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Proceedings Papers

Proceedings Volume Cover
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Heterogeneous Integration: Micro-Systems With Diverse Functionality

2.5D/3D Integration

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan
InterPACK 2017; V001T01A001https://doi.org/10.1115/IPACK2017-74173
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Topics: Lasers , Manufacturing , Microscale devices , Sintering , Fluence (Radiation measurement) , Additive manufacturing , Copper , Density , Design , Energy dissipation
Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins
InterPACK 2017; V001T01A002https://doi.org/10.1115/IPACK2017-74222
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Topics: Temperature distribution , Electronic packaging , Packaging , Power density , Power semiconductor devices , Power conversion systems , Temperature , Computer simulation , Density , Gallium nitride

Additive and Advanced Manufacturing

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
InterPACK 2017; V001T01A003https://doi.org/10.1115/IPACK2017-74059
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Topics: Current density , Damage , Electrodiffusion , Metals , Evaluation methods , Atoms , Circuit design , Computer simulation , Density , Electrons
Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
InterPACK 2017; V001T01A004https://doi.org/10.1115/IPACK2017-74092
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Topics: Current density , Damage , Electrodiffusion , Reservoirs , Shapes , Density , Anodes , Computer simulation
Challenges in 3D Printing of High Conductivity Copper
Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
InterPACK 2017; V001T01A005https://doi.org/10.1115/IPACK2017-74306
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Topics: Additive manufacturing , Copper , Electrical conductivity , Thermal conductivity , Engines , Motors , Electromagnetic induction , Machinery , Aerospace industry , Electric vehicles

Advanced Materials and Interfaces for Emerging Electronic Packaging Paradigms

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer
Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
InterPACK 2017; V001T01A006https://doi.org/10.1115/IPACK2017-74090
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Topics: Boiling , Copper , Heat transfer , Bubbles , Critical heat flux , Cooling , Heat transfer coefficients , Microscale devices , Nucleation (Physics) , Optical images

Advanced Packaging, Interconnects and Substrate Technologies

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
InterPACK 2017; V001T01A007https://doi.org/10.1115/IPACK2017-74010
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Topics: Adhesives , Pressure , Semiconductor wafers , Ultraviolet radiation , String , Finite element analysis , Deformation , Elongation , Finite element model , Fracture (Materials)
Large Flip Chip Assembly Challenges and Risk Mitigation Process
Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
InterPACK 2017; V001T01A008https://doi.org/10.1115/IPACK2017-74026
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Topics: Ball-Grid-Array packaging , Copper , Cracking (Materials) , Delamination , Failure , Flip-chip , Flip-chip assemblies , Flip-chip devices , Flip-chip packages , Fracture (Process)
Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
InterPACK 2017; V001T01A009https://doi.org/10.1115/IPACK2017-74133
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Topics: Solders , Anisotropy , Tin , Solder joints , Ball-Grid-Array packaging , Crystals , Temperature , Alloys , Composite materials , Cooling
Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder
Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2017; V001T01A010https://doi.org/10.1115/IPACK2017-74266
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Topics: Lead-free solders , Tin , Cross section (Physics) , Microscopy , Particulate matter , Cooling , Intermetallic compounds , Nanoindentation , Polishing , Scanning electron microscopy

Fracture, Fatigue, and Thermomechanical Reliability of Devices and Packages

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow
Jing Wang, Yuling Niu, Seungbae Park
InterPACK 2017; V001T01A011https://doi.org/10.1115/IPACK2017-74017
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Topics: Delamination , Reflow soldering , Fracture (Materials) , Stress , Vapor pressure , Ball-Grid-Array packages , Displacement , Finite element analysis , Fracture mechanics , Lead-free solders
Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components
Min Pei, Guru Arakere, Milena Vujosevic
InterPACK 2017; V001T01A012https://doi.org/10.1115/IPACK2017-74082
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Topics: Ball-Grid-Array packaging , Shock (Mechanics) , Failure , Physics , Computer simulation , Deformation , Design , Stress
The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height
Keiji Matsumoto, Keishi Okamoto, Hiroyuki Mori
InterPACK 2017; V001T01A013https://doi.org/10.1115/IPACK2017-74097
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Topics: Manufacturing , Solders , Stress , Delamination , Relaxation (Physics) , Simulation
Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor
Takahiro Kinoshita, Takashi Kawakami, Tadaharu Adachi, Masahiro Funaki
InterPACK 2017; V001T01A014https://doi.org/10.1115/IPACK2017-74099
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Topics: Capacitors , Ceramics , Design , Stress , Finite element methods , Computer simulation , Pressure
In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
InterPACK 2017; V001T01A015https://doi.org/10.1115/IPACK2017-74177
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Topics: Fatigue cracks , Synchrotron radiation , X-rays , Solders , Fracture (Materials) , Nondestructive evaluation , Ceramics , Crack propagation , Cycles , Delamination
Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy
Yiran Li, Yuvraj Singh, Ganesh Subbarayan
InterPACK 2017; V001T01A016https://doi.org/10.1115/IPACK2017-74201
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Topics: Alloys , Fatigue , Solders , Damage , Tin , Creep , Constitutive equations , Energy dissipation , Entropy , Fatigue damage
Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling
InterPACK 2017; V001T01A017https://doi.org/10.1115/IPACK2017-74233
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Topics: Alloys , High temperature , Lead-free solders , Vibration , Temperature , Electronics , Vehicles , Solder joints , Solders , Automotive industry
Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
Deng Yun Chen, Michael Osterman
InterPACK 2017; V001T01A018https://doi.org/10.1115/IPACK2017-74249
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Topics: Ball-Grid-Array packaging , Corners (Structural elements) , Fatigue life , Solder joints , Solders , Adhesives , Failure , Materials properties , Stress , Temperature
A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
InterPACK 2017; V001T01A019https://doi.org/10.1115/IPACK2017-74278
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Topics: Manufacturing , Testing , Reliability , Stress , Lumber , Temperature , Failure , Finite element analysis , Young's modulus , Computation
Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
InterPACK 2017; V001T01A020https://doi.org/10.1115/IPACK2017-74279
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Topics: Event history analysis , Wire , Reliability , Failure , Solders , Copper , Dielectric materials , Manufacturing , Microelectronic devices , Solder joints

Microelectronics and Optoelectronic Systems Integration

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo
InterPACK 2017; V001T01A021https://doi.org/10.1115/IPACK2017-74195
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Topics: Light-emitting diodes , Phosphors , Shapes , Geometry , Coating processes , Coatings , Computer simulation , Fluids , Temperature
Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone
Pradeep Lall, Amrit Abrol, David Locker
InterPACK 2017; V001T01A022https://doi.org/10.1115/IPACK2017-74252
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Topics: Microelectromechanical systems , Microphones , Reliability , Temperature , High temperature , Service life (Equipment) , Analytical methods , Engineers , Failure analysis , Failure mechanisms

Thermal Management for Heterogeneous Integration

State of the Art of Electronics Cooling for Radar Antenna Applications
Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
InterPACK 2017; V001T01A023https://doi.org/10.1115/IPACK2017-74080
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Topics: Computer cooling , Radar , Cooling , Heat flux , Defense industry , Design , Electronics , Refrigerants , Two-phase flow , Analytical methods
Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
Michal Talmor, Jamal Yagoobi
InterPACK 2017; V001T01A024https://doi.org/10.1115/IPACK2017-74107
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Topics: Electrohydrodynamics , Heat conduction , Microscale devices , Performance characterization , Pumps , Electrodes , Fluids , Electronics , Flow (Dynamics) , Aerospace industry
Advanced Cooling of 3D ICs With Nanoparticle Packings
Anil Yuksel, Paul S. Ho, Jayathi Murthy
InterPACK 2017; V001T01A025https://doi.org/10.1115/IPACK2017-74137
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Topics: Cooling , Nanoparticles , Packings (Cushioning) , Energy dissipation , Heat , Thermal management , Dimensions , High temperature , Phonons , Polaritons
The Effect of Surface Texture on Thermal Sensation and Comfort
Han Zhang, Alan Hedge
InterPACK 2017; V001T01A026https://doi.org/10.1115/IPACK2017-74179
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Topics: Computers , Heat , Surface roughness , Surface texture , Surfaces (Materials) , Temperature
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
InterPACK 2017; V001T01A027https://doi.org/10.1115/IPACK2017-74196
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Topics: Composite materials , Optimization , Phase change materials , Thermal management , Thermal conductivity , Latent heat , Temperature , Heat flux , Cooling , Graphite
Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
InterPACK 2017; V001T01A028https://doi.org/10.1115/IPACK2017-74224
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Topics: Heat conduction , Heat transfer , Integrated circuits , Interpolation , Temperature sensors , Temperature , Optimization , Sensors , Finite element analysis , Genetic algorithms

Servers of the Future

Data Centers and Energy Efficient HPC Concepts

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
InterPACK 2017; V001T02A001https://doi.org/10.1115/IPACK2017-74020
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Topics: Cooling systems , Electronics , Experimental analysis , Secondary cells , Boiling , Computer cooling , Condensers (steam plant) , Cooling , Cylinders , Electronic components
Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton
InterPACK 2017; V001T02A002https://doi.org/10.1115/IPACK2017-74028
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Topics: Cooling , Failure , Water , Energy consumption , Fans , Pumps , Data centers , Density , Heat , Redundancy (Engineering)
Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
InterPACK 2017; V001T02A003https://doi.org/10.1115/IPACK2017-74030
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Topics: Cooling , Modeling , Simulation , Heat , Density , Energy dissipation , Flow (Dynamics) , Temperature , Water , Acoustics
An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem
Chun Wang, Xiaoguang Sun, Jun Zhang, Nishi Ahuja
InterPACK 2017; V001T02A004https://doi.org/10.1115/IPACK2017-74033
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Topics: Batteries , Design , Data centers , Energy efficiency , Energy consumption , Data collection , Design methodology , Lead-acid batteries , Optimization , Topology
Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions
Devdatta Kulkarni, Sandeep Ahuja, Sanjoy Saha
InterPACK 2017; V001T02A005https://doi.org/10.1115/IPACK2017-74055
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Topics: Boundary-value problems , Cooling , Data centers , Design , Heat pipes
Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
Jayati D. Athavale, Yogendra Joshi, Minami Yoda
InterPACK 2017; V001T02A006https://doi.org/10.1115/IPACK2017-74108
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Topics: Computational fluid dynamics , Data centers , Tiles , Flow (Dynamics) , Cooling , Temperature , Fans , Pressure , Actuators , Air conditioning
Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure
Kourosh Nemati, Husam A. Alissa, Mohammad I. Tradat, Bahgat Sammakia
InterPACK 2017; V001T02A007https://doi.org/10.1115/IPACK2017-74148
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Topics: Doors , Failure , Heat exchangers , Transients (Dynamics) , Water , Cooling , Data centers , Temperature , Density , Flow (Dynamics)
Failure Analysis of Direct Liquid Cooling System in Data Centers
Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia
InterPACK 2017; V001T02A008https://doi.org/10.1115/IPACK2017-74174
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Topics: Cooling systems , Data centers , Failure analysis , Failure , Temperature , Coolants , Cooling , Fans , High temperature , Leakage
Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
Shenghui Lei, Alexandre Shen, Ryan Enright
InterPACK 2017; V001T02A009https://doi.org/10.1115/IPACK2017-74181
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Topics: Photonics , Silicon , Thermal resistance , Etching , Silicon-on-insulator , Cladding systems (Building) , Thermal conductivity , Aluminum , Crystals , Diffusion (Physics)
Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices
Shenghui Lei, Ertugrul Kardemir, David McCloskey, John F. Donegan, Ryan Enright
InterPACK 2017; V001T02A010https://doi.org/10.1115/IPACK2017-74184
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Topics: Flat heat pipes , Photonic equipment , Thermomechanics , Thin films , Stress , Waveguides , Cladding systems (Building) , Design , Failure , Polymers
CFD Optimization of the Cooling of Yosemite Open Compute Server
Aditya Gupta, Ananthavijayan Sridhar, Dereje Agonafer
InterPACK 2017; V001T02A011https://doi.org/10.1115/IPACK2017-74254
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Topics: Computational fluid dynamics , Cooling , Optimization , Air flow , Data centers , Design , Energy consumption , Flow (Dynamics) , Fans , Modeling
Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling
Fatemeh Tavakkoli, Siavash Ebrahimi, Xiaogang Sun, Yan Cui, Ali Heydari
InterPACK 2017; V001T02A012https://doi.org/10.1115/IPACK2017-74295
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Topics: Data centers , Design , Evaporative cooling , Performance evaluation , Cooling , Computational fluid dynamics , Water , Air flow , Air pollution , Cooling systems
True Concurrent Modulation of a Multi-Channel Ring Modulator Transmitter Driven by a Comb Laser
Ashkan Seyedi, Marco Fiorentino, Ray Beausoleil
InterPACK 2017; V001T02A013https://doi.org/10.1115/IPACK2017-74337
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Topics: Lasers , Quantum dots
Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension
Yusuke Nakajo, Hiroaki Nishi
InterPACK 2017; V001T02A014https://doi.org/10.1115/IPACK2017-74341
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Topics: Cycles , Temperature , Data centers , Stress , Air conditioning , Failure , Heat , Maintenance , Semiconductors (Materials) , Energy consumption

Modeling and Simulation

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems
Manasa Sahini, Dereje Agonafer, Vijayalan Pandiyan
InterPACK 2017; V001T02A015https://doi.org/10.1115/IPACK2017-74016
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Topics: Computational fluid dynamics , Containment , Cooling , Cooling systems , Data centers , Design , Exhaust systems , Fans , Flow (Dynamics) , Hardware
Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions
Emad A. Poshtan, Sudarshan Hegde, Andreas Roessle
InterPACK 2017; V001T02A016https://doi.org/10.1115/IPACK2017-74021
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Topics: Dynamic testing (Materials) , Electronic components , Mechanical behavior , Capacitors , Flat heat pipes , Heat , Materials properties , Reliability , Thermomechanics
Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification
Min Pei, Milena Vujosevic, Sibasish Mukherjee
InterPACK 2017; V001T02A017https://doi.org/10.1115/IPACK2017-74081
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Topics: Temperature , Ball-Grid-Array packaging , Fluctuations (Physics) , Accounting , Damage , Engineering standards , Failure , Physics , Reliability , Risk assessment
Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations
Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori
InterPACK 2017; V001T02A018https://doi.org/10.1115/IPACK2017-74098
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Topics: Manufacturing , Materials properties , Warping , Copper , Design , Finite element analysis , Simulation , Young's modulus , Errors , Flip-chip
Comparison and Evaluation of Different Monitoring Methods in a Data Center Environment
M. Tradat, S. Khalili, B. Sammakia, M. Ibrahim, Th. Peddle, A. Calder, B. Dawson, M. Seymour, K. Nemati, H. Alissa
InterPACK 2017; V001T02A019https://doi.org/10.1115/IPACK2017-74105
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Topics: Data centers , Temperature , Cooling , Data collection , Sensors , Reliability , Sensor networks
Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model
Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
InterPACK 2017; V001T02A020https://doi.org/10.1115/IPACK2017-74129
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Topics: Mechanical properties , Network models , Particulate matter , Thermal conductivity , Brittleness , Computer simulation , Elastic moduli , Heat , Heat sinks , Particle size
Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
InterPACK 2017; V001T02A021https://doi.org/10.1115/IPACK2017-74339
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Topics: Design , Tiles , Air flow , Computational fluid dynamics , Containment , Cooling , Data centers , Density , Engineering simulation , Flow (Dynamics)

Thermal Management and Advanced Heat Spreading Concepts for 2D, 2.5D, and 3D Architectures

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model
Sriram Chandrasekaran, Sushil Bhavnani
InterPACK 2017; V001T02A022https://doi.org/10.1115/IPACK2017-74025
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Topics: Flow (Dynamics) , Nucleation (Physics) , Cooling , Boiling , Data centers , Fluids , Silicon , Bubbles , Electronics , Energy consumption
Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe
Pawan Singh Kathait, Rajnish N. Sharma
InterPACK 2017; V001T02A023https://doi.org/10.1115/IPACK2017-74119
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Topics: Heat pipes , Computer cooling , Heat , Oscillations , Vapors , Bubbles , Construction , Design , Flux (Metallurgy) , Heat transfer
Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
Daniel Bae, Raphael Mandel, Michael Ohadi
InterPACK 2017; V001T02A024https://doi.org/10.1115/IPACK2017-74158
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Topics: Bonding , Cooling , Design , Manifolds , Microchannels , Heat flux , Electronics , Fluids , Manufacturing , Computational fluid dynamics
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel
David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi
InterPACK 2017; V001T02A025https://doi.org/10.1115/IPACK2017-74287
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Topics: Geometry , Two-phase flow , Cooling , Heat , Boiling , Evaporation , Flow (Dynamics) , Manifolds , Cooling systems , Design

Structural and Physical Health Monitoring

Mechanical Reliability Issues in Flexible and Printed Electronics

Silica Nanoparticle Formation by Using Droplet-Based Microreactor
Arsalan Nikdoost, Alican Ozkan, Yusuf Kelestemur, Hilmi Volkan Demir, E. Yegan Erdem
InterPACK 2017; V001T03A001https://doi.org/10.1115/IPACK2017-74178
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Topics: Drops , Nanoparticles , Coating processes , Coatings , Microfluidics , Particulate matter , Quantum dots
Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
Pradeep Lall, Hao Zhang, Rahul Lall
InterPACK 2017; V001T03A002https://doi.org/10.1115/IPACK2017-74232
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Topics: Biometry , Design , Flexible electronics , Sensors , Electronics , Manufacturing , Reliability , Thermal stresses , Biomedicine , Copper
Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
Pradeep Lall, Kartik Goyal
InterPACK 2017; V001T03A003https://doi.org/10.1115/IPACK2017-74264
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Topics: Printed circuit boards , Reliability , Solders , X-rays , Deformation , Electronics , Manufacturing , Solder joints , Computerized tomography , Heating

Novel Sensors and Packaging for Structural and Health Monitoring

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System
Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
InterPACK 2017; V001T03A004https://doi.org/10.1115/IPACK2017-74058
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Topics: Electronic systems , Sensors , Silicon , Stress , Algorithms , Delamination , Failure , Vehicles , Accelerated life testing , Acoustics
Peel-and-Stick Sensors Powered by Directed RF Energy
Christopher Lalau-Keraly, George Daniel, Joseph Lee, David Schwartz
InterPACK 2017; V001T03A005https://doi.org/10.1115/IPACK2017-74150
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Topics: Sensors , Building management systems , Design , Dimensions , Energy harvesting , Flexible electronics , Signals , Temperature
Monitoring Fugitive Methane Gas Emission From Natural Gas Pads
Levente J. Klein, Ted van Kessel, Dhruv Nair, Ramachandran Muralidhar, Hendrik Hamann, Norma Sosa
InterPACK 2017; V001T03A006https://doi.org/10.1115/IPACK2017-74191
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Topics: Emissions , Methane , Natural gas , Leakage , Sensors , Plumes (Fluid dynamics) , Governments , Maintenance , Regulations , Wind
PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
Pradeep Lall, Tony Thomas
InterPACK 2017; V001T03A007https://doi.org/10.1115/IPACK2017-74239
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Topics: Stress , Temperature , Vibration , Failure , Signals , Time-frequency analysis , Algorithms , Independent component analysis , Dimensions , Filtration
Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation
Pradeep Lall, Nakul Kothari, John Deep
InterPACK 2017; V001T03A008https://doi.org/10.1115/IPACK2017-74269
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Topics: Damage , Shock (Mechanics) , X-rays , Reliability , Deformation , Failure , Imaging , Manufacturing , Nondestructive evaluation , Service life (Equipment)
Edge Computing and Contextual Information for the Internet of Things Sensors
Lavanya Turlapati, Nigel Hinds, Dhruv Nair, Levente J. Klein
InterPACK 2017; V001T03A009https://doi.org/10.1115/IPACK2017-74304
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Topics: Internet of things , Sensors , Wind , Computation , Internet , Methane , Modeling , Plumes (Fluid dynamics) , Sensor placement , Signals

Energy Conversion and Storage

Batteries and Storage Devices

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
InterPACK 2017; V001T04A001https://doi.org/10.1115/IPACK2017-74118
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Topics: Phase change materials , Heat , Silicon nitride ceramics , Temperature , Cooling , Cooling systems , Cycles , Inspection , Optical quality control , Temperature profiles
Optimization of Graphite Composite Latent Heat Storage Systems
Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
InterPACK 2017; V001T04A002https://doi.org/10.1115/IPACK2017-74244
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Topics: Composite materials , Graphite , Latent heat , Optimization , Storage , Density , Temperature , Heat , Power density , Thermal conductivity

Harsh Environment and High Temperature Electronics

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
InterPACK 2017; V001T04A003https://doi.org/10.1115/IPACK2017-74138
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Topics: Cracking (Materials) , Fracture (Process) , High temperature , Simulation , Thermomechanics , Transients (Dynamics) , Tension-leg platforms , Stress , Fracture (Materials) , Tin
Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
InterPACK 2017; V001T04A004https://doi.org/10.1115/IPACK2017-74169
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Topics: Electronics , High temperature , Alloys , Fracture (Materials) , Deformation , Shear strength , Solders , Tension , Thermal conductivity , Brittleness

Photovoltaics, Thermoelectrics, Energy Harvesting Devices

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers
Kayvan Abbasi, Sukhvinder Kang
InterPACK 2017; V001T04A005https://doi.org/10.1115/IPACK2017-74015
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Topics: Steady state , Thermoelectric coolers , Transients (Dynamics) , Thermal resistance , Eigenfunctions , Eigenvalues , Insulation , Thermal systems
Thermal Metamaterials for Heat Flow Control in Electronics
Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
InterPACK 2017; V001T04A006https://doi.org/10.1115/IPACK2017-74112
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Topics: Electronics , Flow control , Heat , Metamaterials , Flow (Dynamics) , Anisotropy , Blocks (Building materials) , Circuit design , Composite materials , Design
High-Performance Microchannels Development Using Magnetic Stabilization
Seth Newport, Geoffrey Ormston, Michael Benedict, Ayyoub Mehdizadeh Momen
InterPACK 2017; V001T04A007https://doi.org/10.1115/IPACK2017-74147
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Topics: Microchannels , Particulate matter , Pressure drop , Heat transfer , Ferrites (Magnetic materials) , Flow (Dynamics) , Heat , Manufacturing , Mass transfer , Packing (Shipments)
Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap
Mahmoud Elzouka, Sidy Ndao
InterPACK 2017; V001T04A008https://doi.org/10.1115/IPACK2017-74212
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Topics: Crystals , Thermal radiation , Heat transfer , Heat , Flow (Dynamics) , Radiative heat transfer , Vacuum , Electronics , Engineering prototypes , Numerical analysis
Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
Viral K. Patel, Kyle R. Gluesenkamp
InterPACK 2017; V001T04A009https://doi.org/10.1115/IPACK2017-74243
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Topics: Design , Drying , Electrical resistance , Energy consumption , Energy efficiency , Engineering prototypes , Heat pumps , Heating , Modeling , Optimization

Power Electronics Wide Band Gap Semiconductors, Packaging, Module Assembly and Thermal Management

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick
Joon Hong Boo, Hyun Gon Kim, Chang Woo Han
InterPACK 2017; V001T04A010https://doi.org/10.1115/IPACK2017-74095
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Topics: Computer cooling , Heat pipes , Stress , Thermal resistance , Fluids , Wire screens , Containers , Cooling , Copper , Density
Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO2 Passivation
Dogacan Kara, F. Nazli Donmezer Akgun
InterPACK 2017; V001T04A011https://doi.org/10.1115/IPACK2017-74125
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Topics: Gallium nitride , Plates (structures) , Collapse , Electrons , Heating , Reliability , Electric fields , Electron mobility , Engineering simulation , Joules
Power Packaging Thermal and Stress Model for Quick Parametric Analyses
L. M. Boteler, S. M. Miner
InterPACK 2017; V001T04A012https://doi.org/10.1115/IPACK2017-74130
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Topics: Packaging , Stress , Finite element analysis , Design , Matlab , Temperature , Thermal stresses , Computer-aided design , Resistors , Computer-aided engineering
Integrated Vapor Chamber Heat Spreader for Power Module Applications
Clayton L. Hose, Dimeji Ibitayo, Lauren M. Boteler, Jens Weyant, Bradley Richard
InterPACK 2017; V001T04A013https://doi.org/10.1115/IPACK2017-74132
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Topics: Flat heat pipes , Vapors , Heat , Heat flux , Copper , Electronics , Flux (Metallurgy) , Thermal resistance , Flow (Dynamics) , Modeling
Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
InterPACK 2017; V001T04A014https://doi.org/10.1115/IPACK2017-74163
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Topics: Electronics , Synthetic diamonds , Thermal conductivity , Thermal management , Diamonds , Chemical vapor deposition , Electron backscatter diffraction , Lasers , Boron , Heat flux
3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
InterPACK 2017; V001T04A015https://doi.org/10.1115/IPACK2017-74213
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Topics: Packaging , Silicon , Wire , MOSFET transistors , Bonding , Electromagnetic interference , Electronics , Energy gap , Flip-chip , High temperature

Transportation: Autonomous and Electric Vehicles

Device to System Level Reliability

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components
Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
InterPACK 2017; V001T05A001https://doi.org/10.1115/IPACK2017-74190
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Topics: Electronic components , Failure , Vibration , Engineering standards , Reliability , Damage , Electronics , Failure mechanisms , Risk , Roads
Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems
David Huitink
InterPACK 2017; V001T05A002https://doi.org/10.1115/IPACK2017-74245
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Topics: Design , Electric vehicles , Reliability , Thermomechanics , Stress , Vehicles , Electronics , Failure , Physics , Batteries
The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
InterPACK 2017; V001T05A003https://doi.org/10.1115/IPACK2017-74273
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Topics: Electronic packages , Polymers , Stress , Reliability , Simulation , Weight (Mass) , Absorption , Ball-Grid-Array packaging , Corrosion , Cracking (Materials)

High Temperature Electronics

Advancements in Silver Wire Bonding
Subramani Manoharan, Chandradip Patel, Patrick McCluskey
InterPACK 2017; V001T05A004https://doi.org/10.1115/IPACK2017-74286
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Topics: Silver , Wire bonding , Copper , Wire , Reliability , Bonding , Corrosion , Light-emitting diodes , Palladium , Aerospace industry
Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
InterPACK 2017; V001T05A005https://doi.org/10.1115/IPACK2017-74322
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Topics: Bending (Stress) , Delamination , Epoxy adhesives , Epoxy resins , Fracture toughness , Temperature , Fracture (Materials) , Elongation , Shock (Mechanics) , Failure
Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen
InterPACK 2017; V001T05A006https://doi.org/10.1115/IPACK2017-74325
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Topics: Aluminum , Copper , Electronics , High temperature , Ionic mobility , Wire , Corrosion , Diffusion (Physics) , Gates (Closures) , Bonding

Simulation and Test Methods

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
InterPACK 2017; V001T05A007https://doi.org/10.1115/IPACK2017-74073
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Topics: Delamination , Electronic packaging , Fracture (Materials) , Simulation , Electronic packages , Copper , Finite element analysis , Fracture mechanics , Risk , Stress
Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
InterPACK 2017; V001T05A008https://doi.org/10.1115/IPACK2017-74208
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Topics: Electronics , Reliability , Safety , Automotive industry , Failure , Vehicles , Actuators , Computation , Design , Electric vehicles
Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year
Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
InterPACK 2017; V001T05A009https://doi.org/10.1115/IPACK2017-74300
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Topics: Alloys , Storage , High temperature , Solders , Temperature , Deformation , Electronics , Operating temperature , Constitutive equations , Elastic moduli

Thermal Management of Electric Motors and Power Systems

Electro-Thermal Simulation of Interconnected Systems at Transient Operating Conditions
Torsten Hauck, Vibhash Jha, J. H. J. Janssen
InterPACK 2017; V001T05A010https://doi.org/10.1115/IPACK2017-74096
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Topics: Simulation , Transients (Dynamics) , Finite element model , Boundary-value problems , Computational fluid dynamics , Computational methods , Design , Dynamic systems , Optimization
Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
InterPACK 2017; V001T05A011https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride , Steady state , Thermal characterization , Transients (Dynamics) , Temperature , Sapphire , Temperature distribution , Heating , Imaging , Joules
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