Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Skip to Main Content

Skip Nav Destination

Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays

Advanced Fabrication and Manufacturing

3D Additive Manufacturing

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou

InterPACK 2015; V003T03A001https://doi.org/10.1115/IPACK2015-48027

View Articletitled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Topics: Heat sinks , Manufacturing , Optimization , Testing , Topology , Computer-aided design , Design , Aluminum , Convection , Cooling

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Md Taibur Rahman, Rahul Panat, Deuk Heo

InterPACK 2015; V003T03A002https://doi.org/10.1115/IPACK2015-48187

View Articletitled, 3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Topics: Additive manufacturing , Aerosols , Metals , Inks , Manufacturing , Nanoparticles , Shapes , Sintering , Ultraviolet radiation , Wavelength

Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications

David C. Deisenroth, Martinus Adrian Arie, Serguei Dessiatoun, Amir Shooshtari, Michael Ohadi, Avram Bar-Cohen

InterPACK 2015; V003T03A003https://doi.org/10.1115/IPACK2015-48637

View Articletitled, Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications

Topics: Heat exchangers , Polymers , Thermal management , Additive manufacturing , Corrosion protection , Electrical conductivity , Heat transfer , Manufacturing , Stability , Temperature

Novel Fabrication Methods for Micro- and Nano- Scale Devices

Experimental and Analytical Study of Micro-Serrations on Surgical Blades

Marco Giovannini, Newell Moser, Kornel Ehmann

InterPACK 2015; V003T03A004https://doi.org/10.1115/IPACK2015-48046

View Articletitled, Experimental and Analytical Study of Micro-Serrations on Surgical Blades

Topics: Blades , Surgery , Cutting , Biological tissues , Finite element methods , Friction , Biomedicine , Laser ablation , Machining , Skin

Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Hideo Koguchi, Tomiya Maekawa, Chonlada Luangarpa

InterPACK 2015; V003T03A005https://doi.org/10.1115/IPACK2015-48381

View Articletitled, Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Topics: Piezoelectric materials , Density , Displacement , Stress , Stress singularity , Compression , Corners (Structural elements)

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano

InterPACK 2015; V003T03A006https://doi.org/10.1115/IPACK2015-48449

View Articletitled, A Model to Guide Template-Based Nanoparticle Printing Development

Topics: Nanoparticles , Printing , Inks , Sorption , Fluid dynamics , Fluids , Molding , Vapors , Diffusion (Physics) , Engineering simulation

Emerging Technology Frontiers

2D Materials, Graphene and CNT Thermal Characterization and Applications

The Contribution of the Bulk Modes on Electrical Conductivity in 3D Topological Insulators

Gulru Babac

InterPACK 2015; V003T04A001https://doi.org/10.1115/IPACK2015-48213

View Articletitled, The Contribution of the Bulk Modes on Electrical Conductivity in 3D Topological Insulators

Topics: Electrical conductivity , Magnetic fields

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

InterPACK 2015; V003T04A002https://doi.org/10.1115/IPACK2015-48239

View Articletitled, Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Topics: Graphene , Strain sensors , Chemical vapor deposition , Copper foil , Deformation , Energy gap , Reactive-ion etching , Tensile deformation , Density functional theory , Electron configuration

Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Tatiana Zolotoukhina

InterPACK 2015; V003T04A003https://doi.org/10.1115/IPACK2015-48297

View Articletitled, Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Topics: Graphene , Heating , Phonons , Thermal conductivity , Transients (Dynamics) , Equilibrium (Physics) , High temperature , Density , Dispersion relations , Dynamics (Mechanics)

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar

InterPACK 2015; V003T04A004https://doi.org/10.1115/IPACK2015-48444

View Articletitled, Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

Topics: Electrical conductance , Graphene , Metals , Thermoreflectance , Chemical vapor deposition , Copper foil

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola

InterPACK 2015; V003T04A005https://doi.org/10.1115/IPACK2015-48587

View Articletitled, Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Topics: Carbon nanotubes , Thermoreflectance , Contact resistance , Heat transfer , Heating , Mechanical properties , Metrology , Probes , Thermal conductivity , Uncertainty

Near Junction Thermal Transport in Electronic Devices

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach

InterPACK 2015; V003T04A006https://doi.org/10.1115/IPACK2015-48179

View Articletitled, Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

Topics: Cooling , Diamonds , Gallium nitride , Microfluidics , Junctions , Heat , Integrated circuits , Packaging , Power density , Temperature

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun

InterPACK 2015; V003T04A007https://doi.org/10.1115/IPACK2015-48429

View Articletitled, Advanced Cooling Designs for GaN-on-Diamond MMICs

Topics: Cooling , Diamonds , Gallium nitride , Temperature , Coolers , Microchannels , Thermal resistance , Cooling systems , Design , Engineering prototypes

Power Electronics and Electric Machines

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede

InterPACK 2015; V003T04A008https://doi.org/10.1115/IPACK2015-48029

View Articletitled, Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Topics: Design , Flow (Dynamics) , Manifolds , Microchannels , Cooling , Shapes , Coolants , Temperature , Channel flow , Computer cooling

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham

InterPACK 2015; V003T04A009https://doi.org/10.1115/IPACK2015-48259

View Articletitled, The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Topics: Gallium nitride , Interfacial thermal resistance , Stress , Polishing equipment , Electronics , Crystal structure , Electron mobility , Flow (Dynamics) , Heat , Reliability

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno

InterPACK 2015; V003T04A010https://doi.org/10.1115/IPACK2015-48382

View Articletitled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Topics: Convection , Jets , Machinery , Thermal management , Transmission fluids , Heat transfer coefficients , Temperature , Automotive industry , Cooling , Cooling systems

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd

InterPACK 2015; V003T04A011https://doi.org/10.1115/IPACK2015-48516

View Articletitled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

Topics: Cooling , Engines , Motors , Rotors , Machinery , Design , Heat , Manufacturing , Centrifugal force , Chemical processes

System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

Kraig J. Olejniczak, Tom Flint, David Simco, Sergei Storkov, Brad McGee, Kenny George, Peter Killeen, Austin Curbow, Robert S. Shaw, Brandon Passmore, Ty R. McNutt

InterPACK 2015; V003T04A012https://doi.org/10.1115/IPACK2015-48602

View Articletitled, System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

Topics: Energy gap , Packaging , Traction , Vehicles , Silicon , Reliability , Capacitors , Cooling , High temperature , Junctions

Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Keisuke Horiuchi, Yuichiro Konishi, Atsuo Nishihara

InterPACK 2015; V003T04A013https://doi.org/10.1115/IPACK2015-48625

View Articletitled, Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Topics: Temperature measurement , Water , Flow (Dynamics) , Thermal resistance , Capacitance , Computer simulation , Design , Heat , Heat transfer , Junctions

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins

InterPACK 2015; V003T04A014https://doi.org/10.1115/IPACK2015-48714

View Articletitled, Design Considerations of Packaging a High Voltage Current Switch

Topics: Design , Packaging , Switches , Anodes , Computer software , Current density , Electromagnetic fields , Gates (Closures) , Packing (Shipments) , Packings (Cushioning)

Thermal Management: LED

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak

InterPACK 2015; V003T04A015https://doi.org/10.1115/IPACK2015-48326

View Articletitled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Topics: Cavities , Proteins , Silicones , Biomaterials , Computational fluid dynamics , Light-emitting diodes , Phosphors , Polymers , Thermal conductivity , Absorption

Robust Data Acquisition for Building Lighting Systems

Zak Pearson, Tanya L. Crenshaw, Heather Dillon, Erik Paulson, Nick Warlen

InterPACK 2015; V003T04A016https://doi.org/10.1115/IPACK2015-48445

View Articletitled, Robust Data Acquisition for Building Lighting Systems

Topics: Data acquisition , Heat sinks , Cables , Data acquisition systems , Energy efficiency , Temperature , Thermal management

Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics

Boris Marovic, Mathew Clark, James Petroski

InterPACK 2015; V003T04A017https://doi.org/10.1115/IPACK2015-48635

View Articletitled, Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics

Topics: Computational fluid dynamics , Light-emitting diodes , Simulation , Temperature , Workflow

Thermal Management: Mobile Applications

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

InterPACK 2015; V003T04A018https://doi.org/10.1115/IPACK2015-48175

View Articletitled, A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Topics: Natural convection , Performance characterization , Vapors , Heat , Flat heat pipes , Computer simulation , Condensers (steam plant) , Energy dissipation , Heat losses , Temperature distribution

Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Tannaz Harirchian, Zuyang Frank Liang, Kyle Yazzie, Michael A. Schroeder, Ashish Gupta, Alan C. Mcallister

InterPACK 2015; V003T04A019https://doi.org/10.1115/IPACK2015-48367

View Articletitled, Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Topics: Boundary-value problems , Data collection , Design , Junctions , Reliability , Simulation , Skin , Solder joints , Stress , Temperature

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives

InterPACK 2015; V003T04A020https://doi.org/10.1115/IPACK2015-48523

View Articletitled, Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Topics: Graphite , Heat transfer , Computer software , Errors , Flat heat pipes , Heat , Thermal conductivity , Accounting , Adhesives , Computational fluid dynamics

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi

InterPACK 2015; V003T04A021https://doi.org/10.1115/IPACK2015-48563

View Articletitled, Thermal Performance Enhancement of Glass Interposer

Topics: Glass , Electronics , Packaging , Brittleness , Computer simulation , Cooling , Copper , Design , Electrical resistivity , Modeling

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Carin Lundquist Ruiz

InterPACK 2015; V003T04A022https://doi.org/10.1115/IPACK2015-48769

View Articletitled, Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Topics: Design , Modeling , Cutting , Engineers , Light-emitting diodes , Simulation , Structural design

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo

InterPACK 2015; V003T04A023https://doi.org/10.1115/IPACK2015-48787

View Articletitled, Users’ Thermal Response to a Simulated Tablet Computer Surface

Topics: Computers , Temperature , Engineering prototypes , Heat , Heating , Aluminum , Design , Sensors , Skin

Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices

Biomicrofluidics and Lab-on-a-Chip

A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment

Yichao Yang, Jiayue Shen, Zhili Hao

InterPACK 2015; V003T05A001https://doi.org/10.1115/IPACK2015-48134

View Articletitled, A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment

Topics: Biological tissues , Microfluidics , Tactile sensors , Sensors , Deflection , Transducers , Elasticity , Electrolytes , Phantoms , Power presses

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss

InterPACK 2015; V003T05A002https://doi.org/10.1115/IPACK2015-48491

View Articletitled, Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

Topics: Biomedicine , Hydrogen , Electrodes , Oxidation , Blood , Calibration , Chemistry , Diseases , Plasma desorption mass spectrometry , Plasmas (Ionized gases)

Fuel Cells and Other Energy Devices

A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Devesh Chugh, Rasool Nasr Isfahani, Kyle Gluesenkamp, Omar Abdelaziz, Saeed Moghaddam

InterPACK 2015; V003T05A003https://doi.org/10.1115/IPACK2015-48816

View Articletitled, A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Topics: Absorption , Cycles , Dehumidification , Evaporative cooling , Hot water heating , Water , Heat , Heating , Hot water , Water vapor

Mixing, Mass Transfer, and Chemical Reactions

Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass

Satoru Mizuno, Tamio Ida, Manabu Fuchihata, Edmundo Sanchez, Jr., Koji Yoshikuni

InterPACK 2015; V003T05A004https://doi.org/10.1115/IPACK2015-48767

View Articletitled, Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass

Topics: Biomass , Coke , Compressive strength , Density , Compression , High temperature , Temperature , Water , Coal , Fibers

Transport in Membranes

MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore

Takumu Kitani, Tatiana Zolotoukhina

InterPACK 2015; V003T05A005https://doi.org/10.1115/IPACK2015-48298

View Articletitled, MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore

Topics: DNA , Graphene , Infrared spectra , Nanopores , Atoms , Spectra (Spectroscopy) , Resolution (Optics) , Spectroscopy , Density , Fingerprints

MEMS and NEMS

N/MEMS: Emerging Technology

Two-Dimensional Monolayer MX₂ (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications

Bin Xiang, Lei Yang, Jian Huang, Qi Fu

InterPACK 2015; V003T07A001https://doi.org/10.1115/IPACK2015-48286

View Articletitled, Two-Dimensional Monolayer MX<sub>2</sub> (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications

Topics: Atomic force microscopy , Chemical vapor deposition , Electronics , Emergencies , Mechanical admittance , Optoelectronic devices , Photoluminescence , Pressure , Raman spectroscopy , Resolution (Optics)

RFIC Transformer With 12x Size Reduction and 15x Performance Enhancement by Self-Rolled-Up Membrane Nanotechnology

Wen Huang, Moyang Li, Songbin Gong, Xiuling Li

InterPACK 2015; V003T07A002https://doi.org/10.1115/IPACK2015-48585

View Articletitled, RFIC Transformer With 12x Size Reduction and 15x Performance Enhancement by Self-Rolled-Up Membrane Nanotechnology

Topics: Membranes , Nanotechnology , Size reduction (Materials) , Complementary metal oxide semiconductors , Millimeter waves , Stress

Molybdenum Disulfide (MoS₂) Nanomechanical Resonators Integrated on Microchannels

Rui Yang, Zhenyu Li, Philip X.-L. Feng

InterPACK 2015; V003T07A003https://doi.org/10.1115/IPACK2015-48590

View Articletitled, Molybdenum Disulfide (MoS<sub>2</sub>) Nanomechanical Resonators Integrated on Microchannels

Topics: Microchannels , Molybdenum , Nanomechanical resonators , Resonance , Microfluidics , Plasma desorption mass spectrometry , Thermomechanics , Cantilevers , Fluids , Membranes

N/MEMS: Fabrication, Integration, Packaging, Test and Reliability

MEMS Die Warpage During Curing of Die Attach Material

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue

InterPACK 2015; V003T07A004https://doi.org/10.1115/IPACK2015-48010

View Articletitled, MEMS Die Warpage During Curing of Die Attach Material

Topics: Hardening (Curing) , Microelectromechanical systems , Warping , Materials properties , Finite element analysis , Manufacturing , Shrinkage (Materials) , Stress , Adhesives , Glass transition

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue

InterPACK 2015; V003T07A005https://doi.org/10.1115/IPACK2015-48086

View Articletitled, Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Topics: Adhesives , Shrinkage (Materials) , Storage , Finite element analysis , Sensors , Viscoelasticity , Epoxy adhesives , Epoxy resins , MEMS packaging , Microelectromechanical systems

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky

InterPACK 2015; V003T07A006https://doi.org/10.1115/IPACK2015-48409

View Articletitled, Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Topics: Cooling , Microchannels , Plasma etching , Silicon , Gallium nitride , Electronics , Density , Etching , Finite element analysis , Heat transfer coefficients

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover

InterPACK 2015; V003T07A007https://doi.org/10.1115/IPACK2015-48457

View Articletitled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Topics: Accelerometers , Event history analysis , Microelectromechanical systems , Modeling , Shock (Mechanics) , Failure mechanisms , Capacitance , Failure , Defense industry , Deflection

Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

Azadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn

InterPACK 2015; V003T07A008https://doi.org/10.1115/IPACK2015-48611

View Articletitled, Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

Topics: Catheters , Endoscopic devices , Imaging , Manufacturing , Packaging , Ultrasound , Biomedical imaging , Ultrasonic transducers , Bonding , Design

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee

InterPACK 2015; V003T07A009https://doi.org/10.1115/IPACK2015-48814

View Articletitled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Topics: Coatings , Nanoscale phenomena , Membranes , Semiconductor wafers , Valves , Compression , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Microelectromechanical systems , Cavities

N/MEMS: Sensors, Actuators, and Resonators

A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

Yichao Yang, Zhili Hao

InterPACK 2015; V003T07A010https://doi.org/10.1115/IPACK2015-48133

View Articletitled, A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

Topics: Microfluidics , Tactile sensors , Torque , Transducers , Microchannels , Electrolytes , Computer numerical control machine tools , Electrodes , Engineering prototypes , Lithography

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire

InterPACK 2015; V003T07A011https://doi.org/10.1115/IPACK2015-48567

View Articletitled, Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Topics: Graphene , Liquid metals , Ohmic contacts , Photonic equipment , Contact resistance , Carbon , Engineering standards , Overlays (Materials engineering) , Oxidation , Pressure

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub

InterPACK 2015; V003T07A012https://doi.org/10.1115/IPACK2015-48733

View Articletitled, CMUTs in Permanent Contact Operation for High Output Pressure

Topics: Pressure , Transducers , Acoustics , Cavities , Ultrasonic transducers , Bonding , Cycles , Deflection , Displacement , High temperature

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Pradeep Lall, Amrit Abrol, Lee Simpson, Jessica Glover

InterPACK 2015; V003T07A013https://doi.org/10.1115/IPACK2015-48790

View Articletitled, Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Topics: Accelerometers , Microelectromechanical systems , Shock (Mechanics) , Reliability , Automotive industry , Complementary metal oxide semiconductors , Design , Failure mechanisms , Low temperature , Lumber

Technology Update Talks

Novel Thermal Management of GaN Electronics: Diamond Substrates

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz

InterPACK 2015; V003T08A001https://doi.org/10.1115/IPACK2015-48145

View Articletitled, Novel Thermal Management of GaN Electronics: Diamond Substrates

Topics: Diamonds , Electronics , Gallium nitride , Thermal management , Thermal conductivity , Heat transfer , Junctions , Microwaves , Semiconductor wafers , Temperature

Thermal Management Using Micro Channels, Jets, Sprays

Advanced and Oscillating Heat Pipes

Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe

S. F. Wang, Y. X. Hu, Y. Zhou, W. Zhang

InterPACK 2015; V003T10A001https://doi.org/10.1115/IPACK2015-48665

View Articletitled, Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe

Topics: Fluids , Heat pipes , Heat transfer , Water , Surface tension , Boiling , Bubbles , Cooling , Critical heat flux , Temperature

Cold Plate Integration

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth

InterPACK 2015; V003T10A002https://doi.org/10.1115/IPACK2015-48154

View Articletitled, Measuring Moisture Leakage Out of Water Cooling Hardware

Topics: Cooling , Hardware , Leakage , Water , Computers , Cooling systems , Electronics , Acoustics , Coolants , Errors

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

Michael J. Ellsworth, Jr., Levi A. Campbell

InterPACK 2015; V003T10A003https://doi.org/10.1115/IPACK2015-48324

View Articletitled, Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

Topics: Cooling , Thermal resistance , Heat sinks , Density , Flow (Dynamics) , Fluids , Heat exchangers , Pressure , Specific heat , Water

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler

InterPACK 2015; V003T10A004https://doi.org/10.1115/IPACK2015-48427

View Articletitled, Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Topics: Reliability , Topology , Silicon , Packaging , Composite materials , Cooling , Finite element model , Fracture (Materials) , Fracture (Process) , Gaskets

Embedded Cooling for 3D ICs

A Study on Flow Boiling in Microchannel With Piranha Pin Fin

X. Yu, C. Woodcock, Y. Wang, J. Plawsky, Y. Peles

InterPACK 2015; V003T10A005https://doi.org/10.1115/IPACK2015-48103

View Articletitled, A Study on Flow Boiling in Microchannel With Piranha Pin Fin

Topics: Boiling , Flow (Dynamics) , Microchannels , Critical heat flux , Fluid dynamics , Heat transfer , Pressure drop , Design , Energy dissipation , Fluids

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer

InterPACK 2015; V003T10A006https://doi.org/10.1115/IPACK2015-48341

View Articletitled, Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Topics: Boiling , Flow (Dynamics) , Heat transfer , Microchannels , Heating , Temperature , Cooling , Resistance thermometers , Coolants , Density

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer

InterPACK 2015; V003T10A007https://doi.org/10.1115/IPACK2015-48348

View Articletitled, Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Topics: Cooling , Coolants , Temperature , Vehicles , Flux (Metallurgy) , Heat , Dimensions , Flow (Dynamics) , Heating , Pressure drop

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

InterPACK 2015; V003T10A008https://doi.org/10.1115/IPACK2015-48584

View Articletitled, 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Topics: Cooling , Microfluidics , Heat sinks , Atmospheric pressure , Coolants , Heat flux , Heat transfer coefficients , Pressure drop , Silicon , Testing

Flow-Boiling Experimental Investigations

Passive Thermosyphon Cooling System for High Heat Flux Servers

Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher

InterPACK 2015; V003T10A009https://doi.org/10.1115/IPACK2015-48288

View Articletitled, Passive Thermosyphon Cooling System for High Heat Flux Servers

Topics: Cooling systems , Heat flux , Cooling , Critical heat flux , Design , Condensers (steam plant) , Fluids , Heat , Heat exchangers , Pipeline risers

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

Farzad Houshmand, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

InterPACK 2015; V003T10A010https://doi.org/10.1115/IPACK2015-48734

View Articletitled, High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

Topics: Boiling , Flow (Dynamics) , Heat flux , Methanol , Subcooling , Critical heat flux , Flux (Metallurgy) , Pressure drop , Heat , Cooling

High Heat Flux Hot Spot Cooling

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande

InterPACK 2015; V003T10A011https://doi.org/10.1115/IPACK2015-48242

View Articletitled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Topics: Cooling , Electronics , Heat flux , Pareto optimization , Fins , Stress , Temperature , Design , Shapes , Airfoils

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi

InterPACK 2015; V003T10A012https://doi.org/10.1115/IPACK2015-48496

View Articletitled, Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Topics: Cooling , Electronics , Fluids , Vapors , Heat flux , Pressure drop , Computational fluid dynamics , Engineering simulation , Experimental design , Heat transfer

Microscale Layering of Liquid and Vapor Phases Within Microstructures for Self-Regulated Flow Delivery to Local Hot Spots

Abdolreza Fazeli, Sajjad Bigham, Mehdi Mortazavi, Saeed Moghaddam

InterPACK 2015; V003T10A013https://doi.org/10.1115/IPACK2015-48632

View Articletitled, Microscale Layering of Liquid and Vapor Phases Within Microstructures for Self-Regulated Flow Delivery to Local Hot Spots

Topics: Flow (Dynamics) , Microscale devices , Vapors , Temperature , Boiling , Heat sinks , Thin films , Design , Evaporation , Heat transfer

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa

InterPACK 2015; V003T10A014https://doi.org/10.1115/IPACK2015-48689

View Articletitled, Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

Topics: Cooling , Electronics , Heat flux , Jets , Microfluidics , Simulation , Computational fluid dynamics , Reliability , Coolers , Cooling systems

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey

InterPACK 2015; V003T10A015https://doi.org/10.1115/IPACK2015-48757

View Articletitled, Reliable Integration of Microchannel Coolers for Power Electronics

Topics: Coolers , Electronics , Microchannels , Corrosion , Electronic packages , Electronic systems , Erosion , Failure mechanisms , Fracture (Materials) , Fracture (Process)

Liquid and Synthetic Jets

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Muhammad Ikhlaq, Baris Dogruoz, Omidreza Ghaffari, Mehmet Arik

InterPACK 2015; V003T10A016https://doi.org/10.1115/IPACK2015-48094

View Articletitled, A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Topics: Heat transfer , Momentum , Nozzles , Boundary-value problems , Flow (Dynamics) , Temperature , Computational fluid dynamics , Cooling , Diaphragms (Mechanical devices) , Diaphragms (Structural)

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

InterPACK 2015; V003T10A017https://doi.org/10.1115/IPACK2015-48393

View Articletitled, Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

Topics: Computer cooling , Jets , Flow (Dynamics) , Heat transfer coefficients , Reynolds number , Copper , Electronics , Heat flux , Impingement cooling , Sensors

Single Phase Cooling Fundamentals

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete

InterPACK 2015; V003T10A018https://doi.org/10.1115/IPACK2015-48123

View Articletitled, Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Topics: Heat flux , Microcoolers , Microelectronic devices , Optimization , Cooling , Fluids , Heat transfer , Computational fluid dynamics , Design , Engineering simulation

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich

InterPACK 2015; V003T10A019https://doi.org/10.1115/IPACK2015-48346

View Articletitled, Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Topics: Coolants , Cooling , Design , Temperature , Heat , Heat flux , Fluids , Flux (Metallurgy) , Airfoils , Computer cooling

Two Phase Boiling Computational Modeling Challenges

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome

InterPACK 2015; V003T10A020https://doi.org/10.1115/IPACK2015-48033

View Articletitled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Topics: Boiling , Computational fluid dynamics , Engineering simulation , Heat transfer , Microchannels , Simulation , Slug flows , Bubbles , Evaporation , Flow (Dynamics)

Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome

InterPACK 2015; V003T10A021https://doi.org/10.1115/IPACK2015-48066

View Articletitled, Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Topics: Microchannels , Dynamic models , Flow (Dynamics) , Heat conduction , Heat transfer , Pressure , Simulation , Stability , Two-phase flow

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida

InterPACK 2015; V003T10A022https://doi.org/10.1115/IPACK2015-48129

View Articletitled, Validation Study for VOF Simulations of Boiling in a Microchannel

Topics: Boiling , Microchannels , Simulation , Boundary-value problems , Temperature , Two-phase flow , Flow (Dynamics) , Fluids , Heat flux , Heat transfer

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella

InterPACK 2015; V003T10A023https://doi.org/10.1115/IPACK2015-48178

View Articletitled, A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Topics: Boiling , Flow (Dynamics) , Microchannels , Modeling , Vapors , Bubbles , Simulation , Currents , Errors , Evaporation

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer

InterPACK 2015; V003T10A024https://doi.org/10.1115/IPACK2015-48334

View Articletitled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Topics: Cooling , Modeling , Simulation , Critical heat flux , Corrosion , Design , Electrodiffusion , Erosion , Fluids , Gallium nitride

A Numerical Study of Pulsating Heat Pipe Performance

Brian P. d’Entremont, John R. Thome

InterPACK 2015; V003T10A025https://doi.org/10.1115/IPACK2015-48350

View Articletitled, A Numerical Study of Pulsating Heat Pipe Performance

Topics: Heat pipes , Slug flows , Boiling , Condensation , Evaporation , Microchannels , Buoyancy , Condensers (steam plant) , Flow (Dynamics) , Heat transfer

ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

Gustavo R. Anjos, Norberto Mangiavacchi, Jose Pontes, John Thome

InterPACK 2015; V003T10A026https://doi.org/10.1115/IPACK2015-48441

View Articletitled, ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

Topics: Finite element methods , Heat , Mass transfer , Microchannels , Two-phase flow , Bubbles , Computer programming , Cooling , Design , Electronics

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer

InterPACK 2015; V003T10A027https://doi.org/10.1115/IPACK2015-48489

View Articletitled, Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Topics: Boiling , Cavities , Coolants , Cooling , Density , Evaporative cooling , Flow (Dynamics) , Fluids , Heat transfer , Integrated circuits

Vapor Chambers and Condensation

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Yasushi Koito, Hiroyuki Maehara, Daisuke Shimada, Toshio Tomimura

InterPACK 2015; V003T10A028https://doi.org/10.1115/IPACK2015-48308

View Articletitled, A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Topics: Heat , Heat pipes , Heat transfer , Thermal conductivity , Water , Circuits , Condensers (steam plant) , Copper powders , Dimensions , Fluids

Fabrication of a Vapor Chamber on a Plastic Board

Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura

InterPACK 2015; V003T10A029https://doi.org/10.1115/IPACK2015-48554

View Articletitled, Fabrication of a Vapor Chamber on a Plastic Board

Topics: Manufacturing , Vapors , Heat transfer , Cooling , Heat , Fluids , Water , Condensers (steam plant) , Copper powders , Flat heat pipes