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Proceedings Papers

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5690-1
Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays

Advanced Fabrication and Manufacturing

3D Additive Manufacturing

InterPACK 2015; V003T03A001doi:https://doi.org/10.1115/IPACK2015-48027
InterPACK 2015; V003T03A002doi:https://doi.org/10.1115/IPACK2015-48187
InterPACK 2015; V003T03A003doi:https://doi.org/10.1115/IPACK2015-48637

Novel Fabrication Methods for Micro- and Nano- Scale Devices

InterPACK 2015; V003T03A004doi:https://doi.org/10.1115/IPACK2015-48046
InterPACK 2015; V003T03A005doi:https://doi.org/10.1115/IPACK2015-48381
InterPACK 2015; V003T03A006doi:https://doi.org/10.1115/IPACK2015-48449

Emerging Technology Frontiers

2D Materials, Graphene and CNT Thermal Characterization and Applications

InterPACK 2015; V003T04A001doi:https://doi.org/10.1115/IPACK2015-48213
InterPACK 2015; V003T04A002doi:https://doi.org/10.1115/IPACK2015-48239
InterPACK 2015; V003T04A003doi:https://doi.org/10.1115/IPACK2015-48297
InterPACK 2015; V003T04A004doi:https://doi.org/10.1115/IPACK2015-48444
InterPACK 2015; V003T04A005doi:https://doi.org/10.1115/IPACK2015-48587

Near Junction Thermal Transport in Electronic Devices

InterPACK 2015; V003T04A006doi:https://doi.org/10.1115/IPACK2015-48179
InterPACK 2015; V003T04A007doi:https://doi.org/10.1115/IPACK2015-48429

Power Electronics and Electric Machines

InterPACK 2015; V003T04A008doi:https://doi.org/10.1115/IPACK2015-48029
InterPACK 2015; V003T04A009doi:https://doi.org/10.1115/IPACK2015-48259
InterPACK 2015; V003T04A010doi:https://doi.org/10.1115/IPACK2015-48382
InterPACK 2015; V003T04A011doi:https://doi.org/10.1115/IPACK2015-48516
InterPACK 2015; V003T04A012doi:https://doi.org/10.1115/IPACK2015-48602
InterPACK 2015; V003T04A013doi:https://doi.org/10.1115/IPACK2015-48625
InterPACK 2015; V003T04A014doi:https://doi.org/10.1115/IPACK2015-48714

Thermal Management: LED

InterPACK 2015; V003T04A015doi:https://doi.org/10.1115/IPACK2015-48326
InterPACK 2015; V003T04A016doi:https://doi.org/10.1115/IPACK2015-48445
InterPACK 2015; V003T04A017doi:https://doi.org/10.1115/IPACK2015-48635

Thermal Management: Mobile Applications

InterPACK 2015; V003T04A018doi:https://doi.org/10.1115/IPACK2015-48175
InterPACK 2015; V003T04A019doi:https://doi.org/10.1115/IPACK2015-48367
InterPACK 2015; V003T04A020doi:https://doi.org/10.1115/IPACK2015-48523
InterPACK 2015; V003T04A021doi:https://doi.org/10.1115/IPACK2015-48563
InterPACK 2015; V003T04A022doi:https://doi.org/10.1115/IPACK2015-48769
InterPACK 2015; V003T04A023doi:https://doi.org/10.1115/IPACK2015-48787

Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices

Biomicrofluidics and Lab-on-a-Chip

InterPACK 2015; V003T05A001doi:https://doi.org/10.1115/IPACK2015-48134
InterPACK 2015; V003T05A002doi:https://doi.org/10.1115/IPACK2015-48491

Fuel Cells and Other Energy Devices

InterPACK 2015; V003T05A003doi:https://doi.org/10.1115/IPACK2015-48816

Mixing, Mass Transfer, and Chemical Reactions

InterPACK 2015; V003T05A004doi:https://doi.org/10.1115/IPACK2015-48767

Transport in Membranes

InterPACK 2015; V003T05A005doi:https://doi.org/10.1115/IPACK2015-48298

MEMS and NEMS

N/MEMS: Emerging Technology

InterPACK 2015; V003T07A001doi:https://doi.org/10.1115/IPACK2015-48286
InterPACK 2015; V003T07A002doi:https://doi.org/10.1115/IPACK2015-48585
InterPACK 2015; V003T07A003doi:https://doi.org/10.1115/IPACK2015-48590

N/MEMS: Fabrication, Integration, Packaging, Test and Reliability

InterPACK 2015; V003T07A004doi:https://doi.org/10.1115/IPACK2015-48010
InterPACK 2015; V003T07A005doi:https://doi.org/10.1115/IPACK2015-48086
InterPACK 2015; V003T07A006doi:https://doi.org/10.1115/IPACK2015-48409
InterPACK 2015; V003T07A007doi:https://doi.org/10.1115/IPACK2015-48457
InterPACK 2015; V003T07A008doi:https://doi.org/10.1115/IPACK2015-48611
InterPACK 2015; V003T07A009doi:https://doi.org/10.1115/IPACK2015-48814

N/MEMS: Sensors, Actuators, and Resonators

InterPACK 2015; V003T07A010doi:https://doi.org/10.1115/IPACK2015-48133
InterPACK 2015; V003T07A011doi:https://doi.org/10.1115/IPACK2015-48567
InterPACK 2015; V003T07A012doi:https://doi.org/10.1115/IPACK2015-48733
InterPACK 2015; V003T07A013doi:https://doi.org/10.1115/IPACK2015-48790

Technology Update Talks

InterPACK 2015; V003T08A001doi:https://doi.org/10.1115/IPACK2015-48145

Thermal Management Using Micro Channels, Jets, Sprays

Advanced and Oscillating Heat Pipes

InterPACK 2015; V003T10A001doi:https://doi.org/10.1115/IPACK2015-48665

Cold Plate Integration

InterPACK 2015; V003T10A002doi:https://doi.org/10.1115/IPACK2015-48154
InterPACK 2015; V003T10A003doi:https://doi.org/10.1115/IPACK2015-48324
InterPACK 2015; V003T10A004doi:https://doi.org/10.1115/IPACK2015-48427

Embedded Cooling for 3D ICs

InterPACK 2015; V003T10A005doi:https://doi.org/10.1115/IPACK2015-48103
InterPACK 2015; V003T10A006doi:https://doi.org/10.1115/IPACK2015-48341
InterPACK 2015; V003T10A007doi:https://doi.org/10.1115/IPACK2015-48348
InterPACK 2015; V003T10A008doi:https://doi.org/10.1115/IPACK2015-48584

Flow-Boiling Experimental Investigations

InterPACK 2015; V003T10A009doi:https://doi.org/10.1115/IPACK2015-48288
InterPACK 2015; V003T10A010doi:https://doi.org/10.1115/IPACK2015-48734

High Heat Flux Hot Spot Cooling

InterPACK 2015; V003T10A011doi:https://doi.org/10.1115/IPACK2015-48242
InterPACK 2015; V003T10A012doi:https://doi.org/10.1115/IPACK2015-48496
InterPACK 2015; V003T10A013doi:https://doi.org/10.1115/IPACK2015-48632
InterPACK 2015; V003T10A014doi:https://doi.org/10.1115/IPACK2015-48689
InterPACK 2015; V003T10A015doi:https://doi.org/10.1115/IPACK2015-48757

Liquid and Synthetic Jets

InterPACK 2015; V003T10A016doi:https://doi.org/10.1115/IPACK2015-48094
InterPACK 2015; V003T10A017doi:https://doi.org/10.1115/IPACK2015-48393

Single Phase Cooling Fundamentals

InterPACK 2015; V003T10A018doi:https://doi.org/10.1115/IPACK2015-48123
InterPACK 2015; V003T10A019doi:https://doi.org/10.1115/IPACK2015-48346

Two Phase Boiling Computational Modeling Challenges

InterPACK 2015; V003T10A020doi:https://doi.org/10.1115/IPACK2015-48033
InterPACK 2015; V003T10A021doi:https://doi.org/10.1115/IPACK2015-48066
InterPACK 2015; V003T10A022doi:https://doi.org/10.1115/IPACK2015-48129
InterPACK 2015; V003T10A023doi:https://doi.org/10.1115/IPACK2015-48178
InterPACK 2015; V003T10A024doi:https://doi.org/10.1115/IPACK2015-48334
InterPACK 2015; V003T10A025doi:https://doi.org/10.1115/IPACK2015-48350
InterPACK 2015; V003T10A026doi:https://doi.org/10.1115/IPACK2015-48441
InterPACK 2015; V003T10A027doi:https://doi.org/10.1115/IPACK2015-48489

Vapor Chambers and Condensation

InterPACK 2015; V003T10A028doi:https://doi.org/10.1115/IPACK2015-48308
InterPACK 2015; V003T10A029doi:https://doi.org/10.1115/IPACK2015-48554
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