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Proceedings Papers

Proceedings Volume Cover
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes

Advanced Packaging

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance
Frank Fan Wang
InterPACK 2013; V001T01A001doi:https://doi.org/10.1115/IPACK2013-73029
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Topics: Bonding , Aluminum , Aerospace industry , Electronic equipment , Military systems
Early Power Delivery Analysis of Bump Depopulation
Houle Gan, Krishna Bharath
InterPACK 2013; V001T01A002doi:https://doi.org/10.1115/IPACK2013-73119
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Topics: Circuits , Computer software , Cycles , Design , Ferrosilicon , Flow (Dynamics) , Modeling , Product development , Risk
A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems
Feng Sheng, Dan Jiao
InterPACK 2013; V001T01A003doi:https://doi.org/10.1115/IPACK2013-73177
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Topics: Finite element analysis , Design , Finite element methods , Algorithms , Approximation , Errors , Frequency-domain analysis , Integrated circuits , Linear systems , Modeling
Transient Liquid Phase Sintered Joints for Power Electronic Modules
Hannes Greve, F. Patrick McCluskey
InterPACK 2013; V001T01A004doi:https://doi.org/10.1115/IPACK2013-73209
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Topics: Transients (Dynamics) , Melting point , Metals , Shear strength , Sinter (Metallurgy) , Temperature , Copper , Shear (Mechanics) , Tension-leg platforms , Binders (Materials)
Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly
Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
InterPACK 2013; V001T01A005doi:https://doi.org/10.1115/IPACK2013-73244
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Topics: Flip-chip , Flip-chip devices , Manufacturing , Sensors , Stress
A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method
Ah-Young Park, Satish Chaparala, Seungbae Park
InterPACK 2013; V001T01A006doi:https://doi.org/10.1115/IPACK2013-73280
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Topics: Compression , Copper , Finite element methods , Fracture mechanics , Bonding , Fracture (Materials) , Solders , Density , Joining , Temperature
Highly Manufacturable and Reliable CZT Detectors
Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson
InterPACK 2013; V001T01A007doi:https://doi.org/10.1115/IPACK2013-73314
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Topics: Sensors , Reliability , Design , Finite element model , Manufacturing , Packaging , Radiation detectors , Semiconductors (Materials) , Accelerated life testing , Ceramics

Emerging Technologies

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
InterPACK 2013; V001T03A001doi:https://doi.org/10.1115/IPACK2013-73092
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Topics: Nanoparticles , Self-assembly , Columns (Structural) , Evaporation , Particulate matter , Annealing , Bridges (Structures) , Composite materials , Copper , Electronic packages
Fabrication of Anodic Aluminum Oxide Template and Cu Nanowire Surface Fastener
Hiromasa Teshima, Kohei Kojima, Yang Ju
InterPACK 2013; V001T03A002doi:https://doi.org/10.1115/IPACK2013-73125
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Topics: Aluminum , Fasteners , Manufacturing , Nanowires , Bonding , Membranes , Surface mount technology , Adhesion , Atomic force microscopy , Chemical vapor deposition
Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density
Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
InterPACK 2013; V001T03A003doi:https://doi.org/10.1115/IPACK2013-73130
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Topics: Carbon nanotubes , Current density , Damage , Oxidation , Oxygen , Atoms , Carbon , Density , Electrodes , Electrodiffusion
Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems
Leila Choobineh, Dereje Agonafer, Ankur Jain
InterPACK 2013; V001T03A004doi:https://doi.org/10.1115/IPACK2013-73166
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Topics: Modeling , Temperature distribution , Thermal management , Temperature , Finite element analysis , Heat transfer , Design , Energy conservation , Fourier series , Heat
Analytic Optimization of Cost Effective Thermoelectric Generation on Top of Rankine Cycle
Kazuaki Yazawa, Yee Rui Koh, Ali Shakouri
InterPACK 2013; V001T03A005doi:https://doi.org/10.1115/IPACK2013-73195
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Topics: Optimization , Rankine cycle , Generators , Temperature , Design , Steam , Carbon dioxide , Fuel efficiency , Steam turbines , Climate change
Dynamic Analysis of Thin Glass Under Ball Drop Impact With New Metrics
Liang Xue, Claire R. Coble, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
InterPACK 2013; V001T03A006doi:https://doi.org/10.1115/IPACK2013-73291
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Topics: Dynamic analysis , Finite element analysis , Glass , Impact testing , Momentum
An Experimental and Numerical Study of the Dynamic Fracture of Glass
Liang Xue, Yuling Niu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
InterPACK 2013; V001T03A007doi:https://doi.org/10.1115/IPACK2013-73292
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Topics: Finite element analysis , Fracture (Materials) , Fracture (Process) , Glass
An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact
Liang Xue, Dapeng Liu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
InterPACK 2013; V001T03A008doi:https://doi.org/10.1115/IPACK2013-73293
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Topics: Glass
Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics
Marc T. Dunham, Michael T. Barako, Saniya LeBlanc, Mehdi Asheghi-Roudheni, Baoxing Chen, Kenneth Goodson
InterPACK 2013; V001T03A009doi:https://doi.org/10.1115/IPACK2013-73297
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Topics: Generators , Low-power electronics , Modeling , Optimization , Temperature , Design , Fillers (Materials) , Heat , Thermal resistance , Thermoelectric devices

Modeling and Simulation

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
Michael James Martin, Harish Manohara
InterPACK 2013; V001T04A001doi:https://doi.org/10.1115/IPACK2013-73053
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Topics: Modeling , Nanotubes , Sensors , Temperature , Pressure , Bridges (Structures) , Heat transfer coefficients , Circuits , Convection , Electrical resistivity
Unsteady Thermo-Structural Simulation of Nano-Bridge Resonators
Elham Maghsoudi, Michael James Martin
InterPACK 2013; V001T04A002doi:https://doi.org/10.1115/IPACK2013-73061
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Topics: Bridges (Structures) , Simulation
Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
InterPACK 2013; V001T04A003doi:https://doi.org/10.1115/IPACK2013-73062
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Topics: Cooling , Electric power generation , Electrical efficiency , Energy budget (Physics) , Fatigue life , Flow (Dynamics) , Gallium arsenide , Heat , Heat recovery , Heat sinks
Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder
Michael Neilsen, Paul Vianco
InterPACK 2013; V001T04A004doi:https://doi.org/10.1115/IPACK2013-73074
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Topics: Creep , Damage , Plasticity , Solders , Fatigue , Solder joints , Finite element analysis , Fracture (Materials) , Package on package , Electronic packaging
Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
Zhimin Wan, Yogendra Joshi
InterPACK 2013; V001T04A005doi:https://doi.org/10.1115/IPACK2013-73080
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Topics: Cooling , Heat flux , Microfluidics , Modeling , Transients (Dynamics) , Flow (Dynamics) , Computational fluid dynamics , Heat transfer , Signals , Temperature
Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method
Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
InterPACK 2013; V001T04A006doi:https://doi.org/10.1115/IPACK2013-73112
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Topics: Corners (Structural elements) , Silicon chips , Displacement , Galerkin method , Stress , Bonding , Density , Electronics , Failure , Lasers
High Field Breakdown of Carbon Nanotube Network Transistors
Man Prakash Gupta, Ashkan Behnam, David Estrada, Eric Pop, Satish Kumar
InterPACK 2013; V001T04A007doi:https://doi.org/10.1115/IPACK2013-73115
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Topics: Carbon nanotubes , Transistors , Density , Heating , Reliability , Thin film transistors
A Transient Model for Parallel Flow and Counter Flow Heat Exchangers
K. Abbasi, M. Del Valle, A. P. Wemhoff, A. Ortega
InterPACK 2013; V001T04A008doi:https://doi.org/10.1115/IPACK2013-73118
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Topics: Flow (Dynamics) , Heat exchangers , Transients (Dynamics) , Fluids , Capacitance , Exterior walls , Finite volume methods , Heat conduction , Heat transfer coefficients , Steady state
Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP
Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
InterPACK 2013; V001T04A009doi:https://doi.org/10.1115/IPACK2013-73151
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Topics: Silicon chips , Simulation , Thermal stresses , Stress , Bending strength , Copper , Finite element methods , Yield stress , Brittleness , Elevations (Drawings)
Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
InterPACK 2013; V001T04A010doi:https://doi.org/10.1115/IPACK2013-73161
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Topics: Ball-Grid-Array packages , Damage , Simulation , Solder joints , Fatigue , Crack propagation , Electronic packages , Fatigue life , Modeling , Printed circuit boards
Heat Transfer in Nanoelectronics by Quantum Mechanics
Thomas Prevenslik
InterPACK 2013; V001T04A011doi:https://doi.org/10.1115/IPACK2013-73173
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Topics: Heat transfer , Nanoelectronics , Quantum mechanics , Heat , Joules , Quantum electrodynamics , Circuits , Phonons , Radiation (Physics) , Temperature
Simulations of Deformation and Stress During Copper Wirebond on ULK Chips
Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia
InterPACK 2013; V001T04A012doi:https://doi.org/10.1115/IPACK2013-73178
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Topics: Copper , Deformation , Engineering simulation , Simulation , Stress , Fracture (Materials) , Vibration , Critical points (Physics) , Wire , Wire bonding
A Study on Impact Stresses in Ceramic Capacitors
Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki
InterPACK 2013; V001T04A013doi:https://doi.org/10.1115/IPACK2013-73191
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Topics: Capacitors , Ceramics , Stress , Design engineering , Fracture (Materials) , Impact testing , Machinery , Manufacturing , Printed circuit boards
Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading
Matthew Ernst, Cholmin Choi, Abhijit Dasgupta
InterPACK 2013; V001T04A014doi:https://doi.org/10.1115/IPACK2013-73200
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Topics: Time-domain analysis , Transients (Dynamics) , Finite element analysis , Cycles , Dynamic analysis , Vibration , Cantilever beams , Circuits , Durability , Manufacturing
Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators
Siyi Zhou, Bahgat G. Sammakia, Bruce White, Peter Borgesen, Cheng Chen
InterPACK 2013; V001T04A015doi:https://doi.org/10.1115/IPACK2013-73225
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Topics: Energy conversion , Generators , Water , Flow (Dynamics) , Heat exchangers , Energy budget (Physics) , Energy generation , Finite element analysis , Gages , Heat
Effect of TSV Joule Heating on Device Performance
Fahad Mirza, Gaurang Naware, Thiagarajan Raman, Ankur Jain, Dereje Agonafer
InterPACK 2013; V001T04A016doi:https://doi.org/10.1115/IPACK2013-73228
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Topics: Electrical conductance , Heating , Joules , Mechanical admittance
A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration
Pradeep Lall, Geeta Limaye
InterPACK 2013; V001T04A017doi:https://doi.org/10.1115/IPACK2013-73245
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Topics: High cycle fatigue , High temperature , Vibration , Temperature , Solders , Stress , Alloys , Electronics , Failure , Failure mechanisms
Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging
Pradeep Lall, Peter Sakalaukus, Lynn Davis
InterPACK 2013; V001T04A018doi:https://doi.org/10.1115/IPACK2013-73250
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Topics: Algorithms , Aluminum , Capacitance , Capacitors , Climate , Damage , Electrical components , Failure , High temperature , Service life (Equipment)
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability
Pradeep Lall, Ryan Lowe, Kai Goebel
InterPACK 2013; V001T04A019doi:https://doi.org/10.1115/IPACK2013-73252
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Topics: Algorithms , Reliability , Kalman filters , Ball-Grid-Array packaging , Failure , Filters , Particulate matter , Printed circuit boards , Service life (Equipment) , Solder joints
3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler
Jackson B. Marcinichen, John R. Thome
InterPACK 2013; V001T04A020doi:https://doi.org/10.1115/IPACK2013-73263
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Topics: Microchannels , Cooling , Manufacturing , Thermohydrodynamics , Architecture , Computers , Density , Design , Electronic components , Engineering simulation
Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors
Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
InterPACK 2013; V001T04A021doi:https://doi.org/10.1115/IPACK2013-73264
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Topics: Cooling systems , Dynamic modeling , Heat , Critical heat flux , Flow (Dynamics) , Temperature , Transients (Dynamics) , Condensers (steam plant) , Pumps , Simulation
CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)
Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi
InterPACK 2013; V001T04A022doi:https://doi.org/10.1115/IPACK2013-73275
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Topics: Computational fluid dynamics , Simulation , Wave soldering , Solders , Computer software , Electronics , Flow (Dynamics) , Fluids , Melting , Melting point
Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling
Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian
InterPACK 2013; V001T04A023doi:https://doi.org/10.1115/IPACK2013-73276
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Topics: Microchannels , Thermal management , Thermoelectric cooling , Cooling , Thermoelectric coolers , Heat , Computer simulation , Currents , Design , Electric current
Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter
Pradeep Lall, Hao Zhang, Lynn Davis
InterPACK 2013; V001T04A024doi:https://doi.org/10.1115/IPACK2013-73305
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Topics: Filters , Light-emitting diodes , Particulate matter
Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators
Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel
InterPACK 2013; V001T04A025doi:https://doi.org/10.1115/IPACK2013-73309
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Topics: Electronics , Reliability , Storage , Damage , Temperature , Avionics , Electronic systems , Failure , High temperature , Intermetallic compounds

Multi-Physics Based Reliability

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
InterPACK 2013; V001T05A001doi:https://doi.org/10.1115/IPACK2013-73091
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Topics: Fatigue cracks , Flip-chip , Flip-chip devices , Nondestructive evaluation , Solder joints , Synchrotron radiation , X-rays , Fracture (Materials) , Microcracks , Solders
Characterization of Crack Growth in BGA Under Drop Impact
Quang Nguyen, Seungbae Park, Tung Nguyen
InterPACK 2013; V001T05A002doi:https://doi.org/10.1115/IPACK2013-73110
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Topics: Ball-Grid-Array packaging , Fracture (Materials) , Solder joints , Damage , Imaging , Low cycle fatigue , Microscopes , Polishing , Tin , Vehicles
Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki
InterPACK 2013; V001T05A003doi:https://doi.org/10.1115/IPACK2013-73126
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Topics: Finite element methods , Reliability , Temperature , Finite element analysis , Resins , Electronic packages , Hardening (Curing) , Heat , Integrated circuits , Materials properties
Reliability of Bonded Interfaces for Automotive Power Electronics
Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic
InterPACK 2013; V001T05A004doi:https://doi.org/10.1115/IPACK2013-73143
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Topics: Electronics , Reliability , Cycles , Acoustics , Adhesives , Carbon fibers , Silver , Thermal resistance , Copper , Damage
Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection
Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura
InterPACK 2013; V001T05A005doi:https://doi.org/10.1115/IPACK2013-73147
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Topics: Copper , Thin films , Design , Diffraction , Electron backscatter diffraction , Electrons , Ruthenium , Semiconductor devices
Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate
Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
InterPACK 2013; V001T05A006doi:https://doi.org/10.1115/IPACK2013-73148
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Topics: Copper , Thin films , Electroplating , Electrical properties , Electrical resistivity , Annealing , Bulk solids , Density , Grain boundaries , High temperature
Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
InterPACK 2013; V001T05A007doi:https://doi.org/10.1115/IPACK2013-73175
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Topics: Microelectromechanical systems , Simulation , Uncertainty , Deformation , Chaos , Complex systems , Damping , Displacement , Electrostatics , Fluids
Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects
Mohammad Motalab, Muhannad Mustafa, Jeffrey C. Suhling, Jiawei Zhang, John Evans, Michael J. Bozack, Pradeep Lall
InterPACK 2013; V001T05A008doi:https://doi.org/10.1115/IPACK2013-73230
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Topics: Energy dissipation , Lead-free solders , Reliability , Solders
A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects
Mohammad Motalab, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2013; V001T05A009doi:https://doi.org/10.1115/IPACK2013-73232
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Topics: Constitutive equations , Lead-free solders
The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors
Safina Hussain, Parameshwaran Gnanachchelvi, Jeffrey C. Suhling, Richard C. Jaeger, Michael C. Hamilton, Bogdan M. Wilamowski
InterPACK 2013; V001T05A010doi:https://doi.org/10.1115/IPACK2013-73233
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Topics: Stress , Transistors
The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders
Muhannad Mustafa, Jordan C. Roberts, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2013; V001T05A011doi:https://doi.org/10.1115/IPACK2013-73240
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Topics: Failure , Fatigue , Lead-free solders , Stress
Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot
Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling
InterPACK 2013; V001T05A012doi:https://doi.org/10.1115/IPACK2013-73246
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Topics: Materials properties , Alloys , Temperature , Tin , Copper , Creep , Design , Elastic moduli , Electronics , Finite element model
Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
InterPACK 2013; V001T05A013doi:https://doi.org/10.1115/IPACK2013-73248
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Topics: Density , Simulation , Stress , Diffusion (Physics) , Computer simulation , Electron mobility , Electrons , Heat conduction , Momentum , MOSFET transistors
Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics
Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
InterPACK 2013; V001T05A014doi:https://doi.org/10.1115/IPACK2013-73251
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Topics: Damage , Electronics , Cycles , Failure , Alloys , Elastic moduli , Electronic systems , Errors , High temperature , Reliability
Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing
J. D. Hoffman, B. A. Dow, R. D. Lorenz
InterPACK 2013; V001T05A015doi:https://doi.org/10.1115/IPACK2013-73269
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Topics: Electronic packages , Sensors , Design , Displacement , Finite element analysis , Semiconductors (Materials) , Temperature , Currents , Eddies (Fluid dynamics) , Eddy currents (Electricity)
Solid State Lighting Life Prediction Using Extended Kalman Filter
Pradeep Lall, Junchao Wei, Lynn Davis
InterPACK 2013; V001T05A016doi:https://doi.org/10.1115/IPACK2013-73288
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Topics: Kalman filters , Light-emitting diodes , Failure , Physics , Failure mechanisms , High temperature , Maintenance , Noise (Sound) , Climate , Damage
Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects
Pradeep Lall, Yihua Luo
InterPACK 2013; V001T05A017doi:https://doi.org/10.1115/IPACK2013-73308
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Topics: Spectroscopy , Wire

MEMS and NEMS

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
InterPACK 2013; V001T06A001doi:https://doi.org/10.1115/IPACK2013-73156
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Topics: Carbon nanotubes , Strain sensors , Multi-walled carbon nanotubes , Electrical conductivity , Shapes , Chemical vapor deposition , Electrical resistance , Single-walled carbon nanotubes , Catalysts , Design
Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
InterPACK 2013; V001T06A002doi:https://doi.org/10.1115/IPACK2013-73222
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Topics: Capacitors , Flip-chip , Flip-chip devices , Microelectromechanical systems , Packaging , Semiconductor wafers , Solders , Stress , Deflection , Failure
Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon
Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
InterPACK 2013; V001T06A003doi:https://doi.org/10.1115/IPACK2013-73249
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Topics: Bridges (Structures) , Sensors , Silicon , Stress , Wire
Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Jochen Hempel, Elena Zukowski, Michael Berndt, Sohaib Anees, Jürgen Wilde, Leonhard M. Reindl
InterPACK 2013; V001T06A004doi:https://doi.org/10.1115/IPACK2013-73258
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Topics: Sensors , Surface acoustic waves , Strain sensors , Stress , Cycles , Temperature , Fatigue , Finite element methods , Finite element model , Signals
Micro Cryogenic Coolers With Mixed Refrigerants
Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee
InterPACK 2013; V001T06A005doi:https://doi.org/10.1115/IPACK2013-73290
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Topics: Coolers , Refrigerants , Microelectromechanical systems , Flow (Dynamics) , Heat exchangers , Low temperature , Microchannel flow , Pressure , Temperature , Valves
Influences of Specimen Size and Annealing Temperature on Mechanical Reliability of FIB-Fabricated Si Nanowires for NEMS
Tatsuya Fujii, Koichi Sudoh, Shozo Inoue, Takahiro Namazu
InterPACK 2013; V001T06A006doi:https://doi.org/10.1115/IPACK2013-73310
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Topics: Annealing , Nanoelectromechanical systems , Nanowires , Reliability , Temperature , Manufacturing , Silicon , Young's modulus , Damage , Focused ion beams
Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
InterPACK 2013; V001T06A007doi:https://doi.org/10.1115/IPACK2013-73317
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Topics: Packaging , Semiconductor wafers , Silicon , Stress , Tin , Vehicles , Bonding , Modeling , Transistors , Bolometers
Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
InterPACK 2013; V001T06A008doi:https://doi.org/10.1115/IPACK2013-73324
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Topics: Hydrogen , Mechanical properties , Silicon crystals , Silicon , Atoms , Boiling , Boron , Deformation , Plasticity , Stress

Materials and Processes

Laser Processing by Using Fluidic Laser Beam Shaper
Hong Duc Doan, Naoki Iwatani, Kazuyoshi Fushinobu
InterPACK 2013; V001T07A001doi:https://doi.org/10.1115/IPACK2013-73059
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Topics: Laser beams , Lasers , Laser materials , Drilling
Fundamental Research on Via Processing by Using Short Pulse Laser in SiC
Naoki Iwatani, Hong Duc Doan, Kazuyoshi Fushinobu
InterPACK 2013; V001T07A002doi:https://doi.org/10.1115/IPACK2013-73060
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Topics: Lasers , Water , Ablation (Vaporization technology) , Fluence (Radiation measurement) , Fracture (Materials) , Semiconductor wafers , Drilling , Etching , Film thickness , Nd-YAG lasers
Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging
Z. Huang, I. Dutta, G. S. Subbarayan
InterPACK 2013; V001T07A003doi:https://doi.org/10.1115/IPACK2013-73079
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Topics: Fracture (Materials) , Fracture (Process) , Solders , Tin , Brittleness , Fracture mechanics , Fracture toughness , Solder joints , Adhesives , Ball-Grid-Array packaging
Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon
Hideo Koguchi, Naoki Kimura
InterPACK 2013; V001T07A004doi:https://doi.org/10.1115/IPACK2013-73113
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Topics: Coating processes , Coatings , Sapphire , Silicon , Delamination , Bonding , Resins , Stress , Cooling , Temperature
Effect of Aging on Impression Creep Behavior of Pb-Free Solders
B. Talebanpour, U. Sahaym, I. Dutta, P. Kumar
InterPACK 2013; V001T07A005doi:https://doi.org/10.1115/IPACK2013-73137
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Topics: Creep , Lead-free solders , Tin , Alloys , Particulate matter , Solders , Temperature , Melting , Melting point , Particle size
Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
InterPACK 2013; V001T07A006doi:https://doi.org/10.1115/IPACK2013-73149
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Topics: Reliability , Thin films , Electroplating , Copper , Annealing , Current density , Electrical properties , Electron backscatter diffraction , Electrical resistivity , Grain boundaries
Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit
Yusuke Watanabe, Yuji Ichikawa, Kazuhiro Ogawa, Hideo Miura
InterPACK 2013; V001T07A007doi:https://doi.org/10.1115/IPACK2013-73150
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Topics: Copper , Mechanical properties , Particulate matter , Brittle fracture , Ceramics , Coating processes , Coatings , Dielectric materials , Electrical properties , Electron backscatter diffraction
Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
Hossein Sojoudi, Fernando Reiter, Samuel Graham
InterPACK 2013; V001T07A008doi:https://doi.org/10.1115/IPACK2013-73158
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Topics: Composite materials , Electrodes , Graphene , Single-walled carbon nanotubes , Transparency , Single-walled nanotubes , Chemical vapor deposition , Electrical properties , Annealing , Heat conduction
Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach
Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht
InterPACK 2013; V001T07A009doi:https://doi.org/10.1115/IPACK2013-73164
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Topics: Creep , Micromechanics (Engineering) , Solders , Tin , Nanoscale phenomena , Solder joints , Alloys , Image processing , Intermetallic compounds , Particulate matter
Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel
Shingo Hattori, Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
InterPACK 2013; V001T07A010doi:https://doi.org/10.1115/IPACK2013-73170
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Topics: Plasmas (Ionized gases) , Stainless steel , Tin , Erosion , Diffusion (Physics) , Temperature
Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls
Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
InterPACK 2013; V001T07A011doi:https://doi.org/10.1115/IPACK2013-73171
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Topics: Electrodes , Lead-free solders , Tin , Plating baths , Shear (Mechanics) , Solders , Intermetallic compounds , Melting , Nickel plating
Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil
Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji
InterPACK 2013; V001T07A012doi:https://doi.org/10.1115/IPACK2013-73172
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Topics: Copper foil , Electrolytes , Mechanical properties , Copper , Elastic moduli , Fatigue properties , Grain size , Proteins , Tensile strength
Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
InterPACK 2013; V001T07A013doi:https://doi.org/10.1115/IPACK2013-73192
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Topics: Damage , Low cycle fatigue , Solder joints , Tin , Grain boundaries , Fracture (Materials) , Stress concentration , Crack propagation , Cycles , Electron backscatter diffraction
Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy
Takuma Sato, Yoshiharu Kariya, Kazuma Fukui
InterPACK 2013; V001T07A014doi:https://doi.org/10.1115/IPACK2013-73193
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Topics: Eutectic alloys , Low cycle fatigue , Temperature , Tin , Fatigue life , Deformation , Ductility , Fatigue , Metals , Temperature effects
Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging
Mohammad Hasnine, Muhannad Mustafa, Jing Zou, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
InterPACK 2013; V001T07A015doi:https://doi.org/10.1115/IPACK2013-73234
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Topics: Creep , Electron backscatter diffraction , Microelectronic packaging , Nanoindentation , Solder joints
Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys
Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack
InterPACK 2013; V001T07A016doi:https://doi.org/10.1115/IPACK2013-73241
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Topics: Alloys , Creep , Lead-free solders , Mechanical properties
Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging
Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
InterPACK 2013; V001T07A017doi:https://doi.org/10.1115/IPACK2013-73242
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Topics: Mechanical behavior , Microelectronic packaging , Polymers , Mechanical properties , Stress , Tension , Adhesives , Elastic moduli , Epoxy adhesives , Epoxy resins
Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
Adam Pearl, Michael Osterman
InterPACK 2013; V001T07A018doi:https://doi.org/10.1115/IPACK2013-73278
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Topics: Printed circuit boards , Solders , Finishes , Failure mechanisms , Lumber , Reliability , Cracking (Materials) , Fracture (Process) , Resistors , Shock (Mechanics)
Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects
Pradeep Lall, Shantanu Deshpande
InterPACK 2013; V001T07A019doi:https://doi.org/10.1115/IPACK2013-73287
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Topics: Failure , Intermetallic compounds , Wire , Damage , Service life (Equipment) , Wire bonding , Algorithms , Aluminum , Copper , Electronic packaging
Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu6Sn5 Intermetallic
Soud Farhan Choudhury, Leila Ladani
InterPACK 2013; V001T07A020doi:https://doi.org/10.1115/IPACK2013-73315
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Topics: Crystals , Intermetallic compounds , Mechanical behavior , Tin , Solder joints , Electron backscatter diffraction , Nanoindentation , Anisotropy , Creep , Ductility
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