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Proceedings Papers

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5688-8
Volume 1: Thermal Management

Thermal Management

Air Cooling: Heat Sink to System Level

InterPACK 2015; V001T09A001doi:https://doi.org/10.1115/IPACK2015-48085
InterPACK 2015; V001T09A002doi:https://doi.org/10.1115/IPACK2015-48151
InterPACK 2015; V001T09A003doi:https://doi.org/10.1115/IPACK2015-48191
InterPACK 2015; V001T09A004doi:https://doi.org/10.1115/IPACK2015-48511
InterPACK 2015; V001T09A005doi:https://doi.org/10.1115/IPACK2015-48630
InterPACK 2015; V001T09A006doi:https://doi.org/10.1115/IPACK2015-48641
InterPACK 2015; V001T09A007doi:https://doi.org/10.1115/IPACK2015-48671
InterPACK 2015; V001T09A008doi:https://doi.org/10.1115/IPACK2015-48745
InterPACK 2015; V001T09A009doi:https://doi.org/10.1115/IPACK2015-48753

Data Centers and Energy Efficient Electronic Systems

InterPACK 2015; V001T09A010doi:https://doi.org/10.1115/IPACK2015-48015
InterPACK 2015; V001T09A011doi:https://doi.org/10.1115/IPACK2015-48069
InterPACK 2015; V001T09A012doi:https://doi.org/10.1115/IPACK2015-48071
InterPACK 2015; V001T09A013doi:https://doi.org/10.1115/IPACK2015-48152
InterPACK 2015; V001T09A014doi:https://doi.org/10.1115/IPACK2015-48169
InterPACK 2015; V001T09A015doi:https://doi.org/10.1115/IPACK2015-48176
InterPACK 2015; V001T09A016doi:https://doi.org/10.1115/IPACK2015-48234
InterPACK 2015; V001T09A017doi:https://doi.org/10.1115/IPACK2015-48237
InterPACK 2015; V001T09A018doi:https://doi.org/10.1115/IPACK2015-48274
InterPACK 2015; V001T09A019doi:https://doi.org/10.1115/IPACK2015-48349
InterPACK 2015; V001T09A020doi:https://doi.org/10.1115/IPACK2015-48364
InterPACK 2015; V001T09A021doi:https://doi.org/10.1115/IPACK2015-48375
InterPACK 2015; V001T09A022doi:https://doi.org/10.1115/IPACK2015-48400
InterPACK 2015; V001T09A023doi:https://doi.org/10.1115/IPACK2015-48423
InterPACK 2015; V001T09A024doi:https://doi.org/10.1115/IPACK2015-48424
InterPACK 2015; V001T09A025doi:https://doi.org/10.1115/IPACK2015-48425
InterPACK 2015; V001T09A026doi:https://doi.org/10.1115/IPACK2015-48430
InterPACK 2015; V001T09A027doi:https://doi.org/10.1115/IPACK2015-48432
InterPACK 2015; V001T09A028doi:https://doi.org/10.1115/IPACK2015-48439
InterPACK 2015; V001T09A029doi:https://doi.org/10.1115/IPACK2015-48448
InterPACK 2015; V001T09A030doi:https://doi.org/10.1115/IPACK2015-48466
InterPACK 2015; V001T09A031doi:https://doi.org/10.1115/IPACK2015-48470
InterPACK 2015; V001T09A032doi:https://doi.org/10.1115/IPACK2015-48476
InterPACK 2015; V001T09A033doi:https://doi.org/10.1115/IPACK2015-48593
InterPACK 2015; V001T09A034doi:https://doi.org/10.1115/IPACK2015-48684

Power-Performance-Reliability Co-Design for ICs

InterPACK 2015; V001T09A035doi:https://doi.org/10.1115/IPACK2015-48344
InterPACK 2015; V001T09A036doi:https://doi.org/10.1115/IPACK2015-48354
InterPACK 2015; V001T09A037doi:https://doi.org/10.1115/IPACK2015-48386
InterPACK 2015; V001T09A038doi:https://doi.org/10.1115/IPACK2015-48533
InterPACK 2015; V001T09A039doi:https://doi.org/10.1115/IPACK2015-48690

Rack Level Thermal Management

InterPACK 2015; V001T09A040doi:https://doi.org/10.1115/IPACK2015-48024
InterPACK 2015; V001T09A041doi:https://doi.org/10.1115/IPACK2015-48244
InterPACK 2015; V001T09A042doi:https://doi.org/10.1115/IPACK2015-48258
InterPACK 2015; V001T09A043doi:https://doi.org/10.1115/IPACK2015-48377
InterPACK 2015; V001T09A044doi:https://doi.org/10.1115/IPACK2015-48600
InterPACK 2015; V001T09A045doi:https://doi.org/10.1115/IPACK2015-48607
InterPACK 2015; V001T09A046doi:https://doi.org/10.1115/IPACK2015-48640
InterPACK 2015; V001T09A047doi:https://doi.org/10.1115/IPACK2015-48771

Thermal Management: Device Level Thermal Management

InterPACK 2015; V001T09A048doi:https://doi.org/10.1115/IPACK2015-48017
InterPACK 2015; V001T09A049doi:https://doi.org/10.1115/IPACK2015-48019
InterPACK 2015; V001T09A050doi:https://doi.org/10.1115/IPACK2015-48051
InterPACK 2015; V001T09A051doi:https://doi.org/10.1115/IPACK2015-48061
InterPACK 2015; V001T09A052doi:https://doi.org/10.1115/IPACK2015-48119
InterPACK 2015; V001T09A053doi:https://doi.org/10.1115/IPACK2015-48243
InterPACK 2015; V001T09A054doi:https://doi.org/10.1115/IPACK2015-48285
InterPACK 2015; V001T09A055doi:https://doi.org/10.1115/IPACK2015-48333
InterPACK 2015; V001T09A056doi:https://doi.org/10.1115/IPACK2015-48537
InterPACK 2015; V001T09A057doi:https://doi.org/10.1115/IPACK2015-48592
InterPACK 2015; V001T09A058doi:https://doi.org/10.1115/IPACK2015-48685
InterPACK 2015; V001T09A059doi:https://doi.org/10.1115/IPACK2015-48698
InterPACK 2015; V001T09A060doi:https://doi.org/10.1115/IPACK2015-48770
InterPACK 2015; V001T09A061doi:https://doi.org/10.1115/IPACK2015-48802

Thermal Management: Phase Change Materials

InterPACK 2015; V001T09A062doi:https://doi.org/10.1115/IPACK2015-48082
InterPACK 2015; V001T09A063doi:https://doi.org/10.1115/IPACK2015-48369
InterPACK 2015; V001T09A064doi:https://doi.org/10.1115/IPACK2015-48499
InterPACK 2015; V001T09A065doi:https://doi.org/10.1115/IPACK2015-48522

Thermal Management: Stacked Die and Multi-Chip-Module and Packaging

InterPACK 2015; V001T09A066doi:https://doi.org/10.1115/IPACK2015-48042
InterPACK 2015; V001T09A067doi:https://doi.org/10.1115/IPACK2015-48104
InterPACK 2015; V001T09A068doi:https://doi.org/10.1115/IPACK2015-48316
InterPACK 2015; V001T09A069doi:https://doi.org/10.1115/IPACK2015-48353
InterPACK 2015; V001T09A070doi:https://doi.org/10.1115/IPACK2015-48422

Thermal Management: Thermal Interface Materials and Heat Spreading

InterPACK 2015; V001T09A071doi:https://doi.org/10.1115/IPACK2015-48083
InterPACK 2015; V001T09A072doi:https://doi.org/10.1115/IPACK2015-48146
InterPACK 2015; V001T09A073doi:https://doi.org/10.1115/IPACK2015-48302
InterPACK 2015; V001T09A074doi:https://doi.org/10.1115/IPACK2015-48303
InterPACK 2015; V001T09A075doi:https://doi.org/10.1115/IPACK2015-48535
InterPACK 2015; V001T09A076doi:https://doi.org/10.1115/IPACK2015-48634
InterPACK 2015; V001T09A077doi:https://doi.org/10.1115/IPACK2015-48732
InterPACK 2015; V001T09A078doi:https://doi.org/10.1115/IPACK2015-48735

Thermal Management: Thermoelectrics

InterPACK 2015; V001T09A079doi:https://doi.org/10.1115/IPACK2015-48421
InterPACK 2015; V001T09A080doi:https://doi.org/10.1115/IPACK2015-48682
InterPACK 2015; V001T09A081doi:https://doi.org/10.1115/IPACK2015-48692

Thermal Modeling Methodologies and Simulations

InterPACK 2015; V001T09A082doi:https://doi.org/10.1115/IPACK2015-48205
InterPACK 2015; V001T09A083doi:https://doi.org/10.1115/IPACK2015-48277
InterPACK 2015; V001T09A084doi:https://doi.org/10.1115/IPACK2015-48362
InterPACK 2015; V001T09A085doi:https://doi.org/10.1115/IPACK2015-48370
InterPACK 2015; V001T09A086doi:https://doi.org/10.1115/IPACK2015-48568
InterPACK 2015; V001T09A087doi:https://doi.org/10.1115/IPACK2015-48606
InterPACK 2015; V001T09A088doi:https://doi.org/10.1115/IPACK2015-48678
InterPACK 2015; V001T09A089doi:https://doi.org/10.1115/IPACK2015-48740
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