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Proceedings Papers

ASME 2007 InterPACK Conference, Volume 1

Advanced Wafer Level Packing

InterPACK 2007; 11-17doi:https://doi.org/10.1115/IPACK2007-33464
InterPACK 2007; 19-24doi:https://doi.org/10.1115/IPACK2007-33971

Characterization and Reliability

InterPACK 2007; 25-30doi:https://doi.org/10.1115/IPACK2007-33046
InterPACK 2007; 31-36doi:https://doi.org/10.1115/IPACK2007-33214
InterPACK 2007; 37-42doi:https://doi.org/10.1115/IPACK2007-33503
InterPACK 2007; 43-49doi:https://doi.org/10.1115/IPACK2007-33666
InterPACK 2007; 51-58doi:https://doi.org/10.1115/IPACK2007-33826

MEMS Packaging

InterPACK 2007; 59-66doi:https://doi.org/10.1115/IPACK2007-33716
InterPACK 2007; 67-72doi:https://doi.org/10.1115/IPACK2007-33850
InterPACK 2007; 73-77doi:https://doi.org/10.1115/IPACK2007-33887

Models for Thermomechanical Reliability

InterPACK 2007; 79-85doi:https://doi.org/10.1115/IPACK2007-33204
InterPACK 2007; 87-94doi:https://doi.org/10.1115/IPACK2007-33319
InterPACK 2007; 95-99doi:https://doi.org/10.1115/IPACK2007-33510
InterPACK 2007; 101-116doi:https://doi.org/10.1115/IPACK2007-33876
InterPACK 2007; 117-122doi:https://doi.org/10.1115/IPACK2007-33991

Novel/Alternative Electronics Cooling Concepts and Technologies

InterPACK 2007; 123-128doi:https://doi.org/10.1115/IPACK2007-33188
InterPACK 2007; 129-135doi:https://doi.org/10.1115/IPACK2007-33330
InterPACK 2007; 137-145doi:https://doi.org/10.1115/IPACK2007-33829
InterPACK 2007; 147-154doi:https://doi.org/10.1115/IPACK2007-33886

Micro/Nano-Scale Heat Transfer in Electronics Equipment

InterPACK 2007; 155-162doi:https://doi.org/10.1115/IPACK2007-33269
InterPACK 2007; 163-169doi:https://doi.org/10.1115/IPACK2007-33291
InterPACK 2007; 171-177doi:https://doi.org/10.1115/IPACK2007-33305
InterPACK 2007; 179-184doi:https://doi.org/10.1115/IPACK2007-33484
InterPACK 2007; 185-191doi:https://doi.org/10.1115/IPACK2007-33502
InterPACK 2007; 193-197doi:https://doi.org/10.1115/IPACK2007-33573
InterPACK 2007; 199-209doi:https://doi.org/10.1115/IPACK2007-33636

Thermal Modeling/Characterization of Electronic Systems

InterPACK 2007; 211-216doi:https://doi.org/10.1115/IPACK2007-33070
InterPACK 2007; 217-226doi:https://doi.org/10.1115/IPACK2007-33183
InterPACK 2007; 227-232doi:https://doi.org/10.1115/IPACK2007-33534
InterPACK 2007; 233-239doi:https://doi.org/10.1115/IPACK2007-33705
InterPACK 2007; 241-247doi:https://doi.org/10.1115/IPACK2007-33707
InterPACK 2007; 249-253doi:https://doi.org/10.1115/IPACK2007-33879
InterPACK 2007; 255-266doi:https://doi.org/10.1115/IPACK2007-33892
InterPACK 2007; 267-272doi:https://doi.org/10.1115/IPACK2007-33898
InterPACK 2007; 273-276doi:https://doi.org/10.1115/IPACK2007-33913

Advanced Characterization Methodology

InterPACK 2007; 277-284doi:https://doi.org/10.1115/IPACK2007-33533
InterPACK 2007; 285-295doi:https://doi.org/10.1115/IPACK2007-33569
InterPACK 2007; 297-307doi:https://doi.org/10.1115/IPACK2007-33570
InterPACK 2007; 309-317doi:https://doi.org/10.1115/IPACK2007-33629

Thermal Phenomena in MEMS

InterPACK 2007; 319-326doi:https://doi.org/10.1115/IPACK2007-33094
InterPACK 2007; 327-333doi:https://doi.org/10.1115/IPACK2007-33571
InterPACK 2007; 335-342doi:https://doi.org/10.1115/IPACK2007-33756
InterPACK 2007; 343-350doi:https://doi.org/10.1115/IPACK2007-33769

Interconnect Reliability Models

InterPACK 2007; 351-358doi:https://doi.org/10.1115/IPACK2007-33123
InterPACK 2007; 359-364doi:https://doi.org/10.1115/IPACK2007-33247
InterPACK 2007; 365-374doi:https://doi.org/10.1115/IPACK2007-33542
InterPACK 2007; 375-380doi:https://doi.org/10.1115/IPACK2007-33820

Thermal Interface Materials and Spreaders

InterPACK 2007; 381-388doi:https://doi.org/10.1115/IPACK2007-33026
InterPACK 2007; 389-397doi:https://doi.org/10.1115/IPACK2007-33028
InterPACK 2007; 399-403doi:https://doi.org/10.1115/IPACK2007-33383
InterPACK 2007; 405-414doi:https://doi.org/10.1115/IPACK2007-33554
InterPACK 2007; 415-422doi:https://doi.org/10.1115/IPACK2007-33702

Thermal Management for Advanced Packaging

InterPACK 2007; 423-427doi:https://doi.org/10.1115/IPACK2007-33023
InterPACK 2007; 429-433doi:https://doi.org/10.1115/IPACK2007-33334
InterPACK 2007; 435-437doi:https://doi.org/10.1115/IPACK2007-33474
InterPACK 2007; 439-452doi:https://doi.org/10.1115/IPACK2007-33619

Inspection and Testing

InterPACK 2007; 453-457doi:https://doi.org/10.1115/IPACK2007-33017
InterPACK 2007; 459-467doi:https://doi.org/10.1115/IPACK2007-33067
InterPACK 2007; 469-472doi:https://doi.org/10.1115/IPACK2007-33178
InterPACK 2007; 473-479doi:https://doi.org/10.1115/IPACK2007-33257
InterPACK 2007; 481-488doi:https://doi.org/10.1115/IPACK2007-33268

Mechanical Effects in MEMS

InterPACK 2007; 489-497doi:https://doi.org/10.1115/IPACK2007-33124
InterPACK 2007; 499-504doi:https://doi.org/10.1115/IPACK2007-33234
InterPACK 2007; 505-508doi:https://doi.org/10.1115/IPACK2007-33493
InterPACK 2007; 509-513doi:https://doi.org/10.1115/IPACK2007-33871

Lead Free Reliability

InterPACK 2007; 515-521doi:https://doi.org/10.1115/IPACK2007-33095
InterPACK 2007; 523-529doi:https://doi.org/10.1115/IPACK2007-33170
InterPACK 2007; 531-537doi:https://doi.org/10.1115/IPACK2007-33250
InterPACK 2007; 539-546doi:https://doi.org/10.1115/IPACK2007-33271
InterPACK 2007; 547-552doi:https://doi.org/10.1115/IPACK2007-33349
InterPACK 2007; 553-556doi:https://doi.org/10.1115/IPACK2007-33456
InterPACK 2007; 557-562doi:https://doi.org/10.1115/IPACK2007-33543
InterPACK 2007; 563-579doi:https://doi.org/10.1115/IPACK2007-33545
InterPACK 2007; 581-590doi:https://doi.org/10.1115/IPACK2007-33597
InterPACK 2007; 591-594doi:https://doi.org/10.1115/IPACK2007-33902

Heat Sink Modeling and Characterization

InterPACK 2007; 595-599doi:https://doi.org/10.1115/IPACK2007-33089
InterPACK 2007; 601-606doi:https://doi.org/10.1115/IPACK2007-33167
InterPACK 2007; 607-617doi:https://doi.org/10.1115/IPACK2007-33215
InterPACK 2007; 619-625doi:https://doi.org/10.1115/IPACK2007-33216
InterPACK 2007; 627-636doi:https://doi.org/10.1115/IPACK2007-33256
InterPACK 2007; 637-642doi:https://doi.org/10.1115/IPACK2007-33968
InterPACK 2007; 643-652doi:https://doi.org/10.1115/IPACK2007-33975
InterPACK 2007; 653-661doi:https://doi.org/10.1115/IPACK2007-33983

Heat Pipe/Thermosyphons for Electronics Cooling

InterPACK 2007; 663-668doi:https://doi.org/10.1115/IPACK2007-33161
InterPACK 2007; 669-676doi:https://doi.org/10.1115/IPACK2007-33246
InterPACK 2007; 677-687doi:https://doi.org/10.1115/IPACK2007-33249
InterPACK 2007; 689-693doi:https://doi.org/10.1115/IPACK2007-33337
Topics: Heat pipes
InterPACK 2007; 695-702doi:https://doi.org/10.1115/IPACK2007-33611
InterPACK 2007; 703-705doi:https://doi.org/10.1115/IPACK2007-33779
InterPACK 2007; 707-714doi:https://doi.org/10.1115/IPACK2007-33984
InterPACK 2007; 715-722doi:https://doi.org/10.1115/IPACK2007-33993

Data Center Thermal Management

InterPACK 2007; 723-731doi:https://doi.org/10.1115/IPACK2007-33000
InterPACK 2007; 733-741doi:https://doi.org/10.1115/IPACK2007-33129
InterPACK 2007; 743-750doi:https://doi.org/10.1115/IPACK2007-33176
InterPACK 2007; 751-755doi:https://doi.org/10.1115/IPACK2007-33338
InterPACK 2007; 757-764doi:https://doi.org/10.1115/IPACK2007-33428
InterPACK 2007; 765-771doi:https://doi.org/10.1115/IPACK2007-33432
InterPACK 2007; 773-779doi:https://doi.org/10.1115/IPACK2007-33443
InterPACK 2007; 781-789doi:https://doi.org/10.1115/IPACK2007-33447
InterPACK 2007; 791-802doi:https://doi.org/10.1115/IPACK2007-33463
InterPACK 2007; 803-818doi:https://doi.org/10.1115/IPACK2007-33507
InterPACK 2007; 819-826doi:https://doi.org/10.1115/IPACK2007-33508
InterPACK 2007; 827-836doi:https://doi.org/10.1115/IPACK2007-33540
InterPACK 2007; 837-843doi:https://doi.org/10.1115/IPACK2007-33574
InterPACK 2007; 845-849doi:https://doi.org/10.1115/IPACK2007-33672
InterPACK 2007; 851-857doi:https://doi.org/10.1115/IPACK2007-33700
InterPACK 2007; 859-870doi:https://doi.org/10.1115/IPACK2007-33848
InterPACK 2007; 871-876doi:https://doi.org/10.1115/IPACK2007-33899
InterPACK 2007; 877-886doi:https://doi.org/10.1115/IPACK2007-33924

Assembly and Process

InterPACK 2007; 887-894doi:https://doi.org/10.1115/IPACK2007-33044
InterPACK 2007; 895-900doi:https://doi.org/10.1115/IPACK2007-33194
InterPACK 2007; 901-907doi:https://doi.org/10.1115/IPACK2007-33243
InterPACK 2007; 909-915doi:https://doi.org/10.1115/IPACK2007-33255
InterPACK 2007; 917-922doi:https://doi.org/10.1115/IPACK2007-33678
InterPACK 2007; 923-930doi:https://doi.org/10.1115/IPACK2007-33691
InterPACK 2007; 931-936doi:https://doi.org/10.1115/IPACK2007-33808
InterPACK 2007; 937-943doi:https://doi.org/10.1115/IPACK2007-33857
InterPACK 2007; 945-952doi:https://doi.org/10.1115/IPACK2007-33963

MEMS Processing and Fabrication

InterPACK 2007; 953-962doi:https://doi.org/10.1115/IPACK2007-33013
InterPACK 2007; 963-966doi:https://doi.org/10.1115/IPACK2007-33613
InterPACK 2007; 967-969doi:https://doi.org/10.1115/IPACK2007-33824
InterPACK 2007; 971-977doi:https://doi.org/10.1115/IPACK2007-33986
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