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Proceedings Papers

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1

Advanced Packaging

InterPACK 2011; 9-17doi:https://doi.org/10.1115/IPACK2011-52049
InterPACK 2011; 19-25doi:https://doi.org/10.1115/IPACK2011-52063
InterPACK 2011; 27-33doi:https://doi.org/10.1115/IPACK2011-52113
InterPACK 2011; 35-44doi:https://doi.org/10.1115/IPACK2011-52124
InterPACK 2011; 45-51doi:https://doi.org/10.1115/IPACK2011-52154
InterPACK 2011; 53-63doi:https://doi.org/10.1115/IPACK2011-52189
InterPACK 2011; 65-73doi:https://doi.org/10.1115/IPACK2011-52205
InterPACK 2011; 75-82doi:https://doi.org/10.1115/IPACK2011-52264
InterPACK 2011; 83-89doi:https://doi.org/10.1115/IPACK2011-52286
InterPACK 2011; 91-93doi:https://doi.org/10.1115/IPACK2011-52289
InterPACK 2011; 95-103doi:https://doi.org/10.1115/IPACK2011-52294
InterPACK 2011; 105-114doi:https://doi.org/10.1115/IPACK2011-52297

Modeling and Simulation

InterPACK 2011; 115-122doi:https://doi.org/10.1115/IPACK2011-52034
InterPACK 2011; 123-129doi:https://doi.org/10.1115/IPACK2011-52036
InterPACK 2011; 131-142doi:https://doi.org/10.1115/IPACK2011-52041
InterPACK 2011; 143-148doi:https://doi.org/10.1115/IPACK2011-52044
InterPACK 2011; 149-156doi:https://doi.org/10.1115/IPACK2011-52065
InterPACK 2011; 157-163doi:https://doi.org/10.1115/IPACK2011-52068
InterPACK 2011; 165-174doi:https://doi.org/10.1115/IPACK2011-52081
InterPACK 2011; 175-178doi:https://doi.org/10.1115/IPACK2011-52098
InterPACK 2011; 179-184doi:https://doi.org/10.1115/IPACK2011-52100
InterPACK 2011; 185-190doi:https://doi.org/10.1115/IPACK2011-52101
InterPACK 2011; 191-194doi:https://doi.org/10.1115/IPACK2011-52105
InterPACK 2011; 195-199doi:https://doi.org/10.1115/IPACK2011-52109
InterPACK 2011; 201-205doi:https://doi.org/10.1115/IPACK2011-52111
InterPACK 2011; 207-211doi:https://doi.org/10.1115/IPACK2011-52112
InterPACK 2011; 213-224doi:https://doi.org/10.1115/IPACK2011-52133
InterPACK 2011; 225-234doi:https://doi.org/10.1115/IPACK2011-52137
InterPACK 2011; 235-245doi:https://doi.org/10.1115/IPACK2011-52139
InterPACK 2011; 247-255doi:https://doi.org/10.1115/IPACK2011-52144
InterPACK 2011; 257-262doi:https://doi.org/10.1115/IPACK2011-52160
InterPACK 2011; 263-269doi:https://doi.org/10.1115/IPACK2011-52170
InterPACK 2011; 271-279doi:https://doi.org/10.1115/IPACK2011-52181
InterPACK 2011; 281-297doi:https://doi.org/10.1115/IPACK2011-52196
InterPACK 2011; 299-305doi:https://doi.org/10.1115/IPACK2011-52200
InterPACK 2011; 307-316doi:https://doi.org/10.1115/IPACK2011-52233
InterPACK 2011; 317-323doi:https://doi.org/10.1115/IPACK2011-52237
InterPACK 2011; 325-328doi:https://doi.org/10.1115/IPACK2011-52241
InterPACK 2011; 329-343doi:https://doi.org/10.1115/IPACK2011-52243
InterPACK 2011; 345-350doi:https://doi.org/10.1115/IPACK2011-52247
InterPACK 2011; 351-356doi:https://doi.org/10.1115/IPACK2011-52258
InterPACK 2011; 357-359doi:https://doi.org/10.1115/IPACK2011-52283
InterPACK 2011; 361-367doi:https://doi.org/10.1115/IPACK2011-52284

MEMS, NEMS

InterPACK 2011; 369-374doi:https://doi.org/10.1115/IPACK2011-52002
InterPACK 2011; 375-379doi:https://doi.org/10.1115/IPACK2011-52038
InterPACK 2011; 381-386doi:https://doi.org/10.1115/IPACK2011-52062
InterPACK 2011; 387-393doi:https://doi.org/10.1115/IPACK2011-52074
InterPACK 2011; 395-399doi:https://doi.org/10.1115/IPACK2011-52183
InterPACK 2011; 401-407doi:https://doi.org/10.1115/IPACK2011-52201
InterPACK 2011; 409-415doi:https://doi.org/10.1115/IPACK2011-52250
InterPACK 2011; 417-424doi:https://doi.org/10.1115/IPACK2011-52259
InterPACK 2011; 425-428doi:https://doi.org/10.1115/IPACK2011-52270
InterPACK 2011; 429-436doi:https://doi.org/10.1115/IPACK2011-52290
InterPACK 2011; 437-441doi:https://doi.org/10.1115/IPACK2011-52293

Multi Physics Based Reliability

InterPACK 2011; 443-451doi:https://doi.org/10.1115/IPACK2011-52047
InterPACK 2011; 453-456doi:https://doi.org/10.1115/IPACK2011-52052
InterPACK 2011; 457-462doi:https://doi.org/10.1115/IPACK2011-52057
InterPACK 2011; 463-471doi:https://doi.org/10.1115/IPACK2011-52073
InterPACK 2011; 473-478doi:https://doi.org/10.1115/IPACK2011-52096
InterPACK 2011; 479-486doi:https://doi.org/10.1115/IPACK2011-52150
InterPACK 2011; 487-491doi:https://doi.org/10.1115/IPACK2011-52169
InterPACK 2011; 493-506doi:https://doi.org/10.1115/IPACK2011-52185
InterPACK 2011; 507-518doi:https://doi.org/10.1115/IPACK2011-52186
InterPACK 2011; 519-536doi:https://doi.org/10.1115/IPACK2011-52194
InterPACK 2011; 537-547doi:https://doi.org/10.1115/IPACK2011-52195
InterPACK 2011; 549-562doi:https://doi.org/10.1115/IPACK2011-52197
InterPACK 2011; 563-578doi:https://doi.org/10.1115/IPACK2011-52198
InterPACK 2011; 579-583doi:https://doi.org/10.1115/IPACK2011-52219
InterPACK 2011; 585-590doi:https://doi.org/10.1115/IPACK2011-52230
InterPACK 2011; 591-602doi:https://doi.org/10.1115/IPACK2011-52231
InterPACK 2011; 603-608doi:https://doi.org/10.1115/IPACK2011-52232
InterPACK 2011; 609-615doi:https://doi.org/10.1115/IPACK2011-52260
InterPACK 2011; 617-625doi:https://doi.org/10.1115/IPACK2011-52296

Electrical

InterPACK 2011; 627-631doi:https://doi.org/10.1115/IPACK2011-52254
InterPACK 2011; 633-639doi:https://doi.org/10.1115/IPACK2011-52268
InterPACK 2011; 641-646doi:https://doi.org/10.1115/IPACK2011-52274
InterPACK 2011; 647-652doi:https://doi.org/10.1115/IPACK2011-52276
InterPACK 2011; 653-661doi:https://doi.org/10.1115/IPACK2011-52279
InterPACK 2011; 663-669doi:https://doi.org/10.1115/IPACK2011-52280
InterPACK 2011; 671-674doi:https://doi.org/10.1115/IPACK2011-52282
InterPACK 2011; 675-679doi:https://doi.org/10.1115/IPACK2011-52287
InterPACK 2011; 681-684doi:https://doi.org/10.1115/IPACK2011-52291

Emerging Technologies

InterPACK 2011; 685-692doi:https://doi.org/10.1115/IPACK2011-52046
InterPACK 2011; 693-701doi:https://doi.org/10.1115/IPACK2011-52061
InterPACK 2011; 703-708doi:https://doi.org/10.1115/IPACK2011-52064
InterPACK 2011; 709-712doi:https://doi.org/10.1115/IPACK2011-52071
InterPACK 2011; 713-721doi:https://doi.org/10.1115/IPACK2011-52078
InterPACK 2011; 723-731doi:https://doi.org/10.1115/IPACK2011-52143
InterPACK 2011; 733-739doi:https://doi.org/10.1115/IPACK2011-52190
InterPACK 2011; 741-747doi:https://doi.org/10.1115/IPACK2011-52191
InterPACK 2011; 749-755doi:https://doi.org/10.1115/IPACK2011-52214
InterPACK 2011; 757-768doi:https://doi.org/10.1115/IPACK2011-52244
InterPACK 2011; 769-778doi:https://doi.org/10.1115/IPACK2011-52245
InterPACK 2011; 779-782doi:https://doi.org/10.1115/IPACK2011-52295
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