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Proceedings Papers
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
In This Volume
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Heterogeneous Integration: Micro-Systems With Diverse Functionality
2.5D/3D Integration
Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
InterPACK 2017; V001T01A001https://doi.org/10.1115/IPACK2017-74173
Topics:
Lasers
,
Manufacturing
,
Microscale devices
,
Sintering
,
Fluence (Radiation measurement)
,
Additive manufacturing
,
Copper
,
Density
,
Design
,
Energy dissipation
Additive and Advanced Manufacturing
Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
InterPACK 2017; V001T01A003https://doi.org/10.1115/IPACK2017-74059
Topics:
Current density
,
Damage
,
Electrodiffusion
,
Metals
,
Evaluation methods
,
Atoms
,
Circuit design
,
Computer simulation
,
Density
,
Electrons
Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
InterPACK 2017; V001T01A004https://doi.org/10.1115/IPACK2017-74092
Topics:
Current density
,
Damage
,
Electrodiffusion
,
Reservoirs
,
Shapes
,
Density
,
Anodes
,
Computer simulation
Challenges in 3D Printing of High Conductivity Copper
InterPACK 2017; V001T01A005https://doi.org/10.1115/IPACK2017-74306
Advanced Materials and Interfaces for Emerging Electronic Packaging Paradigms
Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer
Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
InterPACK 2017; V001T01A006https://doi.org/10.1115/IPACK2017-74090
Topics:
Boiling
,
Copper
,
Heat transfer
,
Bubbles
,
Critical heat flux
,
Cooling
,
Heat transfer coefficients
,
Microscale devices
,
Nucleation (Physics)
,
Optical images
Advanced Packaging, Interconnects and Substrate Technologies
Large Flip Chip Assembly Challenges and Risk Mitigation Process
InterPACK 2017; V001T01A008https://doi.org/10.1115/IPACK2017-74026
Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
InterPACK 2017; V001T01A009https://doi.org/10.1115/IPACK2017-74133
Topics:
Solders
,
Anisotropy
,
Tin
,
Solder joints
,
Ball-Grid-Array packaging
,
Crystals
,
Temperature
,
Alloys
,
Composite materials
,
Cooling
Fracture, Fatigue, and Thermomechanical Reliability of Devices and Packages
Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components
InterPACK 2017; V001T01A012https://doi.org/10.1115/IPACK2017-74082
Topics:
Ball-Grid-Array packaging
,
Shock (Mechanics)
,
Failure
,
Physics
,
Computer simulation
,
Deformation
,
Design
,
Stress
The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height
InterPACK 2017; V001T01A013https://doi.org/10.1115/IPACK2017-74097
Topics:
Manufacturing
,
Solders
,
Stress
,
Delamination
,
Relaxation (Physics)
,
Simulation
Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor
InterPACK 2017; V001T01A014https://doi.org/10.1115/IPACK2017-74099
Topics:
Capacitors
,
Ceramics
,
Design
,
Stress
,
Finite element methods
,
Computer simulation
,
Pressure
In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
InterPACK 2017; V001T01A015https://doi.org/10.1115/IPACK2017-74177
Topics:
Fatigue cracks
,
Synchrotron radiation
,
X-rays
,
Solders
,
Fracture (Materials)
,
Nondestructive evaluation
,
Ceramics
,
Crack propagation
,
Cycles
,
Delamination
Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy
InterPACK 2017; V001T01A016https://doi.org/10.1115/IPACK2017-74201
Topics:
Alloys
,
Fatigue
,
Solders
,
Damage
,
Tin
,
Creep
,
Constitutive equations
,
Energy dissipation
,
Entropy
,
Fatigue damage
Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
InterPACK 2017; V001T01A017https://doi.org/10.1115/IPACK2017-74233
Topics:
Alloys
,
High temperature
,
Lead-free solders
,
Vibration
,
Temperature
,
Electronics
,
Vehicles
,
Solder joints
,
Solders
,
Automotive industry
Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
InterPACK 2017; V001T01A018https://doi.org/10.1115/IPACK2017-74249
Topics:
Ball-Grid-Array packaging
,
Corners (Structural elements)
,
Fatigue life
,
Solder joints
,
Solders
,
Adhesives
,
Failure
,
Materials properties
,
Stress
,
Temperature
A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
InterPACK 2017; V001T01A019https://doi.org/10.1115/IPACK2017-74278
Topics:
Manufacturing
,
Testing
,
Reliability
,
Stress
,
Lumber
,
Temperature
,
Failure
,
Finite element analysis
,
Young's modulus
,
Computation
Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
InterPACK 2017; V001T01A020https://doi.org/10.1115/IPACK2017-74279
Topics:
Event history analysis
,
Wire
,
Reliability
,
Failure
,
Solders
,
Copper
,
Dielectric materials
,
Manufacturing
,
Microelectronic devices
,
Solder joints
Microelectronics and Optoelectronic Systems Integration
Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
InterPACK 2017; V001T01A021https://doi.org/10.1115/IPACK2017-74195
Topics:
Light-emitting diodes
,
Phosphors
,
Shapes
,
Geometry
,
Coating processes
,
Coatings
,
Computer simulation
,
Fluids
,
Temperature
Thermal Management for Heterogeneous Integration
State of the Art of Electronics Cooling for Radar Antenna Applications
InterPACK 2017; V001T01A023https://doi.org/10.1115/IPACK2017-74080
Topics:
Computer cooling
,
Radar
,
Cooling
,
Heat flux
,
Defense industry
,
Design
,
Electronics
,
Refrigerants
,
Two-phase flow
,
Analytical methods
Advanced Cooling of 3D ICs With Nanoparticle Packings
InterPACK 2017; V001T01A025https://doi.org/10.1115/IPACK2017-74137
Topics:
Cooling
,
Nanoparticles
,
Packings (Cushioning)
,
Energy dissipation
,
Heat
,
Thermal management
,
Dimensions
,
High temperature
,
Phonons
,
Polaritons
The Effect of Surface Texture on Thermal Sensation and Comfort
InterPACK 2017; V001T01A026https://doi.org/10.1115/IPACK2017-74179
Topics:
Computers
,
Heat
,
Surface roughness
,
Surface texture
,
Surfaces (Materials)
,
Temperature
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
InterPACK 2017; V001T01A027https://doi.org/10.1115/IPACK2017-74196
Topics:
Composite materials
,
Optimization
,
Phase change materials
,
Thermal management
,
Thermal conductivity
,
Latent heat
,
Temperature
,
Heat flux
,
Cooling
,
Graphite
Servers of the Future
Data Centers and Energy Efficient HPC Concepts
Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
InterPACK 2017; V001T02A002https://doi.org/10.1115/IPACK2017-74028
Topics:
Cooling
,
Failure
,
Water
,
Energy consumption
,
Fans
,
Pumps
,
Data centers
,
Density
,
Heat
,
Redundancy (Engineering)
Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
InterPACK 2017; V001T02A003https://doi.org/10.1115/IPACK2017-74030
Topics:
Cooling
,
Modeling
,
Simulation
,
Heat
,
Density
,
Energy dissipation
,
Flow (Dynamics)
,
Temperature
,
Water
,
Acoustics
An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem
InterPACK 2017; V001T02A004https://doi.org/10.1115/IPACK2017-74033
Topics:
Batteries
,
Design
,
Data centers
,
Energy efficiency
,
Energy consumption
,
Data collection
,
Design methodology
,
Lead-acid batteries
,
Optimization
,
Topology
Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions
InterPACK 2017; V001T02A005https://doi.org/10.1115/IPACK2017-74055
Topics:
Boundary-value problems
,
Cooling
,
Data centers
,
Design
,
Heat pipes
Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
InterPACK 2017; V001T02A006https://doi.org/10.1115/IPACK2017-74108
Topics:
Computational fluid dynamics
,
Data centers
,
Tiles
,
Flow (Dynamics)
,
Cooling
,
Temperature
,
Fans
,
Pressure
,
Actuators
,
Air conditioning
Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure
InterPACK 2017; V001T02A007https://doi.org/10.1115/IPACK2017-74148
Topics:
Doors
,
Failure
,
Heat exchangers
,
Transients (Dynamics)
,
Water
,
Cooling
,
Data centers
,
Temperature
,
Density
,
Flow (Dynamics)
Failure Analysis of Direct Liquid Cooling System in Data Centers
InterPACK 2017; V001T02A008https://doi.org/10.1115/IPACK2017-74174
Topics:
Cooling systems
,
Data centers
,
Failure analysis
,
Failure
,
Temperature
,
Coolants
,
Cooling
,
Fans
,
High temperature
,
Leakage
Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices
InterPACK 2017; V001T02A010https://doi.org/10.1115/IPACK2017-74184
Topics:
Flat heat pipes
,
Photonic equipment
,
Thermomechanics
,
Thin films
,
Stress
,
Waveguides
,
Cladding systems (Building)
,
Design
,
Failure
,
Polymers
CFD Optimization of the Cooling of Yosemite Open Compute Server
InterPACK 2017; V001T02A011https://doi.org/10.1115/IPACK2017-74254
Topics:
Computational fluid dynamics
,
Cooling
,
Optimization
,
Air flow
,
Data centers
,
Design
,
Energy consumption
,
Flow (Dynamics)
,
Fans
,
Modeling
Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling
InterPACK 2017; V001T02A012https://doi.org/10.1115/IPACK2017-74295
Topics:
Data centers
,
Design
,
Evaporative cooling
,
Performance evaluation
,
Cooling
,
Computational fluid dynamics
,
Water
,
Air flow
,
Air pollution
,
Cooling systems
True Concurrent Modulation of a Multi-Channel Ring Modulator Transmitter Driven by a Comb Laser
InterPACK 2017; V001T02A013https://doi.org/10.1115/IPACK2017-74337
Topics:
Lasers
,
Quantum dots
Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension
InterPACK 2017; V001T02A014https://doi.org/10.1115/IPACK2017-74341
Topics:
Cycles
,
Temperature
,
Data centers
,
Stress
,
Air conditioning
,
Failure
,
Heat
,
Maintenance
,
Semiconductors (Materials)
,
Energy consumption
Modeling and Simulation
Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems
InterPACK 2017; V001T02A015https://doi.org/10.1115/IPACK2017-74016
Topics:
Computational fluid dynamics
,
Containment
,
Cooling
,
Cooling systems
,
Data centers
,
Design
,
Exhaust systems
,
Fans
,
Flow (Dynamics)
,
Hardware
Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification
InterPACK 2017; V001T02A017https://doi.org/10.1115/IPACK2017-74081
Topics:
Temperature
,
Ball-Grid-Array packaging
,
Fluctuations (Physics)
,
Accounting
,
Damage
,
Engineering standards
,
Failure
,
Physics
,
Reliability
,
Risk assessment
Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations
InterPACK 2017; V001T02A018https://doi.org/10.1115/IPACK2017-74098
Topics:
Manufacturing
,
Materials properties
,
Warping
,
Copper
,
Design
,
Finite element analysis
,
Simulation
,
Young's modulus
,
Errors
,
Flip-chip
Comparison and Evaluation of Different Monitoring Methods in a Data Center Environment
M. Tradat, S. Khalili, B. Sammakia, M. Ibrahim, Th. Peddle, A. Calder, B. Dawson, M. Seymour, K. Nemati, H. Alissa
InterPACK 2017; V001T02A019https://doi.org/10.1115/IPACK2017-74105
Topics:
Data centers
,
Temperature
,
Cooling
,
Data collection
,
Sensors
,
Reliability
,
Sensor networks
Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
InterPACK 2017; V001T02A021https://doi.org/10.1115/IPACK2017-74339
Topics:
Design
,
Tiles
,
Air flow
,
Computational fluid dynamics
,
Containment
,
Cooling
,
Data centers
,
Density
,
Engineering simulation
,
Flow (Dynamics)
Thermal Management and Advanced Heat Spreading Concepts for 2D, 2.5D, and 3D Architectures
Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model
InterPACK 2017; V001T02A022https://doi.org/10.1115/IPACK2017-74025
Topics:
Flow (Dynamics)
,
Nucleation (Physics)
,
Cooling
,
Boiling
,
Data centers
,
Fluids
,
Silicon
,
Bubbles
,
Electronics
,
Energy consumption
Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe
InterPACK 2017; V001T02A023https://doi.org/10.1115/IPACK2017-74119
Topics:
Heat pipes
,
Computer cooling
,
Heat
,
Oscillations
,
Vapors
,
Bubbles
,
Construction
,
Design
,
Flux (Metallurgy)
,
Heat transfer
Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
InterPACK 2017; V001T02A024https://doi.org/10.1115/IPACK2017-74158
Topics:
Bonding
,
Cooling
,
Design
,
Manifolds
,
Microchannels
,
Heat flux
,
Electronics
,
Fluids
,
Manufacturing
,
Computational fluid dynamics
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel
InterPACK 2017; V001T02A025https://doi.org/10.1115/IPACK2017-74287
Topics:
Geometry
,
Two-phase flow
,
Cooling
,
Heat
,
Boiling
,
Evaporation
,
Flow (Dynamics)
,
Manifolds
,
Cooling systems
,
Design
Structural and Physical Health Monitoring
Mechanical Reliability Issues in Flexible and Printed Electronics
Silica Nanoparticle Formation by Using Droplet-Based Microreactor
InterPACK 2017; V001T03A001https://doi.org/10.1115/IPACK2017-74178
Topics:
Drops
,
Nanoparticles
,
Coating processes
,
Coatings
,
Microfluidics
,
Particulate matter
,
Quantum dots
Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
InterPACK 2017; V001T03A002https://doi.org/10.1115/IPACK2017-74232
Topics:
Biometry
,
Design
,
Flexible electronics
,
Sensors
,
Electronics
,
Manufacturing
,
Reliability
,
Thermal stresses
,
Biomedicine
,
Copper
Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
InterPACK 2017; V001T03A003https://doi.org/10.1115/IPACK2017-74264
Topics:
Printed circuit boards
,
Reliability
,
Solders
,
X-rays
,
Deformation
,
Electronics
,
Manufacturing
,
Solder joints
,
Computerized tomography
,
Heating
Novel Sensors and Packaging for Structural and Health Monitoring
Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System
InterPACK 2017; V001T03A004https://doi.org/10.1115/IPACK2017-74058
Topics:
Electronic systems
,
Sensors
,
Silicon
,
Stress
,
Algorithms
,
Delamination
,
Failure
,
Vehicles
,
Accelerated life testing
,
Acoustics
Peel-and-Stick Sensors Powered by Directed RF Energy
InterPACK 2017; V001T03A005https://doi.org/10.1115/IPACK2017-74150
Topics:
Sensors
,
Building management systems
,
Design
,
Dimensions
,
Energy harvesting
,
Flexible electronics
,
Signals
,
Temperature
Monitoring Fugitive Methane Gas Emission From Natural Gas Pads
InterPACK 2017; V001T03A006https://doi.org/10.1115/IPACK2017-74191
Topics:
Emissions
,
Methane
,
Natural gas
,
Leakage
,
Sensors
,
Plumes (Fluid dynamics)
,
Governments
,
Maintenance
,
Regulations
,
Wind
PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
InterPACK 2017; V001T03A007https://doi.org/10.1115/IPACK2017-74239
Topics:
Stress
,
Temperature
,
Vibration
,
Failure
,
Signals
,
Time-frequency analysis
,
Algorithms
,
Independent component analysis
,
Dimensions
,
Filtration
Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation
InterPACK 2017; V001T03A008https://doi.org/10.1115/IPACK2017-74269
Topics:
Damage
,
Shock (Mechanics)
,
X-rays
,
Reliability
,
Deformation
,
Failure
,
Imaging
,
Manufacturing
,
Nondestructive evaluation
,
Service life (Equipment)
Edge Computing and Contextual Information for the Internet of Things Sensors
InterPACK 2017; V001T03A009https://doi.org/10.1115/IPACK2017-74304
Topics:
Internet of things
,
Sensors
,
Wind
,
Computation
,
Internet
,
Methane
,
Modeling
,
Plumes (Fluid dynamics)
,
Sensor placement
,
Signals
Energy Conversion and Storage
Batteries and Storage Devices
Optimization of Graphite Composite Latent Heat Storage Systems
InterPACK 2017; V001T04A002https://doi.org/10.1115/IPACK2017-74244
Topics:
Composite materials
,
Graphite
,
Latent heat
,
Optimization
,
Storage
,
Density
,
Temperature
,
Heat
,
Power density
,
Thermal conductivity
Harsh Environment and High Temperature Electronics
Lead-Free Alternatives for Interconnects in High-Temperature Electronics
InterPACK 2017; V001T04A004https://doi.org/10.1115/IPACK2017-74169
Topics:
Electronics
,
High temperature
,
Alloys
,
Fracture (Materials)
,
Deformation
,
Shear strength
,
Solders
,
Tension
,
Thermal conductivity
,
Brittleness
Photovoltaics, Thermoelectrics, Energy Harvesting Devices
Thermal Metamaterials for Heat Flow Control in Electronics
InterPACK 2017; V001T04A006https://doi.org/10.1115/IPACK2017-74112
Topics:
Electronics
,
Flow control
,
Heat
,
Metamaterials
,
Flow (Dynamics)
,
Anisotropy
,
Blocks (Building materials)
,
Circuit design
,
Composite materials
,
Design
High-Performance Microchannels Development Using Magnetic Stabilization
InterPACK 2017; V001T04A007https://doi.org/10.1115/IPACK2017-74147
Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap
InterPACK 2017; V001T04A008https://doi.org/10.1115/IPACK2017-74212
Topics:
Crystals
,
Thermal radiation
,
Heat transfer
,
Heat
,
Flow (Dynamics)
,
Radiative heat transfer
,
Vacuum
,
Electronics
,
Engineering prototypes
,
Numerical analysis
Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
InterPACK 2017; V001T04A009https://doi.org/10.1115/IPACK2017-74243
Topics:
Design
,
Drying
,
Electrical resistance
,
Energy consumption
,
Energy efficiency
,
Engineering prototypes
,
Heat pumps
,
Heating
,
Modeling
,
Optimization
Power Electronics Wide Band Gap Semiconductors, Packaging, Module Assembly and Thermal Management
The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick
InterPACK 2017; V001T04A010https://doi.org/10.1115/IPACK2017-74095
Topics:
Computer cooling
,
Heat pipes
,
Stress
,
Thermal resistance
,
Fluids
,
Wire screens
,
Containers
,
Cooling
,
Copper
,
Density
Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO2 Passivation
InterPACK 2017; V001T04A011https://doi.org/10.1115/IPACK2017-74125
Topics:
Gallium nitride
,
Plates (structures)
,
Collapse
,
Electrons
,
Heating
,
Reliability
,
Electric fields
,
Electron mobility
,
Engineering simulation
,
Joules
Power Packaging Thermal and Stress Model for Quick Parametric Analyses
InterPACK 2017; V001T04A012https://doi.org/10.1115/IPACK2017-74130
Topics:
Packaging
,
Stress
,
Finite element analysis
,
Design
,
Matlab
,
Temperature
,
Thermal stresses
,
Computer-aided design
,
Resistors
,
Computer-aided engineering
Integrated Vapor Chamber Heat Spreader for Power Module Applications
InterPACK 2017; V001T04A013https://doi.org/10.1115/IPACK2017-74132
Topics:
Flat heat pipes
,
Vapors
,
Heat
,
Heat flux
,
Copper
,
Electronics
,
Flux (Metallurgy)
,
Thermal resistance
,
Flow (Dynamics)
,
Modeling
Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
InterPACK 2017; V001T04A014https://doi.org/10.1115/IPACK2017-74163
3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
InterPACK 2017; V001T04A015https://doi.org/10.1115/IPACK2017-74213
Topics:
Packaging
,
Silicon
,
Wire
,
MOSFET transistors
,
Bonding
,
Electromagnetic interference
,
Electronics
,
Energy gap
,
Flip-chip
,
High temperature
Transportation: Autonomous and Electric Vehicles
Device to System Level Reliability
Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components
InterPACK 2017; V001T05A001https://doi.org/10.1115/IPACK2017-74190
Topics:
Electronic components
,
Failure
,
Vibration
,
Engineering standards
,
Reliability
,
Damage
,
Electronics
,
Failure mechanisms
,
Risk
,
Roads
Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems
InterPACK 2017; V001T05A002https://doi.org/10.1115/IPACK2017-74245
Topics:
Design
,
Electric vehicles
,
Reliability
,
Thermomechanics
,
Stress
,
Vehicles
,
Electronics
,
Failure
,
Physics
,
Batteries
The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
InterPACK 2017; V001T05A003https://doi.org/10.1115/IPACK2017-74273
Topics:
Electronic packages
,
Polymers
,
Stress
,
Reliability
,
Simulation
,
Weight (Mass)
,
Absorption
,
Ball-Grid-Array packaging
,
Corrosion
,
Cracking (Materials)
High Temperature Electronics
Advancements in Silver Wire Bonding
InterPACK 2017; V001T05A004https://doi.org/10.1115/IPACK2017-74286
Topics:
Silver
,
Wire bonding
,
Copper
,
Wire
,
Reliability
,
Bonding
,
Corrosion
,
Light-emitting diodes
,
Palladium
,
Aerospace industry
Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
InterPACK 2017; V001T05A005https://doi.org/10.1115/IPACK2017-74322
Topics:
Bending (Stress)
,
Delamination
,
Epoxy adhesives
,
Epoxy resins
,
Fracture toughness
,
Temperature
,
Fracture (Materials)
,
Elongation
,
Shock (Mechanics)
,
Failure
Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
InterPACK 2017; V001T05A006https://doi.org/10.1115/IPACK2017-74325
Topics:
Aluminum
,
Copper
,
Electronics
,
High temperature
,
Ionic mobility
,
Wire
,
Corrosion
,
Diffusion (Physics)
,
Gates (Closures)
,
Bonding
Simulation and Test Methods
Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
InterPACK 2017; V001T05A007https://doi.org/10.1115/IPACK2017-74073
Topics:
Delamination
,
Electronic packaging
,
Fracture (Materials)
,
Simulation
,
Electronic packages
,
Copper
,
Finite element analysis
,
Fracture mechanics
,
Risk
,
Stress
Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
InterPACK 2017; V001T05A008https://doi.org/10.1115/IPACK2017-74208
Topics:
Electronics
,
Reliability
,
Safety
,
Automotive industry
,
Failure
,
Vehicles
,
Actuators
,
Computation
,
Design
,
Electric vehicles
Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year
InterPACK 2017; V001T05A009https://doi.org/10.1115/IPACK2017-74300
Topics:
Alloys
,
Storage
,
High temperature
,
Solders
,
Temperature
,
Deformation
,
Electronics
,
Operating temperature
,
Constitutive equations
,
Elastic moduli
Thermal Management of Electric Motors and Power Systems
Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
InterPACK 2017; V001T05A011https://doi.org/10.1115/IPACK2017-74149
Topics:
Gallium nitride
,
Steady state
,
Thermal characterization
,
Transients (Dynamics)
,
Temperature
,
Sapphire
,
Temperature distribution
,
Heating
,
Imaging
,
Joules