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Proceedings Papers

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Heterogeneous Integration: Micro-Systems With Diverse Functionality

2.5D/3D Integration

InterPACK 2017; V001T01A001doi:https://doi.org/10.1115/IPACK2017-74173
InterPACK 2017; V001T01A002doi:https://doi.org/10.1115/IPACK2017-74222

Additive and Advanced Manufacturing

InterPACK 2017; V001T01A003doi:https://doi.org/10.1115/IPACK2017-74059
InterPACK 2017; V001T01A004doi:https://doi.org/10.1115/IPACK2017-74092
InterPACK 2017; V001T01A005doi:https://doi.org/10.1115/IPACK2017-74306

Advanced Materials and Interfaces for Emerging Electronic Packaging Paradigms

InterPACK 2017; V001T01A006doi:https://doi.org/10.1115/IPACK2017-74090

Advanced Packaging, Interconnects and Substrate Technologies

InterPACK 2017; V001T01A007doi:https://doi.org/10.1115/IPACK2017-74010
InterPACK 2017; V001T01A008doi:https://doi.org/10.1115/IPACK2017-74026
InterPACK 2017; V001T01A009doi:https://doi.org/10.1115/IPACK2017-74133
InterPACK 2017; V001T01A010doi:https://doi.org/10.1115/IPACK2017-74266

Fracture, Fatigue, and Thermomechanical Reliability of Devices and Packages

InterPACK 2017; V001T01A011doi:https://doi.org/10.1115/IPACK2017-74017
InterPACK 2017; V001T01A012doi:https://doi.org/10.1115/IPACK2017-74082
InterPACK 2017; V001T01A013doi:https://doi.org/10.1115/IPACK2017-74097
InterPACK 2017; V001T01A014doi:https://doi.org/10.1115/IPACK2017-74099
InterPACK 2017; V001T01A015doi:https://doi.org/10.1115/IPACK2017-74177
InterPACK 2017; V001T01A016doi:https://doi.org/10.1115/IPACK2017-74201
InterPACK 2017; V001T01A017doi:https://doi.org/10.1115/IPACK2017-74233
InterPACK 2017; V001T01A018doi:https://doi.org/10.1115/IPACK2017-74249
InterPACK 2017; V001T01A019doi:https://doi.org/10.1115/IPACK2017-74278
InterPACK 2017; V001T01A020doi:https://doi.org/10.1115/IPACK2017-74279

Microelectronics and Optoelectronic Systems Integration

InterPACK 2017; V001T01A021doi:https://doi.org/10.1115/IPACK2017-74195
InterPACK 2017; V001T01A022doi:https://doi.org/10.1115/IPACK2017-74252

Thermal Management for Heterogeneous Integration

InterPACK 2017; V001T01A023doi:https://doi.org/10.1115/IPACK2017-74080
InterPACK 2017; V001T01A024doi:https://doi.org/10.1115/IPACK2017-74107
InterPACK 2017; V001T01A025doi:https://doi.org/10.1115/IPACK2017-74137
InterPACK 2017; V001T01A026doi:https://doi.org/10.1115/IPACK2017-74179
InterPACK 2017; V001T01A027doi:https://doi.org/10.1115/IPACK2017-74196
InterPACK 2017; V001T01A028doi:https://doi.org/10.1115/IPACK2017-74224

Servers of the Future

Data Centers and Energy Efficient HPC Concepts

InterPACK 2017; V001T02A001doi:https://doi.org/10.1115/IPACK2017-74020
InterPACK 2017; V001T02A002doi:https://doi.org/10.1115/IPACK2017-74028
InterPACK 2017; V001T02A003doi:https://doi.org/10.1115/IPACK2017-74030
InterPACK 2017; V001T02A004doi:https://doi.org/10.1115/IPACK2017-74033
InterPACK 2017; V001T02A005doi:https://doi.org/10.1115/IPACK2017-74055
InterPACK 2017; V001T02A006doi:https://doi.org/10.1115/IPACK2017-74108
InterPACK 2017; V001T02A007doi:https://doi.org/10.1115/IPACK2017-74148
InterPACK 2017; V001T02A008doi:https://doi.org/10.1115/IPACK2017-74174
InterPACK 2017; V001T02A009doi:https://doi.org/10.1115/IPACK2017-74181
InterPACK 2017; V001T02A010doi:https://doi.org/10.1115/IPACK2017-74184
InterPACK 2017; V001T02A011doi:https://doi.org/10.1115/IPACK2017-74254
InterPACK 2017; V001T02A012doi:https://doi.org/10.1115/IPACK2017-74295
InterPACK 2017; V001T02A013doi:https://doi.org/10.1115/IPACK2017-74337
InterPACK 2017; V001T02A014doi:https://doi.org/10.1115/IPACK2017-74341

Modeling and Simulation

InterPACK 2017; V001T02A015doi:https://doi.org/10.1115/IPACK2017-74016
InterPACK 2017; V001T02A016doi:https://doi.org/10.1115/IPACK2017-74021
InterPACK 2017; V001T02A017doi:https://doi.org/10.1115/IPACK2017-74081
InterPACK 2017; V001T02A018doi:https://doi.org/10.1115/IPACK2017-74098
InterPACK 2017; V001T02A019doi:https://doi.org/10.1115/IPACK2017-74105
InterPACK 2017; V001T02A020doi:https://doi.org/10.1115/IPACK2017-74129
InterPACK 2017; V001T02A021doi:https://doi.org/10.1115/IPACK2017-74339

Thermal Management and Advanced Heat Spreading Concepts for 2D, 2.5D, and 3D Architectures

InterPACK 2017; V001T02A022doi:https://doi.org/10.1115/IPACK2017-74025
InterPACK 2017; V001T02A023doi:https://doi.org/10.1115/IPACK2017-74119
InterPACK 2017; V001T02A024doi:https://doi.org/10.1115/IPACK2017-74158
InterPACK 2017; V001T02A025doi:https://doi.org/10.1115/IPACK2017-74287

Structural and Physical Health Monitoring

Mechanical Reliability Issues in Flexible and Printed Electronics

InterPACK 2017; V001T03A001doi:https://doi.org/10.1115/IPACK2017-74178
InterPACK 2017; V001T03A002doi:https://doi.org/10.1115/IPACK2017-74232
InterPACK 2017; V001T03A003doi:https://doi.org/10.1115/IPACK2017-74264

Novel Sensors and Packaging for Structural and Health Monitoring

InterPACK 2017; V001T03A004doi:https://doi.org/10.1115/IPACK2017-74058
InterPACK 2017; V001T03A005doi:https://doi.org/10.1115/IPACK2017-74150
InterPACK 2017; V001T03A006doi:https://doi.org/10.1115/IPACK2017-74191
InterPACK 2017; V001T03A007doi:https://doi.org/10.1115/IPACK2017-74239
InterPACK 2017; V001T03A008doi:https://doi.org/10.1115/IPACK2017-74269
InterPACK 2017; V001T03A009doi:https://doi.org/10.1115/IPACK2017-74304

Energy Conversion and Storage

Batteries and Storage Devices

InterPACK 2017; V001T04A001doi:https://doi.org/10.1115/IPACK2017-74118
InterPACK 2017; V001T04A002doi:https://doi.org/10.1115/IPACK2017-74244

Harsh Environment and High Temperature Electronics

InterPACK 2017; V001T04A003doi:https://doi.org/10.1115/IPACK2017-74138
InterPACK 2017; V001T04A004doi:https://doi.org/10.1115/IPACK2017-74169

Photovoltaics, Thermoelectrics, Energy Harvesting Devices

InterPACK 2017; V001T04A005doi:https://doi.org/10.1115/IPACK2017-74015
InterPACK 2017; V001T04A006doi:https://doi.org/10.1115/IPACK2017-74112
InterPACK 2017; V001T04A007doi:https://doi.org/10.1115/IPACK2017-74147
InterPACK 2017; V001T04A008doi:https://doi.org/10.1115/IPACK2017-74212
InterPACK 2017; V001T04A009doi:https://doi.org/10.1115/IPACK2017-74243

Power Electronics Wide Band Gap Semiconductors, Packaging, Module Assembly and Thermal Management

InterPACK 2017; V001T04A010doi:https://doi.org/10.1115/IPACK2017-74095
InterPACK 2017; V001T04A011doi:https://doi.org/10.1115/IPACK2017-74125
InterPACK 2017; V001T04A012doi:https://doi.org/10.1115/IPACK2017-74130
InterPACK 2017; V001T04A013doi:https://doi.org/10.1115/IPACK2017-74132
InterPACK 2017; V001T04A014doi:https://doi.org/10.1115/IPACK2017-74163
InterPACK 2017; V001T04A015doi:https://doi.org/10.1115/IPACK2017-74213

Transportation: Autonomous and Electric Vehicles

Device to System Level Reliability

InterPACK 2017; V001T05A001doi:https://doi.org/10.1115/IPACK2017-74190
InterPACK 2017; V001T05A002doi:https://doi.org/10.1115/IPACK2017-74245
InterPACK 2017; V001T05A003doi:https://doi.org/10.1115/IPACK2017-74273

High Temperature Electronics

InterPACK 2017; V001T05A004doi:https://doi.org/10.1115/IPACK2017-74286
InterPACK 2017; V001T05A005doi:https://doi.org/10.1115/IPACK2017-74322
InterPACK 2017; V001T05A006doi:https://doi.org/10.1115/IPACK2017-74325

Simulation and Test Methods

InterPACK 2017; V001T05A007doi:https://doi.org/10.1115/IPACK2017-74073
InterPACK 2017; V001T05A008doi:https://doi.org/10.1115/IPACK2017-74208
InterPACK 2017; V001T05A009doi:https://doi.org/10.1115/IPACK2017-74300

Thermal Management of Electric Motors and Power Systems

InterPACK 2017; V001T05A010doi:https://doi.org/10.1115/IPACK2017-74096
InterPACK 2017; V001T05A011doi:https://doi.org/10.1115/IPACK2017-74149
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