Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability

July 19–23, 2009

San Francisco, California, USA

Conference Sponsors:

ISBN:

978-0-7918-4359-8

In This Volume

Advanced Packaging (10)
Electro-Thermal-Mechanical Issues in Packaging (Multi-Physics) (14)
Manufacturing and Test (18)
Materials and Processes (15)
MEMS and MEMS Packaging (10)
Nanotechnology and NEMS (17)
Photonics and Optics (6)
Reliability (35)

ASME 2009 InterPACK Conference, Volume 1

Advanced Packaging

Development of a New Wire Bonding Technology on Integrated Circuit Devices

Yingwei Jiang, Ronglu Sun, Sonder Wang, C. L. Zhang, Youmin Yu, Weimin Chen, Xiao Wei

InterPACK 2009; 1-7https://doi.org/10.1115/InterPACK2009-89055

Abstract

View Articletitled, Development of a New Wire Bonding Technology on Integrated Circuit Devices

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Topics: Integrated circuits , Wire bonding , Copper , Wire , Bonding , Reliability , Cycles , Delamination , Flow (Dynamics) , High temperature

Copper Plating Process for Through Silicon Via With High Aspect Ratio in Advanced Packaging

Yu Hung Huang, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang

InterPACK 2009; 9-14https://doi.org/10.1115/InterPACK2009-89163

Abstract

View Articletitled, Copper Plating Process for Through Silicon Via With High Aspect Ratio in Advanced Packaging

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Topics: Copper , Packaging , Plating , Silicon

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho

InterPACK 2009; 15-25https://doi.org/10.1115/InterPACK2009-89245

Abstract

View Articletitled, Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

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Topics: Errors , Flip-chip packages , Sensors , Silicon , Stress , Temperature , Integrated circuits , Electronic packages , Finite element model , Flip-chip

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks

InterPACK 2009; 27-32https://doi.org/10.1115/InterPACK2009-89247

Abstract

View Articletitled, Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

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Topics: Flexible electronics , High cycle fatigue , Metals , Thin films , Unsaturated polyesters , Fracture (Materials) , Bulk solids , Electrical resistance , Electronic systems , Failure

High-Density Room-Temperature 3D Chip-Stacking Using Mechanical Caulking With Compliant Bump and Through-Hole-Electrode

Naoya Watanabe, Michihiro Kawashita, Yasuhiro Yoshimura, Naotaka Tanaka, Tanemasa Asano

InterPACK 2009; 33-38https://doi.org/10.1115/InterPACK2009-89274

Abstract

View Articletitled, High-Density Room-Temperature 3D Chip-Stacking Using Mechanical Caulking With Compliant Bump and Through-Hole-Electrode

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Topics: Density , Electrodes , Temperature , Electroplating , Pattern formation

Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly Using Pb-Free Solder Alloys

Rangaraj Dhanasekaran, Harish Gadepalli, S. Manian Ramkumar, Tim Jensen, Ed Briggs

InterPACK 2009; 39-47https://doi.org/10.1115/InterPACK2009-89304

Abstract

View Articletitled, Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly Using Pb-Free Solder Alloys

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Topics: Alloys , Lead-free solders , Manufacturing , Solders , Electronic packaging , Energy dissipation , Heat , Soldering , Surface mount assemblies

Flat Tree Networks

P. Khanduri, A. Wood, D. Cohen, I. Birkeli, F. Sem-Jacobsen

InterPACK 2009; 49-55https://doi.org/10.1115/InterPACK2009-89336

Abstract

View Articletitled, Flat Tree Networks

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Topics: Packaging , Signals , Switches , Textiles , Topology

Integrating Novel Packaging Technologies for Large Scale Computer Systems

James Mitchell, John Cunningham, Ashok V. Krishnamoorthy, Robert Drost, Ron Ho

InterPACK 2009; 57-66https://doi.org/10.1115/InterPACK2009-89355

Abstract

View Articletitled, Integrating Novel Packaging Technologies for Large Scale Computer Systems

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Topics: Computers , Packaging , Complementary metal oxide semiconductors , Density , Engineering prototypes , Silicon

Effects of TSV (Through Silicon Via) Interposer/Chip on the Thermal Performances of 3D IC Packaging

John H. Lau, Gong Yue Tang, Germaine Yen Yi Hoe, Xiao Wu Zhang, Tai Chong Chai, Pinjala Damaruganath, Kripesh Vaidyanathan

InterPACK 2009; 67-74https://doi.org/10.1115/InterPACK2009-89380

Abstract

View Articletitled, Effects of TSV (Through Silicon Via) Interposer/Chip on the Thermal Performances of 3D IC Packaging

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Topics: Integrated circuit packaging , Silicon , Computational fluid dynamics , Aluminum , Copper , Design , Fillers (Materials) , Heat transfer , Junctions , Polymers

Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage

Jason M. Brand, Myung J. Yim, Ravi Kumar

InterPACK 2009; 75-81https://doi.org/10.1115/InterPACK2009-89414

Abstract

View Articletitled, Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage

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Topics: Materials properties , Molding , Package on package , Semiconductors (Materials) , Warping

Electro-Thermal-Mechanical Issues in Packaging (Multi-Physics)

Electromigration Damage Mechanics of Interconnects

Cemal Basaran, Minghui Lin

InterPACK 2009; 83-94https://doi.org/10.1115/InterPACK2009-89006

Abstract

View Articletitled, Electromigration Damage Mechanics of Interconnects

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Topics: Damage mechanics , Electrodiffusion , Damage , Nanoelectronics , Boundary-value problems , Current density , Diffusion (Physics) , Copper , Materials degradation , Plasticity

Thermal-Electrical Co-Optimization of Block-Level Floorplanning in 3D Integrated Circuits

Ankur Jain, Syed Alam, Scott Pozder, Robert E. Jones

InterPACK 2009; 95-101https://doi.org/10.1115/InterPACK2009-89017

Abstract

View Articletitled, Thermal-Electrical Co-Optimization of Block-Level Floorplanning in 3D Integrated Circuits

PDF

Topics: Bonding , Design , Integrated circuits , Optimization , Semiconductor wafers

Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

Jung-Kyun Kim, Wataru Nakayama, Sun-Kyu Lee

InterPACK 2009; 103-111https://doi.org/10.1115/InterPACK2009-89033

Abstract

View Articletitled, Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

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Topics: Contact resistance , Electronic packages , Heat , Modeling , System dynamics , Temperature , Transients (Dynamics)

Cooling Effect of Several Rods on a Heated Flat Surface by Impinging Jet

Koichi Ichimiya, Yosuke Fujimori

InterPACK 2009; 113-118https://doi.org/10.1115/InterPACK2009-89085

Abstract

View Articletitled, Cooling Effect of Several Rods on a Heated Flat Surface by Impinging Jet

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Topics: Cooling , Rods , Nozzles , Temperature distribution , Algorithms , Convection , Finite difference methods , Flow (Dynamics) , Heat , Heat transfer

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

InterPACK 2009; 119-124https://doi.org/10.1115/InterPACK2009-89112

Abstract

View Articletitled, Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

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Topics: Simulation , Stress , Stress concentration , Physics , Diffusion (Physics) , Semiconductor devices , Simulation models , Computer simulation , Electron mobility , Gates (Closures)

Thermal-Structural Performance of Orthotropic Pin Fin Applications

Abul Fazal M. Arif, Syed M. Zubair

InterPACK 2009; 125-134https://doi.org/10.1115/InterPACK2009-89125

Abstract

View Articletitled, Thermal-Structural Performance of Orthotropic Pin Fin Applications

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Topics: Composite materials , Cooling , Corrosion , Density , Design , Finite element methods , Heat sinks , Heat transfer , Materials properties , Metals

Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki, Masaru Ishizuka

InterPACK 2009; 135-141https://doi.org/10.1115/InterPACK2009-89156

Abstract

View Articletitled, Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

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Topics: Simulation , Relaxation (Physics) , Heat , Electromagnetic scattering , Energy conservation , Momentum , Radiation scattering , Scattering (Physics) , Semiconductor devices , Approximation

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta

InterPACK 2009; 143-148https://doi.org/10.1115/InterPACK2009-89178

Abstract

View Articletitled, Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

PDF

Topics: Accelerometers , Approximation , Bending (Stress) , Damage , Durability , Fatigue , Finite element analysis , Manufacturing , Printed circuit boards , Random excitation

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta, S. Tolchinsky, J. Crystal

InterPACK 2009; 149-154https://doi.org/10.1115/InterPACK2009-89179

Abstract

View Articletitled, Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

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Topics: Electronic systems , Modeling , Shock (Mechanics) , Simulation , Dynamic response , Batteries , Plastic housings , Circuits , Design , Dynamic testing (Materials)

Thermal Challenges Due to Improved RF Performance

Mitesh Parikh, Roberto Montan˜ez, Patrick Loney

InterPACK 2009; 155-159https://doi.org/10.1115/InterPACK2009-89180

Abstract

View Articletitled, Thermal Challenges Due to Improved RF Performance

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Topics: Cycles , Design , Heat , Junctions , Military systems , Modeling , Noise (Sound) , Radar , Reliability , Temperature

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli

InterPACK 2009; 161-173https://doi.org/10.1115/InterPACK2009-89182

Abstract

View Articletitled, Coupled Electro-Thermal Simulation of MOSFETs

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Topics: Simulation , Phonons , Electrons , Heat , Electromagnetic scattering , Radiation scattering , Scattering (Physics) , Acoustics , Anisotropy , Heat conduction

Numerical Optimization of a Electroosmotically Enhanced Microchannel Heat Sink

Afzal Husain, Kwang-Yong Kim

InterPACK 2009; 175-182https://doi.org/10.1115/InterPACK2009-89236

Abstract

View Articletitled, Numerical Optimization of a Electroosmotically Enhanced Microchannel Heat Sink

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Topics: Heat sinks , Microchannels , Optimization , Design , Flow (Dynamics) , Coolants , Temperature , Electric potential , Electroosmosis , Evolutionary algorithms

An Experimental Study of Onset Condition for Electrohydrodynamic Jetting

Hyojun Kim, Junyoung Song, Jaeik Jeong, Jaewon Chung

InterPACK 2009; 183-186https://doi.org/10.1115/InterPACK2009-89387

Abstract

View Articletitled, An Experimental Study of Onset Condition for Electrohydrodynamic Jetting

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Topics: Electrohydrodynamics , Nozzles , Pressure , Printing , Reservoirs , Drops , Electric fields , Electrodes , Flow (Dynamics) , Fluids

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Mohamed-Nabil Sabry

InterPACK 2009; 187-191https://doi.org/10.1115/InterPACK2009-89415

Abstract

View Articletitled, Predicting Thermal Stresses Induced by Conjugate Heat Transfer

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Topics: Heat transfer , Thermal stresses , Fluids , Design , Heat , Temperature , Temperature profiles , Wall temperature , Boundary-value problems , Degrees of freedom

Manufacturing and Test

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran

InterPACK 2009; 193-200https://doi.org/10.1115/InterPACK2009-89014

Abstract

View Articletitled, Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

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Topics: Copper , Heating , Interferometry , Joules , Heat , Current density , Design , Electrodiffusion , Electronic packaging , Energy dissipation

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira

InterPACK 2009; 201-210https://doi.org/10.1115/InterPACK2009-89034

Abstract

View Articletitled, Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

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Topics: Fiber reinforced plastics , Glass , Printed circuit boards , Drilling , Drills (Tools) , Surface roughness , Temperature , Circuits , Delamination , Glass fibers

Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

Fusaomi Nagata, Shintaro Tani, Takanori Mizobuchi, Tetsuo Hase, Zenku Haga, Keigo Watanabe

InterPACK 2009; 211-217https://doi.org/10.1115/InterPACK2009-89042

Abstract

View Articletitled, Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

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Topics: Machine tools , Stick-slip , Finishing , Control systems , Feedback , Feedforward control , Force feedback , Motion control , Lenses (Optics) , Mirrors

Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Okawa

InterPACK 2009; 219-227https://doi.org/10.1115/InterPACK2009-89060

Abstract

View Articletitled, Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

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Topics: Drilling , Drills (Tools) , Optimization , Printed circuit boards , Temperature , Fibers , Glass reinforced plastics

Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Influence of Surface Treatment on Drilled Hole Quality

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsukasa Ayuzawa

InterPACK 2009; 229-237https://doi.org/10.1115/InterPACK2009-89061

Abstract

View Articletitled, Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Influence of Surface Treatment on Drilled Hole Quality

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Topics: Drilling , Hole quality , Lasers , Surface finishing , Carbon dioxide lasers , Copper foil , Copper , Printed circuit boards , Melting , Resins

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura

InterPACK 2009; 239-245https://doi.org/10.1115/InterPACK2009-89145

Abstract

View Articletitled, In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

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Topics: Evaluation methods , Stress , Thin films , Transistors , Gates (Closures) , Electrodes , Finite element methods , Manufacturing , Stress concentration , Focused ion beams

Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages

Youmin Yu, Denis Bai, Y. W. Jiang, Sonder Wang

InterPACK 2009; 247-252https://doi.org/10.1115/InterPACK2009-89158

Abstract

View Articletitled, Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages

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Topics: Blades , Optimization , Roads , Strips , Cutting , Wear , Metals , Manufacturing

Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products

John Zhiyuan Yang

InterPACK 2009; 253-259https://doi.org/10.1115/InterPACK2009-89199

Abstract

View Articletitled, Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products

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Topics: Packaging , Silicon-on-sapphire , Technology development , Equipment performance , Reliability

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari

InterPACK 2009; 261-265https://doi.org/10.1115/InterPACK2009-89221

Abstract

View Articletitled, Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

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Topics: Electronics , Manufacturing , Optical fiber , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Fibers , Engineering design processes , Experimental design , Manufacturing technology

Optical Methodology for Testing of Microsystems

Ryszard J. Pryputniewicz, Ryan T. Marinis, Peter Hefti

InterPACK 2009; 267-276https://doi.org/10.1115/InterPACK2009-89223

Abstract

View Articletitled, Optical Methodology for Testing of Microsystems

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Topics: Microelectromechanical systems , Reliability , Testing

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari

InterPACK 2009; 277-282https://doi.org/10.1115/InterPACK2009-89233

Abstract

View Articletitled, Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

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Topics: Electronics , Manufacturing , Optical fiber , Polarization (Light) , Fibers , Displacement , Polarization (Electricity) , Polarization (Waves) , Electric discharge , Experimental design

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

G. Srinivasan, R. Murcko, K. Srihari

InterPACK 2009; 283-292https://doi.org/10.1115/InterPACK2009-89241

Abstract

View Articletitled, Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

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Topics: Finishes , Plating , Wire , Nickel , Palladium , Silver , Failure analysis , High temperature , Manufacturing , Reliability

Reliability Assessment for Printed Circuit Board in Lead-Free Process

Chien-Yi Huang, Chen-Liang Ku, Hao-Chun Hsieh, Tzu-Min Chien, Hui-Hua Huang

InterPACK 2009; 293-299https://doi.org/10.1115/InterPACK2009-89253

Abstract

View Articletitled, Reliability Assessment for Printed Circuit Board in Lead-Free Process

PDF

Topics: Delamination , Printed circuit boards , Reliability

Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics

Srikanth Poranki, Nagen Nagarur, Krishnaswami Srihari

InterPACK 2009; 301-307https://doi.org/10.1115/InterPACK2009-89315

Abstract

View Articletitled, Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics

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Topics: Flexible electronics , Electronics , Cycles , Diffusion (Physics) , Explosions , Failure , Innovation , Patents , Plastics , Roads

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian

InterPACK 2009; 309-316https://doi.org/10.1115/InterPACK2009-89321

Abstract

View Articletitled, Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

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Topics: Thermal shock , Solders , Alloys , Failure , Chain , Manufacturing , Solder joints , Ball-Grid-Array packaging , Finishes , Lead-free solders

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Velimir Jovanovic, Saeid Ghamaty, Norbert B. Elsner, Daniel Krommenhoek, John Morris

InterPACK 2009; 317-320.8https://doi.org/10.1115/InterPACK2009-89328

Abstract

View Articletitled, New Technique for Testing Performance of Thermoelectric Quantum Well Materials

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Topics: Quantum wells , Testing performance , Electrical resistivity , Thin films , Stress , Temperature , Alloys , Bulk solids , Copper , Electrical properties

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar

InterPACK 2009; 321-328https://doi.org/10.1115/InterPACK2009-89405

Abstract

View Articletitled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

PDF

Topics: Manufacturing , Reliability , Lumber , Pins (Engineering) , Ball-Grid-Array packaging , Construction , Cross section (Physics) , Design , Experimental design , Failure analysis

A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

Youmin Yu, Y. Q. Su, S. A. Yao, Y. W. Jiang, Sonder Wang

InterPACK 2009; 329-334https://doi.org/10.1115/InterPACK2009-89408

Abstract

View Articletitled, A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

PDF

Topics: Errors , Heat , Heat transfer , Heating , Optimization , Ovens , Reflow soldering , Reliability , Solders

Materials and Processes

Material Behavior of Mixed Formulation Solder Joints

Yifei Zhang, Kanth Kurumaddali, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack

InterPACK 2009; 335-346https://doi.org/10.1115/InterPACK2009-89003

Abstract

View Articletitled, Material Behavior of Mixed Formulation Solder Joints

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Topics: Solder joints , Solders , Alloys , Tin , Ball-Grid-Array packaging , Creep , Mechanical properties , Temperature , Electronics , Manufacturing industry

Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics

Pedro O. Quintero-Aguilo´, Pablo Ca´ceres-Valencia, Ricky Valenti´n, Alfredo Di´az

InterPACK 2009; 347-352https://doi.org/10.1115/InterPACK2009-89029

Abstract

View Articletitled, Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics

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Topics: Electronics , Glass , Compressive stress , Diffusion (Physics) , Heat treating (Metalworking) , Intermetallic compounds , Manufacturing , Materials science , Nickel , Scanning electron microscopy

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

InterPACK 2009; 353-359https://doi.org/10.1115/InterPACK2009-89079

Abstract

View Articletitled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

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Topics: Copper , Mechanical properties , Texture (Materials) , Thin films , Fracture (Materials) , Fatigue strength , Grain boundaries , Brittle fracture , Ductile fracture , Fatigue testing

Cooling Control Using by Emulsified Heat Transfer Medium

Hiroshi Yamasaki, Kei Suzuki, Atsushi Ohashi, Yasushige Ujiie

InterPACK 2009; 361-364https://doi.org/10.1115/InterPACK2009-89117

Abstract

View Articletitled, Cooling Control Using by Emulsified Heat Transfer Medium

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Topics: Cooling , Heat transfer , Emulsions , Water , Heat transfer coefficients , Phase transition temperature , Silicones , Temperature , Wire

A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: The Dependency of Roughness on Mechanical and AE Characteristics

Mitsuyuki Nakayama, Hideto Suzuki

InterPACK 2009; 365-370https://doi.org/10.1115/InterPACK2009-89119

Abstract

View Articletitled, A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: The Dependency of Roughness on Mechanical and AE Characteristics

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Topics: Acoustic emissions , Ceramics , Surface roughness , Bone , Mechanical properties , Elasticity , Fracture mechanics , Speed of sound , Stress , Young's modulus

Electroless Nickel Plating Process Optimization for Aluminum Terminals

Philip Westby, Kevin Mattson, Fred Haring, Jacob Baer, Matt Steele, Syed Sajid Ahmad, Aaron Reinholz

InterPACK 2009; 371-378https://doi.org/10.1115/InterPACK2009-89131

Abstract

View Articletitled, Electroless Nickel Plating Process Optimization for Aluminum Terminals

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Topics: Aluminum , Nickel plating , Optimization , Nickel , Adhesion , Solders , Temperature effects

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Yaoyu Pang, Jie-Hua Zhao, Darvin Edwards

InterPACK 2009; 379-384https://doi.org/10.1115/InterPACK2009-89169

Abstract

View Articletitled, Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

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Topics: Polymers , Stress , Viscoelasticity , Polymer films , Temperature , Temperature profiles , Thermomechanics

Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering

J. Liu, P. Kumar, I. Dutta, R. Raj, M. Renavikar

InterPACK 2009; 385-387https://doi.org/10.1115/InterPACK2009-89194

Abstract

View Articletitled, Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering

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Topics: Sintering , Solders , Grain boundaries , Melting point , Thermal conductivity , Deformation , Design , Tin

Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions

P. Kumar, Z. Huang, I. Dutta, R. Mahajan, M. Renavikar, R. Sidhu

InterPACK 2009; 389-396https://doi.org/10.1115/InterPACK2009-89205

Abstract

View Articletitled, Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions

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Topics: Dynamic testing (Materials) , Fracture (Materials) , Solder joints , Solders , Tin

Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

Xu Zhao, Masumi Saka, Mitsuo Yamashita, Fumiaki Togoh

InterPACK 2009; 397-400https://doi.org/10.1115/InterPACK2009-89282

Abstract

View Articletitled, Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

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Topics: Electrodiffusion , Sputtering (Irradiation) , Diffusion (Physics) , Grain size , Temperature , Ceramics , Current density , Electron field emission , Focused ion beams , Materials properties

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho

InterPACK 2009; 401-409https://doi.org/10.1115/InterPACK2009-89311

Abstract

View Articletitled, Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution

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Topics: Failure , Fracture toughness , Blades , Lasers , Fracture (Materials) , Fracture (Process) , Failure mechanisms , Fractography

Assessment of Alpha Emissivity of Packaging Materials and Method to Improve the Measurement Accuracy

Peng Su, Rick Wong, Shi-Jie Wen, Li Li

InterPACK 2009; 411-416https://doi.org/10.1115/InterPACK2009-89333

Abstract

View Articletitled, Assessment of Alpha Emissivity of Packaging Materials and Method to Improve the Measurement Accuracy

PDF

Topics: Accuracy and precision , Emissivity , Packaging , Manufacturing , Emissions , Errors , Flip-chip devices , Silicon

Evolution of the Stress-Strain and Creep Behavior of Underfill Encapsulants With Aging

Chang Lin, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2009; 417-433https://doi.org/10.1115/InterPACK2009-89371

Abstract

View Articletitled, Evolution of the Stress-Strain and Creep Behavior of Underfill Encapsulants With Aging

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Topics: Creep , Stress

Characterization of Viscoelasticity of Molding Compounds in Time Domain

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho

InterPACK 2009; 435-441https://doi.org/10.1115/InterPACK2009-89388

Abstract

View Articletitled, Characterization of Viscoelasticity of Molding Compounds in Time Domain

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Topics: Molding , Viscoelasticity , Relaxation (Physics) , Polymers , Stress , Microelectronic packaging , Stress analysis (Engineering) , Temperature

Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys

K. Mysore, S. Chavali, D. Chan, G. Subbarayan, I. Dutta, V. Gupta, D. Edwards

InterPACK 2009; 443-450https://doi.org/10.1115/InterPACK2009-89401

Abstract

View Articletitled, Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys

PDF

Topics: Alloys , Flow (Dynamics) , Solders , Steady state , Creep , Temperature , Plasticity , Stress , Geometry , Shear (Mechanics)

MEMS and MEMS Packaging

Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire

Yingwei Jiang, Ronglu Sun, Sonder Wang, Kenny Tan, Youmin Yu, Weimin Chen, Xiao Wei

InterPACK 2009; 451-457https://doi.org/10.1115/InterPACK2009-89046

Abstract

View Articletitled, Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire

PDF

Topics: Aluminum , Copper , Wire , Wire bonding , Reliability , Bonding , Manufacturing , Metals , Cycles , Damage

Novel Miniature DMFC With Monolithic Si Electrodes

Masanori Hayase, Yosuke Saito

InterPACK 2009; 459-462https://doi.org/10.1115/InterPACK2009-89143

Abstract

View Articletitled, Novel Miniature DMFC With Monolithic Si Electrodes

PDF

Topics: Direct methanol fuel cells , Electrodes , Catalysts , Plating , Semiconductor wafers , Energy generation , Engineering prototypes , Fuels , Metals , Methanol

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Benjamin Lemke, Rajashree Baskaran, Oliver Paul

InterPACK 2009; 463-469https://doi.org/10.1115/InterPACK2009-89171

Abstract

View Articletitled, Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

PDF

Topics: Complementary metal oxide semiconductors , Sensors , Stress , Temperature , Uncertainty , Currents , Sensitivity analysis

Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

Ryan T. Marinis, Ryszard J. Pryputniewicz

InterPACK 2009; 471-476https://doi.org/10.1115/InterPACK2009-89222

Abstract

View Articletitled, Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

PDF

Topics: Errors , Rotation , Interferometry , Coriolis force , Excitation , Resonance , Sensors , Shapes

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

J. H. Constable, Michael Stevenson, Ming Hung Hung, Bill Infantolino

InterPACK 2009; 477-484https://doi.org/10.1115/InterPACK2009-89246

Abstract

View Articletitled, Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

PDF

Topics: Actuators , Displacement , Electrical resistivity , Microelectromechanical systems , Silicon , Temperature , Dimensions , Electrical resistance , Feedback , Heat conduction

Optimization of the Tip of Microwave AFM Probe

Yang Ju, Motohiro Hamada, Atsushi Hosoi, Akifumi Fujimoto

InterPACK 2009; 485-490https://doi.org/10.1115/InterPACK2009-89252

Abstract

View Articletitled, Optimization of the Tip of Microwave AFM Probe

PDF

Topics: Atomic force microscopy , Microwaves , Optimization , Probes , Gallium arsenide , Manufacturing , Resolution (Optics) , Waveguides , Cantilevers , Diffraction gratings

An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

Yoon Jin Won, Jae ho Lee, Evelyn N. Wang, Kenneth E. Goodson, Thomas W. Kenny

InterPACK 2009; 491-496https://doi.org/10.1115/InterPACK2009-89257

Abstract

View Articletitled, An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

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Topics: Design , Impingement cooling , Microelectromechanical systems , Optimization , Cooling , Computer cooling , Flow (Dynamics) , Heat transfer , Heat transfer coefficients , Pressure drop

The IP Landscape for MEMS Packaging

Charles E. Bauer, Raymond A. Fillion, Herbert J. Neuhaus, Marc Papageorge

InterPACK 2009; 497-500https://doi.org/10.1115/InterPACK2009-89291

Abstract

View Articletitled, The IP Landscape for MEMS Packaging

PDF

Topics: MEMS packaging , Microelectromechanical systems , Databases , MEMS packages , Microelectronic devices , Patents , Semiconductors (Materials) , Valuation

Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors

Vijay Sarihan, Jian Wen, Gary Li

InterPACK 2009; 501-505https://doi.org/10.1115/InterPACK2009-89330

Abstract

View Articletitled, Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors

PDF

Topics: Microelectromechanical systems , Reliability , Resonance , Sensors

Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

Chandradip Patel, Allen Jones, Joshua Davis, Patrick McCluskey, David Lemus

InterPACK 2009; 507-512https://doi.org/10.1115/InterPACK2009-89370

Abstract

View Articletitled, Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

PDF

Topics: Microelectromechanical systems , Reliability , Sensors , Temperature effects , Temperature , Displacement , Displacement measurement , Fire , High temperature , Resonance

Nanotechnology and NEMS

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

Cemal Basaran, Tarek Ragab

InterPACK 2009; 513-516https://doi.org/10.1115/InterPACK2009-89005

Abstract

View Articletitled, Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

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Topics: Carbon , Damage mechanics , Nanotubes , Tension , Stress , Single-walled carbon nanotubes , Boundary-value problems , Computation , Displacement , Molecular dynamics simulation

Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

Toshiaki Tanaka, Aiko Sato, Hitoshi Asano, Mitsuru Takenaga

InterPACK 2009; 517-520https://doi.org/10.1115/InterPACK2009-89058

Abstract

View Articletitled, Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

PDF

Topics: Chain , Electric fields , Electrodes , Film thickness , Glass , Irradiation (Radiation exposure) , Microscopy , Polymer films , Resonance , Silicon

Evaluation of the Electrical Behavior of Polydisperse and Monodisperse Carbon Nanotube Networks

Roderick Jackson, Samuel Graham

InterPACK 2009; 521-527https://doi.org/10.1115/InterPACK2009-89069

Abstract

View Articletitled, Evaluation of the Electrical Behavior of Polydisperse and Monodisperse Carbon Nanotube Networks

PDF

Topics: Absorption spectra , Carbon nanotubes , Electrical conductivity , Single-walled carbon nanotubes , Single-walled nanotubes

An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management

Omar Sanusi, Randy D. Weinstein, Amy S. Fleischer

InterPACK 2009; 529-533https://doi.org/10.1115/InterPACK2009-89070

Abstract

View Articletitled, An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management

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Topics: Carbon , Phase change materials , Thermal management , Transients (Dynamics) , Electrical conductivity , Thermal conductivity , Design , Displacement , Heat , Heat conduction

Multiscale Modeling of Hot Spots in GaN High Electron Mobility Transistors

Adam Christensen, Samuel Graham

InterPACK 2009; 535-541https://doi.org/10.1115/InterPACK2009-89073

Abstract

View Articletitled, Multiscale Modeling of Hot Spots in GaN High Electron Mobility Transistors

PDF

Topics: Electron mobility , Gallium nitride , Multiscale modeling , Transistors , Phonons , Heat , Diffusion (Physics) , Dimensions , Electromagnetic scattering , Lattice Boltzmann methods

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Feng Gao, Jianmin Qu, Matthew Yao

InterPACK 2009; 543-547https://doi.org/10.1115/InterPACK2009-89099

Abstract

View Articletitled, Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

PDF

Topics: Carbon nanotubes , Contact resistance , Copper , Electron configuration , Density , Electrodes , Electrons , Density functional theory , Electrical properties , Electronics

Thermotunneling Systems for Advanced Efficient Cooling

Mehmet Arik, Stanton Weaver, James W. Bray

InterPACK 2009; 549-556https://doi.org/10.1115/InterPACK2009-89109

Abstract

View Articletitled, Thermotunneling Systems for Advanced Efficient Cooling

PDF

Topics: Cooling , Design , Electronics , Energy generation , Heat transfer , Junctions , Nanoscale devices , Radiation (Physics) , Refrigeration , Temperature

Numerical Calculation for Phonon Properties of a Nano-Porous Si

Koji Miyazaki, Daisuke Nagai, Yohei Kido, Hiroshi Tsukamoto

InterPACK 2009; 557-561https://doi.org/10.1115/InterPACK2009-89118

Abstract

View Articletitled, Numerical Calculation for Phonon Properties of a Nano-Porous Si

PDF

Topics: Phonons , Fourier transforms , Thermal conductivity , Boundary-value problems , Crystals , Density , Heat conduction , Mean free path , Molecular dynamics simulation , Nanostructures

Manipulation of Thin Metallic Wires by Joule Heat Joining

Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka

InterPACK 2009; 563-567https://doi.org/10.1115/InterPACK2009-89122

Abstract

View Articletitled, Manipulation of Thin Metallic Wires by Joule Heat Joining

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Topics: Heat , Joining , Joules , Wire , Electrical properties , Electrodes , Electromagnetic actuators , Heating , Microelectromechanical systems , Nanoelectromechanical systems

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura

InterPACK 2009; 569-574https://doi.org/10.1115/InterPACK2009-89146

Abstract

View Articletitled, Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

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Topics: Carbon , Nanotubes , Resins , Strain measurement , Carbon nanotubes , Electrical resistance , Waves , Electrical conductivity , Thermal conductivity , Thin films

Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher

InterPACK 2009; 575-591https://doi.org/10.1115/InterPACK2009-89208

Abstract

View Articletitled, Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces

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Topics: Heat conduction , Phonons , Superlattices , Engineering simulation , Simulation , Thermal conductivity , Acoustics , Electromagnetic scattering , Equilibrium (Physics) , Germanium

Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV

Jun Taniguchi, Shin-ichi Satake, Noriyuki Unno, Takahiro Kanai

InterPACK 2009; 593-597https://doi.org/10.1115/InterPACK2009-89220

Abstract

View Articletitled, Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV

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Topics: Lithography , Ultraviolet radiation , Resins , Hardening (Curing) , Errors , Fluids , Nanofabrication , Particulate matter , Resolution (Optics) , Shrinkage (Materials)

Enhancement of Condensation Heat Transfer in Micro Systems

Atsushi Tokunaga, Gyoko Nagayama, Takaharu Tsuruta

InterPACK 2009; 599-605https://doi.org/10.1115/InterPACK2009-89234

Abstract

View Articletitled, Enhancement of Condensation Heat Transfer in Micro Systems

PDF

Topics: Condensation , Heat transfer , Microelectromechanical systems , Thermal management , Computers , Condensers (steam plant) , Cooling , Cooling systems , Electronic components , Electronics

A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method

Zhiting Tian, Sang Kim, Ying Sun, Bruce White

InterPACK 2009; 607-615https://doi.org/10.1115/InterPACK2009-89272

Abstract

View Articletitled, A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method

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Topics: Molecular dynamics , Nanocomposites , Phonons , Thermal conductivity , Wave packets , Molecular dynamics simulation , Electromagnetic scattering , Equilibrium (Physics) , Flow (Dynamics) , Heat

Analysis of Nanofluids in Liquid Electronic Cooling Systems

N. A. Roberts, D. G. Walker

InterPACK 2009; 617-622https://doi.org/10.1115/InterPACK2009-89327

Abstract

View Articletitled, Analysis of Nanofluids in Liquid Electronic Cooling Systems

PDF

Topics: Computer cooling , Nanofluids , Fluids , Nanoparticles , Water , Particulate matter , Convection , Cooling , Cooling systems , Damage

Wetting Hysteresis, Metastability, and Droplet Impact on Superhydrophobic Surfaces

Kripa K. Varanasi, Tao Deng, Ming F. Hsu, Nitin Bhate

InterPACK 2009; 623-630https://doi.org/10.1115/InterPACK2009-89350

Abstract

View Articletitled, Wetting Hysteresis, Metastability, and Droplet Impact on Superhydrophobic Surfaces

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Topics: Drops , Wetting , Pressure , Equilibrium (Physics) , Energetics , Surface energy , Surface texture , Water , Water hammer

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics

Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher

InterPACK 2009; 631-635https://doi.org/10.1115/InterPACK2009-89352

Abstract

View Articletitled, Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics

PDF

Topics: Bonding , Carbon nanotubes , Electronics , High temperature , Palladium , Electrical conductance , Temperature , Interface structure , Mechanical stability , Thermal resistance

Photonics and Optics

Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages

Walter W. Yuen, Jianping Tu, Wai-Cheong Tam, Dan Blumenthal

InterPACK 2009; 637-645https://doi.org/10.1115/InterPACK2009-89008

Abstract

View Articletitled, Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages

PDF

Topics: Carbon , Cooling , Design , Heat flux , Testing

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran

InterPACK 2009; 647-654https://doi.org/10.1115/InterPACK2009-89016

Abstract

View Articletitled, Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

PDF

Topics: Interferometry , Nanoscale phenomena , Wavelet transforms , Resolution (Optics) , Tensors , Accelerated life testing , Ball-Grid-Array packaging , Computer software , Design , Dynamic testing (Materials)

Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

Satish C. Chaparala, Lawrence C. Hughes, Jae Kwak, Seungbae Park

InterPACK 2009; 655-663https://doi.org/10.1115/InterPACK2009-89108

Abstract

View Articletitled, Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

PDF

Topics: Gallium arsenide , Lasers , Packaging , Thermomechanics

Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris

InterPACK 2009; 665-671https://doi.org/10.1115/InterPACK2009-89115

Abstract

View Articletitled, Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment

PDF

Topics: Condensation , Gallium arsenide , Lasers

Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

Paul J. Huspeni, Ly Le, Wei Liu, Elli Saravanos, Shannon Adkins

InterPACK 2009; 673-683https://doi.org/10.1115/InterPACK2009-89217

Abstract

View Articletitled, Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

PDF

Topics: Optical fiber , Stress , Fibers , Manufacturing , Maximum likelihood estimation , Failure , Reliability , Statistical analysis , Coating processes , Coatings

Novel Application-Specific LED Packages Integrated With Compact Freeform Lens

Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, Sheng Liu

InterPACK 2009; 685-691https://doi.org/10.1115/InterPACK2009-89335

Abstract

View Articletitled, Novel Application-Specific LED Packages Integrated With Compact Freeform Lens

PDF

Topics: Lenses (Optics) , Packaging , Light-emitting diodes , Roads , Silicones , Computer simulation , Design methodology , Manufacturing , Optics

Reliability

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan

InterPACK 2009; 693-701https://doi.org/10.1115/InterPACK2009-89018

Abstract

View Articletitled, Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

PDF

Topics: Reliability , Semiconductor wafers , Fracture (Materials) , Corners (Structural elements) , Failure , Alloys , Failure mechanisms , Finite element analysis , Solder joints , Solders

Solder Joint Electromigration Mechanisms

Pilin Liu, Fan-yi Ouyang, Shenquan Ou, Zezhong Fu, Goyal Deepak

InterPACK 2009; 703-709https://doi.org/10.1115/InterPACK2009-89023

Abstract

View Articletitled, Solder Joint Electromigration Mechanisms

PDF

Topics: Electrodiffusion , Solder joints , Nucleation (Physics) , Failure mechanisms , Warping

Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

Leila J. Ladani

InterPACK 2009; 711-715https://doi.org/10.1115/InterPACK2009-89083

Abstract

View Articletitled, Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

PDF

Topics: Design , Stress , Thermomechanics , Copper , Finite element analysis , Stiffness , Density , Diffusion (Physics) , Finite element model , Integrated circuits

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

Hideo Koguchi, Masato Nakajima

InterPACK 2009; 717-727https://doi.org/10.1115/InterPACK2009-89091

Abstract

View Articletitled, Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

PDF

Topics: Bonding , Resins , Silicon , Stress , Thermal stresses , Boundary element methods , Delamination , Materials properties , Stress concentration , Cooling

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu

InterPACK 2009; 729-736https://doi.org/10.1115/InterPACK2009-89098

Abstract

View Articletitled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

PDF

Topics: Brittleness , Failure , Lead-free solders , Solders , Solder joints , Brittle fracture , Failure mechanisms , Design , Dynamic testing (Materials) , Finite element analysis

Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

Dominik Herkommer, Jeff Punch, Michael Reid

InterPACK 2009; 737-742https://doi.org/10.1115/InterPACK2009-89105

Abstract

View Articletitled, Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

PDF

Topics: Ball-Grid-Array packaging , Failure , Fatigue , Finite element analysis , Modeling , Solders , Temperature , Testing

Localized High-Resolution Stress Measurements on MEMS Structures

Dietmar Vogel, Astrid Gollhardt, Bernd Michel

InterPACK 2009; 743-747https://doi.org/10.1115/InterPACK2009-89106

Abstract

View Articletitled, Localized High-Resolution Stress Measurements on MEMS Structures

PDF

Topics: Microelectromechanical systems , Resolution (Optics) , Stress , Electron backscatter diffraction , Focused ion beams , Milling , Raman spectroscopy

High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

Satoru Katsurayama, Hironori Tohmyoh, Masumi Saka

InterPACK 2009; 749-753https://doi.org/10.1115/InterPACK2009-89148

Abstract

View Articletitled, High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

PDF

Topics: Flip-chip packages , Warping , Reliability , Cycles , Manufacturing , Stress

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata

InterPACK 2009; 755-759https://doi.org/10.1115/InterPACK2009-89152

Abstract

View Articletitled, Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

PDF

Topics: Event history analysis , Flip-chip packages , Fatigue life , Finite element analysis , Viscoelasticity , Cooling , Solders , Warping

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

InterPACK 2009; 761-769https://doi.org/10.1115/InterPACK2009-89155

Abstract

View Articletitled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

PDF

Topics: Fatigue cracks , Nondestructive evaluation , Solder joints , Synchrotron radiation , Tin , X-rays , Solders , Crack propagation , Cycles , Computerized tomography

Reliable Power Electronics for Wind Turbines

Patrick McCluskey, Peter Hansen, Douglas DeVoto

InterPACK 2009; 771-773https://doi.org/10.1115/InterPACK2009-89174

Abstract

View Articletitled, Reliable Power Electronics for Wind Turbines

PDF

Topics: Electronics , Wind turbines , Electronic systems , Failure , Fatigue , Packaging , Heat , Temperature , Bonding , Ceramics

Pb-Free Thin Small Outline Package (TSOP) Board Level Reliability Study

Weidong Xie, Kuo-Chuan Liu, Mark Brillhart

InterPACK 2009; 775-780https://doi.org/10.1115/InterPACK2009-89183

Abstract

View Articletitled, Pb-Free Thin Small Outline Package (TSOP) Board Level Reliability Study

PDF

Topics: Reliability , Lead-free solders , Solders , Ball-Grid-Array packaging , Finite element analysis , Solder joints , Stress , Testing , Cycles , Failure

Virtual Qualification Using Field Life Temperature Data

Patrick McCluskey, Peter Hansen, Christian Lenakakis, Wolfgang Wondrak

InterPACK 2009; 781-787https://doi.org/10.1115/InterPACK2009-89184

Abstract

View Articletitled, Virtual Qualification Using Field Life Temperature Data

PDF

Topics: Temperature , Automotive engines , Cycles , Engines , Failure , Physics , Testing

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2009; 789-796https://doi.org/10.1115/InterPACK2009-89209

Abstract

View Articletitled, Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

PDF

Topics: Flip-chip , Flip-chip devices , Hardening (Curing) , Laminates , Mechanical behavior , Reliability , Stress-strain curves

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi

InterPACK 2009; 797-802https://doi.org/10.1115/InterPACK2009-89232

Abstract

View Articletitled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

PDF

Topics: Ball-Grid-Array packages , Fracture (Materials) , Solder joints , Solders , Crack propagation , Shapes , Finite element analysis , Particulate matter , Stiffness , Deformation

Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

Y. S. Chan, C. Yang, S. W. Ricky Lee

InterPACK 2009; 803-807https://doi.org/10.1115/InterPACK2009-89260

Abstract

View Articletitled, Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

PDF

Topics: Ball-Grid-Array packaging , Fatigue life , Solders , Stress , Solder joints , Copper , Creep , Cycles , Manufacturing , Relaxation (Physics)

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori

InterPACK 2009; 809-814https://doi.org/10.1115/InterPACK2009-89262

Abstract

View Articletitled, Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

PDF

Topics: Fatigue cracks , Solder joints , Tin , Cycles , Fatigue damage , Fracture (Materials) , Printed circuit boards , Resistors , Scanning electron microscopes , Solders

Hygro-Mechanical Analysis of LCD Panels

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki

InterPACK 2009; 815-824https://doi.org/10.1115/InterPACK2009-89267

Abstract

View Articletitled, Hygro-Mechanical Analysis of LCD Panels

PDF

Topics: Adhesives , Boundary layers , Deformation , Diffusion (Physics) , Finite element methods , Gas laws (Thermodynamics) , Glass , Liquid crystals , Manufacturing , Plates (structures)

Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

Kisho Ashida, Kenya Kawano, Naotaka Tanaka, Atsushi Nishikizawa, Nobuya Koike

InterPACK 2009; 825-831https://doi.org/10.1115/InterPACK2009-89273

Abstract

View Articletitled, Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

PDF

Topics: Adhesives , Bonding , Reflow soldering , Silver , Fracture (Process) , Fracture toughness , Copper , Failure , Resins , Stress

Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature

Hiroyuki Nakano, Yasuhiro Ejiri, Takao Mori, Toshihiko Sayama, Takeshi Takayanagi, Yoshiyuki Okamoto

InterPACK 2009; 833-839https://doi.org/10.1115/InterPACK2009-89275

Abstract

View Articletitled, Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature

PDF

Topics: Solder joints , Temperature , Tin , Creep , Fatigue cracks , Corners (Structural elements) , Cycles , Finite element analysis , Finite element methods , Fracture (Materials)

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Kok Ee Tan, John H. L. Pang

InterPACK 2009; 841-847https://doi.org/10.1115/InterPACK2009-89278

Abstract

View Articletitled, Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

PDF

Topics: Lead-free solders , Solders , Yield stress , Stress-strain curves , Bone , Constitutive equations , Deformation , Elastic moduli , Finite element analysis , Mechanical properties

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara

InterPACK 2009; 849-855https://doi.org/10.1115/InterPACK2009-89284

Abstract

View Articletitled, Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

PDF

Topics: Reliability , Shear (Mechanics) , Temperature , Finite element analysis , Cycles , Displacement , Fatigue , Gallium nitride , Stress , Circuits

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling

InterPACK 2009; 857-871https://doi.org/10.1115/InterPACK2009-89298

Abstract

View Articletitled, Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

PDF

Topics: Electronics , Shock (Mechanics) , Vibration , Failure , Damage , Solders , Principal component analysis , Failure mechanisms , Fracture (Process) , Alloys

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Pradeep Lall, Rahul Vaidya, Vikrant More, Jeff Suhling, Kai Goebel

InterPACK 2009; 873-885https://doi.org/10.1115/InterPACK2009-89299

Abstract

View Articletitled, Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

PDF

Topics: Damage , Electronics , Service life (Equipment) , Thermomechanics , Algorithms , Alloys , Circuits , Condition monitoring , Delamination , Fracture (Materials)

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni, Jeff Suhling

InterPACK 2009; 887-901https://doi.org/10.1115/InterPACK2009-89307

Abstract

View Articletitled, Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

PDF

Topics: Damage , Electronics , Shock (Mechanics) , Alloys , Failure mechanisms , Solders , Transients (Dynamics) , Failure , Finite element analysis , Reliability

Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads

Pradeep Lall, Ryan Lowe, Jeff Suhling, Kai Goebel

InterPACK 2009; 903-914https://doi.org/10.1115/InterPACK2009-89308

Abstract

View Articletitled, Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads

PDF

Topics: Electrochemical impedance spectroscopy , Electronics , Shock (Mechanics) , Stress , Vibration , Damage , Spectroscopy , Failure , Solders , Condition monitoring

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

Karl J. L. Geisler

InterPACK 2009; 915-920https://doi.org/10.1115/InterPACK2009-89312

Abstract

View Articletitled, Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

PDF

Topics: Coatings , Fatigue , Solders , Fatigue life , Failure , Failure data , Shapes , Solder joints , Temperature , Urethane elastomers

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

C. H. Chen, W. L. Tsai, C. Y. Tang, M. Y. Tsai

InterPACK 2009; 921-927https://doi.org/10.1115/InterPACK2009-89337

Abstract

View Articletitled, Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

PDF

Topics: Junctions , Reliability , Temperature , Thermal resistance

Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application That is Suitable to a Low-Cost, Fine Pitch and Easy Fabrication

Junehyeon Ahn, Hongkwon Kim, Kangho Byun, Youngmin Lee, Donghoon Jang, Byungsung Kim

InterPACK 2009; 929-935https://doi.org/10.1115/InterPACK2009-89339

Abstract

View Articletitled, Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application That is Suitable to a Low-Cost, Fine Pitch and Easy Fabrication

PDF

Topics: Manufacturing , Nickel , Palladium , Surface finishing , Ball-Grid-Array packaging , Solder joints , Chain , Data acquisition , Data acquisition systems , Failure

Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices

Hiromi Sugihara, Masanori Yamagiwa, Masato Fujita, Toshikazu Oshidari, Qiang Yu

InterPACK 2009; 937-943https://doi.org/10.1115/InterPACK2009-89342

Abstract

View Articletitled, Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices

PDF

Topics: Fatigue , Reliability , Temperature , Finite element analysis , Nickel plating , Circuits , Cooling , Cycles , Electric vehicles , Electronics

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

Kayleen L. E. Helms, Ketan R. Shah, Dan Gerbus, Vasu S. Vasudevan, Jagadeesh Radhakrishnan, Will Berry

InterPACK 2009; 945-951https://doi.org/10.1115/InterPACK2009-89347

Abstract

View Articletitled, The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

PDF

Topics: Ball-Grid-Array packaging , Damage , Electronic packages , Flip-chip , Shock (Mechanics) , Design , Risk , Solder joints , Accelerated life testing , Alloys

Deformation of Resin Material Due to Curing in the Thermal Process

Ryusuke Sone, Qiang Yu, Tadahiro Shibutani

InterPACK 2009; 953-958https://doi.org/10.1115/InterPACK2009-89353

Abstract

View Articletitled, Deformation of Resin Material Due to Curing in the Thermal Process

PDF

Topics: Deformation , Hardening (Curing) , Resins , Warping , Reliability , Strength (Materials) , Stress

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2009; 959-976https://doi.org/10.1115/InterPACK2009-89373

Abstract

View Articletitled, Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

PDF

Topics: Alloys , Mechanical behavior , Reliability , Temperature , Creep , Solders , Lead-free solders , Failure , Silver , Accelerated life testing

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Jordan Roberts, M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Ron Zhang

InterPACK 2009; 977-988https://doi.org/10.1115/InterPACK2009-89383

Abstract

View Articletitled, Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

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Topics: Flip-chip , Flip-chip devices , Packaging , Stress , Sensors , Ceramics , Adhesives , Cycles , Manufacturing , Silicon

High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and Its Influence on the Fracture Location Within Solder Joints

Dennis Chan, Xu Nie, Dhruv Bhate, Ganesh Subbarayan, Indranath Dutta

InterPACK 2009; 989-995https://doi.org/10.1115/InterPACK2009-89404

Abstract

View Articletitled, High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and Its Influence on the Fracture Location Within Solder Joints

PDF

Topics: Alloys , Fracture (Materials) , Fracture (Process) , Solder joints , Solders , Failure , Intermetallic compounds , Engineering simulation , Failure mechanisms , Fatigue failure

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