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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

July 16–18, 2013

Burlingame, California, USA

Conference Sponsors:

ISBN:

978-0-7918-5575-1

In This Volume

Advanced Packaging (7)
Emerging Technologies (9)
Modeling and Simulation (25)
Multi-Physics Based Reliability (17)
MEMS and NEMS (8)
Materials and Processes (20)

Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes

Advanced Packaging

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance

Frank Fan Wang

InterPACK 2013; V001T01A001doi:https://doi.org/10.1115/IPACK2013-73029

Abstract

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Topics: Bonding , Aluminum , Aerospace industry , Electronic equipment , Military systems

Early Power Delivery Analysis of Bump Depopulation

Houle Gan, Krishna Bharath

InterPACK 2013; V001T01A002doi:https://doi.org/10.1115/IPACK2013-73119

Abstract

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Topics: Circuits , Computer software , Cycles , Design , Ferrosilicon , Flow (Dynamics) , Modeling , Product development , Risk

A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems

Feng Sheng, Dan Jiao

InterPACK 2013; V001T01A003doi:https://doi.org/10.1115/IPACK2013-73177

Abstract

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Topics: Finite element analysis , Design , Finite element methods , Algorithms , Approximation , Errors , Frequency-domain analysis , Integrated circuits , Linear systems , Modeling

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey

InterPACK 2013; V001T01A004doi:https://doi.org/10.1115/IPACK2013-73209

Abstract

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Topics: Transients (Dynamics) , Melting point , Metals , Shear strength , Sinter (Metallurgy) , Temperature , Copper , Shear (Mechanics) , Tension-leg platforms , Binders (Materials)

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

InterPACK 2013; V001T01A005doi:https://doi.org/10.1115/IPACK2013-73244

Abstract

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Topics: Flip-chip , Flip-chip devices , Manufacturing , Sensors , Stress

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

Ah-Young Park, Satish Chaparala, Seungbae Park

InterPACK 2013; V001T01A006doi:https://doi.org/10.1115/IPACK2013-73280

Abstract

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Topics: Compression , Copper , Finite element methods , Fracture mechanics , Bonding , Fracture (Materials) , Solders , Density , Joining , Temperature

Highly Manufacturable and Reliable CZT Detectors

Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson

InterPACK 2013; V001T01A007doi:https://doi.org/10.1115/IPACK2013-73314

Abstract

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Topics: Sensors , Reliability , Design , Finite element model , Manufacturing , Packaging , Radiation detectors , Semiconductors (Materials) , Accelerated life testing , Ceramics

Emerging Technologies

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf

InterPACK 2013; V001T03A001doi:https://doi.org/10.1115/IPACK2013-73092

Abstract

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Topics: Nanoparticles , Self-assembly , Columns (Structural) , Evaporation , Particulate matter , Annealing , Bridges (Structures) , Composite materials , Copper , Electronic packages

Fabrication of Anodic Aluminum Oxide Template and Cu Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju

InterPACK 2013; V001T03A002doi:https://doi.org/10.1115/IPACK2013-73125

Abstract

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Topics: Aluminum , Fasteners , Manufacturing , Nanowires , Bonding , Membranes , Surface mount technology , Adhesion , Atomic force microscopy , Chemical vapor deposition

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

InterPACK 2013; V001T03A003doi:https://doi.org/10.1115/IPACK2013-73130

Abstract

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Topics: Carbon nanotubes , Current density , Damage , Oxidation , Oxygen , Atoms , Carbon , Density , Electrodes , Electrodiffusion

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

Leila Choobineh, Dereje Agonafer, Ankur Jain

InterPACK 2013; V001T03A004doi:https://doi.org/10.1115/IPACK2013-73166

Abstract

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Topics: Modeling , Temperature distribution , Thermal management , Temperature , Finite element analysis , Heat transfer , Design , Energy conservation , Fourier series , Heat

Analytic Optimization of Cost Effective Thermoelectric Generation on Top of Rankine Cycle

Kazuaki Yazawa, Yee Rui Koh, Ali Shakouri

InterPACK 2013; V001T03A005doi:https://doi.org/10.1115/IPACK2013-73195

Abstract

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Topics: Optimization , Rankine cycle , Generators , Temperature , Design , Steam , Carbon dioxide , Fuel efficiency , Steam turbines , Climate change

Dynamic Analysis of Thin Glass Under Ball Drop Impact With New Metrics

Liang Xue, Claire R. Coble, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park

InterPACK 2013; V001T03A006doi:https://doi.org/10.1115/IPACK2013-73291

Abstract

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Topics: Dynamic analysis , Finite element analysis , Glass , Impact testing , Momentum

An Experimental and Numerical Study of the Dynamic Fracture of Glass

Liang Xue, Yuling Niu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park

InterPACK 2013; V001T03A007doi:https://doi.org/10.1115/IPACK2013-73292

Abstract

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Topics: Finite element analysis , Fracture (Materials) , Fracture (Process) , Glass

An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact

Liang Xue, Dapeng Liu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park

InterPACK 2013; V001T03A008doi:https://doi.org/10.1115/IPACK2013-73293

Abstract

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Topics: Glass

Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics

Marc T. Dunham, Michael T. Barako, Saniya LeBlanc, Mehdi Asheghi-Roudheni, Baoxing Chen, Kenneth Goodson

InterPACK 2013; V001T03A009doi:https://doi.org/10.1115/IPACK2013-73297

Abstract

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Topics: Generators , Low-power electronics , Modeling , Optimization , Temperature , Design , Fillers (Materials) , Heat , Thermal resistance , Thermoelectric devices

Modeling and Simulation

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara

InterPACK 2013; V001T04A001doi:https://doi.org/10.1115/IPACK2013-73053

Abstract

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Topics: Modeling , Nanotubes , Sensors , Temperature , Pressure , Bridges (Structures) , Heat transfer coefficients , Circuits , Convection , Electrical resistivity

Unsteady Thermo-Structural Simulation of Nano-Bridge Resonators

Elham Maghsoudi, Michael James Martin

InterPACK 2013; V001T04A002doi:https://doi.org/10.1115/IPACK2013-73061

Abstract

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Topics: Bridges (Structures) , Simulation

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray

InterPACK 2013; V001T04A003doi:https://doi.org/10.1115/IPACK2013-73062

Abstract

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Topics: Cooling , Electric power generation , Electrical efficiency , Energy budget (Physics) , Fatigue life , Flow (Dynamics) , Gallium arsenide , Heat , Heat recovery , Heat sinks

Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

Michael Neilsen, Paul Vianco

InterPACK 2013; V001T04A004doi:https://doi.org/10.1115/IPACK2013-73074

Abstract

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Topics: Creep , Damage , Plasticity , Solders , Fatigue , Solder joints , Finite element analysis , Fracture (Materials) , Package on package , Electronic packaging

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Zhimin Wan, Yogendra Joshi

InterPACK 2013; V001T04A005doi:https://doi.org/10.1115/IPACK2013-73080

Abstract

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Topics: Cooling , Heat flux , Microfluidics , Modeling , Transients (Dynamics) , Flow (Dynamics) , Computational fluid dynamics , Heat transfer , Signals , Temperature

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi

InterPACK 2013; V001T04A006doi:https://doi.org/10.1115/IPACK2013-73112

Abstract

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Topics: Corners (Structural elements) , Silicon chips , Displacement , Galerkin method , Stress , Bonding , Density , Electronics , Failure , Lasers

High Field Breakdown of Carbon Nanotube Network Transistors

Man Prakash Gupta, Ashkan Behnam, David Estrada, Eric Pop, Satish Kumar

InterPACK 2013; V001T04A007doi:https://doi.org/10.1115/IPACK2013-73115

Abstract

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Topics: Carbon nanotubes , Transistors , Density , Heating , Reliability , Thin film transistors

A Transient Model for Parallel Flow and Counter Flow Heat Exchangers

K. Abbasi, M. Del Valle, A. P. Wemhoff, A. Ortega

InterPACK 2013; V001T04A008doi:https://doi.org/10.1115/IPACK2013-73118

Abstract

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Topics: Flow (Dynamics) , Heat exchangers , Transients (Dynamics) , Fluids , Capacitance , Exterior walls , Finite volume methods , Heat conduction , Heat transfer coefficients , Steady state

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii

InterPACK 2013; V001T04A009doi:https://doi.org/10.1115/IPACK2013-73151

Abstract

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Topics: Silicon chips , Simulation , Thermal stresses , Stress , Bending strength , Copper , Finite element methods , Yield stress , Brittleness , Elevations (Drawings)

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai

InterPACK 2013; V001T04A010doi:https://doi.org/10.1115/IPACK2013-73161

Abstract

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Topics: Ball-Grid-Array packages , Damage , Simulation , Solder joints , Fatigue , Crack propagation , Electronic packages , Fatigue life , Modeling , Printed circuit boards

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik

InterPACK 2013; V001T04A011doi:https://doi.org/10.1115/IPACK2013-73173

Abstract

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Topics: Heat transfer , Nanoelectronics , Quantum mechanics , Heat , Joules , Quantum electrodynamics , Circuits , Phonons , Radiation (Physics) , Temperature

Simulations of Deformation and Stress During Copper Wirebond on ULK Chips

Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia

InterPACK 2013; V001T04A012doi:https://doi.org/10.1115/IPACK2013-73178

Abstract

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Topics: Copper , Deformation , Engineering simulation , Simulation , Stress , Fracture (Materials) , Vibration , Critical points (Physics) , Wire , Wire bonding

A Study on Impact Stresses in Ceramic Capacitors

Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki

InterPACK 2013; V001T04A013doi:https://doi.org/10.1115/IPACK2013-73191

Abstract

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Topics: Capacitors , Ceramics , Stress , Design engineering , Fracture (Materials) , Impact testing , Machinery , Manufacturing , Printed circuit boards

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta

InterPACK 2013; V001T04A014doi:https://doi.org/10.1115/IPACK2013-73200

Abstract

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Topics: Time-domain analysis , Transients (Dynamics) , Finite element analysis , Cycles , Dynamic analysis , Vibration , Cantilever beams , Circuits , Durability , Manufacturing

Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators

Siyi Zhou, Bahgat G. Sammakia, Bruce White, Peter Borgesen, Cheng Chen

InterPACK 2013; V001T04A015doi:https://doi.org/10.1115/IPACK2013-73225

Abstract

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Topics: Energy conversion , Generators , Water , Flow (Dynamics) , Heat exchangers , Energy budget (Physics) , Energy generation , Finite element analysis , Gages , Heat

Effect of TSV Joule Heating on Device Performance

Fahad Mirza, Gaurang Naware, Thiagarajan Raman, Ankur Jain, Dereje Agonafer

InterPACK 2013; V001T04A016doi:https://doi.org/10.1115/IPACK2013-73228

Abstract

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Topics: Electrical conductance , Heating , Joules , Mechanical admittance

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye

InterPACK 2013; V001T04A017doi:https://doi.org/10.1115/IPACK2013-73245

Abstract

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Topics: High cycle fatigue , High temperature , Vibration , Temperature , Solders , Stress , Alloys , Electronics , Failure , Failure mechanisms

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis

InterPACK 2013; V001T04A018doi:https://doi.org/10.1115/IPACK2013-73250

Abstract

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Topics: Algorithms , Aluminum , Capacitance , Capacitors , Climate , Damage , Electrical components , Failure , High temperature , Service life (Equipment)

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Ryan Lowe, Kai Goebel

InterPACK 2013; V001T04A019doi:https://doi.org/10.1115/IPACK2013-73252

Abstract

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Topics: Algorithms , Reliability , Kalman filters , Ball-Grid-Array packaging , Failure , Filters , Particulate matter , Printed circuit boards , Service life (Equipment) , Solder joints

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

Jackson B. Marcinichen, John R. Thome

InterPACK 2013; V001T04A020doi:https://doi.org/10.1115/IPACK2013-73263

Abstract

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Topics: Microchannels , Cooling , Manufacturing , Thermohydrodynamics , Architecture , Computers , Density , Design , Electronic components , Engineering simulation

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome

InterPACK 2013; V001T04A021doi:https://doi.org/10.1115/IPACK2013-73264

Abstract

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Topics: Cooling systems , Dynamic modeling , Heat , Critical heat flux , Flow (Dynamics) , Temperature , Transients (Dynamics) , Condensers (steam plant) , Pumps , Simulation

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi

InterPACK 2013; V001T04A022doi:https://doi.org/10.1115/IPACK2013-73275

Abstract

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Topics: Computational fluid dynamics , Simulation , Wave soldering , Solders , Computer software , Electronics , Flow (Dynamics) , Fluids , Melting , Melting point

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian

InterPACK 2013; V001T04A023doi:https://doi.org/10.1115/IPACK2013-73276

Abstract

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Topics: Microchannels , Thermal management , Thermoelectric cooling , Cooling , Thermoelectric coolers , Heat , Computer simulation , Currents , Design , Electric current

Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter

Pradeep Lall, Hao Zhang, Lynn Davis

InterPACK 2013; V001T04A024doi:https://doi.org/10.1115/IPACK2013-73305

Abstract

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Topics: Filters , Light-emitting diodes , Particulate matter

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel

InterPACK 2013; V001T04A025doi:https://doi.org/10.1115/IPACK2013-73309

Abstract

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Topics: Electronics , Reliability , Storage , Damage , Temperature , Avionics , Electronic systems , Failure , High temperature , Intermetallic compounds

Multi-Physics Based Reliability

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori

InterPACK 2013; V001T05A001doi:https://doi.org/10.1115/IPACK2013-73091

Abstract

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Topics: Fatigue cracks , Flip-chip , Flip-chip devices , Nondestructive evaluation , Solder joints , Synchrotron radiation , X-rays , Fracture (Materials) , Microcracks , Solders

Characterization of Crack Growth in BGA Under Drop Impact

Quang Nguyen, Seungbae Park, Tung Nguyen

InterPACK 2013; V001T05A002doi:https://doi.org/10.1115/IPACK2013-73110

Abstract

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Topics: Ball-Grid-Array packaging , Fracture (Materials) , Solder joints , Damage , Imaging , Low cycle fatigue , Microscopes , Polishing , Tin , Vehicles

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki

InterPACK 2013; V001T05A003doi:https://doi.org/10.1115/IPACK2013-73126

Abstract

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Topics: Finite element methods , Reliability , Temperature , Finite element analysis , Resins , Electronic packages , Hardening (Curing) , Heat , Integrated circuits , Materials properties

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic

InterPACK 2013; V001T05A004doi:https://doi.org/10.1115/IPACK2013-73143

Abstract

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Topics: Electronics , Reliability , Cycles , Acoustics , Adhesives , Carbon fibers , Silver , Thermal resistance , Copper , Damage

Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection

Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura

InterPACK 2013; V001T05A005doi:https://doi.org/10.1115/IPACK2013-73147

Abstract

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Topics: Copper , Thin films , Design , Diffraction , Electron backscatter diffraction , Electrons , Ruthenium , Semiconductor devices

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura

InterPACK 2013; V001T05A006doi:https://doi.org/10.1115/IPACK2013-73148

Abstract

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Topics: Copper , Thin films , Electroplating , Electrical properties , Electrical resistivity , Annealing , Bulk solids , Density , Grain boundaries , High temperature

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy

InterPACK 2013; V001T05A007doi:https://doi.org/10.1115/IPACK2013-73175

Abstract

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Topics: Microelectromechanical systems , Simulation , Uncertainty , Deformation , Chaos , Complex systems , Damping , Displacement , Electrostatics , Fluids

Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects

Mohammad Motalab, Muhannad Mustafa, Jeffrey C. Suhling, Jiawei Zhang, John Evans, Michael J. Bozack, Pradeep Lall

InterPACK 2013; V001T05A008doi:https://doi.org/10.1115/IPACK2013-73230

Abstract

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Topics: Energy dissipation , Lead-free solders , Reliability , Solders

A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Mohammad Motalab, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2013; V001T05A009doi:https://doi.org/10.1115/IPACK2013-73232

Abstract

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Topics: Constitutive equations , Lead-free solders

The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors

Safina Hussain, Parameshwaran Gnanachchelvi, Jeffrey C. Suhling, Richard C. Jaeger, Michael C. Hamilton, Bogdan M. Wilamowski

InterPACK 2013; V001T05A010doi:https://doi.org/10.1115/IPACK2013-73233

Abstract

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Topics: Stress , Transistors

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Muhannad Mustafa, Jordan C. Roberts, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2013; V001T05A011doi:https://doi.org/10.1115/IPACK2013-73240

Abstract

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Topics: Failure , Fatigue , Lead-free solders , Stress

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling

InterPACK 2013; V001T05A012doi:https://doi.org/10.1115/IPACK2013-73246

Abstract

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Topics: Materials properties , Alloys , Temperature , Tin , Copper , Creep , Design , Elastic moduli , Electronics , Finite element model

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki

InterPACK 2013; V001T05A013doi:https://doi.org/10.1115/IPACK2013-73248

Abstract

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Topics: Density , Simulation , Stress , Diffusion (Physics) , Computer simulation , Electron mobility , Electrons , Heat conduction , Momentum , MOSFET transistors

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel

InterPACK 2013; V001T05A014doi:https://doi.org/10.1115/IPACK2013-73251

Abstract

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Topics: Damage , Electronics , Cycles , Failure , Alloys , Elastic moduli , Electronic systems , Errors , High temperature , Reliability

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

J. D. Hoffman, B. A. Dow, R. D. Lorenz

InterPACK 2013; V001T05A015doi:https://doi.org/10.1115/IPACK2013-73269

Abstract

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Topics: Electronic packages , Sensors , Design , Displacement , Finite element analysis , Semiconductors (Materials) , Temperature , Currents , Eddies (Fluid dynamics) , Eddy currents (Electricity)

Solid State Lighting Life Prediction Using Extended Kalman Filter

Pradeep Lall, Junchao Wei, Lynn Davis

InterPACK 2013; V001T05A016doi:https://doi.org/10.1115/IPACK2013-73288

Abstract

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Topics: Kalman filters , Light-emitting diodes , Failure , Physics , Failure mechanisms , High temperature , Maintenance , Noise (Sound) , Climate , Damage

Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects

Pradeep Lall, Yihua Luo

InterPACK 2013; V001T05A017doi:https://doi.org/10.1115/IPACK2013-73308

Abstract

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Topics: Spectroscopy , Wire

MEMS and NEMS

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura

InterPACK 2013; V001T06A001doi:https://doi.org/10.1115/IPACK2013-73156

Abstract

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Topics: Carbon nanotubes , Strain sensors , Multi-walled carbon nanotubes , Electrical conductivity , Shapes , Chemical vapor deposition , Electrical resistance , Single-walled carbon nanotubes , Catalysts , Design

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop

InterPACK 2013; V001T06A002doi:https://doi.org/10.1115/IPACK2013-73222

Abstract

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Topics: Capacitors , Flip-chip , Flip-chip devices , Microelectromechanical systems , Packaging , Semiconductor wafers , Solders , Stress , Deflection , Failure

Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

InterPACK 2013; V001T06A003doi:https://doi.org/10.1115/IPACK2013-73249

Abstract

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Topics: Bridges (Structures) , Sensors , Silicon , Stress , Wire

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Elena Zukowski, Michael Berndt, Sohaib Anees, Jürgen Wilde, Leonhard M. Reindl

InterPACK 2013; V001T06A004doi:https://doi.org/10.1115/IPACK2013-73258

Abstract

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Topics: Sensors , Surface acoustic waves , Strain sensors , Stress , Cycles , Temperature , Fatigue , Finite element methods , Finite element model , Signals

Micro Cryogenic Coolers With Mixed Refrigerants

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee

InterPACK 2013; V001T06A005doi:https://doi.org/10.1115/IPACK2013-73290

Abstract

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Topics: Coolers , Refrigerants , Microelectromechanical systems , Flow (Dynamics) , Heat exchangers , Low temperature , Microchannel flow , Pressure , Temperature , Valves

Influences of Specimen Size and Annealing Temperature on Mechanical Reliability of FIB-Fabricated Si Nanowires for NEMS

Tatsuya Fujii, Koichi Sudoh, Shozo Inoue, Takahiro Namazu

InterPACK 2013; V001T06A006doi:https://doi.org/10.1115/IPACK2013-73310

Abstract

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Topics: Annealing , Nanoelectromechanical systems , Nanowires , Reliability , Temperature , Manufacturing , Silicon , Young's modulus , Damage , Focused ion beams

Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle

InterPACK 2013; V001T06A007doi:https://doi.org/10.1115/IPACK2013-73317

Abstract

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Topics: Packaging , Semiconductor wafers , Silicon , Stress , Tin , Vehicles , Bonding , Modeling , Transistors , Bolometers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya

InterPACK 2013; V001T06A008doi:https://doi.org/10.1115/IPACK2013-73324

Abstract

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Topics: Hydrogen , Mechanical properties , Silicon crystals , Silicon , Atoms , Boiling , Boron , Deformation , Plasticity , Stress

Materials and Processes

Laser Processing by Using Fluidic Laser Beam Shaper

Hong Duc Doan, Naoki Iwatani, Kazuyoshi Fushinobu

InterPACK 2013; V001T07A001doi:https://doi.org/10.1115/IPACK2013-73059

Abstract

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Topics: Laser beams , Lasers , Laser materials , Drilling

Fundamental Research on Via Processing by Using Short Pulse Laser in SiC

Naoki Iwatani, Hong Duc Doan, Kazuyoshi Fushinobu

InterPACK 2013; V001T07A002doi:https://doi.org/10.1115/IPACK2013-73060

Abstract

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Topics: Lasers , Water , Ablation (Vaporization technology) , Fluence (Radiation measurement) , Fracture (Materials) , Semiconductor wafers , Drilling , Etching , Film thickness , Nd-YAG lasers

Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging

Z. Huang, I. Dutta, G. S. Subbarayan

InterPACK 2013; V001T07A003doi:https://doi.org/10.1115/IPACK2013-73079

Abstract

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Topics: Fracture (Materials) , Fracture (Process) , Solders , Tin , Brittleness , Fracture mechanics , Fracture toughness , Solder joints , Adhesives , Ball-Grid-Array packaging

Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon

Hideo Koguchi, Naoki Kimura

InterPACK 2013; V001T07A004doi:https://doi.org/10.1115/IPACK2013-73113

Abstract

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Topics: Coating processes , Coatings , Sapphire , Silicon , Delamination , Bonding , Resins , Stress , Cooling , Temperature

Effect of Aging on Impression Creep Behavior of Pb-Free Solders

B. Talebanpour, U. Sahaym, I. Dutta, P. Kumar

InterPACK 2013; V001T07A005doi:https://doi.org/10.1115/IPACK2013-73137

Abstract

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Topics: Creep , Lead-free solders , Tin , Alloys , Particulate matter , Solders , Temperature , Melting , Melting point , Particle size

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura

InterPACK 2013; V001T07A006doi:https://doi.org/10.1115/IPACK2013-73149

Abstract

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Topics: Reliability , Thin films , Electroplating , Copper , Annealing , Current density , Electrical properties , Electron backscatter diffraction , Electrical resistivity , Grain boundaries

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

Yusuke Watanabe, Yuji Ichikawa, Kazuhiro Ogawa, Hideo Miura

InterPACK 2013; V001T07A007doi:https://doi.org/10.1115/IPACK2013-73150

Abstract

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Topics: Copper , Mechanical properties , Particulate matter , Brittle fracture , Ceramics , Coating processes , Coatings , Dielectric materials , Electrical properties , Electron backscatter diffraction

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham

InterPACK 2013; V001T07A008doi:https://doi.org/10.1115/IPACK2013-73158

Abstract

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Topics: Composite materials , Electrodes , Graphene , Single-walled carbon nanotubes , Transparency , Single-walled nanotubes , Chemical vapor deposition , Electrical properties , Annealing , Heat conduction

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht

InterPACK 2013; V001T07A009doi:https://doi.org/10.1115/IPACK2013-73164

Abstract

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Topics: Creep , Micromechanics (Engineering) , Solders , Tin , Nanoscale phenomena , Solder joints , Alloys , Image processing , Intermetallic compounds , Particulate matter

Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel

Shingo Hattori, Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara

InterPACK 2013; V001T07A010doi:https://doi.org/10.1115/IPACK2013-73170

Abstract

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Topics: Plasmas (Ionized gases) , Stainless steel , Tin , Erosion , Diffusion (Physics) , Temperature

Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo

InterPACK 2013; V001T07A011doi:https://doi.org/10.1115/IPACK2013-73171

Abstract

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Topics: Electrodes , Lead-free solders , Tin , Plating baths , Shear (Mechanics) , Solders , Intermetallic compounds , Melting , Nickel plating

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji

InterPACK 2013; V001T07A012doi:https://doi.org/10.1115/IPACK2013-73172

Abstract

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Topics: Copper foil , Electrolytes , Mechanical properties , Copper , Elastic moduli , Fatigue properties , Grain size , Proteins , Tensile strength

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

InterPACK 2013; V001T07A013doi:https://doi.org/10.1115/IPACK2013-73192

Abstract

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Topics: Damage , Low cycle fatigue , Solder joints , Tin , Grain boundaries , Fracture (Materials) , Stress concentration , Crack propagation , Cycles , Electron backscatter diffraction

Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy

Takuma Sato, Yoshiharu Kariya, Kazuma Fukui

InterPACK 2013; V001T07A014doi:https://doi.org/10.1115/IPACK2013-73193

Abstract

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Topics: Eutectic alloys , Low cycle fatigue , Temperature , Tin , Fatigue life , Deformation , Ductility , Fatigue , Metals , Temperature effects

Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging

Mohammad Hasnine, Muhannad Mustafa, Jing Zou, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall

InterPACK 2013; V001T07A015doi:https://doi.org/10.1115/IPACK2013-73234

Abstract

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Topics: Creep , Electron backscatter diffraction , Microelectronic packaging , Nanoindentation , Solder joints

Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys

Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack

InterPACK 2013; V001T07A016doi:https://doi.org/10.1115/IPACK2013-73241

Abstract

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Topics: Alloys , Creep , Lead-free solders , Mechanical properties

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2013; V001T07A017doi:https://doi.org/10.1115/IPACK2013-73242

Abstract

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Topics: Mechanical behavior , Microelectronic packaging , Polymers , Mechanical properties , Stress , Tension , Adhesives , Elastic moduli , Epoxy adhesives , Epoxy resins

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman

InterPACK 2013; V001T07A018doi:https://doi.org/10.1115/IPACK2013-73278

Abstract

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Topics: Printed circuit boards , Solders , Finishes , Failure mechanisms , Lumber , Reliability , Cracking (Materials) , Fracture (Process) , Resistors , Shock (Mechanics)

Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects

Pradeep Lall, Shantanu Deshpande

InterPACK 2013; V001T07A019doi:https://doi.org/10.1115/IPACK2013-73287

Abstract

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Topics: Failure , Intermetallic compounds , Wire , Damage , Service life (Equipment) , Wire bonding , Algorithms , Aluminum , Copper , Electronic packaging

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu₆Sn₅ Intermetallic

Soud Farhan Choudhury, Leila Ladani

InterPACK 2013; V001T07A020doi:https://doi.org/10.1115/IPACK2013-73315

Abstract

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Topics: Crystals , Intermetallic compounds , Mechanical behavior , Tin , Solder joints , Electron backscatter diffraction , Nanoindentation , Anisotropy , Creep , Ductility

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