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Proceedings Papers

Proceedings Volume Cover
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5689-5
Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Advanced Electronics and Photonics, Packaging Materials and Processing

Interconnects Materials

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
InterPACK 2015; V002T01A001https://doi.org/10.1115/IPACK2015-48389
View Articletitled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
PDF
Topics: Alloys , Mechanical properties , Operating temperature , Temperature , Electronic systems , Solders , Vibration , Deformation , Elastic moduli , Electronics
Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging
Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2015; V002T01A002https://doi.org/10.1115/IPACK2015-48619
View Articletitled, Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging
PDF
Topics: Constitutive equations , Lead-free solders , Silver , Solidification , Alloys , Mechanical properties , Water , Solders , Reliability , Stress-strain curves
Characterization of Doped SAC Solder Materials and Determination of Anand Parameters
Sudan Ahmed, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2015; V002T01A003https://doi.org/10.1115/IPACK2015-48624
View Articletitled, Characterization of Doped SAC Solder Materials and Determination of Anand Parameters
PDF
Topics: Solders , Alloys , Reliability , Silver , Stress-strain curves , Temperature , Tin , Constitutive equations , Copper , Economics
Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
Pradeep Lall, Shantanu Deshpande, Luu Nguyen
InterPACK 2015; V002T01A004https://doi.org/10.1115/IPACK2015-48638
View Articletitled, Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
PDF
Topics: Aluminum , Copper , Wire , Temperature , Chemistry , Compression , Failure analysis , Image processing , Metals , Molding
Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
InterPACK 2015; V002T01A005https://doi.org/10.1115/IPACK2015-48708
View Articletitled, Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
PDF
Topics: High temperature , Solders , Temperature , Stress , Creep , Equipment performance , Mechanical properties , Melting , Wire
Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal
Subhasis Mukherjee, Bite Zhou, Abhijit Dasgupta, Thomas R. Bieler
InterPACK 2015; V002T01A006https://doi.org/10.1115/IPACK2015-48710
View Articletitled, Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal
PDF
Topics: Anisotropy , Creep , Crystals , Modeling , Steady state , Tin , Dislocations , Stress , Dislocation density , Nanoscale phenomena

Novel Modeling, Test and Characterization Methods

Design of the Next Generation Antenna Mounts
Ruben Gregory Puthota Dominic Savio, Betsegaw Gebrehiwot, Dereje Agonafer, Al Skrepcinski, Tom Palmer
InterPACK 2015; V002T01A007https://doi.org/10.1115/IPACK2015-48594
View Articletitled, Design of the Next Generation Antenna Mounts
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Topics: Design , Telecommunications , Weight (Mass) , Deformation , Image processing , Load bearing capacity , Matlab , Stress , Wind pressure
Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
InterPACK 2015; V002T01A008https://doi.org/10.1115/IPACK2015-48623
View Articletitled, Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
PDF
Topics: Silver , Solder joints , Creep , Alloys , Solders , Nanoindentation , Testing , Crystal structure , Crystals , Stress
An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball
Sai Sudharsanan Paranjothy, Ganesh Subbarayan, Dae Young Jung, Bahgat G. Sammakia
InterPACK 2015; V002T01A009https://doi.org/10.1115/IPACK2015-48653
View Articletitled, An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball
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Topics: Constitutive equations , Copper , Displacement , Finite element analysis , Fracture (Materials) , Fracture (Process) , Bonding , Electrical properties , High temperature , Modeling
DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint
Pradeep Lall, Kazi Mirza, Jeff Suhling
InterPACK 2015; V002T01A010https://doi.org/10.1115/IPACK2015-48727
View Articletitled, DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint
PDF
Topics: Cycles , Solder joints , Temperature , Fatigue , Reliability , Electronics , Alloys , Ball-Grid-Array packaging , Failure , High temperature
LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation
Pradeep Lall, Junchao Wei
InterPACK 2015; V002T01A011https://doi.org/10.1115/IPACK2015-48785
View Articletitled, LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation
PDF
Topics: Computerized tomography , Deformation , Displacement , Computation , Electron configuration , Electronics , Heat , Interferometry , Light-emitting diodes , Shapes

Overmold Compounds, Adhesives, Underfills, Seals, Thermal Interface and Heat Spreader Materials

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
David Samet, Abhishek Kwatra, Suresh K. Sitaraman
InterPACK 2015; V002T01A012https://doi.org/10.1115/IPACK2015-48447
View Articletitled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
PDF
Topics: Copper , Epoxy adhesives , Epoxy resins , Fatigue cracks , Fracture (Materials) , Crack propagation , Fatigue , Cycles , Design , Displacement
Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning
Promod R. Chowdhury, Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2015; V002T01A013https://doi.org/10.1115/IPACK2015-48622
View Articletitled, Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning
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Topics: Creep , Elastic moduli , Experimental characterization , Flip-chip assemblies , Hardening (Curing) , Machinery , Materials properties , Mechanical properties , Microscale devices , Production equipment
Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials
Taryn J. Davis, Tuhin Sinha, Ken Marston, Sushumna Iruvanti
InterPACK 2015; V002T01A014https://doi.org/10.1115/IPACK2015-48712
View Articletitled, Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials
PDF
Topics: Adhesion , Aluminum , Elasticity , Failure mechanisms , Finite element analysis , Finite element methods , Finite element model , Flip-chip , High temperature , Mechanical testing
Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
Yasuhiro Kawase, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani
InterPACK 2015; V002T01A015https://doi.org/10.1115/IPACK2015-48738
View Articletitled, Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
PDF
Topics: Joining , Pellet fusion , Thermal conductivity , Fillers (Materials) , Aluminum , Boron , Composite materials , Cooling , Density , Epoxy adhesives
Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
InterPACK 2015; V002T01A016https://doi.org/10.1115/IPACK2015-48741
View Articletitled, Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
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Topics: Flip-chip packages , Thermal deformation , Warping , Finite element analysis , Manufacturing , Package on package , Shapes , Deformation , Finite element model , Flip-chip

Wafer Finishing, Dicing and Bond and Assembly Development

Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
Richard Barnett, Dave Thomas, Oliver Ansell
InterPACK 2015; V002T01A017https://doi.org/10.1115/IPACK2015-48749
View Articletitled, Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
PDF
Topics: Blades , Damage , Flow (Dynamics) , Lasers , Plasma etching , Plasmas (Ionized gases) , Reliability , Semiconductor wafers , Traction
New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
Yukio Nakamura, Kenichi Oohashi, Koji Morita, Shuji Nomoto, Takayuki Suzuki, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi
InterPACK 2015; V002T01A018https://doi.org/10.1115/IPACK2015-48836
View Articletitled, New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
PDF
Topics: Density , Diluents , Fillers (Materials) , Package on package , Resins , Thermal expansion , Warping

Advanced Electronics and Photonics: Packaging, Interconnect and Reliability

Advances in 2.5D, 3D and Stacked Packaging

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
InterPACK 2015; V002T02A001https://doi.org/10.1115/IPACK2015-48088
View Articletitled, Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
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Topics: Design , Heat sinks , Silicon , Aluminum , Copper , Energy dissipation , Heat , Modeling , Slug flows , Cooling
Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
Lutz Meinshausen, Ming Liu, Tae-Kyu Lee, Indranath Dutta, Li Li
InterPACK 2015; V002T02A002https://doi.org/10.1115/IPACK2015-48124
View Articletitled, Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
PDF
Topics: Reliability , Silicon , Finite element analysis , Finite element model , Shear stress , Temperature , Copper , Creep , Diffusion (Physics) , Electrodiffusion
Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
Babak Talebanpour, Indranath Dutta
InterPACK 2015; V002T02A003https://doi.org/10.1115/IPACK2015-48125
View Articletitled, Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
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Topics: Fracture (Materials) , Solders , Tin , Fracture toughness , Failure , Brittleness , Ductile fracture , Electronic packages , Fractography , Fracture mechanics
Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
InterPACK 2015; V002T02A004https://doi.org/10.1115/IPACK2015-48168
View Articletitled, Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
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Topics: Cycles , Electronic packages , Warping , Heating , Package on package , Reliability , Resins , Elastic moduli , Hardening (Curing) , Relaxation (Physics)
Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
Masaru Gotoh, Ken Suzuki, Hideo Miura
InterPACK 2015; V002T02A005https://doi.org/10.1115/IPACK2015-48197
View Articletitled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper , Thermal conductivity , Thin films , Grain boundaries , Electrical resistivity , Heating , Joules , Stress , Thermal properties , Diffusion (Physics)
Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries
Takahiro Nakanishi, Ken Suzuki, Hideo Miura
InterPACK 2015; V002T02A006https://doi.org/10.1115/IPACK2015-48200
View Articletitled, Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries
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Topics: Grain boundaries , Reliability , Copper , Thin films , Electrical resistivity , Electron backscatter diffraction , Brittleness , Diffusion (Physics) , Dislocations , Focused ion beams
Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands
Frank Wei
InterPACK 2015; V002T02A007https://doi.org/10.1115/IPACK2015-48387
View Articletitled, Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands
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Topics: Metals , Package on package , Packaging , Polishing , Semiconductor wafers
Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs
Anirudh Udupa, Ganesh Subbarayan, Cheng-Kok Koh
InterPACK 2015; V002T02A008https://doi.org/10.1115/IPACK2015-48656
View Articletitled, Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs
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Topics: Risk , Shear stress , Stress , Reliability , Copper , Delamination , Silicon , Stress singularity
Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package
Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer
InterPACK 2015; V002T02A009https://doi.org/10.1115/IPACK2015-48811
View Articletitled, Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package
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Topics: Circuits , Damage , Electronics , Energy dissipation , Gates (Closures) , Graphics processing units , Heating , Joules , Manufacturing , Modeling

Advances in Interconnect Technologies

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
Takashi Kawakami, Takahiro Kinoshita, Hirokazu Oriyama
InterPACK 2015; V002T02A010https://doi.org/10.1115/IPACK2015-48136
View Articletitled, A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
PDF
Topics: Lead-free solders , Low cycle fatigue , Stress , Simulation , Design engineering , Fatigue cracks , Fatigue life , Fatigue testing , Shapes , Solder joints
Arcing and Spacing Requirements for High Voltage Printed Circuit Boards
Prabjit Singh
InterPACK 2015; V002T02A011https://doi.org/10.1115/IPACK2015-48180
View Articletitled, Arcing and Spacing Requirements for High Voltage Printed Circuit Boards
PDF
Topics: Cellulosic fibers , Circuits , Coating processes , Coatings , Dust , Electric potential , Gates (Closures) , Hardware , MOSFET transistors , Physics
Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
Pradeep Lall, Yihua Luo, Luu Nguyen
InterPACK 2015; V002T02A012https://doi.org/10.1115/IPACK2015-48639
View Articletitled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
PDF
Topics: Corrosion , Wire , Diffusion (Physics) , Electrolytic corrosion , Ions , Copper , Electrical resistivity , Molding , Temperature , Deformation
DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
Subramanya Sadasiva, Ganesh Subbarayan
InterPACK 2015; V002T02A013https://doi.org/10.1115/IPACK2015-48655
View Articletitled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
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Topics: Diffusion (Physics) , Simulation , Solids , Stress , Electrodiffusion , Failure , Solder joints , Dynamics (Mechanics) , Finite element analysis , Solders
Modeling the Reflow Soldering Process in PCB’s
João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
InterPACK 2015; V002T02A014https://doi.org/10.1115/IPACK2015-48720
View Articletitled, Modeling the Reflow Soldering Process in PCB’s
PDF
Topics: Alloys , Computational fluid dynamics , Computer software , Copper , Enthalpy , Fluids , Geometry , Heat of fusion , Materials properties , Melting
Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa
InterPACK 2015; V002T02A015https://doi.org/10.1115/IPACK2015-48744
View Articletitled, Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
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Topics: Current density , Electrodiffusion , Numerical analysis , Reservoirs , Tree (Data structure) , Damage , Metals , Electric current , Circuits , Computer simulation
Reliability of Interconnections Made of Sintered Silver Nano Particles
Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki
InterPACK 2015; V002T02A016https://doi.org/10.1115/IPACK2015-48795
View Articletitled, Reliability of Interconnections Made of Sintered Silver Nano Particles
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Topics: Nanoparticles , Reliability , Silver , Sensors , Algorithms , Chain , Coating processes , Coatings , Computerized tomography , Failure mechanisms

Advances in Packaging

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
Hideo Koguchi, Naoki Kimura
InterPACK 2015; V002T02A017https://doi.org/10.1115/IPACK2015-48105
View Articletitled, Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
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Topics: Bonding , Boundary element methods , Cooling , Corners (Structural elements) , Delamination , Joining , Numerical analysis , Packaging , Photonic equipment , Polymers
An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress
Mario Gonzalez, Joeri De Vos, Geert Van der Plas, Eric Beyne
InterPACK 2015; V002T02A018https://doi.org/10.1115/IPACK2015-48111
View Articletitled, An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress
PDF
Topics: Design , Flip-chip packages , Stress , Copper , Columns (Structural) , Polishing equipment , Solders , Finite element model , Flip-chip , Flip-chip devices
A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
InterPACK 2015; V002T02A019https://doi.org/10.1115/IPACK2015-48138
View Articletitled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
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Topics: Creep , Damage , Fatigue , Lead-free solders , Tin , Solder joints , Electronics , Design engineering , Fatigue damage , Stress
Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads
Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii
InterPACK 2015; V002T02A020https://doi.org/10.1115/IPACK2015-48142
View Articletitled, Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads
PDF
Topics: Simulation , Stress , Thermal stresses , Finite element methods , Heat , Temperature , Cooling , Damage , Packaging , Reliability
Mitigation of Tin Whisker Growth by Dopant Addition
Lutz Meinshausen, Soumik Banerjee, Indranath Dutta, Bhaskar Majumdar
InterPACK 2015; V002T02A021https://doi.org/10.1115/IPACK2015-48155
View Articletitled, Mitigation of Tin Whisker Growth by Dopant Addition
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Topics: Atoms , Density , Diffusion (Physics) , Electronic components , Engineering simulation , Grain boundaries , Heat , Molecular dynamics , Reliability , Simulation
Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
InterPACK 2015; V002T02A022https://doi.org/10.1115/IPACK2015-48247
View Articletitled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
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Topics: Cycles , Fatigue life , Temperature , Finite element methods , Thin films , Glass , Textiles , Constitutive equations , Creep , Epoxy resins
Evaluation of Intensity of Singularity at 3D Piezoelectric Bonded Joints Using a Conservative Integral
Chonlada Luangarpa, Hideo Koguchi
InterPACK 2015; V002T02A023https://doi.org/10.1115/IPACK2015-48275
View Articletitled, Evaluation of Intensity of Singularity at 3D Piezoelectric Bonded Joints Using a Conservative Integral
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Topics: Electric potential , Finite element methods , Stress , Stress singularity
Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
InterPACK 2015; V002T02A024https://doi.org/10.1115/IPACK2015-48553
View Articletitled, Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
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Topics: Fatigue cracks , Solder joints , Synchrotron radiation , X-rays , Solders , Crack propagation , Fracture (Materials) , Microcracks , Ball-Grid-Array packaging , Ceramics
Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
InterPACK 2015; V002T02A025https://doi.org/10.1115/IPACK2015-48605
View Articletitled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
PDF
Topics: Fatigue cracks , Shear (Mechanics) , Solder joints , Stiffness , Cycles , Fatigue testing , Fracture (Materials) , Stress , Copper , Corners (Structural elements)
Mechanism and Model of Bond Formation in Ultrasonic Wire Bonding
T. Calvin Tszeng
InterPACK 2015; V002T02A026https://doi.org/10.1115/IPACK2015-48613
View Articletitled, Mechanism and Model of Bond Formation in Ultrasonic Wire Bonding
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Topics: Wire bonding , Micromechanics (Engineering) , Bonding , Boundary-value problems , Critical phenomena (Physics) , Cycles , Engineering simulation , Finite element methods , Finite element model , Flip-chip
Mechanical Characterization of Assemblies Bonded With Pressure-Sensitive Adhesives (PSAs)
Hao Huang, Abhijit Dasgupta, Ehsan Mirbagheri, Srini Boddapati
InterPACK 2015; V002T02A027https://doi.org/10.1115/IPACK2015-48707
View Articletitled, Mechanical Characterization of Assemblies Bonded With Pressure-Sensitive Adhesives (PSAs)
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Topics: Adhesives , Pressure , Bonding , Manufacturing , Mechanical behavior , Stress , Creep , Temperature , Failure mechanisms
Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
Panthea Sepehrband, Maryam Gholamirad
InterPACK 2015; V002T02A028https://doi.org/10.1115/IPACK2015-48812
View Articletitled, Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
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Topics: Bonding , Intermetallic compounds , Alloys , Aluminum , Copper , Diffusion (Physics) , Experimental analysis , Finite element analysis , Low temperature , Micromechanical devices

Flexible and Wearable Electronics

Highly Stretchable Interconnects for Flexible Electronics Applications
Yeasir Arafat, Rahul Panat, Indranath Dutta
InterPACK 2015; V002T02A029https://doi.org/10.1115/IPACK2015-48130
View Articletitled, Highly Stretchable Interconnects for Flexible Electronics Applications
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Topics: Density , Flexible electronics , Geometry , Manufacturing , Polymers
Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination
Ryan Lewis, Julie Slaughter, Y. C. Lee
InterPACK 2015; V002T02A030https://doi.org/10.1115/IPACK2015-48503
View Articletitled, Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination
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Topics: Ceramics , Cracking (Materials) , Elastic moduli , Flexible electronics , Fracture (Materials) , Fracture (Process) , Fracture mechanics , Heat pipes , Laminates , Lamination
Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics
Kaustubh Nagarkar, Craig Galligan, Michael Klitzke, James Rose, Binoy Shah, Donna Sherman
InterPACK 2015; V002T02A031https://doi.org/10.1115/IPACK2015-48704
View Articletitled, Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics
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Topics: Biomedicine , Electronics , Packaging , Circuits , Laminates , Manufacturing , Microelectromechanical systems , Pressure sensors , Sensors
Thermal Evaluation Process on Smart Watches
Angel Qian Han, Nanbo Kang
InterPACK 2015; V002T02A032https://doi.org/10.1115/IPACK2015-48711
View Articletitled, Thermal Evaluation Process on Smart Watches
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Topics: Battery life , Computer software , Design , Safety , Security , Simulation

Harsh Environments and High Temperature Electronics

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
InterPACK 2015; V002T02A033https://doi.org/10.1115/IPACK2015-48009
View Articletitled, Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
PDF
Topics: Event history analysis , Solder joints , Tin , Ball-Grid-Array packaging , Fatigue failure , Finishes , Intermetallic compounds , Solders
Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination
Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer
InterPACK 2015; V002T02A034https://doi.org/10.1115/IPACK2015-48049
View Articletitled, Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination
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Topics: Absorption , Contamination , Corrosion , Data centers , Air conditioning , Gases , Reliability , Wheels , China , Circuits
Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
Paola Rivera Soto, Pedro O. Quintero, Mellyssa Mulero, Dimeji Ibitayo
InterPACK 2015; V002T02A035https://doi.org/10.1115/IPACK2015-48323
View Articletitled, Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
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Topics: Stability , Tin , Bonding , Melting point , Fracture (Materials) , Copper , Diffusion (Physics) , Electronic packaging , Intermetallic compounds , Microscopy
Shock Risk Assessment of BGA Components: Importance of Physics Based Metrics
Helia Rahmani, Milena Vujosevic, Min Pei
InterPACK 2015; V002T02A036https://doi.org/10.1115/IPACK2015-48576
View Articletitled, Shock Risk Assessment of BGA Components: Importance of Physics Based Metrics
PDF
Topics: Ball-Grid-Array packaging , Physics , Risk assessment , Shock (Mechanics) , Failure , Solder joints , Computer simulation , Damage , Stress
High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects
Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
InterPACK 2015; V002T02A037https://doi.org/10.1115/IPACK2015-48577
View Articletitled, High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects
PDF
Topics: High temperature , Shear strength , Tin , Transients (Dynamics) , Creep , Sinter (Metallurgy) , Temperature , Sintering , Tension-leg platforms , Copper
Physics Based Requirements for Qualification of BGA Components in Temperature Cycling
Ru Han, Milena Vujosevic, Min Pei
InterPACK 2015; V002T02A038https://doi.org/10.1115/IPACK2015-48578
View Articletitled, Physics Based Requirements for Qualification of BGA Components in Temperature Cycling
PDF
Topics: Ball-Grid-Array packaging , Physics , Temperature , Adhesives , Package on package , Deformation , Reliability , Solder joints , Computer simulation , Damage
FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
InterPACK 2015; V002T02A039https://doi.org/10.1115/IPACK2015-48620
View Articletitled, FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
PDF
Topics: Finite element analysis , Reliability , Failure , Lead-free solders , Temperature , Accelerated life testing , Ball-Grid-Array packaging , Fracture (Materials) , Lumber , Modeling
Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
InterPACK 2015; V002T02A040https://doi.org/10.1115/IPACK2015-48626
View Articletitled, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
PDF
Topics: Flip-chip , Flip-chip devices , Laminates , Simulation , Stress , Flip-chip assemblies , Diffusion (Physics) , Storage , Temperature , Absorption
Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger
InterPACK 2015; V002T02A041https://doi.org/10.1115/IPACK2015-48627
View Articletitled, Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
PDF
Topics: Stress , Shear stress , Molding , Storage , Weight (Mass) , Computer simulation , Electronic packages , Engineering simulation , Failure , Finite element analysis
Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
Jingshi Meng, Abhijit Dasgupta
InterPACK 2015; V002T02A042https://doi.org/10.1115/IPACK2015-48669
View Articletitled, Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
PDF
Topics: Failure mechanisms , Resonance , Reflection , Stress , Circuits , Diluents , Disperse systems , Electrical wires , Impulse (Physics) , Microelectromechanical systems
Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
InterPACK 2015; V002T02A043https://doi.org/10.1115/IPACK2015-48709
View Articletitled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
PDF
Topics: Durability , Electronic components , Excitation , Testing , Circuits , Printed circuit boards , Degrees of freedom , Dynamics (Mechanics) , Vibration , Damage

Silicon Photonics and LED

A Method to Eliminate the Effect of Phosphor Sedimentation on LED’s Angular Color Uniformity
Qi Chen, Run Hu, Yiman Wang, Huai Zheng, Xiaobing Luo
InterPACK 2015; V002T02A044https://doi.org/10.1115/IPACK2015-48023
View Articletitled, A Method to Eliminate the Effect of Phosphor Sedimentation on LED’s Angular Color Uniformity
PDF
Topics: Phosphors , Sedimentation , Engineering simulation , Ray tracing , Simulation , Temperature
An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions
Pradeep Lall, Peter Sakalaukus, Lynn Davis
InterPACK 2015; V002T02A045https://doi.org/10.1115/IPACK2015-48257
View Articletitled, An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions
PDF
Topics: Computer software , Construction , Cracking (Materials) , Delamination , Design , Energy efficiency , Failure , Failure mechanisms , Fracture (Process) , Junctions
Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
InterPACK 2015; V002T02A046https://doi.org/10.1115/IPACK2015-48664
View Articletitled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
PDF
Topics: Absorption , Emissions , Light scattering , Light-emitting diodes , Modeling , Phosphors , Wavelength , Excitation , Emission spectra , Plates (structures)
Prognostics Health Management Model for LED Package Failure Under Contaminated Environment
Pradeep Lall, Hao Zhang, Lynn Davis
InterPACK 2015; V002T02A047https://doi.org/10.1115/IPACK2015-48724
View Articletitled, Prognostics Health Management Model for LED Package Failure Under Contaminated Environment
PDF
Topics: Errors , Failure , Kalman filters , Maintenance , Organic compounds , Phosphors , Reliability , Robustness , Service life (Equipment) , Stability

Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Continuum/Atomistic Modeling and Simulations

Intrinsic Thermal Conductivity of Wurtzite AlxGa1-xN, InxGa1-xN and InxAl1-xN From First-Principles Calculation
Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo
InterPACK 2015; V002T06A001https://doi.org/10.1115/IPACK2015-48032
View Articletitled, Intrinsic Thermal Conductivity of Wurtzite Al<sub><em>x</em></sub>Ga<sub>1-<em>x</em></sub>N, In<sub><em>x</em></sub>Ga<sub>1-<em>x</em></sub>N and In<sub><em>x</em></sub>Al<sub>1-<em>x</em></sub>N From First-Principles Calculation
PDF
Topics: Thermal conductivity , Alloys , Crystals , Gallium nitride , Mean free path , Size effect , Temperature
The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study
Fernan Saiz, Cristina H. Amon
InterPACK 2015; V002T06A002https://doi.org/10.1115/IPACK2015-48114
View Articletitled, The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study
PDF
Topics: Gallium arsenide , Molecular dynamics , Thermal conductivity , Temperature , Acoustics , Density , Design , Electromagnetic scattering , Equilibrium (Physics) , Heat

Micro/Nano Structures in Phase Change Heat Transfer

Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces
Russell J. LaBrie, II, Jorge Padilla, Jr., Van P. Carey
InterPACK 2015; V002T06A003https://doi.org/10.1115/IPACK2015-48153
View Articletitled, Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces
PDF
Topics: Drops , Heat transfer , Water , Nanocrystals , Heat transfer coefficients , Copper , Evaporation , Film thickness , Gravity (Force) , Hydrophilicity
Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
Chi Zhang, Guoguang Rong, James W. Palko, Thomas J. Dusseault, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson
InterPACK 2015; V002T06A004https://doi.org/10.1115/IPACK2015-48262
View Articletitled, Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
PDF
Topics: Computer cooling , Copper , Permeability , Sintering , Cooling , Fluids , Capillarity , Electrodeposition , Electronics , Heat flux
Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
InterPACK 2015; V002T06A005https://doi.org/10.1115/IPACK2015-48628
View Articletitled, Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
PDF
Topics: Boiling , Drops , Evaporation , Particulate matter , Nanoparticles , Adhesion , Temperature , Bubbles , Critical heat flux , Heat transfer
Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000
Fanghao Yang, Xiaochuan Li, Wenming Li, Chen Li
InterPACK 2015; V002T06A006https://doi.org/10.1115/IPACK2015-48737
View Articletitled, Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000
PDF
Topics: Boiling , Flow (Dynamics) , Heat transfer , Microchannels , Nanostructures , Fluids , Heat sinks , Nanolithography , Nanoparticles , Nanoscale phenomena

Pool Boiling and Condensation

Film Boiling Heat Transfer Enhancement via Electrostatic Leidenfrost State Suppression
Arjang Shahriari, Vaibhav Bahadur
InterPACK 2015; V002T06A007https://doi.org/10.1115/IPACK2015-48667
View Articletitled, Film Boiling Heat Transfer Enhancement via Electrostatic Leidenfrost State Suppression
PDF
Topics: Film boiling , Heat transfer , Boiling , Vapors , Temperature , Energy / power systems , Energy dissipation , Heat , Nuclear power plant operations , Nucleate boiling

Single Phase Flows

Thermal Solution of High Flux Phased Radar Antenna for Military Application
Murat Parlak, Murat Yaban
InterPACK 2015; V002T06A008https://doi.org/10.1115/IPACK2015-48055
View Articletitled, Thermal Solution of High Flux Phased Radar Antenna for Military Application
PDF
Topics: Defense industry , Radar , Design , Cooling , Heat flux , Manifolds , Computational fluid dynamics , Computer software , Finite element methods , Flow (Dynamics)
Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
InterPACK 2015; V002T06A009https://doi.org/10.1115/IPACK2015-48122
View Articletitled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
PDF
Topics: Boundary-value problems , Computational fluid dynamics , Computer simulation , Cooling , Design , Fins , Flow (Dynamics) , Fluid dynamics , Geometry , Heat conduction
Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants
Sheng-Fu Mei, Zhong-Shan Deng, Jing Liu
InterPACK 2015; V002T06A010https://doi.org/10.1115/IPACK2015-48318
View Articletitled, Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants
PDF
Topics: Coolants , Heat sinks , Liquid metals , Microchannels , Water , Cooling , Electronics , Flow (Dynamics) , Specific heat , Computer cooling
Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation
Noris Gallandat, Danielle Hesse, J. Rhett Mayor
InterPACK 2015; V002T06A011https://doi.org/10.1115/IPACK2015-48417
View Articletitled, Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation
PDF
Topics: Density , Heat exchangers , Flow (Dynamics) , Heat , Temperature , Heat sinks , Heat transfer , Hydrofoil , Junctions , Water

Thin Film/Surface Tension Driven Flows

Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces
Zezhi Zeng, Gopinath Warrier, Y. Sungtaek Ju
InterPACK 2015; V002T06A012https://doi.org/10.1115/IPACK2015-48149
View Articletitled, Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces
PDF
Topics: Flow (Dynamics) , Heat transfer , Liquid films , Heat exchangers , Cooling , Design , String , Shapes , Computer simulation , Evaporative cooling
Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
InterPACK 2015; V002T06A013https://doi.org/10.1115/IPACK2015-48532
View Articletitled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
PDF
Topics: Flow (Dynamics) , Glass , Heat , Heat transfer , High temperature , Modeling , Solar energy , Temperature , Viscosity , Fluids

Two Phase Flows

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow
Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella
InterPACK 2015; V002T06A014https://doi.org/10.1115/IPACK2015-48177
View Articletitled, Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow
PDF
Topics: Bubbles , Microchannels , Slug flows , Vapors , Visualization , Flow (Dynamics) , Heating , Junctions , Boiling , Borosilicate glasses
Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV
Matthew J. Rau, Tianqi Guo, Pavlos P. Vlachos, Suresh V. Garimella
InterPACK 2015; V002T06A015https://doi.org/10.1115/IPACK2015-48184
View Articletitled, Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV
PDF
Topics: Boiling , Visualization , Vapors , Flow (Dynamics) , Heat , Particulate matter , Bubbles , Heat flux , Imaging , Outflow
Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow
Masahiro Muraoka, Yuuki Kumagai, Yuuta Yatagawa, Ichiro Ueno
InterPACK 2015; V002T06A016https://doi.org/10.1115/IPACK2015-48241
View Articletitled, Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow
PDF
Topics: Creeping flow , Drops , Flow (Dynamics) , Reynolds number , Clearances (Engineering)
Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
Sajjad Bigham, Saeed Moghaddam
InterPACK 2015; V002T06A017https://doi.org/10.1115/IPACK2015-48581
View Articletitled, Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
PDF
Topics: Boiling , Flow (Dynamics) , Heat transfer , Microchannels , Physics , Bubbles , Evaporation , Heat flux , Resolution (Optics) , Thermal conductivity
Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
InterPACK 2015; V002T06A018https://doi.org/10.1115/IPACK2015-48670
View Articletitled, Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
PDF
Topics: Computer simulation , Gallium nitride , Heat flux , Microcoolers , Microchannels , Simulation , Computational fluid dynamics , Flow (Dynamics) , Fluids , Heat conduction
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