , Batteries , Industrial research , Reliability , Stress , Battery life , Bending (Stress) , Biomedical equipment , Cycles , Electronics

Optics and Photonics

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu

InterPACK 2020; V001T06A001doi:https://doi.org/10.1115/IPACK2020-2526

Abstract

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Topics: Architecture , Bonding , Density , Packaging , Sensors

Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams

Shungo Okamoto, Naomichi Saito, Kotaro Ito, Bei Ma, Ken Morita, Daisuke Iida, Kazuhiro Ohkawa, Yoshihiro Ishitani

InterPACK 2020; V001T06A002doi:https://doi.org/10.1115/IPACK2020-2570

Abstract

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Topics: Gallium , Gallium nitride , Heat , Imaging , Irradiation (Radiation exposure) , Laser beams

Power Electronics

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci

InterPACK 2020; V001T07A001doi:https://doi.org/10.1115/IPACK2020-2516

Abstract

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Topics: Energy gap , Heat sinks , Optimization , Cooling , Heat , Energy conversion , Power semiconductor devices , Reliability , Semiconductor devices , Steady state

Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics

Darryl Jennings, Jr., Sonya Smith

InterPACK 2020; V001T07A002doi:https://doi.org/10.1115/IPACK2020-2527

Abstract

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Topics: Computational fluid dynamics , Cooling , Friction , Heat sinks , Microchannels , Nanofluids , Nanostructures

Performance Analysis of Heat Sinks Designed for Additive Manufacturing

Andrew Scott White, David Saltzman, Stephen Lynch

InterPACK 2020; V001T07A003doi:https://doi.org/10.1115/IPACK2020-2532

Abstract

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Topics: Additive manufacturing , Heat sinks

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

InterPACK 2020; V001T07A004doi:https://doi.org/10.1115/IPACK2020-2556

Abstract

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Topics: Electrodiffusion , Intermetallic compounds , Solder joints , Stress

Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs

Damon Gresham-Chisolm, Sonya Smith

InterPACK 2020; V001T07A005doi:https://doi.org/10.1115/IPACK2020-2565

Abstract

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Topics: Composite materials , Graphite , Lithium-ion batteries , Thermal analysis , Thermal management , Cooling , Design , Heat , Batteries , Stress

Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, David Huitink, Sarah Myane, Noah Akey, Asif Imran, Fang Luo

InterPACK 2020; V001T07A006doi:https://doi.org/10.1115/IPACK2020-2576

Abstract

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Topics: Electronics , Nanocomposites

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

InterPACK 2020; V001T07A007doi:https://doi.org/10.1115/IPACK2020-2581

Abstract

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Topics: MOSFET transistors , Risk assessment , Traction , Temperature , Failure , Reliability , Capacitors , Risk , Boundary-value problems , Cycles

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink

InterPACK 2020; V001T07A008doi:https://doi.org/10.1115/IPACK2020-2589

Abstract

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Topics: Gallium , Gallium nitride , Hall effect , High temperature , Magnetic fields , Reliability , Sensors

CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid

Amirreza Niazmand, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, Dereje Agonafer

InterPACK 2020; V001T07A009doi:https://doi.org/10.1115/IPACK2020-2595

Abstract

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Topics: Computational fluid dynamics , Cooling , Electronics , Fluids , Simulation

Additive Fabricated Compliant Interconnects: Design, Fabrication and Reliability Effects

Tumininu Olatunji, David Huitink

InterPACK 2020; V001T07A010doi:https://doi.org/10.1115/IPACK2020-2596

Abstract

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Topics: Additive manufacturing , Design , Electronic packaging , Manufacturing , Reliability , Solder joints

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson

InterPACK 2020; V001T07A011doi:https://doi.org/10.1115/IPACK2020-2603

Abstract

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Topics: Boiling , Cooling , Copper , Design , Heat flux , Manufacturing , Critical heat flux , Heat , Modeling , Permeability

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock

InterPACK 2020; V001T07A012doi:https://doi.org/10.1115/IPACK2020-2605

Abstract

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Topics: Thermal conductivity , Two-phase flow , Flow (Dynamics) , Additive manufacturing , Army , Boundary-value problems , Bubbles , Buoyancy , Capacitance , Collaboration

Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)

Peter deBock, Rinaldo Miorini, Cathleen Hoel, Darin Sharar, Bryan Whalen

InterPACK 2020; V001T07A013doi:https://doi.org/10.1115/IPACK2020-2606

Abstract

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Topics: Electronics , Experimental characterization , Heat transfer , Swirling flow , Thermal energy storage , Transients (Dynamics) , Two-phase flow

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock

InterPACK 2020; V001T07A014doi:https://doi.org/10.1115/IPACK2020-2608

Abstract

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Topics: Silicon , Steady state , Transients (Dynamics) , Additive manufacturing , Flow (Dynamics) , Army , Bubbles , Buoyancy , Capacitance , Collaboration

Investigation Regarding Thermal Resistance of Surface Mount Type Discrete Power Semiconductor Package

Koji Nishi

InterPACK 2020; V001T07A015doi:https://doi.org/10.1115/IPACK2020-2631

Abstract

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Topics: Power semiconductor devices , Surface mount packaging , Thermal resistance

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2020; V001T07A016doi:https://doi.org/10.1115/IPACK2020-2691

Abstract

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Topics: Ball-Grid-Array packaging , High temperature , Lead-free solders , Particulate matter

Servers of the Future, Edge, and Cloud Computing

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo

InterPACK 2020; V001T08A001doi:https://doi.org/10.1115/IPACK2020-2541

Abstract

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Topics: Cooling systems , Design , Engineering simulation , Simulation , Cooling , Flow (Dynamics) , Heat , Architecture , Boiling , Computer cooling

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

InterPACK 2020; V001T08A002doi:https://doi.org/10.1115/IPACK2020-2542

Abstract

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Topics: Heat exchangers , Microscale devices , Thermal management , Cooling , Heat , Pressure drop , Density , Flow (Dynamics) , Heat transfer , Refrigerants

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang

InterPACK 2020; V001T08A003doi:https://doi.org/10.1115/IPACK2020-2547

Abstract

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Topics: Ball-Grid-Array packaging , Bridges (Structures) , Cloud computing , Corners (Structural elements) , Data centers , Deformation , Elongation , Flip-chip , Flip-chip devices , Fracture (Materials)

Partitioned Heat Sinks for Improved Natural Convection

Todd Salamon, Roger Kempers, Brian Lynch, Kevin Terrell, Elina Simon

InterPACK 2020; V001T08A004doi:https://doi.org/10.1115/IPACK2020-2553

Abstract

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Topics: Heat sinks , Natural convection

CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware

Satyam Saini, Kaustubh K. Adsul, Pardeep Shahi, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer

InterPACK 2020; V001T08A005doi:https://doi.org/10.1115/IPACK2020-2590

Abstract

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Topics: Computational fluid dynamics , Contamination , Data centers , Hardware , Modeling , Particulate matter

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi

InterPACK 2020; V001T08A006doi:https://doi.org/10.1115/IPACK2020-2591

Abstract

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Topics: Additive manufacturing , Computational fluid dynamics , Computers , Cooling , Heat exchangers , Urethane elastomers , Sealants , Wire , Fluids , Calibration

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

Pardeep Shahi, Sarthak Agarwal, Satyam Saini, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer

InterPACK 2020; V001T08A007doi:https://doi.org/10.1115/IPACK2020-2592

Abstract

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Topics: Computational fluid dynamics , Copper , Data centers , Nanoparticles

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia

InterPACK 2020; V001T08A008doi:https://doi.org/10.1115/IPACK2020-2627

Abstract

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Topics: Cooling , Fins , Heat sinks , Microchannels , Pressure drop , Thermal resistance

Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid

Amirreza Niazmand, Prajwal Murthy, Satyam Saini, Pardeep Shahi, Pratik Bansode, Dereje Agonafer

InterPACK 2020; V001T08A009doi:https://doi.org/10.1115/IPACK2020-2662

Abstract

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Topics: Cooling , Mineral oil , Nanofluids , Numerical analysis , Temperature , Thermal conductivity

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang

InterPACK 2020; V001T08A010doi:https://doi.org/10.1115/IPACK2020-2670

Abstract

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Topics: Coolants , Cooling , Cooling systems , Fluids , Graphics processing units , Power density , Data centers , Temperature , Decision making , Density