Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: System-in-package , Molding , Simulation , Accelerated life testing , Copper , Design , Energy dissipation , Internet of things , Manufacturing , Packaging

CFD Analysis of Molten Solder Flow Behavior and Bridging Mechanism During Solder Bump Formation

Risa Miyazawa, Keishi Okamoto, Hiroyuki Mori

InterPACK 2019; V001T01A005https://doi.org/10.1115/IPACK2019-6395

Abstract

View Articletitled, CFD Analysis of Molten Solder Flow Behavior and Bridging Mechanism During Solder Bump Formation

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Topics: Computational fluid dynamics , Flow (Dynamics) , Solders

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee

InterPACK 2019; V001T01A006https://doi.org/10.1115/IPACK2019-6417

Abstract

View Articletitled, Thermal Analysis of 3D ICs With TSVs Placement Optimization

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Topics: Algorithms , Anisotropy , Delays , Heat transfer , Integrated circuits , Optimization , Power density , Signals , Silicon , Simulated annealing

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer

InterPACK 2019; V001T01A007https://doi.org/10.1115/IPACK2019-6507

Abstract

View Articletitled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

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Topics: Alloys , Fatigue life , Shear (Mechanics) , Solders , Stress , Solder joints , Fatigue , Bending (Stress) , Compression , Cycles

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

Yuvraj Singh, Anirudh Udupa, Srinivasan Chandrasekar, Ganesh Subbarayan

InterPACK 2019; V001T01A008https://doi.org/10.1115/IPACK2019-6510

Abstract

View Articletitled, Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

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Topics: Alloys , Lead-free solders , Metal cutting , Cutting , Testing , Cutting tools , Deformation , Dynamometers , Hammers , Microscale devices

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer

InterPACK 2019; V001T01A009https://doi.org/10.1115/IPACK2019-6514

Abstract

View Articletitled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

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Topics: Gates (Closures) , Manufacturing , Modeling , Temperature , Computer simulation , Delays , Density , Design , Dimensions , Energy consumption

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2019; V001T01A010https://doi.org/10.1115/IPACK2019-6539

Abstract

View Articletitled, Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

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Topics: Bonding , Cooling , Lasers , Manifolds , Microchannels , Microfabrication , Micromachining , Silicon

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

InterPACK 2019; V001T01A011https://doi.org/10.1115/IPACK2019-6576

Abstract

View Articletitled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

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Topics: Mechanical properties , Storage , Temperature , Alloys , Operating temperature , Electronic components , Electronics , High temperature , Lead-free solders , Shock (Mechanics)

Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions to InterPACK, the EPP Division, and Leadership in Liquid Cooling of Server Systems

Dynamic Control of Airflow Balance in Data Centers

Stephen Paul Linder, Jim Van Gilder, Yan Zhang, Enda Barrett

InterPACK 2019; V001T02A001https://doi.org/10.1115/IPACK2019-6304

Abstract

View Articletitled, Dynamic Control of Airflow Balance in Data Centers

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Topics: Air flow , Containment , Data centers , Flow (Dynamics)

Thermal Profiling of a Small Operational Data Center

İsmail Türkmen, Cem Ahmet Mercan, Hamza Salih Erden

InterPACK 2019; V001T02A002https://doi.org/10.1115/IPACK2019-6309

Abstract

View Articletitled, Thermal Profiling of a Small Operational Data Center

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Topics: Computational fluid dynamics , Data centers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo

InterPACK 2019; V001T02A003https://doi.org/10.1115/IPACK2019-6386

Abstract

View Articletitled, Design of Passive Two-Phase Thermosyphons for Server Cooling

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Topics: Cooling , Design , Energy consumption , Heat , Cooling systems , Artificial intelligence , Condensers (steam plant) , Coolants , Databases , Electric vehicles

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel

InterPACK 2019; V001T02A004https://doi.org/10.1115/IPACK2019-6389

Abstract

View Articletitled, Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

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Topics: Compression , Contact resistance , Cycles , Fibers , Heat sinks , Microscale devices , Polymers , Pressure , Springs , Surface roughness

Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages

Koji Nishi

InterPACK 2019; V001T02A005https://doi.org/10.1115/IPACK2019-6390

Abstract

View Articletitled, Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages

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Topics: Transients (Dynamics)

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken

InterPACK 2019; V001T02A006https://doi.org/10.1115/IPACK2019-6444

Abstract

View Articletitled, Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

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Topics: Cooling , Design , Design engineering , Thermal management , Water , Graphics processing units , Electronic components , Flow (Dynamics) , Artificial intelligence , Data centers

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

Sadegh Khalili, Srikanth Rangarajan, Bahgat Sammakia, Vadim Gektin

InterPACK 2019; V001T02A007https://doi.org/10.1115/IPACK2019-6463

Abstract

View Articletitled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

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Topics: Cooling , Fluids , Stress , Transients (Dynamics)

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan

InterPACK 2019; V001T02A008https://doi.org/10.1115/IPACK2019-6501

Abstract

View Articletitled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

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Topics: Algorithms , Particulate matter , Packing (Shipments) , Packings (Cushioning) , Nonlinear programming , Optimization algorithms , Simulation , Computer programming , Gradient methods , Heat

Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center

Uschas Chowdhury, Walter Hendrix, Thomas Craft, Willis James, Ankit Sutaria, Dereje Agonafer

InterPACK 2019; V001T02A009https://doi.org/10.1115/IPACK2019-6522

Abstract

View Articletitled, Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center

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Topics: Air conditioning , Containment , Coolers , Data centers , Design , Modeling

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte

InterPACK 2019; V001T02A010https://doi.org/10.1115/IPACK2019-6530

Abstract

View Articletitled, Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

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Topics: Cooling , Heat sinks , Maintainability , Thermal management , Data centers , Heat pipes , Air flow , Boundary-value problems , Computers , Design

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan, Abel Misrak, Dereje Agonafer

InterPACK 2019; V001T02A011https://doi.org/10.1115/IPACK2019-6568

Abstract

View Articletitled, Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

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Topics: Cooling , Electronic packages , Printed circuit boards , Reliability , Thermomechanics

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca

InterPACK 2019; V001T02A012https://doi.org/10.1115/IPACK2019-6585

Abstract

View Articletitled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

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Topics: Cooling , Data centers , Flow (Dynamics) , Jets , Thermal efficiency , Energy consumption , Exergy , Tiles , Computer cooling , Computer software

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

Dhruvkumar Gandhi, Uschas Chowdhury, Tushar Chauhan, Pratik Bansode, Satyam Saini, Jimil M. Shah, Dereje Agonafer

InterPACK 2019; V001T02A013https://doi.org/10.1115/IPACK2019-6587

Abstract

View Articletitled, Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

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Topics: Cooling , Fluids , Optimization

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

Pravin A. Shinde, Pratik V. Bansode, Satyam Saini, Rajesh Kasukurthy, Tushar Chauhan, Jimil M. Shah, Dereje Agonafer

InterPACK 2019; V001T02A014https://doi.org/10.1115/IPACK2019-6590

Abstract

View Articletitled, Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

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Topics: Cooling , Data centers , Experimental analysis , Optimization , Temperature

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3^rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, Ravya Dandamudi, Chinmay Bhatt, Pranavi Rachamreddy, Pratik Bansode, Dereje Agonafer

InterPACK 2019; V001T02A015https://doi.org/10.1115/IPACK2019-6600

Abstract

View Articletitled, CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

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Topics: Computational fluid dynamics , Cooling , Heat sinks , Optimization

Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

Jimil M. Shah, Roshan Anand, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Prabjit Singh, Mike Kaler

InterPACK 2019; V001T02A016https://doi.org/10.1115/IPACK2019-6601

Abstract

View Articletitled, Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

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Topics: Contamination , Data centers , Particulate matter

Computational Form Factor Study of a 3^rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, Chinmay Bhatt, Pranavi Rachamreddy, Ravya Dandamudi, Satyam Saini, Dereje Agonafer

InterPACK 2019; V001T02A017https://doi.org/10.1115/IPACK2019-6602

Abstract

View Articletitled, Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

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Topics: Cooling

Internet of Things

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

Shuv Dey, Yogendra Joshi, J. Michael Brown

InterPACK 2019; V001T03A001https://doi.org/10.1115/IPACK2019-6515

Abstract

View Articletitled, Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

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Topics: Cities , Heat , Internet of things , Packaging , Pollution , Sensor networks , Sensors

Flexible and Wearable Electronics

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

InterPACK 2019; V001T04A001https://doi.org/10.1115/IPACK2019-6408

Abstract

View Articletitled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

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Topics: Damage , Density , Flexible electronics , Inks , Nanoparticles , Metals , Anodes , Current density , Printing , Reliability

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang

InterPACK 2019; V001T04A002https://doi.org/10.1115/IPACK2019-6541

Abstract

View Articletitled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

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Topics: Design , Finite element analysis , Lamination , Light-emitting diodes , Simulation , Stress , Adhesives , Coatings , Fatigue , Materials properties

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

InterPACK 2019; V001T04A003https://doi.org/10.1115/IPACK2019-6569

Abstract

View Articletitled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

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Topics: Additive manufacturing , Aerosols , Temperature , Printing , Sintering , Shear (Mechanics) , Stress , Failure , Manufacturing , Mechanical properties

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller

InterPACK 2019; V001T04A004https://doi.org/10.1115/IPACK2019-6570

Abstract

View Articletitled, Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

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Topics: Accelerated life testing , Batteries , Cycles , Electronics , Energy efficiency , Flexible electronics , High temperature , Lithium-ion batteries , Medical devices , Regression models

Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

Pradeep Lall, Kartik Goyal, Nakul Kothari, Ben Leever, Scott Miller

InterPACK 2019; V001T04A005https://doi.org/10.1115/IPACK2019-6574

Abstract

View Articletitled, Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

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Topics: Aerosols , Printing

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller

InterPACK 2019; V001T04A006https://doi.org/10.1115/IPACK2019-6579

Abstract

View Articletitled, Flexure and Twist Test Reliability Assurance of Flexible Electronics

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Topics: Aerosols , Bending (Stress) , Flexible electronics , Reliability

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

InterPACK 2019; V001T04A007https://doi.org/10.1115/IPACK2019-6580

Abstract

View Articletitled, Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

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Topics: Flexible electronics , Reliability , Electronics , Failure , Lumber , Modeling , Sensors , Statistical analysis , Testing

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller

InterPACK 2019; V001T04A008https://doi.org/10.1115/IPACK2019-6584

Abstract

View Articletitled, Folding-Reliability of Flexible Electronics in Wearable Applications

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Topics: Fatigue life , Flexible electronics , Reliability , Electronics , Stress , Failure mechanisms , Experimental analysis , Failure analysis , Robustness , Skin

Photonics and Optics

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura

InterPACK 2019; V001T05A001https://doi.org/10.1115/IPACK2019-6356

Abstract

View Articletitled, Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

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Topics: Additive manufacturing , Computer simulation , Hardening (Curing) , Lasers , Numerical analysis , Photons , Polymerization , Resins , Manufacturing , Nanoscale phenomena

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

InterPACK 2019; V001T05A002https://doi.org/10.1115/IPACK2019-6391

Abstract

View Articletitled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

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Topics: Computational fluid dynamics , Glass , Heat , Heat transfer , Liquid crystals , Solar energy , Solar radiation , Testing , Temperature , Computer software

Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process

Shunsuke Kawasaki, Shinichi Kuramoto, Kazuyoshi Fushinobu, Koichi Kato, Kimiharu Yamazaki, Kaori Hemmi

InterPACK 2019; V001T05A003https://doi.org/10.1115/IPACK2019-6396

Abstract

View Articletitled, Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process

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Topics: Machine learning , Temperature

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi

InterPACK 2019; V001T05A004https://doi.org/10.1115/IPACK2019-6426

Abstract

View Articletitled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

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Topics: Gallium nitride , Heating , Junctions , Light-emitting diodes , Temperature , Brightness (Photometry) , Indium gallium nitride , Nanoparticles , Quantum wells , Temperature measurement

Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design

Gabor Farkas, Andras Vass-Varnai, Lajos Gaal, Marta Rencz

InterPACK 2019; V001T05A005https://doi.org/10.1115/IPACK2019-6547

Abstract

View Articletitled, Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design

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Topics: Design , Modeling , Physics

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen

InterPACK 2019; V001T05A006https://doi.org/10.1115/IPACK2019-6616

Abstract

View Articletitled, Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

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Topics: Cavities , Ceramics , Inks , Kaolin , Packaging , Printing , Rheology

Power Electronics

Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

Palash V. Acharya, Vaibhav Bahadur, Robert Hebner, Abdelhamid Ouroua, Shannon Strank

InterPACK 2019; V001T06A001https://doi.org/10.1115/IPACK2019-6311

Abstract

View Articletitled, Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

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Topics: Cooling , Electronics , Thermal management , Heat , Electronic packages , Energy dissipation , Heat sinks , Packaging , Silicon , Copper

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won

InterPACK 2019; V001T06A002https://doi.org/10.1115/IPACK2019-6372

Abstract

View Articletitled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

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Topics: Evaporation , Fluorescence , Temperature , Microscale devices , Cooling , Vapors , Calibration , Cutting , Drying , Electronics

Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

L. M. Boteler, S. M. Miner

InterPACK 2019; V001T06A003https://doi.org/10.1115/IPACK2019-6381

Abstract

View Articletitled, Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

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Topics: Design , Electronic packaging , Stress , Temperature , Finite element analysis , Army , Design engineering , Flat heat pipes , Heat sinks , Manufacturing

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

Rajen Murugan, Jie Chen, Todd Harrison, C. T. Kao, Nathan Ai

InterPACK 2019; V001T06A004https://doi.org/10.1115/IPACK2019-6384

Abstract

View Articletitled, System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

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Topics: Capacitors , Design , Inductors , Modeling , Multi-chip modules , Packaging , Power density , Silicon , Simulation , Transient analysis

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler

InterPACK 2019; V001T06A005https://doi.org/10.1115/IPACK2019-6385

Abstract

View Articletitled, Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

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Topics: Cooling , Cycles , Melting , Solidification , Stability , Thermal stability , Alloys , Metals , Temperature , Thermal management

Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

Lanbing Liu, David Nam, Ben Guo, Rolando Burgos, Guo-quan Lu

InterPACK 2019; V001T06A006https://doi.org/10.1115/IPACK2019-6393

Abstract

View Articletitled, Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

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Topics: Aerospace industry , Glass , High temperature , Packaging , Stress

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

Ki Wook Jung, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

InterPACK 2019; V001T06A007https://doi.org/10.1115/IPACK2019-6400

Abstract

View Articletitled, Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

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Topics: Cooling , Heat exchangers , Manifolds , Microchannels

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri

InterPACK 2019; V001T06A008https://doi.org/10.1115/IPACK2019-6413

Abstract

View Articletitled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

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Topics: Aluminum , Electrodiffusion , Imaging , Temperature , Thermoreflectance , Failure , Design , Resolution (Optics) , Temperature profiles , Wire

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink

InterPACK 2019; V001T06A009https://doi.org/10.1115/IPACK2019-6416

Abstract

View Articletitled, Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

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Topics: Event history analysis , Thermomechanics , Reliability , Stress , Testing , Thermal conductivity , Adhesion , Adhesives , Cycles , Electronic packages

Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

Ange-Christian Iradukunda, Josh Kasitz, Fernando Moreno, David Huitink

InterPACK 2019; V001T06A010https://doi.org/10.1115/IPACK2019-6422

Abstract

View Articletitled, Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

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Topics: Electrical properties , Electronic packages , Electronics , Graphene , Heat , Iron , Latent heat , Nanocomposites , Particulate matter , Phase change materials

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang

InterPACK 2019; V001T06A011https://doi.org/10.1115/IPACK2019-6424

Abstract

View Articletitled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

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Topics: Design , Stress , Thermomechanics , Warping , Deformation , Finite element analysis , Manufacturing , Electronic packages , Reliability , Temperature

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon

InterPACK 2019; V001T06A012https://doi.org/10.1115/IPACK2019-6434

Abstract

View Articletitled, Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

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Topics: Cooling , Design , Electric vehicles , Vehicles , Circuits , Density , Dynamics (Mechanics) , Energy dissipation , Engineering prototypes , Engineering simulation

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

InterPACK 2019; V001T06A013https://doi.org/10.1115/IPACK2019-6436

Abstract

View Articletitled, Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

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Topics: Design , Energy gap , Metals , Transients (Dynamics) , Ceramics , Copper , Finite element analysis , Materials properties , MOSFET transistors , Semiconductors (Materials)

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi

InterPACK 2019; V001T06A014https://doi.org/10.1115/IPACK2019-6440

Abstract

View Articletitled, Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

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Topics: Dynamics (Mechanics) , Electron mobility , Electronics , Energy gap , Gallium nitride , Heating , Imaging , Temperature measurement , Thermoreflectance , Transistors

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith

InterPACK 2019; V001T06A015https://doi.org/10.1115/IPACK2019-6442

Abstract

View Articletitled, Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

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Topics: Additive manufacturing , Design , Flat heat pipes , Optimization , Heat , Convection , Heat sinks , Nonmetallic materials , Thermal management , Density

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu

InterPACK 2019; V001T06A016https://doi.org/10.1115/IPACK2019-6443

Abstract

View Articletitled, Comparative Study on Power Module Architectures for Modularity and Scalability

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Topics: Architecture , Electric vehicles , Silicon , Electronics , Hybrid electric vehicles , Carbon , Cooling , Design , Emissions , Energy gap

Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

Ramchandra M. Kotecha, Andriy Zakutayev, Wyatt K. Metzger, Paul Paret, Gilberto Moreno, Bidzina Kekelia, Kevin Bennion, Barry Mather, Sreekant Narumanchi, Samuel Kim, Samuel Graham

InterPACK 2019; V001T06A017https://doi.org/10.1115/IPACK2019-6453

Abstract

View Articletitled, Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

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Topics: Electronics , Energy gap , Gallium , Modeling

Degradation Modeling and Reliability Assessment of Capacitors

Anunay Gupta, Om Prakash Yadav, Arighna Roy, Douglas DeVoto, Joshua Major

InterPACK 2019; V001T06A018https://doi.org/10.1115/IPACK2019-6456

Abstract

View Articletitled, Degradation Modeling and Reliability Assessment of Capacitors

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Topics: Capacitors , Modeling , Reliability , Stochastic processes

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling

InterPACK 2019; V001T06A019https://doi.org/10.1115/IPACK2019-6461

Abstract

View Articletitled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

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Topics: Semiconductor wafers , Sensors , Silicon , Stress , Calibration , Errors , Approximation , Design , Electronics , High temperature

Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

Erick Gutierrez, Kevin Lin, Douglas DeVoto, Patrick McCluskey

InterPACK 2019; V001T06A020https://doi.org/10.1115/IPACK2019-6470

Abstract

View Articletitled, Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

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Topics: Gates (Closures) , Transistors

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm²) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson

InterPACK 2019; V001T06A021https://doi.org/10.1115/IPACK2019-6472

Abstract

View Articletitled, Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling

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Topics: Computational fluid dynamics , Computer cooling , Coolers , Heat flux , Manifolds , Microchannels , Silicon , Water

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Kirsten Lovelace, Sonya Smith

InterPACK 2019; V001T06A022https://doi.org/10.1115/IPACK2019-6499

Abstract

View Articletitled, Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

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Topics: Circuits , Sapphire , Silicon nitride ceramics , Thermal expansion

A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management

Justin Broughton, Yogendra Joshi

InterPACK 2019; V001T06A023https://doi.org/10.1115/IPACK2019-6519

Abstract

View Articletitled, A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management

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Topics: Additive manufacturing , Electronics , Metal foams , Modeling , Thermal management

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling

InterPACK 2019; V001T06A024https://doi.org/10.1115/IPACK2019-6521

Abstract

View Articletitled, Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

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Topics: Electrodiffusion , Failure , Lead-free solders

Thermal Analysis of High Efficiency High Speed Drives

Yasmin Khakpour, Weilun Warren Chen, Parikshith Channegowda, Matthew R. Pearson, Yongduk Lee, Luis Arnedo

InterPACK 2019; V001T06A025https://doi.org/10.1115/IPACK2019-6534

Abstract

View Articletitled, Thermal Analysis of High Efficiency High Speed Drives

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Topics: Thermal analysis

Advanced Packaging and Thermal Management of High-Power DC-DC Converters

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa

InterPACK 2019; V001T06A026https://doi.org/10.1115/IPACK2019-6559

Abstract

View Articletitled, Advanced Packaging and Thermal Management of High-Power DC-DC Converters

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Topics: Electronics , Packaging , Packaging density (Electronics) , Thermal management

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

InterPACK 2019; V001T06A027https://doi.org/10.1115/IPACK2019-6577

Abstract

View Articletitled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

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Topics: Alloys , Temperature , Lead-free solders , Solders , Finite element analysis , Avionics , Constitutive equations , Density , Electronic components , Electronics

Health Monitoring of PCB’s Under Mechanical Shock Loads

Pradeep Lall, Tony Thomas, Jeff Suhling, Ken Blecker

InterPACK 2019; V001T06A028https://doi.org/10.1115/IPACK2019-6578

Abstract

View Articletitled, Health Monitoring of PCB’s Under Mechanical Shock Loads

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Topics: Shock (Mechanics) , Stress , Signals , Failure , Damping , Statistical analysis , Strain gages , Strain measurement

Parametric and Sensitivity Analysis of Power Module Design

L. M. Boteler, M. C. Fish, M. S. Berman

InterPACK 2019; V001T06A029https://doi.org/10.1115/IPACK2019-6592

Abstract

View Articletitled, Parametric and Sensitivity Analysis of Power Module Design

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Topics: Design , Sensitivity analysis

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang

InterPACK 2019; V001T06A030https://doi.org/10.1115/IPACK2019-6631

Abstract

View Articletitled, Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

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Topics: Design , Modeling , Motor drives , Porous materials , Thermal analysis , Computational fluid dynamics , Simulation , Boundary-value problems , Convection , Electronics

Energy Conversion and Storage

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo

InterPACK 2019; V001T07A001https://doi.org/10.1115/IPACK2019-6325

Abstract

View Articletitled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

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Topics: Cooling , Experimental design

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez

InterPACK 2019; V001T07A002https://doi.org/10.1115/IPACK2019-6402

Abstract

View Articletitled, Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

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Topics: Alloys , Modeling , Shapes , Thermal management , Springs , Temperature , Solar energy , Deformation , Irradiation (Radiation exposure) , Actuators

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco

InterPACK 2019; V001T07A003https://doi.org/10.1115/IPACK2019-6520

Abstract

View Articletitled, Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

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Topics: Electronic packaging , Fatigue , Packaging , Simulation , Solders , Thermomechanics , Reliability , Climate , Architecture , Electronics

The Role of Interfacial Thermal Resistance in Li-Ion Battery Thermal Management

Chuanbo Yang, Lei Cao

InterPACK 2019; V001T07A004https://doi.org/10.1115/IPACK2019-6594

Abstract

View Articletitled, The Role of Interfacial Thermal Resistance in Li-Ion Battery Thermal Management

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Topics: Interfacial thermal resistance , Lithium-ion batteries , Modeling , Thermal management

Autonomous, Hybrid, and Electric Vehicles

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman

InterPACK 2019; V001T08A001https://doi.org/10.1115/IPACK2019-6347

Abstract

View Articletitled, Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

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Topics: Failure , Finite element analysis , Risk , Reliability , Engineering simulation , Finite element methods , Finite element model , Simulation , Algorithms , Circuits

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Madi Zholbaryssov, Azeem Sarwar

InterPACK 2019; V001T08A002https://doi.org/10.1115/IPACK2019-6423

Abstract

View Articletitled, Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

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Topics: Motors , Permanent magnets , Stators , Electric propulsion , Emissions , Maintenance , Winding (process) , Damage , Flaw detection , Mechanical admittance

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng

InterPACK 2019; V001T08A003https://doi.org/10.1115/IPACK2019-6429

Abstract

View Articletitled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

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Topics: Electronics , Hybrid electric vehicles , Reliability , Thermal management , Phase change materials , Cooling , Temperature , Electronic packaging , Heat , Automobiles

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin

InterPACK 2019; V001T08A004https://doi.org/10.1115/IPACK2019-6457

Abstract

View Articletitled, Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

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Topics: Convection , Impingement cooling , Machinery , Temperature , Transmission fluids

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Abdullah Fahim, S. M. Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2019; V001T08A005https://doi.org/10.1115/IPACK2019-6471

Abstract

View Articletitled, Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

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Topics: Creep , Nanoindentation , Solder joints , Testing

Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall

InterPACK 2019; V001T08A006https://doi.org/10.1115/IPACK2019-6560

Abstract

View Articletitled, Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

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Topics: Lead-free solders

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2019; V001T08A007https://doi.org/10.1115/IPACK2019-6561

Abstract

View Articletitled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

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Topics: Fatigue life , Finite element analysis , Materials properties , Modeling , Stress , Viscoelasticity , Temperature , Polymers , Simulation , Relaxation (Physics)