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Proceedings Papers

Proceedings Volume Cover
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
ASME 2009 InterPACK Conference, Volume 2

Modeling and Simulation

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component
Kanji Takagi, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi
InterPACK 2009; 1-8https://doi.org/10.1115/InterPACK2009-89019
View Articletitled, Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component
PDF
Topics: Process simulation , Shapes , Solder joints , Reliability , Electronic components , Manufacturing , Simulation , Surface tension , Crack propagation , Design
Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
InterPACK 2009; 9-17https://doi.org/10.1115/InterPACK2009-89040
View Articletitled, Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
PDF
Topics: Molding , Simulation , Viscoelasticity , Warping , Ball-Grid-Array packaging , Finite element analysis , Temperature , Constitutive equations , Cooling , Epoxy adhesives
High-Accuracy Fatigue Evaluation of Power Devices by Multi-Coupled Analysis
Kazunori Shinohara, Qiang Yu, Takashi Anzawa, Hideaki Ishii
InterPACK 2009; 19-26https://doi.org/10.1115/InterPACK2009-89043
View Articletitled, High-Accuracy Fatigue Evaluation of Power Devices by Multi-Coupled Analysis
PDF
Topics: Fatigue , Power semiconductor devices , Electrical conductivity , Semiconductors (Materials) , Vehicles , Electric vehicles , Engineering simulation , Heat , Hybrid electric vehicles , Reliability
Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits
Leila J. Ladani, Omar Rodriguez
InterPACK 2009; 27-32https://doi.org/10.1115/InterPACK2009-89056
View Articletitled, Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits
PDF
Topics: Integrated circuits , Reliability , Silicon , Solders , Thermomechanics , Design , Durability , Solder joints , Copper , Cycles
Thermoelectric Cooling Analysis Using Modified Graphical Method
Huy N. Phan, Dereje Agonafer
InterPACK 2009; 33-37https://doi.org/10.1115/InterPACK2009-89077
View Articletitled, Thermoelectric Cooling Analysis Using Modified Graphical Method
PDF
Topics: Thermoelectric cooling , Computation , Computational fluid dynamics , Cooling , Cooling systems , Currents , Design , Fluids , Temperature , Thermoelectric coolers
Predicting Thermal Characteristics of Particle Laden Thermal Interface Materials
Reza H. Khiabani, Yogendra Joshi, Cyrus Aidun
InterPACK 2009; 39-44https://doi.org/10.1115/InterPACK2009-89078
View Articletitled, Predicting Thermal Characteristics of Particle Laden Thermal Interface Materials
PDF
Topics: Particulate matter , Thermal conductivity , Electronic components , Heat , Heat transfer , Lattice Boltzmann methods , Packaging , Particle size , Thermal management
Nonlinear Response of a Printed Circuit Board in Shock
M. Vujosevic, P. Raghavan, G. Ramanathan, W. Hezeltine, K. Blue
InterPACK 2009; 45-54https://doi.org/10.1115/InterPACK2009-89094
View Articletitled, Nonlinear Response of a Printed Circuit Board in Shock
PDF
Topics: Printed circuit boards , Shock (Mechanics) , Deformation , Stress , Lumber , Membranes , Metrology , Strain measurement , Finite element methods , Inertia (Mechanics)
Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces
Daniel J. Rogers, Jianmin Qu, Matthew Yao
InterPACK 2009; 55-61https://doi.org/10.1115/InterPACK2009-89096
View Articletitled, Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces
PDF
Topics: Carbon nanotubes , Interfacial thermal resistance , Molecular dynamics simulation , Phonons , Thermal resistance
Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages
Erkan Oterkus, Abigail Agwai, Ibrahim Guven, Erdogan Madenci
InterPACK 2009; 63-68https://doi.org/10.1115/InterPACK2009-89107
View Articletitled, Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages
PDF
Topics: Electronic packages , Failure mechanisms , Simulation , Crack propagation , Graphene , Thin films , Molecular dynamics , Nanoindentation , Simulation results
An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
Bo Dan, Sasanka Kanuparthi, Ganesh Subbarayan, Bahgat G. Sammakia
InterPACK 2009; 69-81https://doi.org/10.1115/InterPACK2009-89116
View Articletitled, An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
PDF
Topics: Network models , Particulate matter , Thermal conductivity , Approximation , Dimensions , Finite element model , Engineering simulation , Fillers (Materials) , Simulation , Temperature distribution
A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids
Kyu Hyung Do, Byung Il Choi, Yong Shik Han, Seok Pil Jang
InterPACK 2009; 83-90https://doi.org/10.1115/InterPACK2009-89138
View Articletitled, A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids
PDF
Topics: Heat pipes , Nanofluids , Coating processes , Coatings , Condensation , Evaporation , Fluids , Heat conduction , Heat transfer , Nanoparticles
Numerical Solutions of Poisson Equation by the CIP-Basis Set Method
Daisuke Shibata, Takayuki Utsumi
InterPACK 2009; 91-98https://doi.org/10.1115/InterPACK2009-89150
View Articletitled, Numerical Solutions of Poisson Equation by the CIP-Basis Set Method
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Topics: Poisson equation , Waves , Polynomials , Computers , Crystals , Density , Eigenvalues , Electron configuration , Electrons , Errors
Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
Chunjian Ni, Jayathi Y. Murthy
InterPACK 2009; 99-109https://doi.org/10.1115/InterPACK2009-89181
View Articletitled, Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
PDF
Topics: Anisotropy , Modeling , Phonons , Relaxation (Physics) , Electromagnetic scattering , Radiation scattering , Scattering (Physics) , Silicon , Accounting , Equilibrium (Physics)
Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance
Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
InterPACK 2009; 111-118https://doi.org/10.1115/InterPACK2009-89188
View Articletitled, Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance
PDF
Topics: Clocks , Computer simulation , Computers , Control equipment , Junctions , Pareto optimization , Product reliability , Temperature , Temperature gradient
Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
Kazuhiko Sasagawa, Akihiko Kirita, Takehiro Abo, Abdul Hafiz Nor Hassan
InterPACK 2009; 119-124https://doi.org/10.1115/InterPACK2009-89229
View Articletitled, Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
PDF
Topics: Computer simulation , Current density , Damage , Electrodiffusion , Reliability , Atoms , Electrons , Evaluation methods , Integrated circuits , Silicon
A Capability to Model Crack Initiation and Growth in Solder Joints
Mike Neilsen, Paul Vianco, Alice Kilgo, Elizabeth Holm
InterPACK 2009; 125-132https://doi.org/10.1115/InterPACK2009-89230
View Articletitled, A Capability to Model Crack Initiation and Growth in Solder Joints
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Topics: Fracture (Materials) , Solder joints , Cycles , Finite element analysis , Damage , Engineering simulation , Modeling , Simulation , Computer simulation , Cracking (Materials)
Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards
Takao Mikami, Takaya Kobayashi
InterPACK 2009; 133-138https://doi.org/10.1115/InterPACK2009-89266
View Articletitled, Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards
PDF
Topics: Plate theory , Printed circuit boards , Warping , Deformation , Design , Finite element methods , Finite element model , Manufacturing , Numerical analysis
An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
John Brueckner, Rainer Dudek, Sven Rzepka, Bernd Michel
InterPACK 2009; 139-145https://doi.org/10.1115/InterPACK2009-89270
View Articletitled, An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
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Topics: Anisotropy , Brittleness , Ceramics , Damage , Experimental characterization , Failure , Finite element analysis , Fracture (Process) , Grinding , Grinding wheels
Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots
Viatcheslav Litvinovitch, Avram Bar-Cohen
InterPACK 2009; 147-158https://doi.org/10.1115/InterPACK2009-89289
View Articletitled, Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots
PDF
Topics: Contact resistance , Cooling , Thermal management , Thermoelectric coolers
PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics
Pradeep Lall, Aniket Shirgaokar, Dineshkumar Arunachalam, Jeff Suhling, Mark Strickland, Jim Blanche
InterPACK 2009; 159-170https://doi.org/10.1115/InterPACK2009-89329
View Articletitled, PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics
PDF
Topics: Electronics , Fatigue , Thermomechanics , Temperature , Ball-Grid-Array packages , Cycles , Reliability , Alloys , Architecture , Copper
Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties
T. D. Musho, D. G. Walker
InterPACK 2009; 171-175https://doi.org/10.1115/InterPACK2009-89332
View Articletitled, Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties
PDF
Topics: Composite materials , Simulation , Alloys , Bulk solids , Density , Design , Electromagnetic scattering , Nanoscale phenomena , Phonons , Radiation scattering
Mechanical Design Optimization of a Package on Package
Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer
InterPACK 2009; 177-184https://doi.org/10.1115/InterPACK2009-89349
View Articletitled, Mechanical Design Optimization of a Package on Package
PDF
Topics: Design engineering , Optimization , Package on package
Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages
Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
InterPACK 2009; 185-190https://doi.org/10.1115/InterPACK2009-89384
View Articletitled, Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages
PDF
Topics: Fatigue , Reliability , Solders , Stress analysis (Engineering) , Finite element analysis , Deformation , Metals , Molding materials , Absorption , Constitutive equations
A Multiscale Damage Accumulation Theory for Solder Joint Failure
Dhruv Bhate, Kaushik Mysore, Ganesh Subbarayan
InterPACK 2009; 191-197https://doi.org/10.1115/InterPACK2009-89399
View Articletitled, A Multiscale Damage Accumulation Theory for Solder Joint Failure
PDF
Topics: Damage , Failure , Solder joints , Fracture (Materials) , Alloys , Energy dissipation , Thermodynamics , Brittleness , Microscopes , Plasticity
Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory
Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Luu Nguyen
InterPACK 2009; 199-205https://doi.org/10.1115/InterPACK2009-89402
View Articletitled, Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory
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Topics: Fracture (Materials) , Cycles , Failure analysis , Finite element model , Geometry , Solder joints , Solders , Computer software , Corners (Structural elements) , Creep
Predicting Crack Growth and Fatigue Lives of QFN Solder Joints Using a Multiscale Fracture Model
Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Jeff Zhao, Darvin Edwards
InterPACK 2009; 207-213https://doi.org/10.1115/InterPACK2009-89403
View Articletitled, Predicting Crack Growth and Fatigue Lives of QFN Solder Joints Using a Multiscale Fracture Model
PDF
Topics: Fatigue , Fracture (Materials) , Solder joints , Solders , Geometry , Creep , Failure , Finite element model , Plasticity , Probability
Modelling Reliability of Power Electronics Packaging
Chris Bailey, Hua Lu, Chunyan Yin
InterPACK 2009; 215-220https://doi.org/10.1115/InterPACK2009-89430
View Articletitled, Modelling Reliability of Power Electronics Packaging
PDF
Topics: Electronic packaging , Modeling , Reliability , Electronics , Semiconductors (Materials) , Aluminum , Design , Electric vehicles , Electricity (Physics) , Energy management

Thermal Management - Component Level Thermal Management

Cooling Fan Model for Thermal Design of Compact Electronic Equipment: Improvement of Modeling Using PQ Curve
Hajime Nakamura
InterPACK 2009; 221-228https://doi.org/10.1115/InterPACK2009-89010
View Articletitled, Cooling Fan Model for Thermal Design of Compact Electronic Equipment: Improvement of Modeling Using PQ Curve
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Topics: Cooling , Design , Electronic equipment , Modeling , Flow (Dynamics) , Computational fluid dynamics , Fans , Pressure , Simulation , Forced convection
Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime
Ryan P. Anderson, Alfonso Ortega
InterPACK 2009; 229-237https://doi.org/10.1115/InterPACK2009-89020
View Articletitled, Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime
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Topics: Drops , Modeling , Heat transfer coefficients , Sprays , Air flow , Convection , Cooling , Dynamics (Mechanics) , Evaporation , Flow (Dynamics)
Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment
Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
InterPACK 2009; 239-245https://doi.org/10.1115/InterPACK2009-89052
View Articletitled, Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment
PDF
Topics: Capacitors , Electronic equipment , Modeling , Computational fluid dynamics , Flow simulation , Temperature , Design , Flow (Dynamics) , Switches , Thermal analysis
Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design
Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata
InterPACK 2009; 247-252https://doi.org/10.1115/InterPACK2009-89057
View Articletitled, Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design
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Topics: Computer simulation , Design , Electronic equipment , Simulation , Product development , Physics , Product design
Enhanced Microchannel Heat Sinks Using Oblique Fins
Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou
InterPACK 2009; 253-260https://doi.org/10.1115/InterPACK2009-89059
View Articletitled, Enhanced Microchannel Heat Sinks Using Oblique Fins
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Topics: Fins , Heat sinks , Microchannels , Heat transfer , Flow (Dynamics) , Boundary layers , Fluids , Heat transfer coefficients , Laminar flow , Numerical analysis
Heat Transfer Enhancement Using Laminar Gas-Liquid Segmented Fluid Streams
Y. S. Muzychka, E. J. Walsh, P. Walsh
InterPACK 2009; 261-272https://doi.org/10.1115/InterPACK2009-89065
View Articletitled, Heat Transfer Enhancement Using Laminar Gas-Liquid Segmented Fluid Streams
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Topics: Flow (Dynamics) , Fluids , Heat transfer , Two-phase flow
Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes
Sravan Gondipalli, Bahgat Sammakia, Gamal Refai-Ahmed
InterPACK 2009; 273-282https://doi.org/10.1115/InterPACK2009-89076
View Articletitled, Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes
PDF
Topics: Heat sinks , Shapes
Development of Advanced High Heat Flux Cooling System for Power Electronics
Yasuhisa Shinmoto, Shinichi Miura, Koichi Suzuki, Yoshiyuki Abe, Haruhiko Ohta
InterPACK 2009; 283-292https://doi.org/10.1115/InterPACK2009-89082
View Articletitled, Development of Advanced High Heat Flux Cooling System for Power Electronics
PDF
Topics: Cooling systems , Electronics , Heat flux , Cooling , Critical heat flux , Flow (Dynamics) , Heating , Heat , Semiconductors (Materials) , Boiling
Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures
Xi Wang, Ali Shakouri
InterPACK 2009; 293-296https://doi.org/10.1115/InterPACK2009-89084
View Articletitled, Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures
PDF
Topics: MOSFET transistors , Temperature , Thermal characterization , Temperature distribution , Gates (Closures) , Design , Electrons , Flow (Dynamics) , Heat , Phonons
Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity
Wataru Nakayama, Katsuhiro Koizumi, Takashi Fukue, Masaru Ishizuka, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
InterPACK 2009; 297-310https://doi.org/10.1115/InterPACK2009-89086
View Articletitled, Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity
PDF
Topics: Density , Thermal characterization , Thermal conductivity , Metals , Flow (Dynamics) , Heat , Heat conduction , Copper , Electrical wires , Japan Society of Mechanical Engineers
Thermal Analysis of Thermoelectric Coolers for Processors
Hengyun Zhang, Y. C. Mui, Michael Tarin, Yizhang Yang
InterPACK 2009; 311-318https://doi.org/10.1115/InterPACK2009-89087
View Articletitled, Thermal Analysis of Thermoelectric Coolers for Processors
PDF
Topics: Thermal analysis , Thermoelectric coolers , Cooling , Quality control , Energy dissipation , Junctions , Temperature
Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks
Madhusudan Iyengar, Avram Bar-Cohen
InterPACK 2009; 319-326https://doi.org/10.1115/InterPACK2009-89093
View Articletitled, Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks
PDF
Topics: Design for Manufacturing , Heat sinks , Aluminum , Cooling , Copper , Magnesium (Metal) , Manufacturing , Computers , Cycles , Design
Thermal Performance of Laminate-to-Aluminum Attachment Materials
John F. Maddox, Roy W. Knight, Sushil H. Bhavnani, John Evans
InterPACK 2009; 327-333https://doi.org/10.1115/InterPACK2009-89097
View Articletitled, Thermal Performance of Laminate-to-Aluminum Attachment Materials
PDF
Topics: Aluminum , Laminates , Adhesives , Cycles , Delamination , Lumber , Hardening (Curing) , Temperature , Testing , Thermal conductivity
Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics
Tomoyuki Nomura, Michael V. Shustov, Koichi Suzuki, Chungpyo Hong, Yury A. Kuzma-Kichta
InterPACK 2009; 335-340https://doi.org/10.1115/InterPACK2009-89100
View Articletitled, Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics
PDF
Topics: Boiling , Cooling , Electronics , Flow (Dynamics) , Heat flux , Microchannels , Subcooling , Heating , Critical heat flux , Emissions
Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment
Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa
InterPACK 2009; 341-346https://doi.org/10.1115/InterPACK2009-89103
View Articletitled, Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment
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Topics: Cooling , Dimensions , Electronic equipment , Clearances (Engineering) , Copper , Flow (Dynamics) , Temperature , Ducts , Particulate matter , Transparency
Heat Balance of Micro Hot-Film Sensor Elements Under the Different Gas Operation
Hidetomo Nagayo, Shinji Honami, Shoji Kamiunten, Masahiro Motosuke
InterPACK 2009; 347-355https://doi.org/10.1115/InterPACK2009-89120
View Articletitled, Heat Balance of Micro Hot-Film Sensor Elements Under the Different Gas Operation
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Topics: Heat , Sensors , Flow (Dynamics) , Electricity (Physics) , Simulation , Cavities , Fluids , Gas flow , Helium , Manufacturing
Mixing Behaviour of Coalescing Droplets in a Tube
Masahiro Muraoka, Naoki Ogawa, Renpei Fujita, Ichiro Ueno, Hiroshi Mizoguchi
InterPACK 2009; 357-361https://doi.org/10.1115/InterPACK2009-89121
View Articletitled, Mixing Behaviour of Coalescing Droplets in a Tube
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Topics: Drops , Particulate matter , Flow (Dynamics) , Fluids , Geometry
Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove
C. P. Migliaccio, H. K. Dhavaleswarapu, S. V. Garimella
InterPACK 2009; 363-370https://doi.org/10.1115/InterPACK2009-89134
View Articletitled, Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove
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Topics: Evaporation , Microscale devices , Temperature measurement , Thin films , Quartz , Shapes , Geometry , Heat , Heat flux , Heat transfer
Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules
Victor Chiriac
InterPACK 2009; 371-378https://doi.org/10.1115/InterPACK2009-89136
View Articletitled, Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules
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Topics: Optimization , Steady state , Transients (Dynamics) , Temperature , Automotive industry , Boundary-value problems , Computer simulation , Corners (Structural elements) , Heat , Heat budget (Physics)
An Experimental Investigation of Flow Boiling Characteristics in a Single Transparent Heated Microtube
Osamu Kawanami, Shih-Che Huang, Kazunari Kawakami, Itsuro Honda, Yousuke Kawashima, Haruhiko Ohta
InterPACK 2009; 379-387https://doi.org/10.1115/InterPACK2009-89142
View Articletitled, An Experimental Investigation of Flow Boiling Characteristics in a Single Transparent Heated Microtube
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Topics: Boiling , Flow (Dynamics) , Transparency , Bubbles , Heat flux , Wall temperature , Bubbly flow , Fluids , Gold plating , Heat transfer
Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber
Koichi Mashiko, Masataka Mochizuki, Yuji Saito, Yasuhiro Horiuchi, Thang Nguyen, Xiao Ping, Tien Nguyen, Vijit Wuttijumnong
InterPACK 2009; 389-394https://doi.org/10.1115/InterPACK2009-89144
View Articletitled, Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber
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Topics: Cooling , Cooling systems , Microchannels , Vapors
Microbubble Formation in Collapsing Process of a Single Vapor Bubble Injected in Subcooled Pool
Ichiro Ueno, Yasusuke Hattori
InterPACK 2009; 395-398https://doi.org/10.1115/InterPACK2009-89160
View Articletitled, Microbubble Formation in Collapsing Process of a Single Vapor Bubble Injected in Subcooled Pool
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Topics: Bubbles , Subcooling , Vapors , Boiling , Emissions , Critical heat flux , Heat flux , Water , Wire
Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling
Gareth F. Davies, Ian W. Eames, Paul B. Bailey, Michael W. Dadd, Adam Janiszewski, C. Richard Stone, Graeme G. Maidment, Brian Agnew
InterPACK 2009; 399-408https://doi.org/10.1115/InterPACK2009-89162
View Articletitled, Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling
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Topics: Compression , Computer cooling , Refrigeration , Vapors , Compressors , Cooling , Heat , Heat exchangers , Porous materials , Transients (Dynamics)
Surface Roughness Effects on Flow Boiling in Microchannels
Benjamin J. Jones, Suresh V. Garimella
InterPACK 2009; 409-418https://doi.org/10.1115/InterPACK2009-89168
View Articletitled, Surface Roughness Effects on Flow Boiling in Microchannels
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Topics: Boiling , Flow (Dynamics) , Microchannels , Surface roughness , Electrical discharge machining , Pressure drop , Flux (Metallurgy) , Heat , Heat transfer coefficients , Cutting
Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures
Pramod Chamarthy, H. Peter J. de Bock, Boris Russ, Shakti Chauhan, Brian Rush, Stanton E. Weaver, Tao Deng, Kripa Varanasi
InterPACK 2009; 419-425https://doi.org/10.1115/InterPACK2009-89173
View Articletitled, Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures
PDF
Topics: Heat pipes , Visualization , Permeability , Design , Computer cooling , Condensed matter , Condensers (steam plant) , Flow (Dynamics) , Gravity (Force) , Physics
Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay
Adam G. Pautsch, Arun Gowda, Ljubisa Stevanovic, Rich Beaupre
InterPACK 2009; 427-436https://doi.org/10.1115/InterPACK2009-89190
View Articletitled, Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay
PDF
Topics: Cooling , Electronics , Microchannels , Overlays (Materials engineering) , Heat exchangers , Heat sinks , Contact resistance , Design , Heat transfer , Silicon
Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger
Milnes P. David, Julie Steinbrenner, Josef Miler, Kenneth E. Goodson
InterPACK 2009; 437-444https://doi.org/10.1115/InterPACK2009-89192
View Articletitled, Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger
PDF
Topics: Copper , Heat exchangers , Microchannels , Visualization , Flow (Dynamics) , Membranes , Vapors , Pressure , Air flow , Cooling
Application of Frequency-Domain Thermal Measurements in Electronics Packaging
Yizhang Yang, Zhen Zhang, Maxat Touzelbaev
InterPACK 2009; 445-451https://doi.org/10.1115/InterPACK2009-89198
View Articletitled, Application of Frequency-Domain Thermal Measurements in Electronics Packaging
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Topics: Electronic packaging , Optimization , Packaging , Semiconductor industry , Silicon , Steady state , Thermal characterization
Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution
Y. Ezzahri, A. Shakouri
InterPACK 2009; 453-462https://doi.org/10.1115/InterPACK2009-89200
View Articletitled, Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution
PDF
Topics: Thermoreflectance , Transients (Dynamics) , Excitation , Heat , Heating , Lasers , Systems analysis , Heat conduction , Heat flux , Probes
Improving Flow Circulation in Heat Sinks Using Quadrupole Vortices
Timothy J. Dake, Joseph Majdalani
InterPACK 2009; 463-470https://doi.org/10.1115/InterPACK2009-89211
View Articletitled, Improving Flow Circulation in Heat Sinks Using Quadrupole Vortices
PDF
Topics: Flow (Dynamics) , Heat sinks , Vortices , Generators , Heat transfer , Shapes , Boundary layers , Design , Dynamic light scattering , Fins
Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials
Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
InterPACK 2009; 471-477https://doi.org/10.1115/InterPACK2009-89218
View Articletitled, Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials
PDF
Topics: Phase change materials , Thermal analysis , Fins , Temperature , Transients (Dynamics) , Absorption , Cooling , Design , Electronic equipment , Energy dissipation
Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling
Takashi Fukue, Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
InterPACK 2009; 479-490https://doi.org/10.1115/InterPACK2009-89219
View Articletitled, Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling
PDF
Topics: Computer cooling , Porosity , Vents , Flow (Dynamics) , Cooling , Density , Fans , Pressure
Thermal Imaging of Two-Phase Coooled Microgap Channel Wall
Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen
InterPACK 2009; 491-499https://doi.org/10.1115/InterPACK2009-89238
View Articletitled, Thermal Imaging of Two-Phase Coooled Microgap Channel Wall
PDF
Topics: Absorption , Coolers , Cooling , Dielectric liquids , Electronic components , Flow (Dynamics) , Flux (Metallurgy) , Heat , Heat flux , Imaging
In-Situ, Precise and High-Speed Measurement for Novel TIM Characterization
Yuichi Ishida, Hiroyuki Ryoson, Toshiro Ota, Kazuaki Yazawa
InterPACK 2009; 501-506https://doi.org/10.1115/InterPACK2009-89239
View Articletitled, In-Situ, Precise and High-Speed Measurement for Novel TIM Characterization
PDF
Topics: ASTM International , Creep , Dimensions , Equilibrium (Physics) , Flow (Dynamics) , Heat , Pressure , Resolution (Optics) , Rods , Temperature
The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages
Chih-Kuang Yu, Ming-Che Hsieh, Chun-Kai Liu, Ming-Ji Dai, Ra-Min Tain
InterPACK 2009; 507-512https://doi.org/10.1115/InterPACK2009-89242
View Articletitled, The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages
PDF
Topics: Engineering simulation , Finite volume methods , Heat transfer , Junctions , Materials properties , Silicon , Simulation , Temperature , Temperature distribution , Thermal conductivity
Thermal Mechanical Design and Validation of Memory Heat Spreaders
Ted Lee, Bruce Pederson, An Qiu
InterPACK 2009; 513-519https://doi.org/10.1115/InterPACK2009-89261
View Articletitled, Thermal Mechanical Design and Validation of Memory Heat Spreaders
PDF
Topics: Design engineering , Flat heat pipes , Design
Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics
Ihtesham Chowdhury, Ravi Prasher, Kelly Lofgreen, Sridhar Narasimhan, Ravi Mahajan, David Koester, Rama Venkatasubramanian
InterPACK 2009; 521-526https://doi.org/10.1115/InterPACK2009-89268
View Articletitled, Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics
PDF
Topics: Cooling , Heat flux , Superlattices , Thin films , Thermoelectric coolers , Thermal management , Electronic packages , Electronics , Lasers , Microscale devices
Application of Excel to Thermal Analysis of Electronic Equipment: Program-Less Analysis and Visualization of Its Process by Using Spreadsheet of Excel
Toshio Tomimura, Yasushi Koito, Shuichi Torii, Masaru Ishizuka
InterPACK 2009; 527-533https://doi.org/10.1115/InterPACK2009-89277
View Articletitled, Application of Excel to Thermal Analysis of Electronic Equipment: Program-Less Analysis and Visualization of Its Process by Using Spreadsheet of Excel
PDF
Topics: Electronic equipment , Thermal analysis , Visualization , Computer software , Finite difference methods , Numerical analysis , Printed circuit boards
Mathematical Approaches for Thermal Design of a Vapor Chamber
Yasushi Koito, Yuta Shiki, Masataka Mochizuki, Shuichi Torii, Toshio Tomimura
InterPACK 2009; 535-544https://doi.org/10.1115/InterPACK2009-89279
View Articletitled, Mathematical Approaches for Thermal Design of a Vapor Chamber
PDF
Topics: Design , Vapors , Temperature distribution , Disks , Heat conduction , Momentum , Pressure , Simulation
Microgap Cooling Technique Based on Evaporation of Thin Liquid Films
D. V. Zaitsev, O. A. Kabov
InterPACK 2009; 545-551https://doi.org/10.1115/InterPACK2009-89318
View Articletitled, Microgap Cooling Technique Based on Evaporation of Thin Liquid Films
PDF
Topics: Cooling , Evaporation , Lubrication theory , Flow (Dynamics) , Liquid films , Gas flow , Shear (Mechanics) , Water , Critical heat flux , Dynamics (Mechanics)
Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel
Naveenan Thiagarajan, Daniel T. Pate, Sushil H. Bhavnani, Rory J. Jones
InterPACK 2009; 553-562https://doi.org/10.1115/InterPACK2009-89324
View Articletitled, Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel
PDF
Topics: Boiling , Flow (Dynamics) , Microchannels , Silicon , Subcooling , Cavities , Flux (Metallurgy) , Heat sinks , Pressure drop , Cooling
Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers
Josef L. Miler, Roger Flynn, Gamal Refai-Ahmed, Maxat Touzelbaev, Milnes David, Julie Steinbrenner, Kenneth E. Goodson
InterPACK 2009; 563-569https://doi.org/10.1115/InterPACK2009-89325
View Articletitled, Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers
PDF
Topics: Heat exchangers , Microchannels , Transient heat transfer , Two-phase flow , Heating , Bubbles , Heat sinks , Microfluidics , Nucleation (Physics) , Steady state
Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications
Nikhil Lakhkar, Arijit Banerjee, Gamal Refai-Ahmed, Dereje Agonafer
InterPACK 2009; 571-578https://doi.org/10.1115/InterPACK2009-89341
View Articletitled, Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications
PDF
Topics: Flat heat pipes , Graphite , Pareto optimization , Cooling , Copper , Laptop computers , Temperature , Thermal conductivity , Weight (Mass) , Density
A Sophisticated Method for Static Testing of TIM
V. Sze´kely, G. Somlay, P. Szabo´, E. Kolla´r, M. Rencz
InterPACK 2009; 579-585https://doi.org/10.1115/InterPACK2009-89363
View Articletitled, A Sophisticated Method for Static Testing of TIM
PDF
Topics: Heat flux , Materials science , Steady state , Temperature , Testing , Thermal management , Thermal resistance
Development of a Metal Micro-Textured Thermal Interface Material
R. Kempers, R. Frizzell, A. Lyons, A. J. Robinson
InterPACK 2009; 587-595https://doi.org/10.1115/InterPACK2009-89366
View Articletitled, Development of a Metal Micro-Textured Thermal Interface Material
PDF
Topics: Metals , Thermal conductivity , Fillers (Materials) , Particulate matter , Composite materials , Deformation , Engineering prototypes , Flow (Dynamics) , Manufacturing , Metal foil
Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays
Xuejiao Hu, Lawrence S. Pan, Gang Gu, Kenneth E. Goodson
InterPACK 2009; 597-603https://doi.org/10.1115/InterPACK2009-89375
View Articletitled, Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays
PDF
Topics: Carbon nanotubes , Thermal resistance , Compression , Mechanical properties , Metals , Microscopy , Solders , Thermal conductivity
Optimal Pellet Geometries for Thermoelectric Refrigeration Under Robin Boundary Conditions
Marc Hodes
InterPACK 2009; 605-614https://doi.org/10.1115/InterPACK2009-89376
View Articletitled, Optimal Pellet Geometries for Thermoelectric Refrigeration Under Robin Boundary Conditions
PDF
Topics: Boundary-value problems , Refrigeration
Joint Development of a Package-Level Thermal Interface Material Test System
Yanshu Susan Chen, Stanley Pecavar, Vadim Gektin
InterPACK 2009; 615-618https://doi.org/10.1115/InterPACK2009-89398
View Articletitled, Joint Development of a Package-Level Thermal Interface Material Test System
PDF
Topics: ASTM International , Design , Gages , Heat , Junctions , Materials properties , Microelectromechanical systems , Microelectronic devices , Pressure , Stress

Thermal Management - System Level Thermal Management

Advanced Integrated Cooling Systems for Thermal Management in Data Centers
Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
InterPACK 2009; 619-624https://doi.org/10.1115/InterPACK2009-89009
View Articletitled, Advanced Integrated Cooling Systems for Thermal Management in Data Centers
PDF
Topics: Cooling systems , Data centers , Thermal management , Server racks , Heat pipes , Cables , Fluids , Heat exchangers , Heat sinks , Nanofluids
Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration
Ashish Sinha, Yogendra Joshi
InterPACK 2009; 625-633https://doi.org/10.1115/InterPACK2009-89021
View Articletitled, Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration
PDF
Topics: Cooling systems , Electronics , Heat , Temperature , Desorption , Cooling , Heat pumps , Heat recovery , High temperature
Integrated Design and Management of a Sustainable Data Center
Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
InterPACK 2009; 635-644https://doi.org/10.1115/InterPACK2009-89032
View Articletitled, Integrated Design and Management of a Sustainable Data Center
PDF
Topics: Data centers , Design , Sustainability , Blocks (Building materials) , Collaboration , Visualization
Local Cooling Control of Data Centers With Adaptive Vent Tiles
Monem H. Beitelmal, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Alan McReynolds
InterPACK 2009; 645-652https://doi.org/10.1115/InterPACK2009-89035
View Articletitled, Local Cooling Control of Data Centers With Adaptive Vent Tiles
PDF
Topics: Cooling , Data centers , Tiles , Vents , Control equipment , Air flow , Algorithms , Design , Dynamic models , Errors
The Environmental Footprint of Data Centers
Amip Shah, Cullen Bash, Ratnesh Sharma, Tom Christian, Brian J. Watson, Chandrakant Patel
InterPACK 2009; 653-662https://doi.org/10.1115/InterPACK2009-89036
View Articletitled, The Environmental Footprint of Data Centers
PDF
Topics: Data centers , Energy consumption , Energy efficiency , Cycles , Governments , Sustainability
Designing Environmentally Sustainable Computer Systems Using Networks of Exergo-Thermo-Volume Building Blocks
Amip Shah, Chandrakant D. Patel, Cullen Bash
InterPACK 2009; 663-671https://doi.org/10.1115/InterPACK2009-89037
View Articletitled, Designing Environmentally Sustainable Computer Systems Using Networks of Exergo-Thermo-Volume Building Blocks
PDF
Topics: Blocks (Building materials) , Computers , Design , Sustainability , Heat , Cooling , Linkages , Boundary-value problems , Green design , Life cycle assessment
Thermal Policies and Active Workload Migration Within Data Centers
Cullen Bash, Chris Hyser, Christopher Hoover
InterPACK 2009; 673-679https://doi.org/10.1115/InterPACK2009-89038
View Articletitled, Thermal Policies and Active Workload Migration Within Data Centers
PDF
Topics: Data centers , Energy consumption , Heat capacity , Specific heat , Cooling , Emissions , Energy generation , Machinery
Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
InterPACK 2009; 681-692https://doi.org/10.1115/InterPACK2009-89041
View Articletitled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
PDF
Topics: Cooling , Noise (Sound) , Plasmas (Ionized gases) , Fans , Flow (Dynamics) , Low temperature , Computational fluid dynamics , Heat transfer , Lumber , Natural convection
A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading
Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
InterPACK 2009; 693-699https://doi.org/10.1115/InterPACK2009-89071
View Articletitled, A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading
PDF
Topics: Transients (Dynamics) , Inductors , Cooling , Forced convection , Operating temperature , Steady state , Temperature , Waste heat
Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method
Je-Hyoung Park, Ali Shakouri, Sung-Mo Kang
InterPACK 2009; 701-707https://doi.org/10.1115/InterPACK2009-89072
View Articletitled, Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method
PDF
Topics: Complementary metal oxide semiconductors , Computation , Computer software , Design , Energy dissipation , Errors , Finite element analysis , Heat , Integrated circuits , Optimization
Optimal Fan Speed Control for Thermal Management of Servers
Zhikui Wang, Cullen Bash, Niraj Tolia, Manish Marwah, Xiaoyun Zhu, Parthasarathy Ranganathan
InterPACK 2009; 709-719https://doi.org/10.1115/InterPACK2009-89074
View Articletitled, Optimal Fan Speed Control for Thermal Management of Servers
PDF
Topics: Air flow , Architecture , Control equipment , Cooling , Data centers , Energy consumption , Fans , Feedback , Temperature , Thermal management
Unified Thermal and Power Management in Server Enclosures
Niraj Tolia, Zhikui Wang, Parthasarathy Ranganathan, Cullen Bash, Manish Marwah, Xiaoyun Zhu
InterPACK 2009; 721-730https://doi.org/10.1115/InterPACK2009-89075
View Articletitled, Unified Thermal and Power Management in Server Enclosures
PDF
Topics: Control equipment , Cooling , Data centers , Design , Energy consumption , Energy efficiency , Fans , Feedback , Heat transfer
Integrating an Electronics Component Database Into a Thermal Design Tool
Patrick Loney
InterPACK 2009; 731-740https://doi.org/10.1115/InterPACK2009-89080
View Articletitled, Integrating an Electronics Component Database Into a Thermal Design Tool
PDF
Topics: Databases , Design , Electronics , Engineers , Junctions , Lumber , Temperature , Computer software , Cooling , Electrical conductivity
Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
InterPACK 2009; 741-751https://doi.org/10.1115/InterPACK2009-89092
View Articletitled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
PDF
Topics: Boundary-value problems , Heat , Construction , Design , Errors , Flow (Dynamics) , Junctions , Matlab , Natural convection , Optimization
Effects of Enhanced Surface Inclination on Pool Boiling of a Dielectric Fluid
Liang-Han Chien, Shu-Che Lee
InterPACK 2009; 753-760https://doi.org/10.1115/InterPACK2009-89101
View Articletitled, Effects of Enhanced Surface Inclination on Pool Boiling of a Dielectric Fluid
PDF
Topics: Boiling , Fluids , Heat flux , Nucleate boiling , Nucleation (Physics) , Pool boiling
System Level Transient Thermal Performance of High-Power Dynamic Microelectronics
Victor Chiriac
InterPACK 2009; 761-767https://doi.org/10.1115/InterPACK2009-89110
View Articletitled, System Level Transient Thermal Performance of High-Power Dynamic Microelectronics
PDF
Topics: Computer simulation , Microelectronic devices , Motors , Transients (Dynamics)
Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics
Victor Adrian Chiriac
InterPACK 2009; 769-776https://doi.org/10.1115/InterPACK2009-89111
View Articletitled, Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics
PDF
Topics: Cooling , Fans , Heat pipes , Heat sinks , Microelectronic devices
Autonomous Detection of Thermal Anomalies in Data Centers
Manish Marwah, Ratnesh K. Sharma, Wilfredo Lugo
InterPACK 2009; 777-783https://doi.org/10.1115/InterPACK2009-89140
View Articletitled, Autonomous Detection of Thermal Anomalies in Data Centers
PDF
Topics: Data centers , Cooling , Sensors , Temperature , Temperature sensors , Actuators , Air conditioning , Computers , Cooling towers , Energy consumption
A Flow-Network Model for Predicting Rack Cooling in Containment Systems
Saurabh K. Shrivastava, James W. VanGilder
InterPACK 2009; 785-791https://doi.org/10.1115/InterPACK2009-89161
View Articletitled, A Flow-Network Model for Predicting Rack Cooling in Containment Systems
PDF
Topics: Containment systems , Cooling , Flow (Dynamics) , Air flow , Computational fluid dynamics , Containment , Cooling systems , Data centers , Dimensions , Heat
A Real-Time Data Center Airflow and Energy Assessment Tool
Xuanhang Simon Zhang, James W. VanGilder, Christopher M. Healey
InterPACK 2009; 793-798https://doi.org/10.1115/InterPACK2009-89175
View Articletitled, A Real-Time Data Center Airflow and Energy Assessment Tool
PDF
Topics: Air flow , Data centers , Energy assessment , Temperature , Stress , Computer software , Cooling , Energy consumption , Energy management , Plant layout
Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems
Evan G. Colgan, Madhusudan K. Iyengar
InterPACK 2009; 799-806https://doi.org/10.1115/InterPACK2009-89177
View Articletitled, Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems
PDF
Topics: Water , Cooling , Design , Heat exchangers , Locations , Server racks , Temperature , Architecture , Computers , Data centers
Reduced Order Thermal Modeling of Data Centers via Distributed Sensor Data
Emad Samadiani, Yogendra Joshi, Hendrik Hamann, Madhusudan K. Iyengar, Steven Kamalsy, James Lacey
InterPACK 2009; 807-814https://doi.org/10.1115/InterPACK2009-89187
View Articletitled, Reduced Order Thermal Modeling of Data Centers via Distributed Sensor Data
PDF
Topics: Data centers , Modeling , Sensors , Temperature , Air conditioning , Air flow , Computers , Errors , Flow (Dynamics) , Principal component analysis
Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives
Saket Karajgikar, Veerendra Mulay, Abhilash Menon, Dereje Agonafer, Jiahui Zhang
InterPACK 2009; 815-820https://doi.org/10.1115/InterPACK2009-89189
View Articletitled, Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives
PDF
Topics: Optimization , Flow (Dynamics) , Electronic components , Electronics , Low temperature
Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks
Garrett A. Glover, Yongguo Chen, Annie Luo, Herman Chu
InterPACK 2009; 821-829https://doi.org/10.1115/InterPACK2009-89191
View Articletitled, Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks
PDF
Topics: Heat pipes , Heat sinks , Vapors , Computer cooling , Aluminum , Copper , Cycles , Flow (Dynamics) , Fluids , Heat
A New Methodology for Cold Plate and Heat Sink Optimization
Jeremy Rice, Monem Alyaser
InterPACK 2009; 831-840https://doi.org/10.1115/InterPACK2009-89197
View Articletitled, A New Methodology for Cold Plate and Heat Sink Optimization
PDF
Topics: Heat sinks , Optimization , Computational fluid dynamics , Anisotropy , Convection , Fins , Fluids , Heat conduction , Heat transfer , Prandtl number
Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray
InterPACK 2009; 841-850https://doi.org/10.1115/InterPACK2009-89203
View Articletitled, Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
PDF
Topics: Data centers , Doors , Optimization , Roofs , Temperature , Air flow , Ceilings , Heat , Computers , Coolers
Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
Roger Schmidt, Madhusudan Iyengar
InterPACK 2009; 851-862https://doi.org/10.1115/InterPACK2009-89212
View Articletitled, Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
PDF
Topics: Doors , Heat exchangers , Server racks , Water
IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design
Roger Schmidt, Mike Ellsworth, Madhu Iyengar, Gary New
InterPACK 2009; 863-873https://doi.org/10.1115/InterPACK2009-89213
View Articletitled, IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design
PDF
Topics: Design , Doors , Water
Energy-Efficient Air Cooling of Data Centers at 2000 W/ft2
Magnus K. Herrlin, Michael K. Patterson
InterPACK 2009; 875-880https://doi.org/10.1115/InterPACK2009-89224
View Articletitled, Energy-Efficient Air Cooling of Data Centers at 2000 W/ft<sup>2</sup>
PDF
Topics: Cooling , Data centers , Air flow , Density , Design , Heat , Computational fluid dynamics , Cooling systems , Energy efficiency , Control systems
Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction
Nihad Dukhan
InterPACK 2009; 881-886https://doi.org/10.1115/InterPACK2009-89231
View Articletitled, Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction
PDF
Topics: Convection , Flow (Dynamics) , Fluids , Heat conduction , Porous materials , Electrical conductivity , Heat , Thermal conductivity , Cooling , Design
Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics
Matt Yaquinto, Richard Wirtz
InterPACK 2009; 887-896https://doi.org/10.1115/InterPACK2009-89237
View Articletitled, Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics
PDF
Topics: Cooling , Electronics , Phase transition temperature , Power density , Thermal energy storage , Storage , Flat heat pipes , Phase change materials , Skin , Temperature
Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly
Levi A. Campbell, Michael J. Ellsworth, Jr., Arvind K. Sinha
InterPACK 2009; 897-905https://doi.org/10.1115/InterPACK2009-89244
View Articletitled, Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly
PDF
Topics: Design , Manufacturing , Plates (structures) , Computational fluid dynamics , Copper , Manifolds , Modeling , Tubing , Cooling , EPDM rubber
Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers
Michael J. Ellsworth, Jr., Madhusudan K. Iyengar
InterPACK 2009; 907-914https://doi.org/10.1115/InterPACK2009-89248
View Articletitled, Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers
PDF
Topics: Energy efficiency , Water , Cooling , Energy consumption , Heat , Stress , Air conditioning , Computational fluid dynamics , Condensers (steam plant) , Cooling towers
Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers
Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar
InterPACK 2009; 915-921https://doi.org/10.1115/InterPACK2009-89258
View Articletitled, Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers
PDF
Topics: Cooling , Data centers , Heat exchangers , Refrigeration , Server racks , Refrigerants , Water , Compression , Construction , Coolants
Numerical Simulations for Digitized Heat Transfer
Eric Baird, Kamran Mohseni
InterPACK 2009; 923-931https://doi.org/10.1115/InterPACK2009-89264
View Articletitled, Numerical Simulations for Digitized Heat Transfer
PDF
Topics: Computer simulation , Heat transfer , Alloys , Electronics , Fluids , Heat , Heat flux , Heat sinks , Liquid metals , Microelectromechanical systems
Numerical Analysis of Mist-Cooled High Power Components in Cabinets
Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
InterPACK 2009; 933-944https://doi.org/10.1115/InterPACK2009-89269
View Articletitled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
PDF
Topics: Numerical analysis , Flow (Dynamics) , Heat sinks , Drops , Evaporation , Telecommunications , Thermal management , Acoustics , Circuits , Cooling
Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer
Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
InterPACK 2009; 945-951https://doi.org/10.1115/InterPACK2009-89294
View Articletitled, Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer
PDF
Topics: Cooling systems , Design , Heat , Stress , Control systems , Forced convection , Mineral oil , Natural convection , Power grids , Renewable energy
Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
InterPACK 2009; 953-961https://doi.org/10.1115/InterPACK2009-89306
View Articletitled, Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
PDF
Topics: Computer simulation , Data centers , Computational fluid dynamics , Turbulence , Flow (Dynamics) , Temperature , Compacting , Cooling , Design , Heat transfer
Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition
Jiahui Zhang, Dave Weber, Jason Waggel, Tony Pollice, Marco Matuonto
InterPACK 2009; 963-972https://doi.org/10.1115/InterPACK2009-89310
View Articletitled, Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition
PDF
Topics: Computers , Convection , Cooling , Heat conduction , Heat sinks , Natural convection , Optimization
Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics
Yogen Utturkar, Mehmet Arik, Tunc Icoz
InterPACK 2009; 973-984https://doi.org/10.1115/InterPACK2009-89322
View Articletitled, Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics
PDF
Topics: Design , Electronics , Heat sinks , Cooling , Air jets , Computer simulation , Condensation , Dynamics (Mechanics) , Electronic systems , Energy dissipation
Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
InterPACK 2009; 985-991https://doi.org/10.1115/InterPACK2009-89340
View Articletitled, Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
PDF
Topics: Mixed convection , Solar energy , Stress , Telecommunications , Construction , Cooling systems , Electronics , Optical instruments , Acoustics , Air conditioning
Effective Thermal Management of Data Centers Using Efficient Cabinet Designs
Veerendra Mulay, Dereje Agonafer, Gary Irwin, Darshan Patell
InterPACK 2009; 993-999https://doi.org/10.1115/InterPACK2009-89351
View Articletitled, Effective Thermal Management of Data Centers Using Efficient Cabinet Designs
PDF
Topics: Data centers , Thermal management , Energy consumption , Design , Combined heat and power , Cooling , Environmental Protection Agency , Exhaust systems , Heat , Stress
Cooling of Data Centers Using Airside Economizers
Saket Karajgikar, Veerendra Mulay, Dereje Agonafer, Roger Schmidt
InterPACK 2009; 1001-1007https://doi.org/10.1115/InterPACK2009-89356
View Articletitled, Cooling of Data Centers Using Airside Economizers
PDF
Topics: Cooling , Data centers , Energy consumption , Air conditioners , Computer simulation , Computers , Electronic components , Environmental Protection Agency , Failure , Heat
Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
Michael K. Patterson, Don Atwood, John G. Miner
InterPACK 2009; 1009-1014https://doi.org/10.1115/InterPACK2009-89358
View Articletitled, Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
PDF
Topics: Data centers , Cooling , Cooling systems , Energy consumption , Temperature control , Air conditioning , Design , Doors , Engineers , Heating
Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls
Michael K. Patterson, Michael Meakins, Dennis Nasont, Prasad Pusuluri, William Tschudi, Geoffrey C. Bell, Roger Schmidt, Ken Schneebeli, Tom Brey, Monty McGraw, Wade Vinson, Jason Gloeckner
InterPACK 2009; 1015-1020https://doi.org/10.1115/InterPACK2009-89359
View Articletitled, Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls
PDF
Topics: Energy efficiency , Technology management , Cooling systems , Data centers , Temperature , Temperature sensors , Air flow , Control systems , Cooling , Design
Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee
InterPACK 2009; 1021-1024https://doi.org/10.1115/InterPACK2009-89368
View Articletitled, Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
PDF
Topics: Columns (Structural) , Heat , Switches , Thermal resistance , Electronic packages , Temperature , Flow (Dynamics) , Geometry , Plates (structures) , Reservoirs
Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
Lang Yuan, Jignesh Patel
InterPACK 2009; 1025-1032https://doi.org/10.1115/InterPACK2009-89377
View Articletitled, Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
PDF
Topics: Acoustics , Air filters , Design , Fibers , Noise (Sound) , Telecommunications , Thermal management
Operational Benefits of Real-Time Monitoring and Visualization in Data Centers
Tahir Cader, Ratnesh Sharma, Cullen Bash, Les Fox, Vaibhav Bhatia, Mohandas Mekanapurath
InterPACK 2009; 1033-1046https://doi.org/10.1115/InterPACK2009-89379
View Articletitled, Operational Benefits of Real-Time Monitoring and Visualization in Data Centers
PDF
Topics: Data centers , Visualization , Computers , Energy consumption , Environmental Protection Agency , Sensors , Air flow , Cloud computing , Computer software , Cooling systems
Scaling Analysis of Performance Trade-Offs in Electronics Cooling
Craig E. Green, Andrei G. Fedorov, Yogendra K. Joshi
InterPACK 2009; 1047-1056https://doi.org/10.1115/InterPACK2009-89389
View Articletitled, Scaling Analysis of Performance Trade-Offs in Electronics Cooling
PDF
Topics: Computer cooling , Tradeoffs , Cooling , Scaling laws (Mathematical physics) , Coolants , Fluids , Geometry , Heat sinks , Heat transfer , Internal flow
Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling
Sarng Woo Karng, Kyudae Hwang, Jongmin Moon, Seo Young Kim
InterPACK 2009; 1057-1062https://doi.org/10.1115/InterPACK2009-89410
View Articletitled, Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling
PDF
Topics: Cooling , Plates (structures) , Robots , Aluminum , Copper , Water , Energy dissipation , Flow (Dynamics) , Heat , Heat transfer
Co-Generation: Grid Independent Power and Cooling for a Data Center
Roger Schmidt, Madhusudan Iyengar, James Steffes, Vijay Lund
InterPACK 2009; 1063-1075https://doi.org/10.1115/InterPACK2009-89411
View Articletitled, Co-Generation: Grid Independent Power and Cooling for a Data Center
PDF
Topics: Combined heat and power , Cooling , Data centers , Pressure , Reliability
System Level Thermal Design Challenges in Validation Platforms
Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
InterPACK 2009; 1077-1086https://doi.org/10.1115/InterPACK2009-89412
View Articletitled, System Level Thermal Design Challenges in Validation Platforms
PDF
Topics: Design , Cooling , Engineering simulation , Simulation , Computational fluid dynamics , Semiconductor industry , Silicon , Acoustics , Cables , Heating
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