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Proceedings Papers
Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
Advanced Packaging
Emerging Technologies
Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics
Marc T. Dunham, Michael T. Barako, Saniya LeBlanc, Mehdi Asheghi-Roudheni, Baoxing Chen, Kenneth Goodson
Topics:
Generators
,
Low-power electronics
,
Modeling
,
Optimization
,
Temperature
,
Design
,
Fillers (Materials)
,
Heat
,
Thermal resistance
,
Thermoelectric devices
Modeling and Simulation
Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP
Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Topics:
Silicon chips
,
Simulation
,
Thermal stresses
,
Stress
,
Bending strength
,
Copper
,
Finite element methods
,
Yield stress
,
Brittleness
,
Elevations (Drawings)
Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling
Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian
Topics:
Microchannels
,
Thermal management
,
Thermoelectric cooling
,
Cooling
,
Thermoelectric coolers
,
Heat
,
Computer simulation
,
Currents
,
Design
,
Electric current
Multi-Physics Based Reliability
Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
Topics:
Density
,
Simulation
,
Stress
,
Diffusion (Physics)
,
Computer simulation
,
Electron mobility
,
Electrons
,
Heat conduction
,
Momentum
,
MOSFET transistors
MEMS and NEMS
Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Topics:
Packaging
,
Semiconductor wafers
,
Silicon
,
Stress
,
Tin
,
Vehicles
,
Bonding
,
Modeling
,
Transistors
,
Bolometers
Materials and Processes
Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu6Sn5 Intermetallic
Topics:
Crystals
,
Intermetallic compounds
,
Mechanical behavior
,
Tin
,
Solder joints
,
Electron backscatter diffraction
,
Nanoindentation
,
Anisotropy
,
Creep
,
Ductility