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Proceedings Papers

Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Advanced Electronics and Photonics, Packaging Materials and Processing

Interconnects Materials

InterPACK 2015; V002T01A001doi:https://doi.org/10.1115/IPACK2015-48389
InterPACK 2015; V002T01A002doi:https://doi.org/10.1115/IPACK2015-48619
InterPACK 2015; V002T01A003doi:https://doi.org/10.1115/IPACK2015-48624
InterPACK 2015; V002T01A004doi:https://doi.org/10.1115/IPACK2015-48638
InterPACK 2015; V002T01A005doi:https://doi.org/10.1115/IPACK2015-48708
InterPACK 2015; V002T01A006doi:https://doi.org/10.1115/IPACK2015-48710

Novel Modeling, Test and Characterization Methods

InterPACK 2015; V002T01A007doi:https://doi.org/10.1115/IPACK2015-48594
InterPACK 2015; V002T01A008doi:https://doi.org/10.1115/IPACK2015-48623
InterPACK 2015; V002T01A009doi:https://doi.org/10.1115/IPACK2015-48653
InterPACK 2015; V002T01A010doi:https://doi.org/10.1115/IPACK2015-48727
InterPACK 2015; V002T01A011doi:https://doi.org/10.1115/IPACK2015-48785

Overmold Compounds, Adhesives, Underfills, Seals, Thermal Interface and Heat Spreader Materials

InterPACK 2015; V002T01A012doi:https://doi.org/10.1115/IPACK2015-48447
InterPACK 2015; V002T01A013doi:https://doi.org/10.1115/IPACK2015-48622
InterPACK 2015; V002T01A014doi:https://doi.org/10.1115/IPACK2015-48712
InterPACK 2015; V002T01A015doi:https://doi.org/10.1115/IPACK2015-48738
InterPACK 2015; V002T01A016doi:https://doi.org/10.1115/IPACK2015-48741

Wafer Finishing, Dicing and Bond and Assembly Development

InterPACK 2015; V002T01A017doi:https://doi.org/10.1115/IPACK2015-48749
InterPACK 2015; V002T01A018doi:https://doi.org/10.1115/IPACK2015-48836

Advanced Electronics and Photonics: Packaging, Interconnect and Reliability

Advances in 2.5D, 3D and Stacked Packaging

InterPACK 2015; V002T02A001doi:https://doi.org/10.1115/IPACK2015-48088
InterPACK 2015; V002T02A002doi:https://doi.org/10.1115/IPACK2015-48124
InterPACK 2015; V002T02A003doi:https://doi.org/10.1115/IPACK2015-48125
InterPACK 2015; V002T02A004doi:https://doi.org/10.1115/IPACK2015-48168
InterPACK 2015; V002T02A005doi:https://doi.org/10.1115/IPACK2015-48197
InterPACK 2015; V002T02A006doi:https://doi.org/10.1115/IPACK2015-48200
InterPACK 2015; V002T02A007doi:https://doi.org/10.1115/IPACK2015-48387
InterPACK 2015; V002T02A008doi:https://doi.org/10.1115/IPACK2015-48656
InterPACK 2015; V002T02A009doi:https://doi.org/10.1115/IPACK2015-48811

Advances in Interconnect Technologies

InterPACK 2015; V002T02A010doi:https://doi.org/10.1115/IPACK2015-48136
InterPACK 2015; V002T02A011doi:https://doi.org/10.1115/IPACK2015-48180
InterPACK 2015; V002T02A012doi:https://doi.org/10.1115/IPACK2015-48639
InterPACK 2015; V002T02A013doi:https://doi.org/10.1115/IPACK2015-48655
InterPACK 2015; V002T02A014doi:https://doi.org/10.1115/IPACK2015-48720
InterPACK 2015; V002T02A015doi:https://doi.org/10.1115/IPACK2015-48744
InterPACK 2015; V002T02A016doi:https://doi.org/10.1115/IPACK2015-48795

Advances in Packaging

InterPACK 2015; V002T02A017doi:https://doi.org/10.1115/IPACK2015-48105
InterPACK 2015; V002T02A018doi:https://doi.org/10.1115/IPACK2015-48111
InterPACK 2015; V002T02A019doi:https://doi.org/10.1115/IPACK2015-48138
InterPACK 2015; V002T02A020doi:https://doi.org/10.1115/IPACK2015-48142
InterPACK 2015; V002T02A021doi:https://doi.org/10.1115/IPACK2015-48155
InterPACK 2015; V002T02A022doi:https://doi.org/10.1115/IPACK2015-48247
InterPACK 2015; V002T02A023doi:https://doi.org/10.1115/IPACK2015-48275
InterPACK 2015; V002T02A024doi:https://doi.org/10.1115/IPACK2015-48553
InterPACK 2015; V002T02A025doi:https://doi.org/10.1115/IPACK2015-48605
InterPACK 2015; V002T02A026doi:https://doi.org/10.1115/IPACK2015-48613
InterPACK 2015; V002T02A027doi:https://doi.org/10.1115/IPACK2015-48707
InterPACK 2015; V002T02A028doi:https://doi.org/10.1115/IPACK2015-48812

Flexible and Wearable Electronics

InterPACK 2015; V002T02A029doi:https://doi.org/10.1115/IPACK2015-48130
InterPACK 2015; V002T02A030doi:https://doi.org/10.1115/IPACK2015-48503
InterPACK 2015; V002T02A031doi:https://doi.org/10.1115/IPACK2015-48704
InterPACK 2015; V002T02A032doi:https://doi.org/10.1115/IPACK2015-48711

Harsh Environments and High Temperature Electronics

InterPACK 2015; V002T02A033doi:https://doi.org/10.1115/IPACK2015-48009
InterPACK 2015; V002T02A034doi:https://doi.org/10.1115/IPACK2015-48049
InterPACK 2015; V002T02A035doi:https://doi.org/10.1115/IPACK2015-48323
InterPACK 2015; V002T02A036doi:https://doi.org/10.1115/IPACK2015-48576
InterPACK 2015; V002T02A037doi:https://doi.org/10.1115/IPACK2015-48577
InterPACK 2015; V002T02A038doi:https://doi.org/10.1115/IPACK2015-48578
InterPACK 2015; V002T02A039doi:https://doi.org/10.1115/IPACK2015-48620
InterPACK 2015; V002T02A040doi:https://doi.org/10.1115/IPACK2015-48626
InterPACK 2015; V002T02A041doi:https://doi.org/10.1115/IPACK2015-48627
InterPACK 2015; V002T02A042doi:https://doi.org/10.1115/IPACK2015-48669
InterPACK 2015; V002T02A043doi:https://doi.org/10.1115/IPACK2015-48709

Silicon Photonics and LED

InterPACK 2015; V002T02A044doi:https://doi.org/10.1115/IPACK2015-48023
InterPACK 2015; V002T02A045doi:https://doi.org/10.1115/IPACK2015-48257
InterPACK 2015; V002T02A046doi:https://doi.org/10.1115/IPACK2015-48664
InterPACK 2015; V002T02A047doi:https://doi.org/10.1115/IPACK2015-48724

Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Continuum/Atomistic Modeling and Simulations

InterPACK 2015; V002T06A001doi:https://doi.org/10.1115/IPACK2015-48032
InterPACK 2015; V002T06A002doi:https://doi.org/10.1115/IPACK2015-48114

Micro/Nano Structures in Phase Change Heat Transfer

InterPACK 2015; V002T06A003doi:https://doi.org/10.1115/IPACK2015-48153
InterPACK 2015; V002T06A004doi:https://doi.org/10.1115/IPACK2015-48262
InterPACK 2015; V002T06A005doi:https://doi.org/10.1115/IPACK2015-48628
InterPACK 2015; V002T06A006doi:https://doi.org/10.1115/IPACK2015-48737

Pool Boiling and Condensation

InterPACK 2015; V002T06A007doi:https://doi.org/10.1115/IPACK2015-48667

Single Phase Flows

InterPACK 2015; V002T06A008doi:https://doi.org/10.1115/IPACK2015-48055
InterPACK 2015; V002T06A009doi:https://doi.org/10.1115/IPACK2015-48122
InterPACK 2015; V002T06A010doi:https://doi.org/10.1115/IPACK2015-48318
InterPACK 2015; V002T06A011doi:https://doi.org/10.1115/IPACK2015-48417

Thin Film/Surface Tension Driven Flows

InterPACK 2015; V002T06A012doi:https://doi.org/10.1115/IPACK2015-48149
InterPACK 2015; V002T06A013doi:https://doi.org/10.1115/IPACK2015-48532

Two Phase Flows

InterPACK 2015; V002T06A014doi:https://doi.org/10.1115/IPACK2015-48177
InterPACK 2015; V002T06A015doi:https://doi.org/10.1115/IPACK2015-48184
InterPACK 2015; V002T06A016doi:https://doi.org/10.1115/IPACK2015-48241
InterPACK 2015; V002T06A017doi:https://doi.org/10.1115/IPACK2015-48581
InterPACK 2015; V002T06A018doi:https://doi.org/10.1115/IPACK2015-48670
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