Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems

July 6–8, 2011

Portland, Oregon, USA

Conference Sponsors:

ISBN:

978-0-7918-4462-5

In This Volume

Thermal Management (43)
Data Centers and Energy Efficient Electronic Systems (32)
Materials and Processes (15)

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2

Thermal Management

Modeling of Fan Failures in Networking Enclosures

Susheela Narasimhan, Gokul Shankaran

InterPACK 2011; 1-6https://doi.org/10.1115/IPACK2011-52011

Abstract

View Articletitled, Modeling of Fan Failures in Networking Enclosures

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Topics: Failure , Modeling , Fans , Flow (Dynamics) , Blades , Rotors , Stators , Temperature , Geometry , Simulation

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh

InterPACK 2011; 7-11https://doi.org/10.1115/IPACK2011-52014

Abstract

View Articletitled, Robust Thermal Management for Embedded CPU and GPUs in Displays

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Topics: Graphics processing units , Thermal management , Design , Reliability , Brightness (Photometry) , Circuits , Corners (Structural elements) , Energy dissipation , Heat , Manufacturing

Development of a Compliant Nanothermal Interface Material

David Shaddock, Stanton Weaver, Ioannis Chasiotis, Binoy Shah, Dalong Zhong

InterPACK 2011; 13-17https://doi.org/10.1115/IPACK2011-52015

Abstract

View Articletitled, Development of a Compliant Nanothermal Interface Material

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Topics: Copper , Fatigue , Manufacturing , Plates (structures) , Power density , Silicon , Solders , Stress , Testing performance , Thermal conductivity

An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator

Z. R. Lin, Z. Y. Lee, L. W. Zhang, S. F. Wang, A. A. Merrikh, G. Refai-Ahmed

InterPACK 2011; 19-27https://doi.org/10.1115/IPACK2011-52017

Abstract

View Articletitled, An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator

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Topics: Cooling , Graphics processing units , Heat pipes , Heat transfer

Heat Transfer Characteristics of Aluminum Plate Pulsating Heat Pipes

Z. R. Lin, Z. Y. Lee, L. W. Zhang, S. F. Wang, A. A. Merrikh, G. Refai-Ahmed

InterPACK 2011; 29-35https://doi.org/10.1115/IPACK2011-52018

Abstract

View Articletitled, Heat Transfer Characteristics of Aluminum Plate Pulsating Heat Pipes

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Topics: Aluminum plate , Flow visualization , Heat , Heat pipes , Heat transfer

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno

InterPACK 2011; 37-45https://doi.org/10.1115/IPACK2011-52019

Abstract

View Articletitled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

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Topics: Heat , Temperature control , Heat sinks , Temperature , Energy consumption , Algorithms , Thermal resistance , Circuits , Currents , Electrical resistivity

Cooling Performance Comparisons of Five Different Plate-Pin Compound Heat Sinks Based on Two Different Length Scale

Feng Zhou, David Geb, Ivan Catton

InterPACK 2011; 47-57https://doi.org/10.1115/IPACK2011-52020

Abstract

View Articletitled, Cooling Performance Comparisons of Five Different Plate-Pin Compound Heat Sinks Based on Two Different Length Scale

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Topics: Cooling , Heat sinks , Heat transfer , Pressure drop , Reynolds number , Computational fluid dynamics , Computer simulation , Design , Flow (Dynamics) , Heat

Experimental Investigation of the Thermal Performance of a Manifold Hierarchical Microchannel Cold Plate

Ercan M. Dede

InterPACK 2011; 59-67https://doi.org/10.1115/IPACK2011-52023

Abstract

View Articletitled, Experimental Investigation of the Thermal Performance of a Manifold Hierarchical Microchannel Cold Plate

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Topics: Manifolds , Microchannels , Flat plates , Pressure drop , Heat transfer , Optimization , Pressure , Temperature , Thermal resistance , Thermofluids

An Experimentally Validated Model for Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders

Ram Ranjan, Jayathi Y. Murthy, Suresh V. Garimella, David H. Altman

InterPACK 2011; 69-80https://doi.org/10.1115/IPACK2011-52039

Abstract

View Articletitled, An Experimentally Validated Model for Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders

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Topics: Boiling , Computer simulation , Flat heat pipes , Flux (Metallurgy) , Heat , Thermal conductivity , Thermal resistance , Vapors

Submerged Jet Impingement Boiling on a Polished Silicon Surface

Preeti Mani, Ruander Cardenas, Vinod Narayanan

InterPACK 2011; 81-94https://doi.org/10.1115/IPACK2011-52042

Abstract

View Articletitled, Submerged Jet Impingement Boiling on a Polished Silicon Surface

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Topics: Boiling , Polishing , Silicon , Heat , Heat flux , Heat transfer , Reynolds number , Temperature , Fluids , Heat transfer coefficients

Critical Heat Flux During Submerged Jet Impingement Boiling of Saturated Water at Sub-Atmospheric Conditions

Ruander Cardenas, Vinod Narayanan

InterPACK 2011; 95-106https://doi.org/10.1115/IPACK2011-52043

Abstract

View Articletitled, Critical Heat Flux During Submerged Jet Impingement Boiling of Saturated Water at Sub-Atmospheric Conditions

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Topics: Boiling , Critical heat flux , Water , Errors , Nozzles , Finishes , Fluids , Reynolds number , Temperature

Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future

Jie Wei

InterPACK 2011; 107-111https://doi.org/10.1115/IPACK2011-52045

Abstract

View Articletitled, Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future

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Topics: Cooling , Water , Convection , Architecture , Cooling systems , Design , Energy consumption , Flow (Dynamics) , Low temperature , Maintainability

Numerical Simulation of Local Heat Transfer and Scaling of a Synthetic Impinging Jet in a Canonical Geometry

Luis Silva, Alfonso Ortega

InterPACK 2011; 113-121https://doi.org/10.1115/IPACK2011-52053

Abstract

View Articletitled, Numerical Simulation of Local Heat Transfer and Scaling of a Synthetic Impinging Jet in a Canonical Geometry

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Topics: Computer simulation , Geometry , Heat transfer , Momentum , Vortices , Flow (Dynamics) , Fluids , Jets , Outflow , Convection

On the Lateral Motion of Bubbles Generated From Re-Entrant Cavities Located on Asymmetrically Structured Surfaces

Naveenan Thiagarajan, Florian Kapsenberg, Vinod Narayanan, Sushil H. Bhavnani, Charles Ellis

InterPACK 2011; 123-131https://doi.org/10.1115/IPACK2011-52056

Abstract

View Articletitled, On the Lateral Motion of Bubbles Generated From Re-Entrant Cavities Located on Asymmetrically Structured Surfaces

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Topics: Bubbles , Cavities , Nucleation (Physics) , Etching , Flow (Dynamics) , Heat sinks , Lithography , Photography , Pool boiling , Propulsion systems

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen

InterPACK 2011; 133-142https://doi.org/10.1115/IPACK2011-52079

Abstract

View Articletitled, Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

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Topics: Army , Electronics , Vehicles , Temperature , Energy dissipation , Heat , Coolants , Cooling , Design , Electrical resistivity

Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink

Ravi S. Patel, Tannaz Harirchian, Suresh V. Garimella

InterPACK 2011; 143-151https://doi.org/10.1115/IPACK2011-52089

Abstract

View Articletitled, Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink

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Topics: Boiling , Flow (Dynamics) , Heat sinks , Heat transfer coefficients , Microchannels , Vapors , Dimensions , Dielectric liquids , Energy dissipation , Entrance region

An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar

InterPACK 2011; 153-163https://doi.org/10.1115/IPACK2011-52094

Abstract

View Articletitled, An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

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Topics: Electronic packages , Energy dissipation , Integrated circuits , Reliability , Temperature , Temperature gradient , Thermal management

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki

InterPACK 2011; 165-172https://doi.org/10.1115/IPACK2011-52095

Abstract

View Articletitled, Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

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Topics: Heat pipes , Heat transfer , Heat , Cooling , Cooling systems , Water , Bubbles , Flow (Dynamics) , Stress , Thermal energy

Development of a Hybrid PCM-Air Heat Sink

Y. Kozak, B. Abramzon, G. Ziskind

InterPACK 2011; 173-178https://doi.org/10.1115/IPACK2011-52097

Abstract

View Articletitled, Development of a Hybrid PCM-Air Heat Sink

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Topics: Heat sinks , Temperature , Heat , Melting , Energy dissipation , Phase change materials , Thermal management , Aluminum , Cooling , Delays

Fundamental Study on Thermal Characteristics of Heat Spreaders

Yasushi Koito, Yusaku Nonaka, Toshio Tomimura

InterPACK 2011; 179-184https://doi.org/10.1115/IPACK2011-52099

Abstract

View Articletitled, Fundamental Study on Thermal Characteristics of Heat Spreaders

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Topics: Flat heat pipes , Design , Heat , Disks , Flow (Dynamics) , Heat flux , Heat sinks , Heat transfer , Numerical analysis , Photonic systems

Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards

Yuta Nakano, Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Masataka Hirokawa, Toshio Tomimura

InterPACK 2011; 185-191https://doi.org/10.1115/IPACK2011-52106

Abstract

View Articletitled, Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards

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Topics: Electrical wires , Printed circuit boards , Thermal conductivity , Copper , Wire , Computational fluid dynamics , Thermal diffusion

Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows

Sidharth Paranjape, Susan N. Ritchey, Suresh V. Garimella

InterPACK 2011; 193-202https://doi.org/10.1115/IPACK2011-52116

Abstract

View Articletitled, Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows

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Topics: Flow (Dynamics) , Microchannel flow , Porosity , Impedance (Electricity) , Two-phase flow , Electrical conductance , Electrical properties , Microchannels , Signals , Transparency

Thermal Characterization of Non-Isolated DC to DC Convertor

Shiladitya Chakravorty, Bahgat Sammakia, Varaprasad Calmidi

InterPACK 2011; 203-212https://doi.org/10.1115/IPACK2011-52121

Abstract

View Articletitled, Thermal Characterization of Non-Isolated DC to DC Convertor

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Topics: Thermal characterization , Energy dissipation , Computational fluid dynamics , Air flow , Design , Inductors , Insulation , Semiconductor devices , Stress , Temperature

Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices

David H. Altman, Joseph R. Wasniewski, Mark T. North, Sungwon S. Kim, Timothy S. Fisher

InterPACK 2011; 213-220https://doi.org/10.1115/IPACK2011-52122

Abstract

View Articletitled, Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices

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Topics: Carbon nanotubes , Flat heat pipes , Thermal management , Thermal resistance , Vapors

An Overview of the Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl

InterPACK 2011; 221-229https://doi.org/10.1115/IPACK2011-52130

Abstract

View Articletitled, An Overview of the Power 775 Supercomputer Water Cooling System

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Topics: Cooling systems , Water , Heat , Stress , Cooling , Disks , Heat exchangers , Doors , Electronics , Energy efficiency

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola

InterPACK 2011; 231-240https://doi.org/10.1115/IPACK2011-52148

Abstract

View Articletitled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

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Topics: Carbon , Nanotubes , Steady state , Carbon nanotubes , Bonding , Design , Heat , Nanomaterials , Optimization , Pressure

Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

David Romero, Aydin Nabovati, Gamal Refai-Ahmed, Daniel P. Sellan, Saeed Ghalambor, Niket Shah, Dereje Agonafer, Cristina H. Amon

InterPACK 2011; 241-249https://doi.org/10.1115/IPACK2011-52161

Abstract

View Articletitled, Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

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Topics: Optimization , Temperature effects , Thermal conductivity , Energy generation , Heat transfer , Reliability , Semiconductors (Materials) , Simulation , Temperature gradient

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa

InterPACK 2011; 251-258https://doi.org/10.1115/IPACK2011-52168

Abstract

View Articletitled, Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

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Topics: Network analysis , Printed circuit boards , Thermal resistance , Copper , Heat , Computational fluid dynamics , Temperature , Electronics , Epoxy adhesives , Epoxy resins

Advances in Fan Modeling: Using Multiple Reference Frame (MRF) Approach on Blowers

Gokul Shankaran, M. Baris Dogruoz

InterPACK 2011; 259-267https://doi.org/10.1115/IPACK2011-52172

Abstract

View Articletitled, Advances in Fan Modeling: Using Multiple Reference Frame (MRF) Approach on Blowers

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Topics: Impellers , Modeling

Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution

A. Tamayol, F. McGregor, E. Demian, E. Trandafir, P. Bowler, P. Rada, M. Bahrami

InterPACK 2011; 269-276https://doi.org/10.1115/IPACK2011-52174

Abstract

View Articletitled, Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution

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Topics: Fins , Heat transfer , Radiation (Physics) , Natural convection , Heat , Temperature distribution

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri

InterPACK 2011; 277-283https://doi.org/10.1115/IPACK2011-52179

Abstract

View Articletitled, High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

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Topics: Heat recovery , Heat transfer , Flow (Dynamics) , Heat transfer coefficients , Pressure drop , Refrigerants , Thermal management , Absorption , Cooling , Electronic products

Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance

Cong Yue, Jun Lu, Xiaotian Zhang, Yueh-Se Ho

InterPACK 2011; 285-292https://doi.org/10.1115/IPACK2011-52188

Abstract

View Articletitled, Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance

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Topics: Simulation , Wire , Thermal resistance , Finite element model , Gages , Junctions , Natural convection , Power semiconductor devices , Testing , Transistors

An Innovative Way to Measure Temperature by Using the Faraday Effect

Pranav Limaye, Anisur Rehman

InterPACK 2011; 293-296https://doi.org/10.1115/IPACK2011-52202

Abstract

View Articletitled, An Innovative Way to Measure Temperature by Using the Faraday Effect

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Topics: Faraday effect , Temperature , Magnetic fields , Cables , Electromagnetic interference , Fibers , Insulation , Magnets , Optical fiber , Permanent magnets

TSV Interposers With Embedded Microchannels for 3D IC and LED Integration

John Lau, Heng-Chieh Chien, Ray Tain

InterPACK 2011; 297-304https://doi.org/10.1115/IPACK2011-52204

Abstract

View Articletitled, TSV Interposers With Embedded Microchannels for 3D IC and LED Integration

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Topics: Microchannels , Silicon , Cooling , Optical instruments , Pressure drop , Structural design , System-in-package

High Performance Thermal Conductive Sheets Made of Carbon Fibers

Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida

InterPACK 2011; 305-309https://doi.org/10.1115/IPACK2011-52218

Abstract

View Articletitled, High Performance Thermal Conductive Sheets Made of Carbon Fibers

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Topics: Carbon fibers , Resins , Thermal conductivity , Compressibility , Cooling systems , Fibers , Particulate matter , Aluminum , ASTM International , Contact resistance

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang

InterPACK 2011; 311-318https://doi.org/10.1115/IPACK2011-52225

Abstract

View Articletitled, Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

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Topics: Cooling , Graphics processing units , Diamonds , Fins , Water , Design , Flow (Dynamics) , Coolers , Electrolytic corrosion , Metals

Silicon Hot Spot Remediation With a Germanium Self Cooling Layer

Horacio Nochetto, Peng Wang, Avram Bar-Cohen

InterPACK 2011; 319-326https://doi.org/10.1115/IPACK2011-52229

Abstract

View Articletitled, Silicon Hot Spot Remediation With a Germanium Self Cooling Layer

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Topics: Cooling , Germanium , Silicon , Silicon chips , Temperature , Engineering simulation , Shrinkage (Materials) , Simulation , Thermal conductivity , Thermal management

IR Based Inverse Calculation of Two-Phase Heat Transfer Coefficients in Microgap Channels

Jessica Sheehan, Avram Bar-Cohen

InterPACK 2011; 327-334https://doi.org/10.1115/IPACK2011-52238

Abstract

View Articletitled, IR Based Inverse Calculation of Two-Phase Heat Transfer Coefficients in Microgap Channels

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Topics: Heat transfer coefficients , Flux (Metallurgy) , Heat , Thermography , Two-phase flow

IC-Package Thermal Co-Analysis in 3D IC Environment

Stephen H. Pan, Norman Chang, Ji Zheng

InterPACK 2011; 335-341https://doi.org/10.1115/IPACK2011-52240

Abstract

View Articletitled, IC-Package Thermal Co-Analysis in 3D IC Environment

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Topics: Design , Electrodiffusion , Leakage , Power density , Reliability , Temperature , Temperature distribution

Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles

Leyuan Yu, Dong Liu, Frank Botz

InterPACK 2011; 343-355https://doi.org/10.1115/IPACK2011-52256

Abstract

View Articletitled, Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles

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Topics: Convection , Nanofluids , Nanoparticles , Fluids , Heat transfer , Particulate matter , Water , Friction , Laminar flow , Nanorods

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales

InterPACK 2011; 357-365https://doi.org/10.1115/IPACK2011-52262

Abstract

View Articletitled, The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

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Topics: Air jets , Cooling , Jets , Microelectronic devices

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen

InterPACK 2011; 367-375https://doi.org/10.1115/IPACK2011-52267

Abstract

View Articletitled, Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

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Topics: Diluents , Heat pipes , Cooling , Laptop computers , Packaging , Acoustics , Condensers (steam plant) , Density , Flat heat pipes , Heat

Do You Know Your Onboard Temperature Sensing IC?

Herman Chu

InterPACK 2011; 377-384https://doi.org/10.1115/IPACK2011-52288

Abstract

View Articletitled, Do You Know Your Onboard Temperature Sensing IC?

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Topics: Temperature , Power density , Air flow , Algorithms , Circuit design , Computer simulation , Control systems , Design , Electronic packaging , Heating

Data Centers and Energy Efficient Electronic Systems

Energy Modeling of Air-Cooled Data Centers: Part I—The Optimization of Enclosed Aisle Configurations

Dustin W. Demetriou, H. Ezzat Khalifa

InterPACK 2011; 385-394https://doi.org/10.1115/IPACK2011-52003

Abstract

View Articletitled, Energy Modeling of Air-Cooled Data Centers: Part I—The Optimization of Enclosed Aisle Configurations

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Topics: Data centers , Modeling , Optimization , Temperature , Energy consumption , Cooling , Flow (Dynamics) , Air conditioners , Computers , Containment

Energy Modeling of Air-Cooled Data Centers: Part II—The Effect of Recirculation on the Energy Optimization of Open-Aisle, Air-Cooled Data Centers

Dustin W. Demetriou, H. Ezzat Khalifa

InterPACK 2011; 395-404https://doi.org/10.1115/IPACK2011-52004

Abstract

View Articletitled, Energy Modeling of Air-Cooled Data Centers: Part II—The Effect of Recirculation on the Energy Optimization of Open-Aisle, Air-Cooled Data Centers

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Topics: Data centers , Modeling , Optimization , Cooling , Temperature , Energy consumption , Air flow , Flow (Dynamics) , High temperature , Temperature nonunifomity

Evaluation of a Data Center Recirculation Non-Uniformity Metric Using Computational Fluid Dynamics

Dustin W. Demetriou, H. Ezzat Khalifa

InterPACK 2011; 405-414https://doi.org/10.1115/IPACK2011-52005

Abstract

View Articletitled, Evaluation of a Data Center Recirculation Non-Uniformity Metric Using Computational Fluid Dynamics

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Topics: Computational fluid dynamics , Data centers , Temperature , Buoyancy , Flow (Dynamics) , Tiles , Engineering simulation , Simulation , Cooling , Energy consumption

Design of Simulated Server Racks for Data Center Research

James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar

InterPACK 2011; 415-422https://doi.org/10.1115/IPACK2011-52016

Abstract

View Articletitled, Design of Simulated Server Racks for Data Center Research

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Topics: Data centers , Design , Server racks , Computers , Fans , Heating , Temperature , Density , Flow (Dynamics) , Pressure drop

Dynamic Reduced Order Thermal Modeling of Data Center Air Temperatures

Rajat Ghosh, Yogendra Joshi

InterPACK 2011; 423-432https://doi.org/10.1115/IPACK2011-52029

Abstract

View Articletitled, Dynamic Reduced Order Thermal Modeling of Data Center Air Temperatures

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Topics: Data centers , Modeling , Principal component analysis , Temperature , Transients (Dynamics)

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader

InterPACK 2011; 433-442https://doi.org/10.1115/IPACK2011-52030

Abstract

View Articletitled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

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Topics: Cooling , Cooling towers , Data centers , Energy efficiency , Leakage , Modeling , Operating temperature , Energy consumption , Heat , Accounting

Liquid Cooling Network Systems for Energy Conservation in Data Centers

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura

InterPACK 2011; 443-449https://doi.org/10.1115/IPACK2011-52066

Abstract

View Articletitled, Liquid Cooling Network Systems for Energy Conservation in Data Centers

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Topics: Cooling , Data centers , Energy conservation , Heat exchangers , Cooling systems , Heat , Flat heat pipes , Server racks , Air conditioning , Condensation

Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate

Thong Dang, Carine Serreli, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar

InterPACK 2011; 451-459https://doi.org/10.1115/IPACK2011-52067

Abstract

View Articletitled, Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate

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Topics: Exhaust systems , Flow (Dynamics) , Temperature gradient , Temperature , Algorithms , Computational fluid dynamics , Data centers , Engineering simulation , Heat , Simulation

Spatially-Aware Optimization of Energy Consumption in Consolidated Data Center Systems

Hui Chen, Mukil Kesavan, Karsten Schwan, Ada Gavrilovska, Pramod Kumar, Yogendra Joshi

InterPACK 2011; 461-470https://doi.org/10.1115/IPACK2011-52080

Abstract

View Articletitled, Spatially-Aware Optimization of Energy Consumption in Consolidated Data Center Systems

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Topics: Data centers , Energy consumption , Optimization , Stress , Temperature , Cooling , Energy efficiency , Machinery , Air flow

Real-Time Data Center Transient Analysis

Xuanhang Simon Zhang, James W. VanGilder

InterPACK 2011; 471-477https://doi.org/10.1115/IPACK2011-52088

Abstract

View Articletitled, Real-Time Data Center Transient Analysis

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Topics: Data centers , Transient analysis , Cooling , Transients (Dynamics) , Design , Computer software , Failure , Fans , Pumps , Stress

An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures

Michael K. Patterson, Rainer Weidmann, Markus Leberecht, Manuel Mair, Richard M. Libby

InterPACK 2011; 479-488https://doi.org/10.1115/IPACK2011-52090

Abstract

View Articletitled, An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures

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Topics: Air flow , Architecture , Containment , Cooling systems , Data centers , Temperature , Energy consumption , Cooling , Fans , Hardware

Server Heat Load Based CRAC Fan Controller Paired With Rear Door Heat Exchanger

Vikneshan Sundaralingam, Pramod Kumar, Yogendra Joshi

InterPACK 2011; 489-496https://doi.org/10.1115/IPACK2011-52114

Abstract

View Articletitled, Server Heat Load Based CRAC Fan Controller Paired With Rear Door Heat Exchanger

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Topics: Control equipment , Doors , Heat , Heat exchangers , Stress , Cooling , Data centers , Air conditioning , Blades , Computer software

Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks

Pramod Kumar, Yogendra Joshi, Michael K. Patterson, Robin Steinbrecher, Marissa Mena

InterPACK 2011; 497-504https://doi.org/10.1115/IPACK2011-52117

Abstract

View Articletitled, Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks

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Topics: Data centers , Air flow , Heat , Stress , Tiles , Air conditioning , Computers , Density , Flow (Dynamics) , Particulate matter

The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow

James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang, Collyn T. O’Kane

InterPACK 2011; 505-510https://doi.org/10.1115/IPACK2011-52127

Abstract

View Articletitled, The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow

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Topics: Air flow , Data centers , Tiles , Cooling , Architecture , Computational fluid dynamics , Design , Flow (Dynamics) , Leakage , Modeling

A Data Center Environmental Advisory System

Christopher Hoover, Niru Kumari, Carlos Felix, Cullen Bash

InterPACK 2011; 511-517https://doi.org/10.1115/IPACK2011-52128

Abstract

View Articletitled, A Data Center Environmental Advisory System

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Topics: Data centers , Cooling , Air conditioners , Computers , Geometry , Stress , Temperature , Tiles , Vents

Optimization of Outside Air Cooling in Data Centers

Niru Kumari, Rocky Shih, Alan McReynolds, Ratnesh Sharma, Tom Christian, Cullen Bash

InterPACK 2011; 519-525https://doi.org/10.1115/IPACK2011-52132

Abstract

View Articletitled, Optimization of Outside Air Cooling in Data Centers

PDF

Topics: Cooling , Data centers , Optimization , Temperature , Flow (Dynamics)

Potential-Flow Modeling for Data Center Applications

Christopher M. Healey, James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang

InterPACK 2011; 527-534https://doi.org/10.1115/IPACK2011-52136

Abstract

View Articletitled, Potential-Flow Modeling for Data Center Applications

PDF

Topics: Data centers , Flow (Dynamics) , Modeling , Computational fluid dynamics , Friction , Air flow , Buoyancy , Design , Fluid dynamics , Heat transfer

A Rack-Level Cooling Redundancy Metric for Data Center Applications

James W. VanGilder, Christopher M. Healey

InterPACK 2011; 535-539https://doi.org/10.1115/IPACK2011-52138

Abstract

View Articletitled, A Rack-Level Cooling Redundancy Metric for Data Center Applications

PDF

Topics: Cooling , Data centers , Redundancy (Engineering) , Power systems (Machinery) , Cooling systems , Design , System failures , Temperature

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader, Thomas J. Breen, Ed J. Walsh, Jeff Punch

InterPACK 2011; 541-551https://doi.org/10.1115/IPACK2011-52140

Abstract

View Articletitled, On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

PDF

Topics: Energy efficiency , Data centers , Energy consumption , Traction

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein

InterPACK 2011; 553-563https://doi.org/10.1115/IPACK2011-52141

Abstract

View Articletitled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

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Topics: Data centers , Energy efficiency , Uncertainty , Stress , Temperature , Design , Experimental analysis , Flow (Dynamics) , Air flow , Compressors

A Data-Centric Approach for Integrated Data Center Management

Christopher Hoover

InterPACK 2011; 565-576https://doi.org/10.1115/IPACK2011-52159

Abstract

View Articletitled, A Data-Centric Approach for Integrated Data Center Management

PDF

Topics: Data centers , Bridges (Structures) , Control systems , Modeling , Visualization

Characterization of a Server Thermal Mass Using Experimental Measurements

Mahmoud Ibrahim, Furat Afram, Bahgat Sammakia, Kanad Ghose, Bruce Murray, Madhusudan Iyengar, Roger Schmidt

InterPACK 2011; 577-583https://doi.org/10.1115/IPACK2011-52165

Abstract

View Articletitled, Characterization of a Server Thermal Mass Using Experimental Measurements

PDF

Topics: Cooling , Data centers , Electronic equipment , Energy dissipation , Energy efficiency , Fans , Heat , Materials properties , Sensors , Steady state

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt

InterPACK 2011; 585-593https://doi.org/10.1115/IPACK2011-52166

Abstract

View Articletitled, Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

PDF

Topics: Cooling , Electronic equipment , Temperature , Ceilings , Data centers , Energy dissipation , Heat , Sealing (Process) , Air conditioning , Air flow

Multivariate Prediction of Airflow and Temperature Distributions Using Artificial Neural Networks

Zhihang Song, Bruce T. Murray, Bahgat Sammakia

InterPACK 2011; 595-604https://doi.org/10.1115/IPACK2011-52167

Abstract

View Articletitled, Multivariate Prediction of Airflow and Temperature Distributions Using Artificial Neural Networks

PDF

Topics: Air flow , Artificial neural networks , Temperature distribution , Computational fluid dynamics , Data centers , Design , Flow (Dynamics) , Thermal management , Tiles , Computer software

A Statistical Approach to Thermal Zone Mapping

Hongfei Li, Hendrik F. Hamann

InterPACK 2011; 605-610https://doi.org/10.1115/IPACK2011-52192

Abstract

View Articletitled, A Statistical Approach to Thermal Zone Mapping

PDF

Topics: Cooling , Data centers , Failure , Sensors , Structures , Temperature

Energy Savings Through Hot and Cold Aisle Containment Configurations for Air Cooled Servers in Data Centers

Roger Schmidt, Aparna Vallury, Madhusudan Iyengar

InterPACK 2011; 611-616https://doi.org/10.1115/IPACK2011-52206

Abstract

View Articletitled, Energy Savings Through Hot and Cold Aisle Containment Configurations for Air Cooled Servers in Data Centers

PDF

Topics: Containment , Data centers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil

InterPACK 2011; 617-622https://doi.org/10.1115/IPACK2011-52207

Abstract

View Articletitled, Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

PDF

Topics: Energy consumption , Experimental characterization , Server racks , Temperature , Doors , Heat exchangers , Data centers , Stress , Algorithms , Cooling

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Madhusudan Iyengar, Roger Schmidt

InterPACK 2011; 623-627https://doi.org/10.1115/IPACK2011-52210

Abstract

View Articletitled, Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

PDF

Topics: Data centers , Evaporative cooling , Cooling , Temperature , Climate , Computers , Energy consumption , Air conditioning , Evaporation , Filtration

Humidity Control and Dew Point Management

Levente J. Klein, Hendrik F. Hamann

InterPACK 2011; 629-635https://doi.org/10.1115/IPACK2011-52211

Abstract

View Articletitled, Humidity Control and Dew Point Management

PDF

Topics: Corrosion , Data centers , Energy efficiency , Failure , Hardware , Printed circuit boards , Reliability , Risk , Structures , Temperature distribution

A Numerical Technique for the Approximation of Thermal Zones

Vanessa Lo´pez, Hendrik F. Hamann

InterPACK 2011; 637-644https://doi.org/10.1115/IPACK2011-52213

Abstract

View Articletitled, A Numerical Technique for the Approximation of Thermal Zones

PDF

Topics: Air conditioning , Approximation , Boundary-value problems , Convection , Cooling systems , Data centers , Numerical analysis

Employing Thermal Zones for Energy Optimization in Data Centers

Srinivas Yarlanki, Rajarshi Das, Hendrik Hamann, Vanessa Lopez, Andrew Stepanchuk

InterPACK 2011; 645-652https://doi.org/10.1115/IPACK2011-52234

Abstract

View Articletitled, Employing Thermal Zones for Energy Optimization in Data Centers

PDF

Topics: Data centers , Optimization , Cooling , Heat , Energy consumption , Air conditioning , Computers , Energy dissipation , Flow (Dynamics) , Supply and demand

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh

InterPACK 2011; 653-661https://doi.org/10.1115/IPACK2011-52265

Abstract

View Articletitled, Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

PDF

Topics: Computers , Data centers , Energy conservation , Heat pipes , Energy storage , Design , Storage , Water storage , Climate change , Control systems

Materials and Processes

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo

InterPACK 2011; 663-666https://doi.org/10.1115/IPACK2011-52024

Abstract

View Articletitled, Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

PDF

Topics: Electrodes , Lead-free solders , Plating , Shear strength , Shear (Mechanics) , Tin , Reliability , Solders

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase

InterPACK 2011; 667-672https://doi.org/10.1115/IPACK2011-52025

Abstract

View Articletitled, Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

PDF

Topics: Aerospace industry , Solders , Tensile strength , Tin , Elongation , Brittleness , Electrodes , Mechanical properties

Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder

Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara

InterPACK 2011; 673-676https://doi.org/10.1115/IPACK2011-52026

Abstract

View Articletitled, Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder

PDF

Topics: Erosion , Lead-free solders , Nitriding , Plasmas (Ionized gases) , Stainless steel , Tin , Diffusion (Physics) , Solders , Steel

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

InterPACK 2011; 677-684https://doi.org/10.1115/IPACK2011-52048

Abstract

View Articletitled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

PDF

Topics: Copper , Electrical properties , Grain boundaries , Thin films , Fracture (Materials) , Annealing , Reliability , Brittle fracture , Electron backscatter diffraction , Stress

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

InterPACK 2011; 685-690https://doi.org/10.1115/IPACK2011-52058

Abstract

View Articletitled, Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

PDF

Topics: Copper , Electrodiffusion , Stress , Thin films , Atoms , Sulfur , Current density , Electroplating , Fracture (Materials) , Fracture (Process)

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

Takahiro Akutsu, Qiang Yu

InterPACK 2011; 691-700https://doi.org/10.1115/IPACK2011-52070

Abstract

View Articletitled, Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

PDF

Topics: Fatigue , Lead-free solders , Fatigue cracks , Crystals , Finite element methods , Finite element model , Solder joints , Fatigue life , Grain size , Solders

Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper

Shinji Koyama, Yukinari Aoki, Ikuo Shohji

InterPACK 2011; 701-705https://doi.org/10.1115/IPACK2011-52072

Abstract

View Articletitled, Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper

PDF

Topics: Bond strength , Copper , Bonding , Temperature , Base metals , Pressure , Vacuum

Fatigue Life and Fracture Behavior of Micro Size Sn-Ag-Cu Solder Joint

Tashiro Naoki, Yoshiharu Kariya, Yoshihiko Kanda

InterPACK 2011; 707-712https://doi.org/10.1115/IPACK2011-52104

Abstract

View Articletitled, Fatigue Life and Fracture Behavior of Micro Size Sn-Ag-Cu Solder Joint

PDF

Topics: Fatigue life , Fracture (Materials) , Solder joints , Tin , Failure , Grain boundaries , Failure mechanisms , Low cycle fatigue , Solders , Temperature

Effect of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for Sn Based Alloy

Yoshihiko Kanda, Yuji Oto, Yusuke Shiigi, Yoshiharu Kariya

InterPACK 2011; 713-718https://doi.org/10.1115/IPACK2011-52107

Abstract

View Articletitled, Effect of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for Sn Based Alloy

PDF

Topics: Alloys , Ductility , Fatigue , Tin , Work hardening , Solid solutions , Temperature , Creep , Damage , Fracture (Materials)

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Shinichi Fujiwara, Nobuhiko Chiwata, Masaru Fujiyoshi, Motoki Wakano, Hisashi Tanie

InterPACK 2011; 719-723https://doi.org/10.1115/IPACK2011-52110

Abstract

View Articletitled, Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

PDF

Topics: Copper , Cycles , Electrodiffusion , Solders , Intermetallic compounds , Solder joints , Current density , Joining , Reliability , Accelerated life testing

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Shinichi Fujiwara

InterPACK 2011; 725-732https://doi.org/10.1115/IPACK2011-52115

Abstract

View Articletitled, Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

PDF

Topics: Ball-Grid-Array packaging , Flip-chip , Solders , Solder joints , Impact strength , Fatigue life , Finite element analysis , Reliability , Crack propagation , Deformation

The Effects of Dopants on the Aging Behavior of Lead Free Solders

Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack

InterPACK 2011; 733-748https://doi.org/10.1115/IPACK2011-52184

Abstract

View Articletitled, The Effects of Dopants on the Aging Behavior of Lead Free Solders

PDF

Topics: Creep , Lead-free solders

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2011; 749-761https://doi.org/10.1115/IPACK2011-52209

Abstract

View Articletitled, Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

PDF

Topics: Creep , Experimental characterization , Modeling , Temperature , Stress , Testing , Tension , Constitutive equations , Engineering simulation , Finite element analysis

High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates

Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar, R. Mahajan

InterPACK 2011; 763-771https://doi.org/10.1115/IPACK2011-52220

Abstract

View Articletitled, High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates

PDF

Topics: Fracture (Materials) , Fracture (Process) , Solder joints , Tin , Fracture toughness , Solders , Yield strength , Failure , Intermetallic compounds , Microcracks

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan

InterPACK 2011; 773-780https://doi.org/10.1115/IPACK2011-52221

Abstract

View Articletitled, Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

PDF

Topics: Composite materials , Solders , Sintering , Yield strength , Melting , Contact resistance , Diffusion (Physics) , Electrical properties , Intermetallic compounds , Shear (Mechanics)

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