Proceedings Papers

Advanced Wafer Level Packing

Design Optimization of a Wafer Level Package for Surface Acoustic Wave Filters

Jupyo Hong, Shan Gao, Job Ha, Sijoong Yang, Ingoo Kang, Taehoon Kim, Seogmoon Choi, Sung Yi

InterPACK 2007; 1-5https://doi.org/10.1115/IPACK2007-33031

Abstract

View Articletitled, Design Optimization of a Wafer Level Package for Surface Acoustic Wave Filters

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Topics: Design , Filters , Optimization , Semiconductor wafers , Surface acoustic waves , Finite element methods , Reliability , Packaging , Copper , Stress

Assembly Cost Reduction With Wafer Level Die Attach Film

Stewart Dunlap

InterPACK 2007; 7-9https://doi.org/10.1115/IPACK2007-33121

Abstract

View Articletitled, Assembly Cost Reduction With Wafer Level Die Attach Film

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Topics: Manufacturing , Semiconductor wafers , Adhesives , Lamination , Silicon

Electrical, Optical and Thermofluidic Chip I/O Interconnections

Muhannad S. Bakir, Bing Dang, James D. Meindl

InterPACK 2007; 11-17https://doi.org/10.1115/IPACK2007-33464

Abstract

View Articletitled, Electrical, Optical and Thermofluidic Chip I/O Interconnections

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Topics: Complementary metal oxide semiconductors , Coolants , Cooling , Flip-chip , Heat sinks , Manufacturing , Microchannels , Microfluidics , Microscale devices , Silicon

Screen-Printing of Yellow Phosphor Powder on Blue Light Emitting Diode (LED) Arrays for White Light Illumination

K. H. Lee, S. W. Ricky Lee

InterPACK 2007; 19-24https://doi.org/10.1115/IPACK2007-33971

Abstract

View Articletitled, Screen-Printing of Yellow Phosphor Powder on Blue Light Emitting Diode (LED) Arrays for White Light Illumination

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Topics: Light-emitting diodes , Phosphors , Printing , Coating processes , Coatings , Circuit design , Density , Manufacturing , Packing (Shipments) , Packings (Cushioning)

Characterization and Reliability

On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires

C. J. Hang, I. Lum, J. Lee, M. Mayer, Y. Zhou, C. Q. Wang, S. J. Hong, S. M. Lee

InterPACK 2007; 25-30https://doi.org/10.1115/IPACK2007-33046

Abstract

View Articletitled, On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires

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Topics: Bonding , Copper , Wire

Failure Analysis of Contact Probe Pins for SnPb and Sn Applications

Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta

InterPACK 2007; 31-36https://doi.org/10.1115/IPACK2007-33214

Abstract

View Articletitled, Failure Analysis of Contact Probe Pins for SnPb and Sn Applications

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Topics: Failure analysis , Pins (Engineering) , Probes , Tin , Failure , Inspection , Wear , Contact resistance , Failure mechanisms , Surface roughness

Quantitative Characterization of Microsystem Dynamics

Ryszard J. Pryputniewicz, Emily J. Pryputniewicz

InterPACK 2007; 37-42https://doi.org/10.1115/IPACK2007-33503

Abstract

View Articletitled, Quantitative Characterization of Microsystem Dynamics

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Topics: Dynamics (Mechanics) , Microelectromechanical systems , Stress

Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes

Guhan Subbarayan, Robert Kinyanjui, Pei Fang Tsai, Krishnaswami Srihari

InterPACK 2007; 43-49https://doi.org/10.1115/IPACK2007-33666

Abstract

View Articletitled, Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes

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Topics: Finishes , Reliability , Tin , Testing , Hazardous substances , Integrated circuits , Intermetallic compounds , Lumber , Nickel , Optical microscopes

Mold Adhesion Force Measurement

Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, Yeong-Jyh Lin

InterPACK 2007; 51-58https://doi.org/10.1115/IPACK2007-33826

Abstract

View Articletitled, Mold Adhesion Force Measurement

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Topics: Adhesion , Force measurement , Coatings , Molding , Engineers , Instrumentation , Temperature , Foundry coatings , Surface finishing , Cavities

MEMS Packaging

Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer

A. Goswami, B. Han, Suk-Jin Ham, Byung-Gil Jeong

InterPACK 2007; 59-66https://doi.org/10.1115/IPACK2007-33716

Abstract

View Articletitled, Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer

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Topics: Helium , Leakage , Mass spectrometers

Die and Wafer-Level Hermetic Sealing for MEMS Applications

Abiodun A. Fasoro, Praveen Pandojirao-S., Dan O. Popa, Harry E. Stephanou, Dereje A. Agonafer

InterPACK 2007; 67-72https://doi.org/10.1115/IPACK2007-33850

Abstract

View Articletitled, Die and Wafer-Level Hermetic Sealing for MEMS Applications

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Topics: Microelectromechanical systems , Packaging , Reliability , Sealing (Process) , Semiconductor wafers

A Stamp-Sealed Microshell Package for RF MEMS Switches

John Heck, Hanan Bar, Tsung-Kuan A. Chou, Quan Tran, Qing Ma, Boaz Weinfeld, Valluri Rao

InterPACK 2007; 73-77https://doi.org/10.1115/IPACK2007-33887

Abstract

View Articletitled, A Stamp-Sealed Microshell Package for RF MEMS Switches

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Topics: Microelectromechanical systems , Switches , Semiconductor wafers , Manufacturing , Sealing (Process) , Tunnels , Bonding , Embossing , Metal stamping , Packaging

Models for Thermomechanical Reliability

On the Multiscale Finite Element Analysis for Interfacial Fracture in Cu/Low-K Interconnects

Tz-Cheng Chiu, Huang-Chun Lin

InterPACK 2007; 79-85https://doi.org/10.1115/IPACK2007-33204

Abstract

View Articletitled, On the Multiscale Finite Element Analysis for Interfacial Fracture in Cu/Low-K Interconnects

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Topics: Finite element analysis , Fracture (Materials) , Thin films , Fracture mechanics , Errors , Etching , Flip-chip packages , Integrated circuits , Modeling , Multiscale modeling

Shape Prediction of Molten Micro-Solder Joints Using Particle Method and Application to Evaluation of Fracture Life

Hisashi Tanie

InterPACK 2007; 87-94https://doi.org/10.1115/IPACK2007-33319

Abstract

View Articletitled, Shape Prediction of Molten Micro-Solder Joints Using Particle Method and Application to Evaluation of Fracture Life

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Topics: Fracture (Materials) , Particulate matter , Shapes , Solders , Crack propagation , Topology , Deformation , Lead-free solders , Solder joints , Finite element analysis

DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses

Ming-Che Hsieh, Wei Lee

InterPACK 2007; 95-99https://doi.org/10.1115/IPACK2007-33510

Abstract

View Articletitled, DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses

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Topics: Geometry , Stress , Copper , Finite element analysis , Dimensions , Dielectric materials , Response surface methodology , Design , Design methodology , Experimental design

Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

Pradeep Lall, Madhura Hande, Chandan Bhat, Jeff Suhling

InterPACK 2007; 101-116https://doi.org/10.1115/IPACK2007-33876

Abstract

View Articletitled, Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

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Topics: Electronics , Packaging , Reliability , Stress , Thermomechanics , Failure , Damage , Algorithms , Architecture , Automotive safety

Optimization of Copper Column Flip Chip Packages Incorporating a Variable Interconnect Compliance Configuration

Andrew A. O. Tay, Siow Ling Ho

InterPACK 2007; 117-122https://doi.org/10.1115/IPACK2007-33991

Abstract

View Articletitled, Optimization of Copper Column Flip Chip Packages Incorporating a Variable Interconnect Compliance Configuration

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Topics: Copper , Flip-chip packages , Optimization , Solder joints , Creep , Fatigue life , Reliability , Finite element analysis , Semiconductor wafers

Novel/Alternative Electronics Cooling Concepts and Technologies

Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows

Mehmet Arik, Yogen Utturkar, Mustafa Gursoy

InterPACK 2007; 123-128https://doi.org/10.1115/IPACK2007-33188

Abstract

View Articletitled, Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows

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Topics: Buoyancy , Cooling , Flow (Dynamics) , Gravity (Force) , Heat transfer , Boundary layers , Convection , Cross-flow , Energy dissipation , Heat

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy

InterPACK 2007; 129-135https://doi.org/10.1115/IPACK2007-33330

Abstract

View Articletitled, Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

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Topics: Chain , Flow (Dynamics) , Temperature , Temperature distribution , Biomedical microelectromechanical systems , Liquid crystals , Copper , Thermal management , Thermocouples , Thin films

Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems

Fred K. Forster, Travis Walter

InterPACK 2007; 137-145https://doi.org/10.1115/IPACK2007-33829

Abstract

View Articletitled, Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems

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Topics: Cooling systems , Design , Micropumps , Optimization , Valves , Pumps , Flow (Dynamics) , Pressure , Stress , Actuators

A Novel Airflow Management System With Redundant Fan Field Replaceable Units

Younes Shabany

InterPACK 2007; 147-154https://doi.org/10.1115/IPACK2007-33886

Abstract

View Articletitled, A Novel Airflow Management System With Redundant Fan Field Replaceable Units

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Topics: Air flow , Fans , Cooling , Computational fluid dynamics , Engineering simulation , Exhaust systems , Simulation

Micro/Nano-Scale Heat Transfer in Electronics Equipment

Study of Heat Transfer in Microscale Systems

Ryszard J. Pryputniewicz, Dariusz R. Pryputniewicz

InterPACK 2007; 155-162https://doi.org/10.1115/IPACK2007-33269

Abstract

View Articletitled, Study of Heat Transfer in Microscale Systems

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Topics: Gallium arsenide , Heat transfer , Microelectromechanical systems , Microscale devices , Thermal analysis

Measurements of Microjet Cooling and Phase Change Characteristics Using Microcantilever Heaters

Jungchul Lee, Hanif Hunter, Fabian Goericke, Nisarga Naik, Mark Allen, Ari Glezer, William P. King

InterPACK 2007; 163-169https://doi.org/10.1115/IPACK2007-33291

Abstract

View Articletitled, Measurements of Microjet Cooling and Phase Change Characteristics Using Microcantilever Heaters

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Topics: Boiling , Cooling , Flow (Dynamics) , Flux (Metallurgy) , Heat , Microcantilevers , Critical heat flux , Metrology , Micromachining , Microscale devices

Temperature Dependent Phonon Lifetimes and Decay Pathways in Hexagonal Gallium Nitride

Thomas Beechem, Samuel Graham

InterPACK 2007; 171-177https://doi.org/10.1115/IPACK2007-33305

Abstract

View Articletitled, Temperature Dependent Phonon Lifetimes and Decay Pathways in Hexagonal Gallium Nitride

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Topics: Gallium nitride , Phonons , Temperature , Electromagnetic scattering , Radiation scattering , Scattering (Physics) , Uncertainty

Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink

Roger Flynn, Ching-Hsiang Cheng, Kenneth Goodson

InterPACK 2007; 179-184https://doi.org/10.1115/IPACK2007-33484

Abstract

View Articletitled, Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink

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Topics: Boiling , Cooling , Flow (Dynamics) , Heat sinks , Microchannels , Thermal resistance , Convection , Design , Flow instability , Microfluidics

Thermal Management in RF MEMS Ohmic Switches

Ryszard J. Pryputniewicz

InterPACK 2007; 185-191https://doi.org/10.1115/IPACK2007-33502

Abstract

View Articletitled, Thermal Management in RF MEMS Ohmic Switches

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Topics: Heat , Joules , Microelectromechanical systems , Switches , Thermal analysis , Thermal management

Thermal Characterization of Micro-Channels Heat Exchanger for High-End Processors

Khalid Sheltami, Gamal Refai-Ahmed

InterPACK 2007; 193-197https://doi.org/10.1115/IPACK2007-33573

Abstract

View Articletitled, Thermal Characterization of Micro-Channels Heat Exchanger for High-End Processors

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Topics: Heat exchangers , Microchannels , Thermal characterization , Cooling , Computational fluid dynamics , Engineering simulation , Heat flux , Heat transfer coefficients , Junctions , Semiconductor devices

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Waqar A. Khan, Michael M. Yovanovich

InterPACK 2007; 199-209https://doi.org/10.1115/IPACK2007-33636

Abstract

View Articletitled, Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

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Topics: Fluid dynamics , Heat sinks , Heat transfer , Modeling , Momentum , Viscosity , Boundary-value problems , Flow (Dynamics) , Fluids , Forced convection

Thermal Modeling/Characterization of Electronic Systems

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

Frank Fan Wang

InterPACK 2007; 211-216https://doi.org/10.1115/IPACK2007-33070

Abstract

View Articletitled, Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

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Topics: Cooling , Ducts , Electronic equipment , Design , Aerospace industry , Air flow , Buoyancy , Computational fluid dynamics , Electronics , Failure

Numerical and Experimental Analysis for Air Circulation and Cooling Performance in a Cell Cabinet

Jiahui Zhang, Jason Waggel, Dave Weber, Tony Pollice

InterPACK 2007; 217-226https://doi.org/10.1115/IPACK2007-33183

Abstract

View Articletitled, Numerical and Experimental Analysis for Air Circulation and Cooling Performance in a Cell Cabinet

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Topics: Computational fluid dynamics , Cooling , Experimental analysis , Flow (Dynamics) , Heat exchangers , Temperature , Air flow , Simulation models , Coolants , Electronic components

Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure

Chan-Yen Chou, Chung-Jung Wu, Hsiu-Ping Wei, Ming-Chih Yew, Chien-Chia Chiu, Kuo-Ning Chiang

InterPACK 2007; 227-232https://doi.org/10.1115/IPACK2007-33534

Abstract

View Articletitled, Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure

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Topics: Junctions , Power density , System-in-package , Temperature , Thermal management , Heat , Metals , Design , Slug flows , Solders

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

Victor Chiriac, Tien-Yu Tom Lee

InterPACK 2007; 233-239https://doi.org/10.1115/IPACK2007-33705

Abstract

View Articletitled, Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

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Topics: Computer simulation , Heat , Performance evaluation , Transients (Dynamics) , Cycles , Heat budget (Physics) , Signals , Copper , Design , Dynamic systems

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee

InterPACK 2007; 241-247https://doi.org/10.1115/IPACK2007-33707

Abstract

View Articletitled, System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

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Topics: Lightning , Optimization , Energy dissipation , Temperature , Design , Pins (Engineering) , Heat , Heat budget (Physics) , Junctions , Automotive industry

An Improved Method of Thermal Resistance Measurement for Variable Thermal Resistors

Hyeun-Su Kim, Hyun Oh Song, Thomas W. Kenny

InterPACK 2007; 249-253https://doi.org/10.1115/IPACK2007-33879

Abstract

View Articletitled, An Improved Method of Thermal Resistance Measurement for Variable Thermal Resistors

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Topics: Resistors , Thermal resistance , Signals , Contact resistance , Steady state , Temperature , Transients (Dynamics)

Fan Laws for Rack Systems

Maurice F. Holahan, Bret P. Elison

InterPACK 2007; 255-266https://doi.org/10.1115/IPACK2007-33892

Abstract

View Articletitled, Fan Laws for Rack Systems

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Topics: Acoustic emissions , Acoustics , Air flow , Design , Electronics , Fans , Flow (Dynamics) , Noise (Sound) , Packaging , Parity (Physics)

A Fundamental Approach to Modeling Transport to an Impinging Spray

Andrea C. Ashwood, Curtis Lane, Benjamin M. Regner, Timothy A. Shedd

InterPACK 2007; 267-272https://doi.org/10.1115/IPACK2007-33898

Abstract

View Articletitled, A Fundamental Approach to Modeling Transport to an Impinging Spray

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Topics: Modeling , Sprays , Liquid films , Computer simulation , Fittings , Simulation , Computational fluid dynamics , Drops , Fluids , Jets

Thermal Characteristics of LED Light Source in Flat Panel Display Backlight System

Sung Ki Kim, Joon Kang, Seo Young Kim

InterPACK 2007; 273-276https://doi.org/10.1115/IPACK2007-33913

Abstract

View Articletitled, Thermal Characteristics of LED Light Source in Flat Panel Display Backlight System

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Topics: Light sources , Reliability , Temperature , Convection , Electrodes , Failure , Heat , Light-emitting diodes , Operating temperature , Soldering

Advanced Characterization Methodology

Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

InterPACK 2007; 277-284https://doi.org/10.1115/IPACK2007-33533

Abstract

View Articletitled, Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

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Topics: Resins , Stress , Electron mobility , Molding , Diffusion (Physics) , Experimental analysis , Silicon chips , Simulation

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Yonggang Chen, Richard C. Jaeger, Jeffrey C. Suhling

InterPACK 2007; 285-295https://doi.org/10.1115/IPACK2007-33569

Abstract

View Articletitled, High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

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Topics: Complementary metal oxide semiconductors , Resolution (Optics) , Sensors , Stress , Integrated circuits , Calibration , Cavities , Finite element analysis , Mirrors , Shear stress

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, M. Kaysar Rahim

InterPACK 2007; 297-307https://doi.org/10.1115/IPACK2007-33570

Abstract

View Articletitled, Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

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Topics: Calibration , Hydrostatics , Silicon , Stress , Sensors , Temperature , Pressure , Electrical resistivity , Experimental methods , Manufacturing

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar

InterPACK 2007; 309-317https://doi.org/10.1115/IPACK2007-33629

Abstract

View Articletitled, Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

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Topics: Delamination , Inspection , Metrology , Nondestructive evaluation , Packaging , X-rays , Silicones , Acoustics , Finishes , Adhesion

Thermal Phenomena in MEMS

Effect of Process Parameters on TED-Based Q-Factor of MEMS

Ryszard J. Pryputniewicz, Dariusz R. Pryputniewicz, Emily J. Pryputniewicz

InterPACK 2007; 319-326https://doi.org/10.1115/IPACK2007-33094

Abstract

View Articletitled, Effect of Process Parameters on TED-Based Q-Factor of MEMS

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Topics: Microelectromechanical systems , Q-factor

Micro-Raman Thermometry of Laser Heated Surfaces

Justin R. Serrano, Leslie M. Phinney

InterPACK 2007; 327-333https://doi.org/10.1115/IPACK2007-33571

Abstract

View Articletitled, Micro-Raman Thermometry of Laser Heated Surfaces

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Topics: Lasers , Temperature measurement , Temperature , Polysilicon , Computer simulation , Data collection , Heating , Infrared imaging , Microelectromechanical systems , Microscopy

Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

Koji Miyazaki, Jun-Ichiro Kurosaki, Masayuki Takashiri, Bertrand Lenoir, Hiroshi Tsukamoto

InterPACK 2007; 335-342https://doi.org/10.1115/IPACK2007-33756

Abstract

View Articletitled, Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

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Topics: Microcoolers , Thin films , Shades and shadows , Temperature , Thermal conductivity , Annealing , Atmospheric pressure , Bulk solids , Chemical etching , Dry etching

Electro Thermal Modeling of the Micro Flow Sensor With Feedback Control Circuit Using SPICE

Shoji Kamiunten, Hidetomo Nagayo, Masahiro Motosuke, Shinji Honami

InterPACK 2007; 343-350https://doi.org/10.1115/IPACK2007-33769

Abstract

View Articletitled, Electro Thermal Modeling of the Micro Flow Sensor With Feedback Control Circuit Using SPICE

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Topics: Circuits , Feedback , Flow sensors , Modeling , Flow (Dynamics) , Simulation , Channel flow , Convection , Energy budget (Physics) , Fluid dynamics

Interconnect Reliability Models

Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards

InterPACK 2007; 351-358https://doi.org/10.1115/IPACK2007-33123

Abstract

View Articletitled, Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages

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Topics: Lead-free solders , Modeling , Reliability , Semiconductor wafers , Fatigue , Constitutive equations , Creep , Errors , Density , Finite element methods

Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method

T. E. Wong, C. Chu

InterPACK 2007; 359-364https://doi.org/10.1115/IPACK2007-33247

Abstract

View Articletitled, Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method

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Topics: Fatigue , Fatigue life , Solder joints , Solders , Electronic packages , Manufacturing , Calibration , Ceramics , Design , Equilibrium (Physics)

Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

Jin Yang, I. Charles Ume

InterPACK 2007; 365-374https://doi.org/10.1115/IPACK2007-33542

Abstract

View Articletitled, Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

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Topics: Flip-chip , Flip-chip devices , Inspection , Modal analysis , Solders , Computer simulation , Dynamic response , Electronics , Experimental methods , Interferometry

Modelling the Reliability of Components on Flexible Substrates

J. Rizvi, C. Yin, C. Bailey, H. Lu

InterPACK 2007; 375-380https://doi.org/10.1115/IPACK2007-33820

Abstract

View Articletitled, Modelling the Reliability of Components on Flexible Substrates

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Topics: Modeling , Reliability , Aerospace industry , Computers , Copper , Design , Dielectric materials , Flexible electronics , Manufacturing , Packaging

Thermal Interface Materials and Spreaders

Thermal Conductivity and Contact Resistance Measurements for Adhesives

Peter Teertstra

InterPACK 2007; 381-388https://doi.org/10.1115/IPACK2007-33026

Abstract

View Articletitled, Thermal Conductivity and Contact Resistance Measurements for Adhesives

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Topics: Adhesives , Contact resistance , Thermal conductivity , Thermal properties , ASTM International , Bulk solids , Ceramics , Electronics , Fillers (Materials) , Heat flux

Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

Ravi Bollina, Janet Landgraf, Hannes Wagner, Robert Wilhelm, Sven Knippscheer, Gerhard Mitic, Svetlana Levchuck

InterPACK 2007; 389-397https://doi.org/10.1115/IPACK2007-33028

Abstract

View Articletitled, Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

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Topics: Composite materials , Diamonds , Metals , Reliability , Testing , Pressure , Thermal diffusivity , Thermal properties , Aluminum , Aluminum alloys

Comparison of Thermal Performance of Current High-End Thermal Interface Materials

Gamal Refai-Ahmed, Zhaojuan He, Ellen Heian, Ramzi Vincent, Tim Rude, David Van Heerden

InterPACK 2007; 399-403https://doi.org/10.1115/IPACK2007-33383

Abstract

View Articletitled, Comparison of Thermal Performance of Current High-End Thermal Interface Materials

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Topics: Alloys , Bonding , Damage , Heat , Heat sinks , Melting , Nanotechnology , Phase change materials , Polymers , Reliability

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

Vinh Khuu, Michael Osterman, Avram Bar-Cohen, Michael Pecht

InterPACK 2007; 405-414https://doi.org/10.1115/IPACK2007-33554

Abstract

View Articletitled, Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

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Topics: Lasers , Heat , Composite materials , Thermal resistance , Acoustics , Adhesives , Algorithms , Cracking (Materials) , Delamination , Electronic packages

Phase Change Metallic Alloy TIM2 Performance and Reliability

Chris G. Macris, Robert G. Ebel, Christopher B. Leyerle, John C. McCullough

InterPACK 2007; 415-422https://doi.org/10.1115/IPACK2007-33702

Abstract

View Articletitled, Phase Change Metallic Alloy TIM2 Performance and Reliability

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Topics: Alloys , Reliability , Vehicles , Accelerated life testing , Contact resistance , Electrical measurement , Junctions , Metals , Performance characterization , Stress

Thermal Management for Advanced Packaging

Development of New Power MOSFETs Package With Double-Sided Cooling

Kisho Ashida, Akira Muto, Ichio Shimizu, Kenya Kawano, Naotaka Tanaka, Nae Yoneda

InterPACK 2007; 423-427https://doi.org/10.1115/IPACK2007-33023

Abstract

View Articletitled, Development of New Power MOSFETs Package With Double-Sided Cooling

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Topics: Cooling , Solders , Fracture (Materials) , Thermal resistance , Copper , Fatigue , Fatigue life , Packaging , Structural optimization , Crack propagation

Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China

Xiu-Lan Cheng, Yu-Zhuo Fu, Cheng Yang, Yan Chen

InterPACK 2007; 429-433https://doi.org/10.1115/IPACK2007-33334

Abstract

View Articletitled, Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China

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Topics: China , Microelectronic packaging , Packaging , Students , Design , Engineers , Failure analysis , Flow (Dynamics) , Manufacturing , Printed circuit board assemblies

Template Based Assembly for Solid State Cooling

Kerwin Wang, Rajashree Baskaran, Karl F. Bo¨hringer

InterPACK 2007; 435-437https://doi.org/10.1115/IPACK2007-33474

Abstract

View Articletitled, Template Based Assembly for Solid State Cooling

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Topics: Cooling , Manufacturing , Thermoelectric cooling

Passive Immersion Cooling of 3-D Stacked Dies

Karl J. L. Geisler, Avram Bar-Cohen

InterPACK 2007; 439-452https://doi.org/10.1115/IPACK2007-33619

Abstract

View Articletitled, Passive Immersion Cooling of 3-D Stacked Dies

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Topics: Cooling , Boiling , Heat , Natural convection , Buoyancy , Density , Fluid dynamics , Heat transfer coefficients , Integrated circuits , Microelectronic devices

Inspection and Testing

Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography

Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita

InterPACK 2007; 453-457https://doi.org/10.1115/IPACK2007-33017

Abstract

View Articletitled, Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography

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Topics: Artificial neural networks , Computerized tomography , Inspection , Solders , Ball-Grid-Array packaging , Density , Electronics , Shapes , Solder joints , X-rays

Benchmark Testing of LGA Sockets for Server Applications

Brian Beaman

InterPACK 2007; 459-467https://doi.org/10.1115/IPACK2007-33067

Abstract

View Articletitled, Benchmark Testing of LGA Sockets for Server Applications

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Topics: Testing , Engineering standards , Circuits , Construction , Hardware , Compression , Heat sinks , Reliability , Solders

Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope

Minhua Lu, Carla Bailey, Hsichang Liu, Krystyna Semkow

InterPACK 2007; 469-472https://doi.org/10.1115/IPACK2007-33178

Abstract

View Articletitled, Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope

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Topics: Acoustics , Microscopes , Failure analysis , Manufacturing , Metallurgy , Microscopy

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

Yuki Sato, Hideo Miura

InterPACK 2007; 473-479https://doi.org/10.1115/IPACK2007-33257

Abstract

View Articletitled, Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

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Topics: Failure , Nondestructive evaluation , Deformation , Delamination , Finite element analysis , Surface deformation , Diluents , Epoxy resins , Lasers , Microscopes

Optoelectronic Methodology for Development of MEMS

Ryszard J. Pryputniewicz, Ryan T. Marinis, Adam R. Klempner, Peter Hefti

InterPACK 2007; 481-488https://doi.org/10.1115/IPACK2007-33268

Abstract

View Articletitled, Optoelectronic Methodology for Development of MEMS

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Topics: Microelectromechanical systems , Vibration

Mechanical Effects in MEMS

Analytical Solution of Whispering-Gallery Modes

Haiyong Quan, Zhixiong Guo

InterPACK 2007; 489-497https://doi.org/10.1115/IPACK2007-33124

Abstract

View Articletitled, Analytical Solution of Whispering-Gallery Modes

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Topics: Boundary-value problems , Cavities , Electric fields , Filters , Microelectromechanical systems , Nanoelectromechanical systems , Nanosensors , Resonance , Separation (Technology) , Wave equations

CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators

Bongsang Kim, Matthew A. Hopcroft, Renata Melamud, Chandra M. Jha, Manu Agarwal, Saurabh A. Chandorkar, Thomas W. Kenny

InterPACK 2007; 499-504https://doi.org/10.1115/IPACK2007-33234

Abstract

View Articletitled, CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators

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Topics: Complementary metal oxide semiconductors , Microelectromechanical systems , Semiconductor wafers , Stability , Temperature , Composite materials , Packaging , Q-factor , Sealing (Process) , Silicon

Stress Isolation Structures in MEMS Gyroscope Packages

C. H. Yun, X. Zhang, V. Kumar, M. G. Edwards

InterPACK 2007; 505-508https://doi.org/10.1115/IPACK2007-33493

Abstract

View Articletitled, Stress Isolation Structures in MEMS Gyroscope Packages

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Topics: Microelectromechanical systems , Stress , Design , Cavities , Etching , Finite element analysis , Finite element methods , Finite element model , Modeling , Temperature

Characterization of 1^st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

Arun Madyala, Adam Huang

InterPACK 2007; 509-513https://doi.org/10.1115/IPACK2007-33871

Abstract

View Articletitled, Characterization of 1^st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

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Topics: Aircraft , Elastomers , Microelectromechanical systems , Sensors , Manufacturing , Carbon black pigments , Design , Electrical resistivity , Mechanical properties , Metals

Lead Free Reliability

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta

InterPACK 2007; 515-521https://doi.org/10.1115/IPACK2007-33095

Abstract

View Articletitled, SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

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Topics: Durability , Temperature , Vibration , Solders , Damage , Finite element analysis , High cycle fatigue , Printed circuit boards , Electrical wires , Excitation

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori

InterPACK 2007; 523-529https://doi.org/10.1115/IPACK2007-33170

Abstract

View Articletitled, Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

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Topics: Fatigue damage , Flip-chip , Flip-chip devices , Nondestructive evaluation , Synchrotron radiation , X-rays , Solders , Cycles , Fatigue cracks , Computerized tomography

Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices

Qiang Yu, Tadahiro Shibutani, Akifumi Tanaka, Takahiro Koyama, Masaki Shiratori

InterPACK 2007; 531-537https://doi.org/10.1115/IPACK2007-33250

Abstract

View Articletitled, Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices

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Topics: Electronics , Lead-free solders , Low cycle fatigue , Reliability , Vehicles

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

X. Long, I. Dutta, R. Guduru, R. Prasanna, M. Pacheco

InterPACK 2007; 539-546https://doi.org/10.1115/IPACK2007-33271

Abstract

View Articletitled, A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

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Topics: Ball-Grid-Array packages , Reliability , Solders , Solder joints , Ball-Grid-Array packaging , Temperature , Tension , Damage , Design , Engineering simulation

Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads

Akihiko Tosaka, Qiang Yu, Tadahiro Shibutani, Satoshi Kondo, Masaki Shiratori

InterPACK 2007; 547-552https://doi.org/10.1115/IPACK2007-33349

Abstract

View Articletitled, Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads

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Topics: Lead-free solders , Reliability , Stress , Solder joints , Fatigue , Ball-Grid-Array packaging , Warping , Deformation , Fatigue life , Heat

Reliability of Indium Solder for Cold Temperature Packaging

Rui Wu, F. Patrick McCluskey

InterPACK 2007; 553-556https://doi.org/10.1115/IPACK2007-33456

Abstract

View Articletitled, Reliability of Indium Solder for Cold Temperature Packaging

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Topics: Packaging , Reliability , Solders , Temperature , Stress , Ceramics , Control systems , Damage , Failure , Fatigue

Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading

Nikhil Lakhkar, Mohammad M. Hossain, Puligandla Viswanadham, Dereje Agonafer

InterPACK 2007; 557-562https://doi.org/10.1115/IPACK2007-33543

Abstract

View Articletitled, Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading

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Topics: Solders , Tin , Temperature , Copper , Electronic packages , Electronic packaging , Fatigue life , Fracture (Materials) , Fracture toughness , Lead-free solders

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, Michael J. Bozack

InterPACK 2007; 563-579https://doi.org/10.1115/IPACK2007-33545

Abstract

View Articletitled, Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

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Topics: Lead-free solders , Temperature , Solders , Creep , Reliability , Solder joints , Alloys , Failure , Mechanical behavior , Mechanical properties

Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders

Heng Cheng Lin, Chieh Kung, Rong Shen Chen

InterPACK 2007; 581-590https://doi.org/10.1115/IPACK2007-33597

Abstract

View Articletitled, Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders

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Topics: Fatigue analysis , Fatigue life , Lead-free solders , Solders , Taguchi methods , Cycles , Deformation , Geometry , Temperature , Adhesives

Generating Behavior of Whisker on Pb Free Sn Plating and Its Control

Yuki Takeshita, Yuji Kimura

InterPACK 2007; 591-594https://doi.org/10.1115/IPACK2007-33902

Abstract

View Articletitled, Generating Behavior of Whisker on Pb Free Sn Plating and Its Control

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Topics: Plating , Tin , Alloys , Electronic components

Heat Sink Modeling and Characterization

A PCM-Filled Heat Sink for an LED-Based Dental Device

Younes Shabany, Eric P. Rose

InterPACK 2007; 595-599https://doi.org/10.1115/IPACK2007-33089

Abstract

View Articletitled, A PCM-Filled Heat Sink for an LED-Based Dental Device

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Topics: Heat sinks , Phase change materials , Cavities , Copper , Engineering simulation , Hardening (Curing) , Light-emitting diodes , Resins , Simulation

Experimental Investigation on Thermal Performance of Heat Sink With Two Pairs of Embedded Heat Pipes

Hsiang-Sheng Huang, Jung-Chang Wang, Sih-Li Chen

InterPACK 2007; 601-606https://doi.org/10.1115/IPACK2007-33167

Abstract

View Articletitled, Experimental Investigation on Thermal Performance of Heat Sink With Two Pairs of Embedded Heat Pipes

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Topics: Heat pipes , Heat sinks , Heat transfer , Thermal resistance , Heating , Fins , Heat , Testing performance

Thermal Performance of Natural Graphite Heat Spreaders With Embedded Thermal Vias

Martin Smalc, Prathib Skandakumaran, Julian Norley

InterPACK 2007; 607-617https://doi.org/10.1115/IPACK2007-33215

Abstract

View Articletitled, Thermal Performance of Natural Graphite Heat Spreaders With Embedded Thermal Vias

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Topics: Flat heat pipes , Graphite

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

Tunc Icoz, Mehmet Arik, John T. Dardis, II

InterPACK 2007; 619-625https://doi.org/10.1115/IPACK2007-33216

Abstract

View Articletitled, Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

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Topics: Electronics , Heat sinks , Thermal management , Weight (Mass) , Advanced materials , Cooling , Anisotropy , Computer simulation , Design , Reliability

A Modified Particle Swarm Optimization Scheme and Its Application in Electronic Heat Sink Design

M. R. Alrasheed, C. W. de Silva, M. S. Gadala

InterPACK 2007; 627-636https://doi.org/10.1115/IPACK2007-33256

Abstract

View Articletitled, A Modified Particle Swarm Optimization Scheme and Its Application in Electronic Heat Sink Design

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Topics: Design , Heat sinks , Particle swarm optimization , Algorithms , Heat transfer , Electronic components , Entropy , Evolutionary computation , Heat

A Study on Polymer Pin Fin Based Heat Sinks

Ajmal Ansari

InterPACK 2007; 637-642https://doi.org/10.1115/IPACK2007-33968

Abstract

View Articletitled, A Study on Polymer Pin Fin Based Heat Sinks

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Topics: Heat sinks , Polymers , Shapes , Cooling , Design , Metals , Polymer engineering , Resins , Thermal conductivity

Experimental and Computational Characterization of a Heat Sink Tester

Aalok Trivedi, Nikhil Lakhkar, Madhusudhan Iyengar, Michael Ellsworth, Jr., Roger Schmidt, Dereje Agonafer

InterPACK 2007; 643-652https://doi.org/10.1115/IPACK2007-33975

Abstract

View Articletitled, Experimental and Computational Characterization of a Heat Sink Tester

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Topics: Heat sinks , Uncertainty analysis

Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

Waqar A. Khan, Michael M. Yovanovich

InterPACK 2007; 653-661https://doi.org/10.1115/IPACK2007-33983

Abstract

View Articletitled, Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

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Topics: Entropy , Flow (Dynamics) , Heat sinks , Optimization , Pressure drop , Conservation laws (Physics) , Fluid dynamics , Fluids , Friction , Heat transfer

Heat Pipe/Thermosyphons for Electronics Cooling

Dynamic Characteristics of the Capillary Pumped Loop for Cooling the Tower-Type Computer

Atsushi Tsujimori, Masashi Kato, Maiko Uchida

InterPACK 2007; 663-668https://doi.org/10.1115/IPACK2007-33161

Abstract

View Articletitled, Dynamic Characteristics of the Capillary Pumped Loop for Cooling the Tower-Type Computer

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Topics: Computers , Cooling

A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe

H. B. Ma, B. Borgmeyer, P. Cheng, Y. Zhang

InterPACK 2007; 669-676https://doi.org/10.1115/IPACK2007-33246

Abstract

View Articletitled, A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe

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Topics: Heat pipes , Heat transfer , Evaporation , Temperature , Condensers (steam plant) , Vapors , Bubbles , Bulk modulus , Condensation , Excitation

Challenges and Advances of Heat Pipes in Cooling Notebook Systems

Sridhar V. Machiroutu, Himanshu Pokharna, Masahiro Kuroda

InterPACK 2007; 677-687https://doi.org/10.1115/IPACK2007-33249

Abstract

View Articletitled, Challenges and Advances of Heat Pipes in Cooling Notebook Systems

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Topics: Cooling , Heat pipes , Laptop computers , Design , Computers , Condensers (steam plant) , Experimental design , Heat , Heat exchangers , Manufacturing

Frequency Analysis on Pulsating Heat Pipe

Wei Qu, Yuhua Li, Tongze Ma

InterPACK 2007; 689-693https://doi.org/10.1115/IPACK2007-33337

Abstract

View Articletitled, Frequency Analysis on Pulsating Heat Pipe

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Topics: Heat pipes

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

Masataka Mochizuki, Yuji Saito, Fumitoshi Kiyooka, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong

InterPACK 2007; 695-702https://doi.org/10.1115/IPACK2007-33611

Abstract

View Articletitled, Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

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Topics: Cooling , Heat pipes , Microchannels , Vapors

Vapor Chambers in Blade Server CPU Cooling Solutions

Matt Connors

InterPACK 2007; 703-705https://doi.org/10.1115/IPACK2007-33779

Abstract

View Articletitled, Vapor Chambers in Blade Server CPU Cooling Solutions

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Topics: Blades , Computer cooling , Vapors , Heat sinks , Aluminum , Copper , Computational fluid dynamics , Cooling , Design , Dimensions

Heat Pipes for High Temperature Thermal Management

David B. Sarraf, William G. Anderson

InterPACK 2007; 707-714https://doi.org/10.1115/IPACK2007-33984

Abstract

View Articletitled, Heat Pipes for High Temperature Thermal Management

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Topics: Heat pipes , High temperature , Thermal management , Fluids , Water , Temperature , Electronics , Copper , Life testing , Vapor pressure

Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

John R. Hartenstine, Richard W. Bonner, III, Jared R. Montgomery, Tadej Semenic

InterPACK 2007; 715-722https://doi.org/10.1115/IPACK2007-33993

Abstract

View Articletitled, Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

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Topics: Composite materials , Cooling , Copper , Design , Flow (Dynamics) , Fluids , Flux (Metallurgy) , Heat , Heat flux , Slabs

Data Center Thermal Management

Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madshusudan Iyengar, Jay Nigen

InterPACK 2007; 723-731https://doi.org/10.1115/IPACK2007-33000

Abstract

View Articletitled, Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers

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Topics: Cooling , Data centers , Thermal management , Stress , Heat , Air conditioners , Ceilings , Computational fluid dynamics , Computers , Design

Data Center Workload Placement for Energy Efficiency

Cullen Bash, George Forman

InterPACK 2007; 733-741https://doi.org/10.1115/IPACK2007-33129

Abstract

View Articletitled, Data Center Workload Placement for Energy Efficiency

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Topics: Data centers , Energy efficiency , Cooling , Computers , Heat , Optimization

Analysis of Alternative Data Center Cooling Approaches

Robert Hannemann, Herman Chu

InterPACK 2007; 743-750https://doi.org/10.1115/IPACK2007-33176

Abstract

View Articletitled, Analysis of Alternative Data Center Cooling Approaches

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Topics: Cooling , Data centers , Heat , Stress , Density , Refrigerants , Water , Computers , Heat exchangers

Metrics and an Infrastructure Model to Evaluate Data Center Efficiency

Christian L. Belady, Christopher G. Malone

InterPACK 2007; 751-755https://doi.org/10.1115/IPACK2007-33338

Abstract

View Articletitled, Metrics and an Infrastructure Model to Evaluate Data Center Efficiency

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Topics: Data centers , Energy consumption , Energy efficiency , Hardware

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Emad Samadiani, Jeffrey Rambo, Yogendra Joshi

InterPACK 2007; 757-764https://doi.org/10.1115/IPACK2007-33428

Abstract

View Articletitled, Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

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Topics: Computer simulation , Data centers , Flow (Dynamics) , Tiles , Computers , Modeling , Pipes , Air conditioning , Air flow , Porosity

Data Center Cooling Prediction Using Artificial Neural Network

Saurabh K. Shrivastava, James W. VanGilder, Bahgat G. Sammakia

InterPACK 2007; 765-771https://doi.org/10.1115/IPACK2007-33432

Abstract

View Articletitled, Data Center Cooling Prediction Using Artificial Neural Network

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Topics: Artificial neural networks , Cooling , Data centers , Computational fluid dynamics , Optimization , Air flow , Artificial intelligence , Errors , Genetic algorithms

Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

Tohru Suwa, Hamid Hadim

InterPACK 2007; 773-779https://doi.org/10.1115/IPACK2007-33443

Abstract

View Articletitled, Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

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Topics: Electrical wires , Genetic algorithms , Heat , Optimization

Partially Decoupled Aisle Method for Estimating Rack-Cooling Performance in Near-Real Time

James W. VanGilder, Xuanhang Zhang, Saurabh K. Shrivastava

InterPACK 2007; 781-789https://doi.org/10.1115/IPACK2007-33447

Abstract

View Articletitled, Partially Decoupled Aisle Method for Estimating Rack-Cooling Performance in Near-Real Time

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Topics: Cooling , Computational fluid dynamics , Air flow , Boundary-value problems , Coolers , Computer software , Data centers , Engineering simulation , Engines , Simulation

Technologies for the Energy-Efficient Data Center

Tahir Cader, Levi Westra, Andres Marquez

InterPACK 2007; 791-802https://doi.org/10.1115/IPACK2007-33463

Abstract

View Articletitled, Technologies for the Energy-Efficient Data Center

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Topics: Data centers , Computational fluid dynamics , Cooling , Boundary-value problems , Energy consumption , Optimization , Pacific Ocean , Semiconductors (Materials)

Data Center Housing the World’s 3rd Fastest Supercomputer: Above Floor Thermal Measurements Compared to CFD Analysis

Roger Schmidt, Madhusudan Iyengar, Joe Caricari

InterPACK 2007; 803-818https://doi.org/10.1115/IPACK2007-33507

Abstract

View Articletitled, Data Center Housing the World’s 3rd Fastest Supercomputer: Above Floor Thermal Measurements Compared to CFD Analysis

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Topics: Computational fluid dynamics , Data centers

Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

Madhusudan Iyengar, Roger R. Schmidt, Hendrik Hamann, Jim VanGilder

InterPACK 2007; 819-826https://doi.org/10.1115/IPACK2007-33508

Abstract

View Articletitled, Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

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Topics: Data centers , Temperature distribution , Errors , Server racks , Temperature , Air conditioning , Computer simulation , Exhaust systems , Flow (Dynamics) , Modeling

Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt

InterPACK 2007; 827-836https://doi.org/10.1115/IPACK2007-33540

Abstract

View Articletitled, Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

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Topics: Data centers , Flow (Dynamics) , Tiles , Air conditioning , Computational fluid dynamics , Pipes , Air flow , Cables , Computer simulation , Computers

Analysis of Airflow Distribution Across a Front-to-Rear Server Rack

Amir Radmehr, Kailash C. Karki, Suhas V. Patankar

InterPACK 2007; 837-843https://doi.org/10.1115/IPACK2007-33574

Abstract

View Articletitled, Analysis of Airflow Distribution Across a Front-to-Rear Server Rack

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Topics: Air flow , Server racks , Cooling , Data centers , Boundary-value problems , Computational fluid dynamics , Symmetry (Physics) , Tiles , Computers , Density

Server-Rack Air Flow and Heat Transfer Interactions in Data Centers

S. P. Tan, K. C. Toh, Y. W. Wong

InterPACK 2007; 845-849https://doi.org/10.1115/IPACK2007-33672

Abstract

View Articletitled, Server-Rack Air Flow and Heat Transfer Interactions in Data Centers

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Topics: Air flow , Data centers , Heat transfer , Server racks , Flow (Dynamics) , Pressure , Modeling , Temperature , Approximation , Design

Application of Exploratory Data Analysis (EDA) Techniques to Temperature Data in a Conventional Data Center

Ratnesh Sharma, Rocky Shih, Chandrakant Patel, John Sontag

InterPACK 2007; 851-857https://doi.org/10.1115/IPACK2007-33700

Abstract

View Articletitled, Application of Exploratory Data Analysis (EDA) Techniques to Temperature Data in a Conventional Data Center

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Topics: Data centers , Temperature , Cooling , Thermal management , Density , Energy consumption , Sensors , Surges , Air flow , Calibration

Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

Ali Heydari

InterPACK 2007; 859-870https://doi.org/10.1115/IPACK2007-33848

Abstract

View Articletitled, Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

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Topics: Cooling , Cooling systems , Data centers , Energy efficiency , Modeling , Thermodynamics , Heat exchangers , Computational fluid dynamics , Refrigeration , Density

Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility

Yasuo Amemiya, Madhusudan Iyengar, Hendrik Hamann, Martin O’Boyle, Michael Schappert, Jing Shen, Theodore van Kessel

InterPACK 2007; 871-876https://doi.org/10.1115/IPACK2007-33899

Abstract

View Articletitled, Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility

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Topics: Computer simulation , Data centers , Temperature , Computational fluid dynamics , Transients (Dynamics) , Air conditioning , Temperature profiles , Algorithms , Boundary-value problems , Energy dissipation

Analytical Modeling of Energy Consumption and Thermal Performance of Data Center Cooling Systems: From the Chip to the Environment

Madhusudan Iyengar, Roger R. Schmidt

InterPACK 2007; 877-886https://doi.org/10.1115/IPACK2007-33924

Abstract

View Articletitled, Analytical Modeling of Energy Consumption and Thermal Performance of Data Center Cooling Systems: From the Chip to the Environment

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Topics: Cooling systems , Data centers , Energy consumption , Modeling , Temperature , Cooling , Air conditioning , Computers , Energy efficiency , Flow (Dynamics)

Assembly and Process

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah

InterPACK 2007; 887-894https://doi.org/10.1115/IPACK2007-33044

Abstract

View Articletitled, Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

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Topics: Cavities , Compression , Deformation , Packaging , Vehicles

Influence of Cu Surface Treatment on the Cu-Direct Via Hole Drilling Efficiency of PWBs

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Shogo Matsutani

InterPACK 2007; 895-900https://doi.org/10.1115/IPACK2007-33194

Abstract

View Articletitled, Influence of Cu Surface Treatment on the Cu-Direct Via Hole Drilling Efficiency of PWBs

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Topics: Drilling , Surface finishing , Carbon dioxide lasers , Copper , Lasers , Copper foil , Shapes , Melting , Printed circuit boards , Thermography

CAM System Based on Constant Drill Hole Temperature for Drilling in Printed Wiring Board

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Seita Sumida

InterPACK 2007; 901-907https://doi.org/10.1115/IPACK2007-33243

Abstract

View Articletitled, CAM System Based on Constant Drill Hole Temperature for Drilling in Printed Wiring Board

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Topics: Drilling , Drills (Tools) , Printed circuit boards , Temperature , Damage , Density , Heat

Investigation of Drill Hole Quality of Multi-Layer PWBs for High Current Capacity

Eiichi Aoyama, Toshiki Hirogaki, Keiji Ogawa, Kenichi Mori, Yuusuke Itagaki

InterPACK 2007; 909-915https://doi.org/10.1115/IPACK2007-33255

Abstract

View Articletitled, Investigation of Drill Hole Quality of Multi-Layer PWBs for High Current Capacity

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Topics: Drills (Tools) , Hole quality , Copper foil , Cutting , Stress , Automobiles , Automotive industry , Drilling , Electronic equipment , Electronic systems

New Product Introduction of Fully Buffered DIMM: A Process Perspective

Gurudutt Chennagiri, Satyanarayan Iyer, Pei-Fang Tsai, Krishnaswami Srihari

InterPACK 2007; 917-922https://doi.org/10.1115/IPACK2007-33678

Abstract

View Articletitled, New Product Introduction of Fully Buffered DIMM: A Process Perspective

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Topics: Adhesion , Failure mechanisms , Failure mode and effects analysis , Heat sinks , Manufacturing , Product reliability , Reliability , Separation (Technology) , Shock (Mechanics) , Vibration tests

Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology

S. Saiyed, S. A. Kudtarkar, R. Murcko, K. Srihari

InterPACK 2007; 923-930https://doi.org/10.1115/IPACK2007-33691

Abstract

View Articletitled, Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology

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Topics: Wire , Bonding , Reliability , High temperature , Stress , Aluminum , Bond strength , Catalysts , Mechanical testing , Shear (Mechanics)

Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine

Ashok Thiagarajan, Purushothaman Damodaran, Krishnaswami Srihari

InterPACK 2007; 931-936https://doi.org/10.1115/IPACK2007-33808

Abstract

View Articletitled, Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine

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Topics: Cycles , Machinery , Assembly lines , Computer software , Lumber , Nozzles , Solders , Electronics , Manufacturing , Ovens

Pb-Free Process Development for a High End Storage Area Network Application

Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou

InterPACK 2007; 937-943https://doi.org/10.1115/IPACK2007-33857

Abstract

View Articletitled, Pb-Free Process Development for a High End Storage Area Network Application

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Topics: Alloys , Cycles , Electronic products , Finishes , High temperature , Laminates , Lead-free solders , Lumber , Manufacturing , Optimization

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

Anand Kannabiran, Sreekanth Varma Penmatsa, S. Manian Ramkumar, Reza Ghaffarian

InterPACK 2007; 945-952https://doi.org/10.1115/IPACK2007-33963

Abstract

View Articletitled, Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

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Topics: Finishes , Printed circuit boards , Solders , Tin , Manufacturing , Solder joints , Testing , Design , Intermetallic compounds , Surface mount packaging

MEMS Processing and Fabrication

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, Y. C. Lee

InterPACK 2007; 953-962https://doi.org/10.1115/IPACK2007-33013

Abstract

View Articletitled, Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

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Topics: Atomic clocks , Physics , Structural analysis , Finite element analysis , Shock (Mechanics) , Design , Thermal resistance , Alkali metals , Cavities , Energy dissipation

Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope

Yang Ju, Tetsuya Kobayashi, Hitoshi Soyama

InterPACK 2007; 963-966https://doi.org/10.1115/IPACK2007-33613

Abstract

View Articletitled, Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope

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Topics: Atomic force microscopy , Gallium arsenide , Manufacturing , Microwaves , Probes , Waveguides , Cantilevers , Diffraction gratings , Dimensions , Evaporation

Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher

InterPACK 2007; 967-969https://doi.org/10.1115/IPACK2007-33824

Abstract

View Articletitled, Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

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Topics: Carbon nanotubes , Diamonds , Vapors , Diamond films , Nucleation (Physics) , Plasmas (Ionized gases)

Process Development and Die Shear Testing in MOEMS Packaging

Nikhil Lakhkar, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer, Harry Stephanou

InterPACK 2007; 971-977https://doi.org/10.1115/IPACK2007-33986

Abstract

View Articletitled, Process Development and Die Shear Testing in MOEMS Packaging

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Topics: Microoptoelectromechanical systems , Packaging , Shear (Mechanics) , Testing , Reliability , MEMS packaging , Microelectromechanical systems , Signals , Contamination , Failure