Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: High temperature , Low temperature , Temperature , Tin , Diffusion (Physics) , Melting point , Bonding , Electromechanical devices , Electronic packaging , Electronics

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

InterPACK 2011; 19-25https://doi.org/10.1115/IPACK2011-52063

Abstract

View Articletitled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

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Topics: Flip-chip , Flip-chip devices , Mechanical properties , Stress , Copper , Silicon chips , Gages , Packaging , Sensors , Strain gages

The Effects of Variations in Manufacturing on PCB Thermal Properties

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

InterPACK 2011; 27-33https://doi.org/10.1115/IPACK2011-52113

Abstract

View Articletitled, The Effects of Variations in Manufacturing on PCB Thermal Properties

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Topics: Manufacturing , Thermal properties , Thermal resistance , Epoxy adhesives , Epoxy resins , ASTM International , Design , Printed circuit boards , Steady state

Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors

Benjamin Lemke, Oliver Paul, Shankar Ganapathysubramanian, Patrick Nardi, Rajashree Baskaran

InterPACK 2011; 35-44https://doi.org/10.1115/IPACK2011-52124

Abstract

View Articletitled, Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors

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Topics: Complementary metal oxide semiconductors , Flip-chip , Resolution (Optics) , Sensors , Stress , Compression , Shear (Mechanics) , Computer simulation , Shear stress , Adhesion

A Study on Reliability of High-Temperature Joint in Packaging Structure

Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu

InterPACK 2011; 45-51https://doi.org/10.1115/IPACK2011-52154

Abstract

View Articletitled, A Study on Reliability of High-Temperature Joint in Packaging Structure

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Topics: High temperature , Packaging , Reliability , Nickel plating , Aluminum , Plating , Stress , Temperature , Cooling systems , Cycles

The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)

John H. Lau

InterPACK 2011; 53-63https://doi.org/10.1115/IPACK2011-52189

Abstract

View Articletitled, The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)

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Topics: System-in-package , Polishing equipment , Reliability , Thermal management

Effects of TSV Interposer on the Reliability of 3D IC Integration SiP

John H. Lau, Xiaowu Zhang

InterPACK 2011; 65-73https://doi.org/10.1115/IPACK2011-52205

Abstract

View Articletitled, Effects of TSV Interposer on the Reliability of 3D IC Integration SiP

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Topics: Reliability , Corners (Structural elements) , Creep , Cycles , Density , Failure analysis , Silicon , Solder joints , Stress , System-in-package

Design for Reliability of Stacked Die Package Using TSV Technology

Shiwani Thakur, Satej Nakanekar, Abhijit Kaisare, Sandeep Tonapi

InterPACK 2011; 75-82https://doi.org/10.1115/IPACK2011-52264

Abstract

View Articletitled, Design for Reliability of Stacked Die Package Using TSV Technology

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Topics: Design , Reliability

A Note on the Reliability of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau

InterPACK 2011; 83-89https://doi.org/10.1115/IPACK2011-52286

Abstract

View Articletitled, A Note on the Reliability of Cu/Au Wire Interconnects

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Topics: Reliability , Wire , Copper , Deformation , Displacement , Failure , Microelectronic devices , Structural mechanics

A Practical Approach for Low-Cost Hermetic Lid Sealing

Jeremy Palmer, Dahwey Chu

InterPACK 2011; 91-93https://doi.org/10.1115/IPACK2011-52289

Abstract

View Articletitled, A Practical Approach for Low-Cost Hermetic Lid Sealing

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Topics: Sealing (Process) , Temperature , Cycles , Furnaces , Belts , Ceramics , Gallium arsenide , Lead-free solders , Leakage , Nitrogen

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume

InterPACK 2011; 95-103https://doi.org/10.1115/IPACK2011-52294

Abstract

View Articletitled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

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Topics: Ball-Grid-Array packages , Lasers , Lead-free solders , Ultrasound , Wetting , Solders , Inspection , Transients (Dynamics) , Ball-Grid-Array packaging , Displacement

Scalable Microsprings for Integrated Test and Packaging

Eugene M. Chow

InterPACK 2011; 105-114https://doi.org/10.1115/IPACK2011-52297

Abstract

View Articletitled, Scalable Microsprings for Integrated Test and Packaging

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Topics: Density , Multi-chip modules , Packaging , Springs

Modeling and Simulation

Energy Conversion Efficiency of Synthetic Jets

Ri Li, Rajdeep Sharma, Mehmet Arik

InterPACK 2011; 115-122https://doi.org/10.1115/IPACK2011-52034

Abstract

View Articletitled, Energy Conversion Efficiency of Synthetic Jets

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Topics: Energy conversion , Jets , Electricity (Physics) , Energy efficiency , Signals , Actuators , Air flow , Design , Piezoelectric actuators , Cooling

Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components

Lorraine M. Renta, Ricky Valentin, Pedro Quintero, David Ma, Alan Hovland

InterPACK 2011; 123-129https://doi.org/10.1115/IPACK2011-52036

Abstract

View Articletitled, Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components

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Topics: Solder joints , Thermomechanics , Tin , Ball-Grid-Array packaging , Lead-free solders , Solders , Cycles , Alloys , Copper , Density

Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders

Ram Ranjan, Abhijeet Patel, Suresh V. Garimella, Jayathi Y. Murthy

InterPACK 2011; 131-142https://doi.org/10.1115/IPACK2011-52041

Abstract

View Articletitled, Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders

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Topics: Columns (Structural) , Cooling , Evaporation , Flat heat pipes , Heat pipes , Particulate matter , Permeability , Porosity , Pressure , Reverse engineering

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

Kanji Takagi, Masaki Wakabayashi, Junichi Inoue, Qiang Yu, Takahiro Akutsu

InterPACK 2011; 143-148https://doi.org/10.1115/IPACK2011-52044

Abstract

View Articletitled, Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

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Topics: Lead-free solders , Metals , Reliability , Rupture , Solder joints , Crack propagation , Heating , Temperature , Thermal conductivity , Design methodology

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

Hideo Koguchi, Kazuhisa Hoshi

InterPACK 2011; 149-156https://doi.org/10.1115/IPACK2011-52065

Abstract

View Articletitled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

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Topics: Joining , Resins , Silicon , Bonding , Boundary element methods , Eigenvalues , Stress concentration , Stress singularity , Delamination , Density

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi

InterPACK 2011; 157-163https://doi.org/10.1115/IPACK2011-52068

Abstract

View Articletitled, Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

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Topics: Fatigue life , Solder joints , Wire , Bonding , Fatigue , Finite element methods , Fracture (Materials) , Temperature distribution , Crack propagation , Damage

Multiphysics Approach to Modeling Supercapacitors for Improving Performance

Xinqiang Xu, Bahgat G. Sammakia, DaeYoung Jung, Thor Eilertsen

InterPACK 2011; 165-174https://doi.org/10.1115/IPACK2011-52081

Abstract

View Articletitled, Multiphysics Approach to Modeling Supercapacitors for Improving Performance

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Topics: Modeling , Ultracapacitors , Heat , Electrolytes , Temperature , Temperature distribution , Thermal management , Activated carbon , Boundary-value problems , Computer software

Band Gap Properties of Piezoelectric/Viscous Liquid Phononic Crystals

Yi-Ze Wang, Kazuaki Inaba, Feng-Ming Li, Kikuo Kishimoto

InterPACK 2011; 175-178https://doi.org/10.1115/IPACK2011-52098

Abstract

View Articletitled, Band Gap Properties of Piezoelectric/Viscous Liquid Phononic Crystals

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Topics: Energy gap , Phononic crystals , Damping , Eigenvalues

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Chang Yong Ha, Soo Il Lee

InterPACK 2011; 179-184https://doi.org/10.1115/IPACK2011-52100

Abstract

View Articletitled, Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

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Topics: Bonding , Integrated circuits , Optimization , Packaging , Topology , Design , Modal assurance criterion , Vibration , Errors , Finite element model

A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

Hiroyuki Sato, Qiang Yu, Ryusuke Sone

InterPACK 2011; 185-190https://doi.org/10.1115/IPACK2011-52101

Abstract

View Articletitled, A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

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Topics: Hardening (Curing) , Mechanical properties , Resins , Thermal deformation , Aluminum , Warping , Deformation , Elastic moduli , Reliability , Semiconductors (Materials)

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

Yuji Nishimura, Qiang Yu

InterPACK 2011; 191-194https://doi.org/10.1115/IPACK2011-52105

Abstract

View Articletitled, Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

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Topics: Fatigue life , Reliability , Shapes , Solder joints , Fibers , Electronics , Fatigue , Fatigue cracks , Fatigue properties , Fatigue testing

The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices

Shiqiang Zhao, Qiang Yu, Hiroki Akaeda

InterPACK 2011; 195-199https://doi.org/10.1115/IPACK2011-52109

Abstract

View Articletitled, The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices

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Topics: Fatigue life , Solder joints , Surface roughness , Cycles , Aluminum , Reliability , Thermal stresses

Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions

Shilin Liu, Qiang Yu, Michael Pecht

InterPACK 2011; 201-205https://doi.org/10.1115/IPACK2011-52111

Abstract

View Articletitled, Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions

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Topics: Reliability , Stress , Accounting , Electronic components , Fatigue life , Semiconductors (Materials)

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano

InterPACK 2011; 207-211https://doi.org/10.1115/IPACK2011-52112

Abstract

View Articletitled, Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

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Topics: Fatigue life , Lead-free solders , Electronic components , Electronic packages , Electronic products , Fatigue , Fatigue damage , Fatigue failure , Finite element analysis , Reliability

Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar

InterPACK 2011; 213-224https://doi.org/10.1115/IPACK2011-52133

Abstract

View Articletitled, Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method

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Topics: Principal component analysis , Transients (Dynamics) , Heating , Integrated circuits , Joules , Microelectronic devices , Circuits , Failure , Fatigue failure , Finite element analysis

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer

InterPACK 2011; 225-234https://doi.org/10.1115/IPACK2011-52137

Abstract

View Articletitled, Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

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Topics: Cooling , Microchannels , Heat sinks , Thermal management , Thermal resistance , Architecture , Cooling systems , Energy dissipation , Silicon

Single-Phase Liquid Cooling of a Quad-Core Processor

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer

InterPACK 2011; 235-245https://doi.org/10.1115/IPACK2011-52139

Abstract

View Articletitled, Single-Phase Liquid Cooling of a Quad-Core Processor

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Topics: Cooling , Flow (Dynamics) , Microchannels , Energy dissipation , Heat , Temperature , Cooling systems , Design , Engineering standards , Failure

Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

Elham Maghsoudi, Michael James Martin

InterPACK 2011; 247-255https://doi.org/10.1115/IPACK2011-52144

Abstract

View Articletitled, Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

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Topics: Bridges (Structures) , Convection , Heat conduction , Nanoscale phenomena , Simulation , Displacement , Pressure , Silicon , Cooling , Diamonds

Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot

Naveen Kannan, Niket Shah, Dereje Agonafer, Alan Bowling

InterPACK 2011; 257-262https://doi.org/10.1115/IPACK2011-52160

Abstract

View Articletitled, Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot

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Topics: Control equipment , Design , Engines , Motors , Optimization , Robots , Thermal analysis , Heat , Computer programming , Computers

Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts

Simranjit Khalsa, Ganesh Subbarayan

InterPACK 2011; 263-269https://doi.org/10.1115/IPACK2011-52170

Abstract

View Articletitled, Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts

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Topics: Flow (Dynamics) , Plates (structures) , Fluids , Particulate matter , Finite element analysis , Flat heat pipes , Pressure , Viscosity , Yield strength

Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

Sulaman Pashah, Abul Fazal M. Arif

InterPACK 2011; 271-279https://doi.org/10.1115/IPACK2011-52181

Abstract

View Articletitled, Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

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Topics: Composite materials , Electronic packaging , Fatigue life , Heat sinks , Thermal stresses , Thermomechanics

SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

Pradeep Lall, Mandar Kulkarni, Sandeep Shantaram, Jeff Suhling

InterPACK 2011; 281-297https://doi.org/10.1115/IPACK2011-52196

Abstract

View Articletitled, SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

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Topics: Alloys , Springs , Copper , Solders , Fracture (Materials) , Shock (Mechanics) , Failure , Fracture toughness , Stress , Ball-Grid-Array packages

Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

Pei-Chi Chen, Shin-Yueh Yang, Kuo-Ning Chiang

InterPACK 2011; 299-305https://doi.org/10.1115/IPACK2011-52200

Abstract

View Articletitled, Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

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Topics: Silicon , Fracture (Materials) , Finite element methods , Semiconductor wafers , Computer software , Diluents , Electronic packaging , Failure , Failure mechanisms , Packaging density (Electronics)

Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

Jae B. Kwak, Da Yu, Tung T. Nguyen, Seungbae Park

InterPACK 2011; 307-316https://doi.org/10.1115/IPACK2011-52233

Abstract

View Articletitled, Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

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Topics: Flip-chip packages , Reliability , Solder joints , Solders , Finite element analysis , Corners (Structural elements) , Stress , Thermomechanics , Chemical etching , Damage

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia

InterPACK 2011; 317-323https://doi.org/10.1115/IPACK2011-52237

Abstract

View Articletitled, Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

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Topics: Dielectric materials , Fracture (Materials) , Modeling , Failure , Fracture (Process) , Fracture toughness , Boundary-value problems , Computer-aided design , Crack propagation , Displacement

Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

InterPACK 2011; 325-328https://doi.org/10.1115/IPACK2011-52241

Abstract

View Articletitled, Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP

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Topics: Silicon , Silicon chips , Thermal stresses , Stress , Copper , Crystals , Damage , Reliability , Yield stress , Cycles

Spectral Detail of Phonon Conduction and Scattering in Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher

InterPACK 2011; 329-343https://doi.org/10.1115/IPACK2011-52243

Abstract

View Articletitled, Spectral Detail of Phonon Conduction and Scattering in Graphene

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Topics: Electromagnetic scattering , Graphene , Heat conduction , Phonons , Radiation scattering , Scattering (Physics) , Thermal conductivity , Probability , Algorithms , Approximation

Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices

Shinji Hiramitsu, Hiroshi Shintani, Takahiro Satake, Hisashi Tanie

InterPACK 2011; 345-350https://doi.org/10.1115/IPACK2011-52247

Abstract

View Articletitled, Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices

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Topics: Fatigue cracks , Heat , Solders , Crack propagation , Fatigue testing , Fracture (Materials) , Boundary-value problems , Heat transfer , Reliability , Thermal stresses

Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

Hung-Yun Lin, Abhishek Tambat, Ian Claydon, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia

InterPACK 2011; 351-356https://doi.org/10.1115/IPACK2011-52258

Abstract

View Articletitled, Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

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Topics: Deformation , Fracture (Process) , Risk , Temperature , Computer software , Cooling , Finite element analysis , Flip-chip , Flip-chip devices , Flip-chip packages

A Quantum Mechanical Study of the Thermal Conduction Across a ZrB₂-SiC Interface as a Function of Temperature and Strain

Vikas Samvedi, Vikas Tomar

InterPACK 2011; 357-359https://doi.org/10.1115/IPACK2011-52283

Abstract

View Articletitled, A Quantum Mechanical Study of the Thermal Conduction Across a ZrB<sub>2</sub>-SiC Interface as a Function of Temperature and Strain

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Topics: Heat conduction , Temperature , Nanocomposites , Density functional theory , Thermal properties , Waves

Role of Interface Thermal Boundary Resistance, Straining, and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites

Vikas Samvedi, Vikas Tomar

InterPACK 2011; 361-367https://doi.org/10.1115/IPACK2011-52284

Abstract

View Articletitled, Role of Interface Thermal Boundary Resistance, Straining, and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites

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Topics: Biomimetics , Interfacial thermal resistance , Nanocomposites , Superlattices , Thermal conductivity , Nanoscale phenomena , Nanostructures , Temperature , Engineering simulation , Equilibrium (Physics)

MEMS, NEMS

Design, Reliability and Manufacturing Readiness for MEMS Microphone

Ganesh Iyer, Wei Li, Lavanya Gopalakrishnan

InterPACK 2011; 369-374https://doi.org/10.1115/IPACK2011-52002

Abstract

View Articletitled, Design, Reliability and Manufacturing Readiness for MEMS Microphone

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Topics: Design , Manufacturing , Microelectromechanical systems , Microphones , Reliability , Signals , Acoustics , Condensers (steam plant)

Multi-Physics of Nanoscale Thin Films and Interfaces

M. A. Haque

InterPACK 2011; 375-379https://doi.org/10.1115/IPACK2011-52038

Abstract

View Articletitled, Multi-Physics of Nanoscale Thin Films and Interfaces

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Topics: Nanoscale phenomena , Physics , Thin films , Electrical conductivity , Thermal conductivity , Deformation , Design , Dimensions , Electron microscopes , Electrons

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura

InterPACK 2011; 381-386https://doi.org/10.1115/IPACK2011-52062

Abstract

View Articletitled, Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

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Topics: Carbon , Nanotubes , Resins , Sensors , Multi-walled carbon nanotubes , Carbon nanotubes , Electrical conductivity , Electrical resistance , Rubber , Single-walled carbon nanotubes

Design and Implementation of a Multiple-Beam Tuning-Fork Gyroscope

Ren Wang, Peng Cheng, Fei Xie, Zhili Hao, Darrin Young

InterPACK 2011; 387-393https://doi.org/10.1115/IPACK2011-52074

Abstract

View Articletitled, Design and Implementation of a Multiple-Beam Tuning-Fork Gyroscope

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Topics: Design , Computer simulation , Manufacturing , Q-factor , Resolution (Optics) , Semiconductor wafers , Silicon-on-insulator , Thermoelastic damping , Vacuum , Vibration

Combined Temperature and Humidity Effects on MEMS Vibratory Gyroscope Sensor

Chandradip Patel, Patrick McCluskey

InterPACK 2011; 395-399https://doi.org/10.1115/IPACK2011-52183

Abstract

View Articletitled, Combined Temperature and Humidity Effects on MEMS Vibratory Gyroscope Sensor

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Topics: Microelectromechanical systems , Sensors , Temperature

Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology

Han-Jung Wang, Hung-An Deng, Shih-Ying Chiang, Kuo-Ning Chiang

InterPACK 2011; 401-407https://doi.org/10.1115/IPACK2011-52201

Abstract

View Articletitled, Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology

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Topics: Microelectromechanical systems , Microphones , Modeling , Stress , Thin films , Finite element analysis , Aluminum , Deformation , Polysilicon , Residual stresses

Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films

Vu Le Huy, Joao Gaspar, Oliver Paul, Shoji Kamiya

InterPACK 2011; 409-415https://doi.org/10.1115/IPACK2011-52250

Abstract

View Articletitled, Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films

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Topics: Fatigue , Polysilicon , Thin films , Fracture (Materials) , Fracture (Process) , Shapes , Fatigue testing , Stress , Stress concentration , Weibull distribution

Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor

Hiroki Yanamori, Takuma Kobayashi, Masaki Omiya

InterPACK 2011; 417-424https://doi.org/10.1115/IPACK2011-52259

Abstract

View Articletitled, Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor

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Topics: Actuators , Metallic composites , Microelectromechanical systems , Polymers , Sensors , Electrodes , Electric fields , Membranes , Temperature , Composite materials

Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura

InterPACK 2011; 425-428https://doi.org/10.1115/IPACK2011-52270

Abstract

View Articletitled, Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

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Topics: Electromagnetic scattering , Focused ion beams , Fracture toughness , Microscale devices , Resolution (Optics) , Uncertainty , Vapors

Micro Accelerometer and Magnetoresistive (MR) Sensor Directly Fabricated on a Ceramic Substrate

Seiji Aoyagi, Masato Suzuki, Tomokazu Takahashi, Tsutomu Tajikawa, Ken-ichi Saitoh, Shoso Shingubara, Yasuhiko Arai, Hiroyuki Tajiri, Yasuhiro Yoshikawa

InterPACK 2011; 429-436https://doi.org/10.1115/IPACK2011-52290

Abstract

View Articletitled, Micro Accelerometer and Magnetoresistive (MR) Sensor Directly Fabricated on a Ceramic Substrate

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Topics: Accelerometers , Ceramics , Sensors

Characterization of a Macrofiber Piezoelectric Composite

David A. Miller

InterPACK 2011; 437-441https://doi.org/10.1115/IPACK2011-52293

Abstract

View Articletitled, Characterization of a Macrofiber Piezoelectric Composite

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Topics: Composite materials , Epoxy adhesives , Epoxy resins , Displacement measurement , Electrical measurement , Excitation , Fibers , Laminates , Resonance , Service life (Equipment)

Multi Physics Based Reliability

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

InterPACK 2011; 443-451https://doi.org/10.1115/IPACK2011-52047

Abstract

View Articletitled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

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Topics: Fatigue cracks , Nondestructive evaluation , Solder joints , Synchrotron radiation , X-rays , Crack propagation , Fatigue , Fracture (Materials) , Microcracks , Computerized tomography

Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer

Minhua Lu, Paul Lauro, Charles Goldsmith

InterPACK 2011; 453-456https://doi.org/10.1115/IPACK2011-52052

Abstract

View Articletitled, Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer

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Topics: Electrodiffusion , Iron , Lead-free solders , Nickel , Reliability , Intermetallic compounds , Metallurgy , Solders , Alloys , Stability

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura

InterPACK 2011; 457-462https://doi.org/10.1115/IPACK2011-52057

Abstract

View Articletitled, Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

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Topics: Carbon nanotubes , Electrical conductivity , Graphene , Thermal conductivity , Buckling , Cylinders , Deformation , Shapes , Density functional theory , Electrical resistivity

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H-Integral Method

Toru Ikeda, Hiroshi Hirai, Mitsutoshi Abe, Masatsugu Chiba, Noriyuki Miyazaki

InterPACK 2011; 463-471https://doi.org/10.1115/IPACK2011-52073

Abstract

View Articletitled, Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the <em>H</em>-Integral Method

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Topics: Corners (Structural elements) , Stress , Anisotropy , Piezoelectric materials , Eigenvalues , Electronic packages , Finite element methods , Microelectromechanical systems , Eigenfunctions , Failure

Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition

Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, Hideo Senoo

InterPACK 2011; 473-478https://doi.org/10.1115/IPACK2011-52096

Abstract

View Articletitled, Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition

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Topics: Adhesives , Reliability , Stress , Bonding , Evaluation methods , Shear (Mechanics) , Corners (Structural elements) , Finite element methods , Finite element model , Integrated circuit fabrication

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

InterPACK 2011; 479-486https://doi.org/10.1115/IPACK2011-52150

Abstract

View Articletitled, Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

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Topics: Metal oxide semiconductors , Stress , Transistors , Simulation , Electron mobility , Computer simulation , Diffusion (Physics) , Electrons , Flow (Dynamics) , Gates (Closures)

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo

InterPACK 2011; 487-491https://doi.org/10.1115/IPACK2011-52169

Abstract

View Articletitled, Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

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Topics: Carbon nanotubes , Current density , Damage , Oxygen , Multi-walled carbon nanotubes , Oxidation , Carbon , Density , Electrodiffusion , Electrons

Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

InterPACK 2011; 493-506https://doi.org/10.1115/IPACK2011-52185

Abstract

View Articletitled, Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping

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Topics: Heat sinks , Manufacturing , Packaging , Sensors , Stress

Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders

Muhannad Mustafa, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2011; 507-518https://doi.org/10.1115/IPACK2011-52186

Abstract

View Articletitled, Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders

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Topics: Lead-free solders , Stress-strain curves

Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Mandar Kulkarni, Geeta Limaye, Jeff Suhling

InterPACK 2011; 519-536https://doi.org/10.1115/IPACK2011-52194

Abstract

View Articletitled, Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates

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Topics: Alloys , Shock (Mechanics) , Failure , Solders , Constitutive equations , Copper , Fracture (Process) , Lead-free solders , Damage , Electronic products

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

Pradeep Lall, Dinesh Arunachalam, Jeff Suhling

InterPACK 2011; 537-547https://doi.org/10.1115/IPACK2011-52195

Abstract

View Articletitled, Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

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Topics: Alloys , Architecture , Ball-Grid-Array packages , Copper , Cycles , Design , Electronics , Failure data , Lead-free solders , Model development

PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

Pradeep Lall, Ryan Lowe, Kai Goebel

InterPACK 2011; 549-562https://doi.org/10.1115/IPACK2011-52197

Abstract

View Articletitled, PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

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Topics: Filters , Particulate matter , Shock (Mechanics) , Spectroscopy , Vibration , Damage , Failure , Service life (Equipment) , Algorithms , Electronics

KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock

Pradeep Lall, Prashant Gupta, Kai Goebel

InterPACK 2011; 563-578https://doi.org/10.1115/IPACK2011-52198

Abstract

View Articletitled, KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock

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Topics: Artificial neural networks , Electronics , Failure mechanisms , Shock (Mechanics) , Failure , Parity (Physics) , Damage , Vibration , Algorithms , Copper

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo

InterPACK 2011; 579-583https://doi.org/10.1115/IPACK2011-52219

Abstract

View Articletitled, Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

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Topics: Chain , Fatigue cracks , Lead-free solders , Temperature , Solder joints , Electrical resistance , Failure , Fatigue , Fatigue failure , Fracture (Materials)

Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso

InterPACK 2011; 585-590https://doi.org/10.1115/IPACK2011-52230

Abstract

View Articletitled, Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

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Topics: Computer simulation , Electrodiffusion , Lead-free solders , Stress , Finite element analysis , Flip-chip , Solder joints , Accounting , Diffusion (Physics) , Electric potential

Reliability Studies for Package-on-Package Components in Drop and Shock Environments

Pradeep Lall, Arjun Angral, Jeff Suhling

InterPACK 2011; 591-602https://doi.org/10.1115/IPACK2011-52231

Abstract

View Articletitled, Reliability Studies for Package-on-Package Components in Drop and Shock Environments

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Topics: Package on package , Reliability , Shock (Mechanics) , Architecture , Electronics , Failure , Engineering simulation , Simulation , Warping , Design

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

Da Yu, Tung Nguyen, Ho H. Lee, Namseo Goo, S. B. Park

InterPACK 2011; 603-608https://doi.org/10.1115/IPACK2011-52232

Abstract

View Articletitled, Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

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Topics: Reliability , Heat , Heat sinks , Power density , Solder joints , Circuits , Computer simulation , Cycles , Energy dissipation , Experimental methods

Lead Free Flip Chip Reliability for Various Package Types

Nokibul Islam, Miguel Jimarez, Ahmer Syed, TaeKyeong Hwang, JaeYun Gim, WonJoon Kang

InterPACK 2011; 609-615https://doi.org/10.1115/IPACK2011-52260

Abstract

View Articletitled, Lead Free Flip Chip Reliability for Various Package Types

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Topics: Ball-Grid-Array packaging , Flip-chip , Flip-chip devices , Reliability , Warping

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

Siddharth Bhopte, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, Nataraj Hariharan

InterPACK 2011; 617-625https://doi.org/10.1115/IPACK2011-52296

Abstract

View Articletitled, Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

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Topics: Microelectromechanical systems , Solder joints , Solders , Actuators , Metals , Pressure sensors , Refrigeration , Reliability , Flow (Dynamics) , Flow control

Electrical

Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement

Michael J. Hill, Kemal Aygun, Kaladhar Radhakrishnan

InterPACK 2011; 627-631https://doi.org/10.1115/IPACK2011-52254

Abstract

View Articletitled, Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement

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Topics: Capacitors , Thin films , Engineering prototypes

Use Condition Characterization of Package Components

Leigh Wojewoda, Dhanya Athreya, Michael J. Hill

InterPACK 2011; 633-639https://doi.org/10.1115/IPACK2011-52268

Abstract

View Articletitled, Use Condition Characterization of Package Components

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Topics: Capacitors , Design , Electronic packages , Inductors , Metallic composites , Printed circuit boards

Signal and Power Integrity Co-Simulation on DDR Memory

Md. Ruhul Quddus, Sanjiv Soman

InterPACK 2011; 641-646https://doi.org/10.1115/IPACK2011-52274

Abstract

View Articletitled, Signal and Power Integrity Co-Simulation on DDR Memory

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Topics: Signals , Simulation , Noise (Sound)

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Qing He, Duo Chen, Dan Jiao

InterPACK 2011; 647-652https://doi.org/10.1115/IPACK2011-52276

Abstract

View Articletitled, A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

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Topics: Circuits , Design , Simulation , Capacitors , Complementary metal oxide semiconductors , Computation , Electromagnetic force , Electromagnetism , Inductors , Resistors

An Accurate and Efficient Link Analysis Methodology for High Speed I/O Design

Mohiuddin Mazumder, James Jaussi, Sitaraman Iyer, Fulvio Spagna, Zuoguo Wu, Beomtaek Lee, Arvind Kumar

InterPACK 2011; 653-661https://doi.org/10.1115/IPACK2011-52279

Abstract

View Articletitled, An Accurate and Efficient Link Analysis Methodology for High Speed I/O Design

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Topics: Design , Circuits , Engineering simulation , Optimization , Simulation , Modeling

Cloud-Based Scalable Parallel Electromagnetic Tools for Full-System Simulation

Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Xiren Wang

InterPACK 2011; 663-669https://doi.org/10.1115/IPACK2011-52280

Abstract

View Articletitled, Cloud-Based Scalable Parallel Electromagnetic Tools for Full-System Simulation

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Topics: Simulation , Algorithms , Boundary element methods , Computer software , Electromagnetic fields , Electronics , Encryption , Fault tolerance , Security

Signal Integrity Analysis for RF System-in-Package

Jeff Chen, Weiping Li, Feng Ling

InterPACK 2011; 671-674https://doi.org/10.1115/IPACK2011-52282

Abstract

View Articletitled, Signal Integrity Analysis for RF System-in-Package

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Topics: Signals , System-in-package , Design methodology , Architects , Design , Electromagnetic compatibility , Engineering simulation , Noise (Sound) , Packaging , Simulation

Power/Ground Pin-Map Design for Power Integrity

Jingook Kim, James Drewniak, Jun Fan

InterPACK 2011; 675-679https://doi.org/10.1115/IPACK2011-52287

Abstract

View Articletitled, Power/Ground Pin-Map Design for Power Integrity

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Topics: Design , Circuits , Cavities , Performance , Resonance

Estimation of Power Integrity Impact to Low Power Processor Performance Through Pre-Silicon Simulation and Post-Silicon Measurements

Christopher Pan, Amirali Shayan, Mikhail Popovich, Kevin Bowles

InterPACK 2011; 681-684https://doi.org/10.1115/IPACK2011-52291

Abstract

View Articletitled, Estimation of Power Integrity Impact to Low Power Processor Performance Through Pre-Silicon Simulation and Post-Silicon Measurements

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Topics: Silicon , Simulation , Nanoscale phenomena

Emerging Technologies

Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

Susmita Dash, Niru Kumari, Mercy Dicuangco, Suresh V. Garimella

InterPACK 2011; 685-692https://doi.org/10.1115/IPACK2011-52046

Abstract

View Articletitled, Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

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Topics: Manufacturing , Surface roughness , Drops , Microscale devices , Dynamics (Mechanics) , Etching , Robustness , Wetting

Dynamics of Droplet Motion Under Electrowetting Actuation

S. Ravi Annapragada, Susmita Dash, Suresh V. Garimella, Jayathi Y. Murthy

InterPACK 2011; 693-701https://doi.org/10.1115/IPACK2011-52061

Abstract

View Articletitled, Dynamics of Droplet Motion Under Electrowetting Actuation

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Topics: Drops , Dynamics (Mechanics) , Shapes , Transients (Dynamics) , Fluids , Physics , Steady state , Surface tension , Water

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura

InterPACK 2011; 703-708https://doi.org/10.1115/IPACK2011-52064

Abstract

View Articletitled, Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

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Topics: Carbon , Electrical conductivity , Nanotubes , Resins , Carbon nanotubes , Microwaves , Reflectance , Impedance (Electricity) , Stress , Electrical properties

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka

InterPACK 2011; 709-712https://doi.org/10.1115/IPACK2011-52071

Abstract

View Articletitled, Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

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Topics: Heat , Joules , Metals , Thermoelectricity , Welding , Wire , Temperature , Circuits , Electrodes

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

Pushkraj Tumne, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, Krishnaswami Srihari

InterPACK 2011; 713-721https://doi.org/10.1115/IPACK2011-52078

Abstract

View Articletitled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

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Topics: Design , Semiconductor wafers , Solders , Reliability , Electronics , Failure , Flip-chip , Intermetallic compounds , Brittle fracture , Failure mechanisms

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

Vikram Venkatadri, Mark Downey, Xiaojie Xue, Dipak Sengupta, Daryl Santos, Ross Havens, Krishnaswami Srihari

InterPACK 2011; 723-731https://doi.org/10.1115/IPACK2011-52143

Abstract

View Articletitled, Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

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Topics: Bonding , Compression , Design , Finite element analysis

Material Optimization for Concentrated Solar Photovoltaic and Thermal Co-Generation

Kazuaki Yazawa, Ali Shakouri

InterPACK 2011; 733-739https://doi.org/10.1115/IPACK2011-52190

Abstract

View Articletitled, Material Optimization for Concentrated Solar Photovoltaic and Thermal Co-Generation

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Topics: Combined heat and power , Optimization , Solar energy , Hot water , Electric power generation , Heat , Heat sinks , Solar cells , Tradeoffs , Cogeneration systems

Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

Kazuaki Yazawa, Ali Shakouri

InterPACK 2011; 741-747https://doi.org/10.1115/IPACK2011-52191

Abstract

View Articletitled, Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

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Topics: Electronics , Entropy , Exergy analysis , Heat recovery , Heat , Electronic systems , Brayton cycle , Design , Energy / power systems , Energy conversion

Fluidic Laser Beam Shaper by Using Thermal Lens Effect

Hong Duc Doan, Yoshihiko Akamine, Kazuyoshi Fushinobu

InterPACK 2011; 749-755https://doi.org/10.1115/IPACK2011-52214

Abstract

View Articletitled, Fluidic Laser Beam Shaper by Using Thermal Lens Effect

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Topics: Laser beams , Lenses (Optics) , Lasers , Pumps , Absorption , Probes , Refractive index , Optics , Temperature distribution

Frequency Resolved Phonon Transport in Si/Ge Nanocomposites

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher

InterPACK 2011; 757-768https://doi.org/10.1115/IPACK2011-52244

Abstract

View Articletitled, Frequency Resolved Phonon Transport in Si/Ge Nanocomposites

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Topics: Nanocomposites , Phonons , Thermal conductivity , Mean free path , Acoustics , Approximation , Density , Electromagnetic scattering , Engineering simulation , Equilibrium (Physics)

Thermal Conductivity Reduction in Few-Layer Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher

InterPACK 2011; 769-778https://doi.org/10.1115/IPACK2011-52245

Abstract

View Articletitled, Thermal Conductivity Reduction in Few-Layer Graphene

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Topics: Graphene , Thermal conductivity , Phonons , Acoustics , Electromagnetic scattering , Radiation scattering , Scattering (Physics) , Accounting , Graphite , Harmonics (Music)