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Proceedings Papers

Proceedings Volume Cover
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes

Advanced Packaging

InterPACK 2013; V001T01A001doi:https://doi.org/10.1115/IPACK2013-73029
InterPACK 2013; V001T01A002doi:https://doi.org/10.1115/IPACK2013-73119
InterPACK 2013; V001T01A003doi:https://doi.org/10.1115/IPACK2013-73177
InterPACK 2013; V001T01A004doi:https://doi.org/10.1115/IPACK2013-73209
InterPACK 2013; V001T01A005doi:https://doi.org/10.1115/IPACK2013-73244
InterPACK 2013; V001T01A006doi:https://doi.org/10.1115/IPACK2013-73280
InterPACK 2013; V001T01A007doi:https://doi.org/10.1115/IPACK2013-73314

Emerging Technologies

InterPACK 2013; V001T03A001doi:https://doi.org/10.1115/IPACK2013-73092
InterPACK 2013; V001T03A002doi:https://doi.org/10.1115/IPACK2013-73125
InterPACK 2013; V001T03A003doi:https://doi.org/10.1115/IPACK2013-73130
InterPACK 2013; V001T03A004doi:https://doi.org/10.1115/IPACK2013-73166
InterPACK 2013; V001T03A005doi:https://doi.org/10.1115/IPACK2013-73195
InterPACK 2013; V001T03A006doi:https://doi.org/10.1115/IPACK2013-73291
InterPACK 2013; V001T03A007doi:https://doi.org/10.1115/IPACK2013-73292
InterPACK 2013; V001T03A008doi:https://doi.org/10.1115/IPACK2013-73293
Topics: Glass
InterPACK 2013; V001T03A009doi:https://doi.org/10.1115/IPACK2013-73297

Modeling and Simulation

InterPACK 2013; V001T04A001doi:https://doi.org/10.1115/IPACK2013-73053
InterPACK 2013; V001T04A002doi:https://doi.org/10.1115/IPACK2013-73061
InterPACK 2013; V001T04A003doi:https://doi.org/10.1115/IPACK2013-73062
InterPACK 2013; V001T04A004doi:https://doi.org/10.1115/IPACK2013-73074
InterPACK 2013; V001T04A005doi:https://doi.org/10.1115/IPACK2013-73080
InterPACK 2013; V001T04A006doi:https://doi.org/10.1115/IPACK2013-73112
InterPACK 2013; V001T04A007doi:https://doi.org/10.1115/IPACK2013-73115
InterPACK 2013; V001T04A008doi:https://doi.org/10.1115/IPACK2013-73118
InterPACK 2013; V001T04A009doi:https://doi.org/10.1115/IPACK2013-73151
InterPACK 2013; V001T04A010doi:https://doi.org/10.1115/IPACK2013-73161
InterPACK 2013; V001T04A011doi:https://doi.org/10.1115/IPACK2013-73173
InterPACK 2013; V001T04A012doi:https://doi.org/10.1115/IPACK2013-73178
InterPACK 2013; V001T04A013doi:https://doi.org/10.1115/IPACK2013-73191
InterPACK 2013; V001T04A014doi:https://doi.org/10.1115/IPACK2013-73200
InterPACK 2013; V001T04A015doi:https://doi.org/10.1115/IPACK2013-73225
InterPACK 2013; V001T04A016doi:https://doi.org/10.1115/IPACK2013-73228
InterPACK 2013; V001T04A017doi:https://doi.org/10.1115/IPACK2013-73245
InterPACK 2013; V001T04A018doi:https://doi.org/10.1115/IPACK2013-73250
InterPACK 2013; V001T04A019doi:https://doi.org/10.1115/IPACK2013-73252
InterPACK 2013; V001T04A020doi:https://doi.org/10.1115/IPACK2013-73263
InterPACK 2013; V001T04A021doi:https://doi.org/10.1115/IPACK2013-73264
InterPACK 2013; V001T04A022doi:https://doi.org/10.1115/IPACK2013-73275
InterPACK 2013; V001T04A023doi:https://doi.org/10.1115/IPACK2013-73276
InterPACK 2013; V001T04A024doi:https://doi.org/10.1115/IPACK2013-73305
InterPACK 2013; V001T04A025doi:https://doi.org/10.1115/IPACK2013-73309

Multi-Physics Based Reliability

InterPACK 2013; V001T05A001doi:https://doi.org/10.1115/IPACK2013-73091
InterPACK 2013; V001T05A002doi:https://doi.org/10.1115/IPACK2013-73110
InterPACK 2013; V001T05A003doi:https://doi.org/10.1115/IPACK2013-73126
InterPACK 2013; V001T05A004doi:https://doi.org/10.1115/IPACK2013-73143
InterPACK 2013; V001T05A005doi:https://doi.org/10.1115/IPACK2013-73147
InterPACK 2013; V001T05A006doi:https://doi.org/10.1115/IPACK2013-73148
InterPACK 2013; V001T05A007doi:https://doi.org/10.1115/IPACK2013-73175
InterPACK 2013; V001T05A008doi:https://doi.org/10.1115/IPACK2013-73230
InterPACK 2013; V001T05A009doi:https://doi.org/10.1115/IPACK2013-73232
InterPACK 2013; V001T05A010doi:https://doi.org/10.1115/IPACK2013-73233
InterPACK 2013; V001T05A011doi:https://doi.org/10.1115/IPACK2013-73240
InterPACK 2013; V001T05A012doi:https://doi.org/10.1115/IPACK2013-73246
InterPACK 2013; V001T05A013doi:https://doi.org/10.1115/IPACK2013-73248
InterPACK 2013; V001T05A014doi:https://doi.org/10.1115/IPACK2013-73251
InterPACK 2013; V001T05A015doi:https://doi.org/10.1115/IPACK2013-73269
InterPACK 2013; V001T05A016doi:https://doi.org/10.1115/IPACK2013-73288
InterPACK 2013; V001T05A017doi:https://doi.org/10.1115/IPACK2013-73308

MEMS and NEMS

InterPACK 2013; V001T06A001doi:https://doi.org/10.1115/IPACK2013-73156
InterPACK 2013; V001T06A002doi:https://doi.org/10.1115/IPACK2013-73222
InterPACK 2013; V001T06A003doi:https://doi.org/10.1115/IPACK2013-73249
InterPACK 2013; V001T06A004doi:https://doi.org/10.1115/IPACK2013-73258
InterPACK 2013; V001T06A005doi:https://doi.org/10.1115/IPACK2013-73290
InterPACK 2013; V001T06A006doi:https://doi.org/10.1115/IPACK2013-73310
InterPACK 2013; V001T06A007doi:https://doi.org/10.1115/IPACK2013-73317
InterPACK 2013; V001T06A008doi:https://doi.org/10.1115/IPACK2013-73324

Materials and Processes

InterPACK 2013; V001T07A001doi:https://doi.org/10.1115/IPACK2013-73059
InterPACK 2013; V001T07A002doi:https://doi.org/10.1115/IPACK2013-73060
InterPACK 2013; V001T07A003doi:https://doi.org/10.1115/IPACK2013-73079
InterPACK 2013; V001T07A004doi:https://doi.org/10.1115/IPACK2013-73113
InterPACK 2013; V001T07A005doi:https://doi.org/10.1115/IPACK2013-73137
InterPACK 2013; V001T07A006doi:https://doi.org/10.1115/IPACK2013-73149
InterPACK 2013; V001T07A007doi:https://doi.org/10.1115/IPACK2013-73150
InterPACK 2013; V001T07A008doi:https://doi.org/10.1115/IPACK2013-73158
InterPACK 2013; V001T07A009doi:https://doi.org/10.1115/IPACK2013-73164
InterPACK 2013; V001T07A010doi:https://doi.org/10.1115/IPACK2013-73170
InterPACK 2013; V001T07A011doi:https://doi.org/10.1115/IPACK2013-73171
InterPACK 2013; V001T07A012doi:https://doi.org/10.1115/IPACK2013-73172
InterPACK 2013; V001T07A013doi:https://doi.org/10.1115/IPACK2013-73192
InterPACK 2013; V001T07A014doi:https://doi.org/10.1115/IPACK2013-73193
InterPACK 2013; V001T07A015doi:https://doi.org/10.1115/IPACK2013-73234
InterPACK 2013; V001T07A016doi:https://doi.org/10.1115/IPACK2013-73241
InterPACK 2013; V001T07A017doi:https://doi.org/10.1115/IPACK2013-73242
InterPACK 2013; V001T07A018doi:https://doi.org/10.1115/IPACK2013-73278
InterPACK 2013; V001T07A019doi:https://doi.org/10.1115/IPACK2013-73287
InterPACK 2013; V001T07A020doi:https://doi.org/10.1115/IPACK2013-73315
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