Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems

August 29–September 1, 2017

San Francisco, California, USA

Conference Sponsors:

ISBN:

978-0-7918-5809-7

In This Volume

Heterogeneous Integration: Micro-Systems With Diverse Functionality (28)
Servers of the Future (25)
Structural and Physical Health Monitoring (9)
- Mechanical Reliability Issues in Flexible and Printed Electronics (3)
- Novel Sensors and Packaging for Structural and Health Monitoring (6)
Energy Conversion and Storage (15)
Transportation: Autonomous and Electric Vehicles (11)

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Heterogeneous Integration: Micro-Systems With Diverse Functionality

2.5D/3D Integration

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan

InterPACK 2017; V001T01A001doi:https://doi.org/10.1115/IPACK2017-74173

Abstract

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Topics: Lasers , Manufacturing , Microscale devices , Sintering , Fluence (Radiation measurement) , Additive manufacturing , Copper , Density , Design , Energy dissipation

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins

InterPACK 2017; V001T01A002doi:https://doi.org/10.1115/IPACK2017-74222

Abstract

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Topics: Temperature distribution , Electronic packaging , Packaging , Power density , Power semiconductor devices , Power conversion systems , Temperature , Computer simulation , Density , Gallium nitride

Additive and Advanced Manufacturing

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

InterPACK 2017; V001T01A003doi:https://doi.org/10.1115/IPACK2017-74059

Abstract

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Topics: Current density , Damage , Electrodiffusion , Metals , Evaluation methods , Atoms , Circuit design , Computer simulation , Density , Electrons

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki

InterPACK 2017; V001T01A004doi:https://doi.org/10.1115/IPACK2017-74092

Abstract

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Topics: Current density , Damage , Electrodiffusion , Reservoirs , Shapes , Density , Anodes , Computer simulation

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt

InterPACK 2017; V001T01A005doi:https://doi.org/10.1115/IPACK2017-74306

Abstract

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Topics: Additive manufacturing , Copper , Electrical conductivity , Thermal conductivity , Engines , Motors , Electromagnetic induction , Machinery , Aerospace industry , Electric vehicles

Advanced Materials and Interfaces for Emerging Electronic Packaging Paradigms

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2017; V001T01A006doi:https://doi.org/10.1115/IPACK2017-74090

Abstract

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Topics: Boiling , Copper , Heat transfer , Bubbles , Critical heat flux , Cooling , Heat transfer coefficients , Microscale devices , Nucleation (Physics) , Optical images

Advanced Packaging, Interconnects and Substrate Technologies

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda

InterPACK 2017; V001T01A007doi:https://doi.org/10.1115/IPACK2017-74010

Abstract

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Topics: Adhesives , Pressure , Semiconductor wafers , Ultraviolet radiation , String , Finite element analysis , Deformation , Elongation , Finite element model , Fracture (Materials)

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang

InterPACK 2017; V001T01A008doi:https://doi.org/10.1115/IPACK2017-74026

Abstract

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Topics: Ball-Grid-Array packaging , Copper , Cracking (Materials) , Delamination , Failure , Flip-chip , Flip-chip assemblies , Flip-chip devices , Flip-chip packages , Fracture (Process)

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta

InterPACK 2017; V001T01A009doi:https://doi.org/10.1115/IPACK2017-74133

Abstract

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Topics: Solders , Anisotropy , Tin , Solder joints , Ball-Grid-Array packaging , Crystals , Temperature , Alloys , Composite materials , Cooling

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2017; V001T01A010doi:https://doi.org/10.1115/IPACK2017-74266

Abstract

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Topics: Lead-free solders , Tin , Cross section (Physics) , Microscopy , Particulate matter , Cooling , Intermetallic compounds , Nanoindentation , Polishing , Scanning electron microscopy

Fracture, Fatigue, and Thermomechanical Reliability of Devices and Packages

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park

InterPACK 2017; V001T01A011doi:https://doi.org/10.1115/IPACK2017-74017

Abstract

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Topics: Delamination , Reflow soldering , Fracture (Materials) , Stress , Vapor pressure , Ball-Grid-Array packages , Displacement , Finite element analysis , Fracture mechanics , Lead-free solders

Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Min Pei, Guru Arakere, Milena Vujosevic

InterPACK 2017; V001T01A012doi:https://doi.org/10.1115/IPACK2017-74082

Abstract

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Topics: Ball-Grid-Array packaging , Shock (Mechanics) , Failure , Physics , Computer simulation , Deformation , Design , Stress

The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height

Keiji Matsumoto, Keishi Okamoto, Hiroyuki Mori

InterPACK 2017; V001T01A013doi:https://doi.org/10.1115/IPACK2017-74097

Abstract

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Topics: Manufacturing , Solders , Stress , Delamination , Relaxation (Physics) , Simulation

Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Takahiro Kinoshita, Takashi Kawakami, Tadaharu Adachi, Masahiro Funaki

InterPACK 2017; V001T01A014doi:https://doi.org/10.1115/IPACK2017-74099

Abstract

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Topics: Capacitors , Ceramics , Design , Stress , Finite element methods , Computer simulation , Pressure

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori

InterPACK 2017; V001T01A015doi:https://doi.org/10.1115/IPACK2017-74177

Abstract

View Article

Topics: Fatigue cracks , Synchrotron radiation , X-rays , Solders , Fracture (Materials) , Nondestructive evaluation , Ceramics , Crack propagation , Cycles , Delamination

Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

Yiran Li, Yuvraj Singh, Ganesh Subbarayan

InterPACK 2017; V001T01A016doi:https://doi.org/10.1115/IPACK2017-74201

Abstract

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Topics: Alloys , Fatigue , Solders , Damage , Tin , Creep , Constitutive equations , Energy dissipation , Entropy , Fatigue damage

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling

InterPACK 2017; V001T01A017doi:https://doi.org/10.1115/IPACK2017-74233

Abstract

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Topics: Alloys , High temperature , Lead-free solders , Vibration , Temperature , Electronics , Vehicles , Solder joints , Solders , Automotive industry

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman

InterPACK 2017; V001T01A018doi:https://doi.org/10.1115/IPACK2017-74249

Abstract

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Topics: Ball-Grid-Array packaging , Corners (Structural elements) , Fatigue life , Solder joints , Solders , Adhesives , Failure , Materials properties , Stress , Temperature

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer

InterPACK 2017; V001T01A019doi:https://doi.org/10.1115/IPACK2017-74278

Abstract

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Topics: Manufacturing , Testing , Reliability , Stress , Lumber , Temperature , Failure , Finite element analysis , Young's modulus , Computation

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer

InterPACK 2017; V001T01A020doi:https://doi.org/10.1115/IPACK2017-74279

Abstract

View Article

Topics: Event history analysis , Wire , Reliability , Failure , Solders , Copper , Dielectric materials , Manufacturing , Microelectronic devices , Solder joints

Microelectronics and Optoelectronic Systems Integration

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo

InterPACK 2017; V001T01A021doi:https://doi.org/10.1115/IPACK2017-74195

Abstract

View Article

Topics: Light-emitting diodes , Phosphors , Shapes , Geometry , Coating processes , Coatings , Computer simulation , Fluids , Temperature

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Pradeep Lall, Amrit Abrol, David Locker

InterPACK 2017; V001T01A022doi:https://doi.org/10.1115/IPACK2017-74252

Abstract

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Topics: Microelectromechanical systems , Microphones , Reliability , Temperature , High temperature , Service life (Equipment) , Analytical methods , Engineers , Failure analysis , Failure mechanisms

Thermal Management for Heterogeneous Integration

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss

InterPACK 2017; V001T01A023doi:https://doi.org/10.1115/IPACK2017-74080

Abstract

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Topics: Computer cooling , Radar , Cooling , Heat flux , Defense industry , Design , Electronics , Refrigerants , Two-phase flow , Analytical methods

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi

InterPACK 2017; V001T01A024doi:https://doi.org/10.1115/IPACK2017-74107

Abstract

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Topics: Electrohydrodynamics , Heat conduction , Microscale devices , Performance characterization , Pumps , Electrodes , Fluids , Electronics , Flow (Dynamics) , Aerospace industry

Advanced Cooling of 3D ICs With Nanoparticle Packings

Anil Yuksel, Paul S. Ho, Jayathi Murthy

InterPACK 2017; V001T01A025doi:https://doi.org/10.1115/IPACK2017-74137

Abstract

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Topics: Cooling , Nanoparticles , Packings (Cushioning) , Energy dissipation , Heat , Thermal management , Dimensions , High temperature , Phonons , Polaritons

The Effect of Surface Texture on Thermal Sensation and Comfort

Han Zhang, Alan Hedge

InterPACK 2017; V001T01A026doi:https://doi.org/10.1115/IPACK2017-74179

Abstract

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Topics: Computers , Heat , Surface roughness , Surface texture , Surfaces (Materials) , Temperature

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo

InterPACK 2017; V001T01A027doi:https://doi.org/10.1115/IPACK2017-74196

Abstract

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Topics: Composite materials , Optimization , Phase change materials , Thermal management , Thermal conductivity , Latent heat , Temperature , Heat flux , Cooling , Graphite

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua

InterPACK 2017; V001T01A028doi:https://doi.org/10.1115/IPACK2017-74224

Abstract

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Topics: Heat conduction , Heat transfer , Integrated circuits , Interpolation , Temperature sensors , Temperature , Optimization , Sensors , Finite element analysis , Genetic algorithms

Servers of the Future

Data Centers and Energy Efficient HPC Concepts

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon

InterPACK 2017; V001T02A001doi:https://doi.org/10.1115/IPACK2017-74020

Abstract

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Topics: Cooling systems , Electronics , Experimental analysis , Secondary cells , Boiling , Computer cooling , Condensers (steam plant) , Cooling , Cylinders , Electronic components

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton

InterPACK 2017; V001T02A002doi:https://doi.org/10.1115/IPACK2017-74028

Abstract

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Topics: Cooling , Failure , Water , Energy consumption , Fans , Pumps , Data centers , Density , Heat , Redundancy (Engineering)

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome

InterPACK 2017; V001T02A003doi:https://doi.org/10.1115/IPACK2017-74030

Abstract

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Topics: Cooling , Modeling , Simulation , Heat , Density , Energy dissipation , Flow (Dynamics) , Temperature , Water , Acoustics

An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem

Chun Wang, Xiaoguang Sun, Jun Zhang, Nishi Ahuja

InterPACK 2017; V001T02A004doi:https://doi.org/10.1115/IPACK2017-74033

Abstract

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Topics: Batteries , Design , Data centers , Energy efficiency , Energy consumption , Data collection , Design methodology , Lead-acid batteries , Optimization , Topology

Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions

Devdatta Kulkarni, Sandeep Ahuja, Sanjoy Saha

InterPACK 2017; V001T02A005doi:https://doi.org/10.1115/IPACK2017-74055

Abstract

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Topics: Boundary-value problems , Cooling , Data centers , Design , Heat pipes

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda

InterPACK 2017; V001T02A006doi:https://doi.org/10.1115/IPACK2017-74108

Abstract

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Topics: Computational fluid dynamics , Data centers , Tiles , Flow (Dynamics) , Cooling , Temperature , Fans , Pressure , Actuators , Air conditioning

Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure

Kourosh Nemati, Husam A. Alissa, Mohammad I. Tradat, Bahgat Sammakia

InterPACK 2017; V001T02A007doi:https://doi.org/10.1115/IPACK2017-74148

Abstract

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Topics: Doors , Failure , Heat exchangers , Transients (Dynamics) , Water , Cooling , Data centers , Temperature , Density , Flow (Dynamics)

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia

InterPACK 2017; V001T02A008doi:https://doi.org/10.1115/IPACK2017-74174

Abstract

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Topics: Cooling systems , Data centers , Failure analysis , Failure , Temperature , Coolants , Cooling , Fans , High temperature , Leakage

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright

InterPACK 2017; V001T02A009doi:https://doi.org/10.1115/IPACK2017-74181

Abstract

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Topics: Photonics , Silicon , Thermal resistance , Etching , Silicon-on-insulator , Cladding systems (Building) , Thermal conductivity , Aluminum , Crystals , Diffusion (Physics)

Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices

Shenghui Lei, Ertugrul Kardemir, David McCloskey, John F. Donegan, Ryan Enright

InterPACK 2017; V001T02A010doi:https://doi.org/10.1115/IPACK2017-74184

Abstract

View Article

Topics: Flat heat pipes , Photonic equipment , Thermomechanics , Thin films , Stress , Waveguides , Cladding systems (Building) , Design , Failure , Polymers

CFD Optimization of the Cooling of Yosemite Open Compute Server

Aditya Gupta, Ananthavijayan Sridhar, Dereje Agonafer

InterPACK 2017; V001T02A011doi:https://doi.org/10.1115/IPACK2017-74254

Abstract

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Topics: Computational fluid dynamics , Cooling , Optimization , Air flow , Data centers , Design , Energy consumption , Flow (Dynamics) , Fans , Modeling

Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling

Fatemeh Tavakkoli, Siavash Ebrahimi, Xiaogang Sun, Yan Cui, Ali Heydari

InterPACK 2017; V001T02A012doi:https://doi.org/10.1115/IPACK2017-74295

Abstract

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Topics: Data centers , Design , Evaporative cooling , Performance evaluation , Cooling , Computational fluid dynamics , Water , Air flow , Air pollution , Cooling systems

True Concurrent Modulation of a Multi-Channel Ring Modulator Transmitter Driven by a Comb Laser

Ashkan Seyedi, Marco Fiorentino, Ray Beausoleil

InterPACK 2017; V001T02A013doi:https://doi.org/10.1115/IPACK2017-74337

Abstract

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Topics: Lasers , Quantum dots

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

Yusuke Nakajo, Hiroaki Nishi

InterPACK 2017; V001T02A014doi:https://doi.org/10.1115/IPACK2017-74341

Abstract

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Topics: Cycles , Temperature , Data centers , Stress , Air conditioning , Failure , Heat , Maintenance , Semiconductors (Materials) , Energy consumption

Modeling and Simulation

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

Manasa Sahini, Dereje Agonafer, Vijayalan Pandiyan

InterPACK 2017; V001T02A015doi:https://doi.org/10.1115/IPACK2017-74016

Abstract

View Article

Topics: Computational fluid dynamics , Containment , Cooling , Cooling systems , Data centers , Design , Exhaust systems , Fans , Flow (Dynamics) , Hardware

Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions

Emad A. Poshtan, Sudarshan Hegde, Andreas Roessle

InterPACK 2017; V001T02A016doi:https://doi.org/10.1115/IPACK2017-74021

Abstract

View Article

Topics: Dynamic testing (Materials) , Electronic components , Mechanical behavior , Capacitors , Flat heat pipes , Heat , Materials properties , Reliability , Thermomechanics

Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification

Min Pei, Milena Vujosevic, Sibasish Mukherjee

InterPACK 2017; V001T02A017doi:https://doi.org/10.1115/IPACK2017-74081

Abstract

View Article

Topics: Temperature , Ball-Grid-Array packaging , Fluctuations (Physics) , Accounting , Damage , Engineering standards , Failure , Physics , Reliability , Risk assessment

Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations

Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori

InterPACK 2017; V001T02A018doi:https://doi.org/10.1115/IPACK2017-74098

Abstract

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Topics: Manufacturing , Materials properties , Warping , Copper , Design , Finite element analysis , Simulation , Young's modulus , Errors , Flip-chip

Comparison and Evaluation of Different Monitoring Methods in a Data Center Environment

M. Tradat, S. Khalili, B. Sammakia, M. Ibrahim, Th. Peddle, A. Calder, B. Dawson, M. Seymour, K. Nemati, H. Alissa

InterPACK 2017; V001T02A019doi:https://doi.org/10.1115/IPACK2017-74105

Abstract

View Article

Topics: Data centers , Temperature , Cooling , Data collection , Sensors , Reliability , Sensor networks

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

InterPACK 2017; V001T02A020doi:https://doi.org/10.1115/IPACK2017-74129

Abstract

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Topics: Mechanical properties , Network models , Particulate matter , Thermal conductivity , Brittleness , Computer simulation , Elastic moduli , Heat , Heat sinks , Particle size

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia

InterPACK 2017; V001T02A021doi:https://doi.org/10.1115/IPACK2017-74339

Abstract

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Topics: Design , Tiles , Air flow , Computational fluid dynamics , Containment , Cooling , Data centers , Density , Engineering simulation , Flow (Dynamics)

Thermal Management and Advanced Heat Spreading Concepts for 2D, 2.5D, and 3D Architectures

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Sriram Chandrasekaran, Sushil Bhavnani

InterPACK 2017; V001T02A022doi:https://doi.org/10.1115/IPACK2017-74025

Abstract

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Topics: Flow (Dynamics) , Nucleation (Physics) , Cooling , Boiling , Data centers , Fluids , Silicon , Bubbles , Electronics , Energy consumption

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma

InterPACK 2017; V001T02A023doi:https://doi.org/10.1115/IPACK2017-74119

Abstract

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Topics: Heat pipes , Computer cooling , Heat , Oscillations , Vapors , Bubbles , Construction , Design , Flux (Metallurgy) , Heat transfer

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi

InterPACK 2017; V001T02A024doi:https://doi.org/10.1115/IPACK2017-74158

Abstract

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Topics: Bonding , Cooling , Design , Manifolds , Microchannels , Heat flux , Electronics , Fluids , Manufacturing , Computational fluid dynamics

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi

InterPACK 2017; V001T02A025doi:https://doi.org/10.1115/IPACK2017-74287

Abstract

View Article

Topics: Geometry , Two-phase flow , Cooling , Heat , Boiling , Evaporation , Flow (Dynamics) , Manifolds , Cooling systems , Design

Structural and Physical Health Monitoring

Mechanical Reliability Issues in Flexible and Printed Electronics

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

Arsalan Nikdoost, Alican Ozkan, Yusuf Kelestemur, Hilmi Volkan Demir, E. Yegan Erdem

InterPACK 2017; V001T03A001doi:https://doi.org/10.1115/IPACK2017-74178

Abstract

View Article

Topics: Drops , Nanoparticles , Coating processes , Coatings , Microfluidics , Particulate matter , Quantum dots

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Pradeep Lall, Hao Zhang, Rahul Lall

InterPACK 2017; V001T03A002doi:https://doi.org/10.1115/IPACK2017-74232

Abstract

View Article

Topics: Biometry , Design , Flexible electronics , Sensors , Electronics , Manufacturing , Reliability , Thermal stresses , Biomedicine , Copper

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal

InterPACK 2017; V001T03A003doi:https://doi.org/10.1115/IPACK2017-74264

Abstract

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Topics: Printed circuit boards , Reliability , Solders , X-rays , Deformation , Electronics , Manufacturing , Solder joints , Computerized tomography , Heating

Novel Sensors and Packaging for Structural and Health Monitoring

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz

InterPACK 2017; V001T03A004doi:https://doi.org/10.1115/IPACK2017-74058

Abstract

View Article

Topics: Electronic systems , Sensors , Silicon , Stress , Algorithms , Delamination , Failure , Vehicles , Accelerated life testing , Acoustics

Peel-and-Stick Sensors Powered by Directed RF Energy

Christopher Lalau-Keraly, George Daniel, Joseph Lee, David Schwartz

InterPACK 2017; V001T03A005doi:https://doi.org/10.1115/IPACK2017-74150

Abstract

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Topics: Sensors , Building management systems , Design , Dimensions , Energy harvesting , Flexible electronics , Signals , Temperature

Monitoring Fugitive Methane Gas Emission From Natural Gas Pads

Levente J. Klein, Ted van Kessel, Dhruv Nair, Ramachandran Muralidhar, Hendrik Hamann, Norma Sosa

InterPACK 2017; V001T03A006doi:https://doi.org/10.1115/IPACK2017-74191

Abstract

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Topics: Emissions , Methane , Natural gas , Leakage , Sensors , Plumes (Fluid dynamics) , Governments , Maintenance , Regulations , Wind

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas

InterPACK 2017; V001T03A007doi:https://doi.org/10.1115/IPACK2017-74239

Abstract

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Topics: Stress , Temperature , Vibration , Failure , Signals , Time-frequency analysis , Algorithms , Independent component analysis , Dimensions , Filtration

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep

InterPACK 2017; V001T03A008doi:https://doi.org/10.1115/IPACK2017-74269

Abstract

View Article

Topics: Damage , Shock (Mechanics) , X-rays , Reliability , Deformation , Failure , Imaging , Manufacturing , Nondestructive evaluation , Service life (Equipment)

Edge Computing and Contextual Information for the Internet of Things Sensors

Lavanya Turlapati, Nigel Hinds, Dhruv Nair, Levente J. Klein

InterPACK 2017; V001T03A009doi:https://doi.org/10.1115/IPACK2017-74304

Abstract

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Topics: Internet of things , Sensors , Wind , Computation , Internet , Methane , Modeling , Plumes (Fluid dynamics) , Sensor placement , Signals

Energy Conversion and Storage

Batteries and Storage Devices

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero

InterPACK 2017; V001T04A001doi:https://doi.org/10.1115/IPACK2017-74118

Abstract

View Article

Topics: Phase change materials , Heat , Silicon nitride ceramics , Temperature , Cooling , Cooling systems , Cycles , Inspection , Optical quality control , Temperature profiles

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham

InterPACK 2017; V001T04A002doi:https://doi.org/10.1115/IPACK2017-74244

Abstract

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Topics: Composite materials , Graphite , Latent heat , Optimization , Storage , Density , Temperature , Heat , Power density , Thermal conductivity

Harsh Environment and High Temperature Electronics

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi

InterPACK 2017; V001T04A003doi:https://doi.org/10.1115/IPACK2017-74138

Abstract

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Topics: Cracking (Materials) , Fracture (Process) , High temperature , Simulation , Thermomechanics , Transients (Dynamics) , Tension-leg platforms , Stress , Fracture (Materials) , Tin

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

InterPACK 2017; V001T04A004doi:https://doi.org/10.1115/IPACK2017-74169

Abstract

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Topics: Electronics , High temperature , Alloys , Fracture (Materials) , Deformation , Shear strength , Solders , Tension , Thermal conductivity , Brittleness

Photovoltaics, Thermoelectrics, Energy Harvesting Devices

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers

Kayvan Abbasi, Sukhvinder Kang

InterPACK 2017; V001T04A005doi:https://doi.org/10.1115/IPACK2017-74015

Abstract

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Topics: Steady state , Thermoelectric coolers , Transients (Dynamics) , Thermal resistance , Eigenfunctions , Eigenvalues , Insulation , Thermal systems

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

InterPACK 2017; V001T04A006doi:https://doi.org/10.1115/IPACK2017-74112

Abstract

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Topics: Electronics , Flow control , Heat , Metamaterials , Flow (Dynamics) , Anisotropy , Blocks (Building materials) , Circuit design , Composite materials , Design

High-Performance Microchannels Development Using Magnetic Stabilization

Seth Newport, Geoffrey Ormston, Michael Benedict, Ayyoub Mehdizadeh Momen

InterPACK 2017; V001T04A007doi:https://doi.org/10.1115/IPACK2017-74147

Abstract

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Topics: Microchannels , Particulate matter , Pressure drop , Heat transfer , Ferrites (Magnetic materials) , Flow (Dynamics) , Heat , Manufacturing , Mass transfer , Packing (Shipments)

Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap

Mahmoud Elzouka, Sidy Ndao

InterPACK 2017; V001T04A008doi:https://doi.org/10.1115/IPACK2017-74212

Abstract

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Topics: Crystals , Thermal radiation , Heat transfer , Heat , Flow (Dynamics) , Radiative heat transfer , Vacuum , Electronics , Engineering prototypes , Numerical analysis

Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation

Viral K. Patel, Kyle R. Gluesenkamp

InterPACK 2017; V001T04A009doi:https://doi.org/10.1115/IPACK2017-74243

Abstract

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Topics: Design , Drying , Electrical resistance , Energy consumption , Energy efficiency , Engineering prototypes , Heat pumps , Heating , Modeling , Optimization

Power Electronics Wide Band Gap Semiconductors, Packaging, Module Assembly and Thermal Management

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

Joon Hong Boo, Hyun Gon Kim, Chang Woo Han

InterPACK 2017; V001T04A010doi:https://doi.org/10.1115/IPACK2017-74095

Abstract

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Topics: Computer cooling , Heat pipes , Stress , Thermal resistance , Fluids , Wire screens , Containers , Cooling , Copper , Density

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO₂ Passivation

Dogacan Kara, F. Nazli Donmezer Akgun

InterPACK 2017; V001T04A011doi:https://doi.org/10.1115/IPACK2017-74125

Abstract

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Topics: Gallium nitride , Plates (structures) , Collapse , Electrons , Heating , Reliability , Electric fields , Electron mobility , Engineering simulation , Joules

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner

InterPACK 2017; V001T04A012doi:https://doi.org/10.1115/IPACK2017-74130

Abstract

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Topics: Packaging , Stress , Finite element analysis , Design , Matlab , Temperature , Thermal stresses , Computer-aided design , Resistors , Computer-aided engineering

Integrated Vapor Chamber Heat Spreader for Power Module Applications

Clayton L. Hose, Dimeji Ibitayo, Lauren M. Boteler, Jens Weyant, Bradley Richard

InterPACK 2017; V001T04A013doi:https://doi.org/10.1115/IPACK2017-74132

Abstract

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Topics: Flat heat pipes , Vapors , Heat , Heat flux , Copper , Electronics , Flux (Metallurgy) , Thermal resistance , Flow (Dynamics) , Modeling

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham

InterPACK 2017; V001T04A014doi:https://doi.org/10.1115/IPACK2017-74163

Abstract

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Topics: Electronics , Synthetic diamonds , Thermal conductivity , Thermal management , Diamonds , Chemical vapor deposition , Electron backscatter diffraction , Lasers , Boron , Heat flux

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth

InterPACK 2017; V001T04A015doi:https://doi.org/10.1115/IPACK2017-74213

Abstract

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Topics: Packaging , Silicon , Wire , MOSFET transistors , Bonding , Electromagnetic interference , Electronics , Energy gap , Flip-chip , High temperature

Transportation: Autonomous and Electric Vehicles

Device to System Level Reliability

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

InterPACK 2017; V001T05A001doi:https://doi.org/10.1115/IPACK2017-74190

Abstract

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Topics: Electronic components , Failure , Vibration , Engineering standards , Reliability , Damage , Electronics , Failure mechanisms , Risk , Roads

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink

InterPACK 2017; V001T05A002doi:https://doi.org/10.1115/IPACK2017-74245

Abstract

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Topics: Design , Electric vehicles , Reliability , Thermomechanics , Stress , Vehicles , Electronics , Failure , Physics , Batteries

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

InterPACK 2017; V001T05A003doi:https://doi.org/10.1115/IPACK2017-74273

Abstract

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Topics: Electronic packages , Polymers , Stress , Reliability , Simulation , Weight (Mass) , Absorption , Ball-Grid-Array packaging , Corrosion , Cracking (Materials)

High Temperature Electronics

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey

InterPACK 2017; V001T05A004doi:https://doi.org/10.1115/IPACK2017-74286

Abstract

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Topics: Silver , Wire bonding , Copper , Wire , Reliability , Bonding , Corrosion , Light-emitting diodes , Palladium , Aerospace industry

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep

InterPACK 2017; V001T05A005doi:https://doi.org/10.1115/IPACK2017-74322

Abstract

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Topics: Bending (Stress) , Delamination , Epoxy adhesives , Epoxy resins , Fracture toughness , Temperature , Fracture (Materials) , Elongation , Shock (Mechanics) , Failure

Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature

Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen

InterPACK 2017; V001T05A006doi:https://doi.org/10.1115/IPACK2017-74325

Abstract

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Topics: Aluminum , Copper , Electronics , High temperature , Ionic mobility , Wire , Corrosion , Diffusion (Physics) , Gates (Closures) , Bonding

Simulation and Test Methods

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman

InterPACK 2017; V001T05A007doi:https://doi.org/10.1115/IPACK2017-74073

Abstract

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Topics: Delamination , Electronic packaging , Fracture (Materials) , Simulation , Electronic packages , Copper , Finite element analysis , Fracture mechanics , Risk , Stress

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

InterPACK 2017; V001T05A008doi:https://doi.org/10.1115/IPACK2017-74208

Abstract

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Topics: Electronics , Reliability , Safety , Automotive industry , Failure , Vehicles , Actuators , Computation , Design , Electric vehicles

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker

InterPACK 2017; V001T05A009doi:https://doi.org/10.1115/IPACK2017-74300

Abstract

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Topics: Alloys , Storage , High temperature , Solders , Temperature , Deformation , Electronics , Operating temperature , Constitutive equations , Elastic moduli

Thermal Management of Electric Motors and Power Systems

Electro-Thermal Simulation of Interconnected Systems at Transient Operating Conditions

Torsten Hauck, Vibhash Jha, J. H. J. Janssen

InterPACK 2017; V001T05A010doi:https://doi.org/10.1115/IPACK2017-74096

Abstract

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Topics: Simulation , Transients (Dynamics) , Finite element model , Boundary-value problems , Computational fluid dynamics , Computational methods , Design , Dynamic systems , Optimization

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham

InterPACK 2017; V001T05A011doi:https://doi.org/10.1115/IPACK2017-74149

Abstract

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Topics: Gallium nitride , Steady state , Thermal characterization , Transients (Dynamics) , Temperature , Sapphire , Temperature distribution , Heating , Imaging , Joules

All Years

Proceedings Papers

Heterogeneous Integration: Micro-Systems With Diverse Functionality

2.5D/3D Integration

Additive and Advanced Manufacturing

Advanced Materials and Interfaces for Emerging Electronic Packaging Paradigms

Advanced Packaging, Interconnects and Substrate Technologies

Fracture, Fatigue, and Thermomechanical Reliability of Devices and Packages

Microelectronics and Optoelectronic Systems Integration

Thermal Management for Heterogeneous Integration

Servers of the Future

Data Centers and Energy Efficient HPC Concepts

Modeling and Simulation

Thermal Management and Advanced Heat Spreading Concepts for 2D, 2.5D, and 3D Architectures

Structural and Physical Health Monitoring

Mechanical Reliability Issues in Flexible and Printed Electronics

Novel Sensors and Packaging for Structural and Health Monitoring

Energy Conversion and Storage

Batteries and Storage Devices

Harsh Environment and High Temperature Electronics

Photovoltaics, Thermoelectrics, Energy Harvesting Devices

Power Electronics Wide Band Gap Semiconductors, Packaging, Module Assembly and Thermal Management

Transportation: Autonomous and Electric Vehicles

Device to System Level Reliability

High Temperature Electronics

Simulation and Test Methods

Thermal Management of Electric Motors and Power Systems

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