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ASME 2003 International Electronic Packaging Technical Conference and Exhibition

July 6–11, 2003

Maui, Hawaii, USA

Conference Sponsors:

ISBN:

0-7918-3690-8

In This Volume

RF Microwave (4)
Telecommunications (3)
Thermal Management (88)
Embedded Passives (7)
Airborne, Space and Defense Electronic Systems (7)
Packaging Technology (10)

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2

RF Microwave

Antenna Miniaturization Using Flexible PBG Materials

Pekka Salonen, Lauri Syda¨nheimo, Mikko Keskilammi

InterPACK 2003; 1-5https://doi.org/10.1115/IPACK2003-35010

Abstract

View Articletitled, Antenna Miniaturization Using Flexible PBG Materials

PDF

Topics: Ceramics , Design , Dimensions , Energy gap , Microwaves , Physical laws , Radiation (Physics) , Resonance , Signals , Standing waves

Design Optimization of LTCC Interconnects With Meshed Ground Planes

Lai L. Wai, Albert Chee W. Lu, Wei Fan, Lin Jin, Lee A. Low

InterPACK 2003; 7-12https://doi.org/10.1115/IPACK2003-35155

Abstract

View Articletitled, Design Optimization of LTCC Interconnects With Meshed Ground Planes

PDF

Topics: Density , Design , Engineering simulation , Finite element methods , Finite element model , Geometry , Metals , Optimization , Simulation

Characterization of Vertical Interconnects in 3-D System in a Package

Qinghua Kang, Altan M. Ferendeci

InterPACK 2003; 13-18https://doi.org/10.1115/IPACK2003-35247

Abstract

View Articletitled, Characterization of Vertical Interconnects in 3-D System in a Package

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Topics: System-in-package , Circuits , Microwaves , Microelectromechanical systems , Dimensions , Junctions , Microfabrication , Millimeter waves , Transmission lines , Wavelength

RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems

M. Tentzeris, J. Laskar

InterPACK 2003; 19-24https://doi.org/10.1115/IPACK2003-35360

Abstract

View Articletitled, RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems

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Topics: Architecture , Cavities , Filters , Finite difference time-domain analysis , Inductors , Manufacturing , Microelectromechanical systems , Modeling , Q-factor , Simulation

Telecommunications

Towards Next Generation of Switching

Alex Vukovic, Michel Savoie, Heng Hua

InterPACK 2003; 25-28https://doi.org/10.1115/IPACK2003-35043

Abstract

View Articletitled, Towards Next Generation of Switching

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Topics: Blocks (Building materials) , Optoelectronic devices , Storage , Switches , Traffic , Wavelength

A Package for Thermal Compensation of Fiber Bragg Gratings

Alison L. Howlett, Luc J. Vandeperre, William J. Clegg

InterPACK 2003; 29-33https://doi.org/10.1115/IPACK2003-35127

Abstract

View Articletitled, A Package for Thermal Compensation of Fiber Bragg Gratings

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Topics: Fiber Bragg gratings , Cycles , Deformation , Fibers , Temperature , Wavelength

Design Optimization of a Router Board Using Computational Fluid Dynamics

Timothy J. Dake, Joseph Majdalani, Susheela Narasimhan

InterPACK 2003; 35-39https://doi.org/10.1115/IPACK2003-35338

Abstract

View Articletitled, Design Optimization of a Router Board Using Computational Fluid Dynamics

PDF

Topics: Computational fluid dynamics , Design , Optimization , Cooling , Internet , Energy dissipation , Gears , Lumber , Telecommunications

Thermal Management

Thermal Characteristics of Graphite Foam Thermosyphon for Electronics Cooling

Hongkoo Roh, Jungho Kim, Paul J. Boudreaux

InterPACK 2003; 41-46https://doi.org/10.1115/IPACK2003-35002

Abstract

View Articletitled, Thermal Characteristics of Graphite Foam Thermosyphon for Electronics Cooling

PDF

Topics: Computer cooling , Graphite

Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

B. Elliott Short, Jr., Donald C. Price, Peter E. Raad

InterPACK 2003; 47-55https://doi.org/10.1115/IPACK2003-35004

Abstract

View Articletitled, Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

PDF

Topics: Design , Electronics , Reynolds number , Control systems , Fins , Flow (Dynamics) , Friction

Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

John Chia, Charles Yang

InterPACK 2003; 57-61https://doi.org/10.1115/IPACK2003-35008

Abstract

View Articletitled, Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

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Topics: Printed circuit boards , Thermal management , Thermal efficiency , Air flow , Computer simulation , Design , Electronics , Energy consumption , Energy dissipation , Pine (Wood product)

Thermal Analysis for Three-Dimensional Heat Spreader Integrated With Heat Sink

Y. C. Wu, H. T. Chen, C. C. Lin, Y. H. Hung

InterPACK 2003; 63-71https://doi.org/10.1115/IPACK2003-35018

Abstract

View Articletitled, Thermal Analysis for Three-Dimensional Heat Spreader Integrated With Heat Sink

PDF

Topics: Flat heat pipes , Heat sinks , Thermal analysis

Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique

S. T. Kuo, M. P. Wang, M. C. Wu, Y. H. Hung

InterPACK 2003; 73-80https://doi.org/10.1115/IPACK2003-35020

Abstract

View Articletitled, Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique

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Topics: Heat sinks , Liquid crystals , Transients (Dynamics)

Performance Prediction for Partially-Confined Heat Sinks

Tzer-Ming Jeng, Meng-Ping Wang, Ying-Huei Hung

InterPACK 2003; 81-88https://doi.org/10.1115/IPACK2003-35021

Abstract

View Articletitled, Performance Prediction for Partially-Confined Heat Sinks

PDF

Topics: Fins , Heat sinks , Reynolds number

Optimization of Elliptical Fin Heat Sink Design in Forced Convection: Single and Multiple Heat Sink Scenarios

Subha M. Kadangode, John R. Mason

InterPACK 2003; 89-96https://doi.org/10.1115/IPACK2003-35029

Abstract

View Articletitled, Optimization of Elliptical Fin Heat Sink Design in Forced Convection: Single and Multiple Heat Sink Scenarios

PDF

Topics: Design , Forced convection , Heat sinks , Optimization , Fins , Air flow , Computational fluid dynamics , Computer software , Geometry , Heat flux

Study on Alternative Cooling Methods Beyond Next Generation Microprocessors

Albert Chan, Jie Wei

InterPACK 2003; 97-102https://doi.org/10.1115/IPACK2003-35041

Abstract

View Articletitled, Study on Alternative Cooling Methods Beyond Next Generation Microprocessors

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Topics: Cooling , Heat sinks , Refrigeration

Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

Katsuhiro Koizumi, Akito Joboji, Kuniaki Nagahara, Masaru Ishizuka

InterPACK 2003; 103-109https://doi.org/10.1115/IPACK2003-35048

Abstract

View Articletitled, Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

PDF

Topics: Natural convection , Switches , Thermal analysis , Power semiconductor devices , Computational methods , Design , Experimental design , Flow simulation , Heat , Modeling

Understanding Longitudinal Fin Heat Sink Orientation Sensitivity for Light Emitting Diode (LED) Lighting Applications

James Petroski

InterPACK 2003; 111-117https://doi.org/10.1115/IPACK2003-35055

Abstract

View Articletitled, Understanding Longitudinal Fin Heat Sink Orientation Sensitivity for Light Emitting Diode (LED) Lighting Applications

PDF

Topics: Heat sinks , Heat transfer , Light-emitting diodes , Natural convection

Inkjet Assisted Spray Cooling of Electronics

Cullen E. Bash, Chandrakant D. Patel, Ratnesh K. Sharma

InterPACK 2003; 119-127https://doi.org/10.1115/IPACK2003-35058

Abstract

View Articletitled, Inkjet Assisted Spray Cooling of Electronics

PDF

Topics: Cooling , Electronics , Sprays , Thermal management

Smart Cooling of Data Centers

Chandrakant D. Patel, Cullen E. Bash, Ratnesh Sharma, Monem Beitelmal, Rich Friedrich

InterPACK 2003; 129-137https://doi.org/10.1115/IPACK2003-35059

Abstract

View Articletitled, Smart Cooling of Data Centers

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Topics: Air conditioning , Computers , Cooling , Data centers

The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers

E. E. Marotta, M. J. Ellsworth, Jr., J. Norley, G. Getz

InterPACK 2003; 139-146https://doi.org/10.1115/IPACK2003-35060

Abstract

View Articletitled, The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers

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Topics: Epoxy adhesives , Epoxy resins , Graphite , Heat sinks , Copper , Aluminum , Density , Thermal conductivity , Heat , Metals

Low-Profile Synthetic Jet Cooling for Portable Computers

Raghav Mahalingam, Ari Glezer

InterPACK 2003; 147-151https://doi.org/10.1115/IPACK2003-35069

Abstract

View Articletitled, Low-Profile Synthetic Jet Cooling for Portable Computers

PDF

Topics: Computers , Cooling , Cavities , Ejectors , Fluids , Channel flow , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Ducts , Electronic systems

Capacity Control in Refrigerated Systems

Johnston W. Peeples

InterPACK 2003; 153-157https://doi.org/10.1115/IPACK2003-35070

Abstract

View Articletitled, Capacity Control in Refrigerated Systems

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Topics: Architecture , Compression , Computer cooling , Condensers (steam plant) , Construction , Cooling , Design , Electronics , Energy dissipation , Flow (Dynamics)

Dynamic Characterization of Thermal Interface Material for Electronic Cooling

Rocky Shih, Cullen E. Bash

InterPACK 2003; 159-166https://doi.org/10.1115/IPACK2003-35073

Abstract

View Articletitled, Dynamic Characterization of Thermal Interface Material for Electronic Cooling

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Topics: ASTM International , Computer cooling , Construction , Design , Heating , Instrumentation , Product development , Testing , Thermal resistance , Vehicles

Silicone Phase Change Thermal Interface Materials: Properties and Applications

S. Mark Zhang, Diane Swarthout, Thomas Noll, Susan Gelderbloom, Douglas Houtman, Kelly Wall

InterPACK 2003; 167-170https://doi.org/10.1115/IPACK2003-35075

Abstract

View Articletitled, Silicone Phase Change Thermal Interface Materials: Properties and Applications

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Topics: Materials properties , Silicones , Aluminum , Siloxanes , Thermal conductivity , Chain , Phase change materials , Pressure , Strength (Materials) , Thermal resistance

Numerical Evaluation of High Power Amplifier Heat Sink Design Options

Luke Maguire, Masud Behnia, Graham Morrison

InterPACK 2003; 171-181https://doi.org/10.1115/IPACK2003-35077

Abstract

View Articletitled, Numerical Evaluation of High Power Amplifier Heat Sink Design Options

PDF

Topics: Design , Heat sinks , Temperature , Air flow , Computational fluid dynamics , Cooling systems , Copper , Flow (Dynamics) , Junctions , Transistors

Numerical Calculation of Sub-Micron Hot Spot in Si Devices

Kazuyoshi Fushinobu, Hirohisa Maruyama

InterPACK 2003; 183-188https://doi.org/10.1115/IPACK2003-35079

Abstract

View Articletitled, Numerical Calculation of Sub-Micron Hot Spot in Si Devices

PDF

Topics: Electrons , Modeling , MOSFET transistors , Silicon , Temperature

Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models

I. Savija, J. R. Culham, M. M. Yovanovich

InterPACK 2003; 189-200https://doi.org/10.1115/IPACK2003-35088

Abstract

View Articletitled, Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models

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Topics: ASTM International , Solids , Stress , Thermal conductivity , Thermal resistance , Young's modulus

Thermal Modeling of Plated-Through Hole Vias in a FBGA Package

X. Howard Sun, Z. Zhao, R. Sahan

InterPACK 2003; 201-206https://doi.org/10.1115/IPACK2003-35092

Abstract

View Articletitled, Thermal Modeling of Plated-Through Hole Vias in a FBGA Package

PDF

Topics: Modeling , Temperature , Junctions , Computational fluid dynamics , Errors , Ball-Grid-Array packaging , Cylinders , Engineering simulation , Simulation

The Dynamic Inverse Method for Thermal Resistance of Cooling Device

Heng-Chieh Chien, Ming-Hsi Tseng, Wen-Yang Chang

InterPACK 2003; 207-210https://doi.org/10.1115/IPACK2003-35097

Abstract

View Articletitled, The Dynamic Inverse Method for Thermal Resistance of Cooling Device

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Topics: Cooling , Thermal resistance , Heat capacity , Heating , Steady state , Temperature , Testing

A Novel Electronics Cooling System Using Water Heat Pipes Under Freezing Conditions

Osamu Suzuki, Atsuo Nishihara

InterPACK 2003; 211-220https://doi.org/10.1115/IPACK2003-35098

Abstract

View Articletitled, A Novel Electronics Cooling System Using Water Heat Pipes Under Freezing Conditions

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Topics: Computer cooling , Freezing , Heat pipes , Water , Fins , Engineering prototypes , Temperature , Thermal resistance , Cooling , Cooling systems

Experimental Study of Innovative Heat Sinks for High Power Density Electronic Components

Giampietro Fabbri, Marco Lorenzini

InterPACK 2003; 221-227https://doi.org/10.1115/IPACK2003-35102

Abstract

View Articletitled, Experimental Study of Innovative Heat Sinks for High Power Density Electronic Components

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Topics: Electronic components , Heat sinks , Power density , Thermal resistance

Performance Analysis, Optimum and Verification for Parallel Plate Heat Sink Associated With Single Non-Uniform Heat Source

Vincent Lin, Sih-Li Chen

InterPACK 2003; 229-236https://doi.org/10.1115/IPACK2003-35103

Abstract

View Articletitled, Performance Analysis, Optimum and Verification for Parallel Plate Heat Sink Associated With Single Non-Uniform Heat Source

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Topics: Heat , Heat sinks , Thermal resistance , Air flow , Geometry , Heat flux , Testing

The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow

Sukhvinder Kang, Maurice Holahan

InterPACK 2003; 237-244https://doi.org/10.1115/IPACK2003-35104

Abstract

View Articletitled, The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow

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Topics: Flow (Dynamics) , Heat sinks , Thermal resistance , Fins , Temperature , Blocks (Building materials) , Computational fluid dynamics , Engineering simulation , Heat transfer , Heat transfer coefficients

Micro Heat Pipes for Stacked 3D Microelectronic Modules

Sameer Khandekar, Manfred Groll, Vivak Luckchoura, Walter Findl, Jun Zhuang

InterPACK 2003; 245-251https://doi.org/10.1115/IPACK2003-35109

Abstract

View Articletitled, Micro Heat Pipes for Stacked 3D Microelectronic Modules

PDF

Topics: Heat pipes , Thermal management

Advanced Thermal Interface Materials Using Natural Graphite

Martin Smalc, Julian Norley, R. Andy Reynolds, III, Richard Pachuta, Dan W. Krassowski

InterPACK 2003; 253-261https://doi.org/10.1115/IPACK2003-35113

Abstract

View Articletitled, Advanced Thermal Interface Materials Using Natural Graphite

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Topics: Graphite

Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet

Seok Pil Jang, Sung Jin Kim

InterPACK 2003; 263-270https://doi.org/10.1115/IPACK2003-35114

Abstract

View Articletitled, Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet

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Topics: Fluid dynamics , Heat sinks , Microchannels , Cooling , Pressure drop , Temperature distribution , Flow (Dynamics) , Heat transfer , Microfabrication , Sensors

Modeling and Thermal Optimization of a Micro Heat Pipe With Curved Triangular Grooves

Kyu Hyung Do, Sung Jin Kim, Gunn Hwang

InterPACK 2003; 271-278https://doi.org/10.1115/IPACK2003-35116

Abstract

View Articletitled, Modeling and Thermal Optimization of a Micro Heat Pipe With Curved Triangular Grooves

PDF

Topics: Heat pipes , Modeling , Optimization , Computer simulation , Heat , Experimental methods , Fluid dynamics , Heat transfer , Pressure drop , Shear stress

A Numerical Analysis on the System Impedance in a Fan Cooling System

Dong-Il Kim, Ki-So Bok, Han-Bae Lee

InterPACK 2003; 279-284https://doi.org/10.1115/IPACK2003-35121

Abstract

View Articletitled, A Numerical Analysis on the System Impedance in a Fan Cooling System

PDF

Topics: Cooling systems , Numerical analysis , Boundary-value problems , Computational fluid dynamics , Fans , Flow (Dynamics) , Pressure , Pressure drop

Thermal Behavior of Next Generation of Raman Pump Lasers in Telco Equipment

Gamal Refai-Ahmed, Stephanie Trottier

InterPACK 2003; 285-292https://doi.org/10.1115/IPACK2003-35129

Abstract

View Articletitled, Thermal Behavior of Next Generation of Raman Pump Lasers in Telco Equipment

PDF

Topics: Lasers , Pumps , Waves , Temperature , Energy dissipation , Transient heat transfer

Temperature Distribution in Two-Layered Composites

Wing K. Yeung, Tung T. Lam

InterPACK 2003; 293-302https://doi.org/10.1115/IPACK2003-35131

Abstract

View Articletitled, Temperature Distribution in Two-Layered Composites

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Topics: Composite materials , Temperature distribution , Anisotropy , Algorithms , Heat , Heat conduction , Reflection , Thermal conductivity , Thermal diffusion , Wave propagation

Heat Transfer in Triangular Microchannels

J. Todd Dickey, Tung T. Lam

InterPACK 2003; 303-307https://doi.org/10.1115/IPACK2003-35133

Abstract

View Articletitled, Heat Transfer in Triangular Microchannels

PDF

Topics: Heat transfer , Microchannels , Porous materials , Cross section (Physics) , Fluid dynamics , Fluids , Microchannel flow

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Patrick E. Phelan, Victor Chiriac, Tien-Yu Tom Lee

InterPACK 2003; 309-315https://doi.org/10.1115/IPACK2003-35140

Abstract

View Articletitled, Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

PDF

Topics: Electronic packaging , Refrigeration , Compression , Vapors , Compressors , Cycles , Microelectronic devices , Thermoelectric coolers

Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module

Z. F. Shi, Albert C. W. Lu, Eric Tan, Ronson Tan

InterPACK 2003; 317-321https://doi.org/10.1115/IPACK2003-35141

Abstract

View Articletitled, Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module

PDF

Topics: Cavities , Computational fluid dynamics , Computer simulation , Heat sinks , Junctions , Lasers , Optical interconnections , Performance evaluation , Robustness , Signals

Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

Teck Joo Goh, Chia-Pin Chiu, K. N. Seetharamu, G. A. Quadir, Z. A. Zainal

InterPACK 2003; 323-330https://doi.org/10.1115/IPACK2003-35142

Abstract

View Articletitled, Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

PDF

Topics: Automotive design , Finite element analysis , Flip-chip , Flip-chip devices , Thermal characterization , Vehicles

Numerical Simulation of Conjugate Heat Transfer From Multiple Electronic Module Packages Cooled by Air

Hideo Yoshino, Motoo Fujii, Xing Zhang, Masud Behnia

InterPACK 2003; 331-336https://doi.org/10.1115/IPACK2003-35144

Abstract

View Articletitled, Numerical Simulation of Conjugate Heat Transfer From Multiple Electronic Module Packages Cooled by Air

PDF

Topics: Computer simulation , Heat transfer

Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop

Satoru Gima, Takashi Nagata, Xing Zhang, Motoo Fujii

InterPACK 2003; 337-342https://doi.org/10.1115/IPACK2003-35148

Abstract

View Articletitled, Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop

PDF

Topics: Cooling , Laptop computers , Condensers (steam plant) , Temperature , Boiling , Heat , Computer cooling , Cooling systems , Dimensions , Fluids

Constructing a Trade-Off Surface for Extruded Heat Sinks Exposed to Forced Convection

D. J. de Kock, J. A. Visser

InterPACK 2003; 343-350https://doi.org/10.1115/IPACK2003-35151

Abstract

View Articletitled, Constructing a Trade-Off Surface for Extruded Heat Sinks Exposed to Forced Convection

PDF

Topics: Forced convection , Heat sinks , Tradeoffs , Design , Optimization , Engineers , Heat , Pressure drop , Temperature , Electronic components

Thermal Design and Packaging of a Prototype Refrigeration Cooling System for CMOS-Based MCMs

Jie Wei, Hideo Kubo, Junichi Ishimine

InterPACK 2003; 351-356https://doi.org/10.1115/IPACK2003-35156

Abstract

View Articletitled, Thermal Design and Packaging of a Prototype Refrigeration Cooling System for CMOS-Based MCMs

PDF

Topics: Complementary metal oxide semiconductors , Cooling , Cooling systems , Design , Engineering prototypes , Low temperature , Packaging , Refrigeration

Automatic Thermal Modeling for System Level Design of Electronic Equipment

Kenichiro Aoki, Koichi Shimizu, Akira Ueda, Akira Tamura, Masanori Motegi

InterPACK 2003; 357-362https://doi.org/10.1115/IPACK2003-35161

Abstract

View Articletitled, Automatic Thermal Modeling for System Level Design of Electronic Equipment

PDF

Topics: Computer software , Design , Electronic equipment , Fittings , Hardware , Modeling , Numerical analysis , Product development , Simulation , Thermofluids

Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

Shankar Krishnan, Suresh V. Garimella

InterPACK 2003; 363-374https://doi.org/10.1115/IPACK2003-35169

Abstract

View Articletitled, Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

PDF

Topics: Computer cooling , Copper , Electronics , Energy storage , Heat sinks , Phase change materials , Thermal management , Transients (Dynamics)

Effect of Percolation on Equivalent Thermal Conductivity of Insulating Layer in Insulated Metal Substrates

Kenji Monden

InterPACK 2003; 375-380https://doi.org/10.1115/IPACK2003-35175

Abstract

View Articletitled, Effect of Percolation on Equivalent Thermal Conductivity of Insulating Layer in Insulated Metal Substrates

PDF

Topics: Metals , Percolation theory , Thermal conductivity

A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets

Jorge L. Rosales, Victor A. Chiriac

InterPACK 2003; 381-387https://doi.org/10.1115/IPACK2003-35183

Abstract

View Articletitled, A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets

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Topics: Air jets , Cooling , Microelectronic devices , Jets , Reynolds number , Heat transfer , Flow (Dynamics) , Heat , Bubbles , Heat transfer coefficients

Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

Tarek Jamal-Eddine, Lawrence Mok

InterPACK 2003; 389-394https://doi.org/10.1115/IPACK2003-35186

Abstract

View Articletitled, Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

PDF

Topics: Hinges , Laptop computers , Heat , Computer simulation , Flat heat pipes , Computers , Heat pipes , Springs , Acoustics , Aluminum

Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins

John Klein, George Gilchrist, Jim Karanik, Noe Arcas, Richard Yurman, James Whiteside, Bill Shields, Tony Bartilucci

InterPACK 2003; 395-400https://doi.org/10.1115/IPACK2003-35187

Abstract

View Articletitled, Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins

PDF

Topics: Fins , Metals , Thermal management , Warfare , Heat exchangers , Heat transfer , Cooling , Heat transfer coefficients , Aircraft , Electronics

Boundary Effect on Temperature Gradients in Microchannels

Patrick S. Cabral, Tung T. Lam

InterPACK 2003; 401-409https://doi.org/10.1115/IPACK2003-35190

Abstract

View Articletitled, Boundary Effect on Temperature Gradients in Microchannels

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Topics: Microchannels , Temperature gradient , Boundary-value problems , Heat , Computer cooling , Convection , Cooling , Drag (Fluid dynamics) , Electronics , Flow (Dynamics)

Automatic Generation and Validation of Compact Network Models for a Fine Pitch BGA Package

Manoj Nagulapally, Sam Ziqun Zhao

InterPACK 2003; 411-416https://doi.org/10.1115/IPACK2003-35196

Abstract

View Articletitled, Automatic Generation and Validation of Compact Network Models for a Fine Pitch BGA Package

PDF

Topics: Ball-Grid-Array packages , Network models , Computational fluid dynamics , Engineering simulation , Simulation , Agglomeration (Materials) , Ball-Grid-Array packaging , Boundary-value problems , Computer simulation , Cooling

Control of a Laboratory-Based Thermal Management System

Mark H. McKinney, Charles Wall

InterPACK 2003; 417-421https://doi.org/10.1115/IPACK2003-35198

Abstract

View Articletitled, Control of a Laboratory-Based Thermal Management System

PDF

Topics: Control systems , Refrigeration , Thermal management , Vapors

Effects of Boundary Conditions and Source Dimensions on the Effective Thermal Conductivity of a Printed Circuit Board

Younes Shabany

InterPACK 2003; 423-428https://doi.org/10.1115/IPACK2003-35201

Abstract

View Articletitled, Effects of Boundary Conditions and Source Dimensions on the Effective Thermal Conductivity of a Printed Circuit Board

PDF

Topics: Boundary-value problems , Dimensions , Printed circuit boards , Thermal conductivity , Convection , Heat conduction , Lumber , Copper

Optimum Airflow Management for Multi-Board Rack-Mount Equipment

Bhalchandra Puranik, Younes Shabany

InterPACK 2003; 429-434https://doi.org/10.1115/IPACK2003-35210

Abstract

View Articletitled, Optimum Airflow Management for Multi-Board Rack-Mount Equipment

PDF

Topics: Air flow , Design , Air filters , Dimensions , Lumber , Noise (Sound) , Redundancy (Engineering) , Reliability , Telecommunications , Vacuum equipment

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee, H. S. Chen

InterPACK 2003; 435-442https://doi.org/10.1115/IPACK2003-35213

Abstract

View Articletitled, System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

PDF

Topics: Microelectronic devices , Optimization , Thermal analysis , Transients (Dynamics) , Temperature , Cycles , Design , Computer software , Cooling , Flow (Dynamics)

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz

InterPACK 2003; 443-450https://doi.org/10.1115/IPACK2003-35216

Abstract

View Articletitled, System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

PDF

Topics: Optimization , Temperature , Elastomers , Design , Slug flows , Computer software , Copper , Failure , High temperature , Numerical analysis

Novel Method for Estimating Thermal Film Coefficients for Analysis of Thermal Cycling of Microelectronic Packages

Benjamin C. Chambers

InterPACK 2003; 451-454https://doi.org/10.1115/IPACK2003-35217

Abstract

View Articletitled, Novel Method for Estimating Thermal Film Coefficients for Analysis of Thermal Cycling of Microelectronic Packages

PDF

Topics: Boundary-value problems , Cooling , Failure analysis , Flow (Dynamics) , Fluids , Heat , Heat flux , Quenching (Metalworking) , Solids , Steel

The Effects of Nozzle Configuration and Coolant Flow Rate on Spray Evaporative Cooling in a Multi-Chip Module Using FC-72

Adam G. Pautsch, Timothy A. Shedd

InterPACK 2003; 455-460https://doi.org/10.1115/IPACK2003-35227

Abstract

View Articletitled, The Effects of Nozzle Configuration and Coolant Flow Rate on Spray Evaporative Cooling in a Multi-Chip Module Using FC-72

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Topics: Coolants , Evaporative cooling , Flow (Dynamics) , Multi-chip modules , Nozzles , Sprays , Heat , Cooling , Critical heat flux , Computers

Reverse Mount Packages and Their Cooling

Mudasir Ahmad, Susheela Narasimhan

InterPACK 2003; 461-466https://doi.org/10.1115/IPACK2003-35231

Abstract

View Articletitled, Reverse Mount Packages and Their Cooling

PDF

Topics: Air flow , Cooling , Density , Design , Flat heat pipes , Heat , Heat conduction , Lumber , Packaging , Sheet metal

Analysis and Design of Liquid-Cooling Systems Using Flow Network Modeling (FNM)

Kanchan M. Kelkar, Suhas V. Patankar

InterPACK 2003; 467-472https://doi.org/10.1115/IPACK2003-35233

Abstract

View Articletitled, Analysis and Design of Liquid-Cooling Systems Using Flow Network Modeling (FNM)

PDF

Topics: Cooling , Design , Flow (Dynamics) , Modeling , Temperature , Biomedicine , Computers , Cooling systems , Defense industry , Electronic components

Analysis of Pumping Requirements for Microchannel Cooling Systems

Vishal Singhal, Dong Liu, Suresh V. Garimella

InterPACK 2003; 473-479https://doi.org/10.1115/IPACK2003-35237

Abstract

View Articletitled, Analysis of Pumping Requirements for Microchannel Cooling Systems

PDF

Topics: Cooling systems , Microchannels , Heat sinks , Pumps , Analytical methods , Cooling , Flow (Dynamics) , Heat , Micropumps , Pressure

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed

Roger Schmidt, Ethan Cruz

InterPACK 2003; 481-493https://doi.org/10.1115/IPACK2003-35240

Abstract

View Articletitled, Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed

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Topics: Computers , Data centers , Temperature , Computational fluid dynamics , Flow (Dynamics) , Tiles , Computer simulation , Design , Electronic equipment , Temperature distribution

Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

Roger Schmidt, Ethan Cruz

InterPACK 2003; 495-508https://doi.org/10.1115/IPACK2003-35241

Abstract

View Articletitled, Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

PDF

Topics: Computers , Data centers , Temperature , Computational fluid dynamics , Flow (Dynamics) , Tiles , Computer simulation , Design , Electronic equipment , Exhaust systems

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen

InterPACK 2003; 509-516https://doi.org/10.1115/IPACK2003-35242

Abstract

View Articletitled, Thermofluid Design of Energy Efficient and Compact Heat Sinks

PDF

Topics: Design , Heat sinks , Thermofluids , Fins , Convection , Cooling , Cooling systems , Design methodology , Electronic products , Energy efficiency

Miniature Loop Heat Pipes for Electronic Cooling

Triem T. Hoang, Tamara A. O’Connell, Jentung Ku, C. Dan Butler, Theodore D. Swanson

InterPACK 2003; 517-525https://doi.org/10.1115/IPACK2003-35245

Abstract

View Articletitled, Miniature Loop Heat Pipes for Electronic Cooling

PDF

Topics: Computer cooling , Heat pipes , Heat , Electronics , Packaging , Water , Control systems , Electricity (Physics) , Energy dissipation , Fluids

Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

Ralph L. Webb

InterPACK 2003; 527-535https://doi.org/10.1115/IPACK2003-35251

Abstract

View Articletitled, Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

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Topics: Design , Flow (Dynamics) , Manifolds , Microchannels , Friction , Manufacturing , Microelectromechanical systems , Cooling , Reynolds number , Shapes

Very High Performance Thermal Interface Material and Attachment Technology

Ralph L. Webb, Jin Wook Paek, David Pickrell

InterPACK 2003; 537-543https://doi.org/10.1115/IPACK2003-35253

Abstract

View Articletitled, Very High Performance Thermal Interface Material and Attachment Technology

PDF

Topics: Alloys , Contact resistance , Contamination , Copper , Diffusion (Physics) , Errors , Melting , Melting point , Modeling , Oxidation

Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

James S. Wilson

InterPACK 2003; 545-550https://doi.org/10.1115/IPACK2003-35256

Abstract

View Articletitled, Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

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Topics: Design , Electricity (Physics) , Energy dissipation , Energy generation , Heat , Integrated circuits , Junctions , Microwaves , Packaging , Radar

Thermal Performance of a Thermo-Electric Base Thermal Control Unit Using Various Interface Materials

Jihad Y. Hammoud

InterPACK 2003; 551-556https://doi.org/10.1115/IPACK2003-35259

Abstract

View Articletitled, Thermal Performance of a Thermo-Electric Base Thermal Control Unit Using Various Interface Materials

PDF

Topics: Cooling systems , Design , Graphite , Heat , Heat transfer , Manufacturing , Pressure , Temperature , Thermal management , Thermal resistance

Analysis and Optimization of the Thermal Performance of Microchannel Heat Sinks

Dong Liu, Suresh V. Garimella

InterPACK 2003; 557-565https://doi.org/10.1115/IPACK2003-35260

Abstract

View Articletitled, Analysis and Optimization of the Thermal Performance of Microchannel Heat Sinks

PDF

Topics: Heat sinks , Microchannels , Optimization , Computational fluid dynamics , Convection , Modeling , Porous materials , Temperature , Thermal resistance

Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data

I. Savija, J. R. Culham, M. M. Yovanovich

InterPACK 2003; 567-573https://doi.org/10.1115/IPACK2003-35264

Abstract

View Articletitled, Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data

PDF

Topics: ASTM International , Cycles , Modeling , Pressure , Temperature , Thermal conductivity , Thermal expansion , Thermal resistance , Vacuum , Young's modulus

Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics

Nitesh D. Nimkar, Sushil H. Bhavnani, Richard C. Jaeger

InterPACK 2003; 575-585https://doi.org/10.1115/IPACK2003-35267

Abstract

View Articletitled, Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics

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Topics: Bubbles , Cavities , Cooling , Critical heat flux , Electronics , Emissions , Fluids , Glass , Heat flux , Heat losses

Experiments and Modeling of the Hydraulic Resistance of In-Line Square Pin Fin Heat Sinks With Top By-Pass Flow

Mario Urdaneta, Alfonso Ortega, Russel V. Westphal

InterPACK 2003; 587-596https://doi.org/10.1115/IPACK2003-35268

Abstract

View Articletitled, Experiments and Modeling of the Hydraulic Resistance of In-Line Square Pin Fin Heat Sinks With Top By-Pass Flow

PDF

Topics: Flow (Dynamics) , Heat sinks , Modeling , Pins (Engineering) , Aluminum , Pressure , Clearances (Engineering) , Dimensions , Pressure drop , Pressure measurement

Experiments and Modeling of the Thermal Resistance of In-Line Square Pin-Fin Heat Sinks With Top By-Pass Flow

Mario Urdaneta, Alfonso Ortega

InterPACK 2003; 597-604https://doi.org/10.1115/IPACK2003-35270

Abstract

View Articletitled, Experiments and Modeling of the Thermal Resistance of In-Line Square Pin-Fin Heat Sinks With Top By-Pass Flow

PDF

Topics: Flow (Dynamics) , Heat sinks , Modeling , Thermal resistance , Aluminum , Cooling , Dimensions , Geometry , Heat transfer

A Hybrid Methodology for the Optimization of Data Center Room Layout

Shrishail Guggari, Dereje Agonafer, Christian Belady, Lennart Stahl

InterPACK 2003; 605-612https://doi.org/10.1115/IPACK2003-35273

Abstract

View Articletitled, A Hybrid Methodology for the Optimization of Data Center Room Layout

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Topics: Computational fluid dynamics , Data centers , Optimization

Effect of the Thermostatic Expansion Valve Characteristics on the Stability of a Refrigeration System: Part II

Amit Kulkarni, Dereje Agonafer, Roger Schmidt

InterPACK 2003; 613-619https://doi.org/10.1115/IPACK2003-35278

Abstract

View Articletitled, Effect of the Thermostatic Expansion Valve Characteristics on the Stability of a Refrigeration System: Part II

PDF

Topics: Refrigeration , Stability , Valves , Stress , Temperature , Computers , Suction , Electronics , Energy dissipation , Heat flux

Techniques for Controlling Airflow Distribution in Raised-Floor Data Centers

Kailash C. Karki, Suhas V. Patankar, Amir Radmehr

InterPACK 2003; 621-628https://doi.org/10.1115/IPACK2003-35282

Abstract

View Articletitled, Techniques for Controlling Airflow Distribution in Raised-Floor Data Centers

PDF

Topics: Air flow , Data centers , Tiles , Flow (Dynamics) , Computers , Cooling , Heat , Pressure , Stress

Cooling Solution for Next Generation High-Power Processor Boards in 1U Computer Servers

Farzam Roknaldin, Ridvan A. Sahan

InterPACK 2003; 629-634https://doi.org/10.1115/IPACK2003-35294

Abstract

View Articletitled, Cooling Solution for Next Generation High-Power Processor Boards in 1U Computer Servers

PDF

Topics: Aluminum , Computers , Cooling , Copper , Design , Flow (Dynamics) , Heat pipes , Heat sinks , Lumber , Optimization

Orientation-Independent Atomization Heat Transfer Cell for Thermal Management of Microelectronics

Samuel N. Heffington, Ari Glezer

InterPACK 2003; 635-640https://doi.org/10.1115/IPACK2003-35299

Abstract

View Articletitled, Orientation-Independent Atomization Heat Transfer Cell for Thermal Management of Microelectronics

PDF

Topics: Cooling , Heat transfer , Microelectronic devices , Sprays , Thermal management

Influence of Package-Sink Interface Materials on Die Performance and Reliability

Henry H. Jung, Sai Ankireddi, Stanley Pecavar, James Jones

InterPACK 2003; 641-645https://doi.org/10.1115/IPACK2003-35304

Abstract

View Articletitled, Influence of Package-Sink Interface Materials on Die Performance and Reliability

PDF

Topics: Electrical conductivity , Electronic packages , Junctions , Reliability , Temperature , Temperature gradient , Thermal conductivity , Thermal resistance

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

Gary L. Solbrekken, Kazuaki Yazawa, Avram Bar-Cohen

InterPACK 2003; 647-652https://doi.org/10.1115/IPACK2003-35305

Abstract

View Articletitled, Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

PDF

Topics: Electronic equipment , Refrigeration , Thermoelectric devices , Heat sinks , Heat , Energy dissipation , Thermal resistance , Accounting , Electronic components , Flow (Dynamics)

The Effectiveness of Solar Shield for Outdoor Equipment

Mulugeta K. Berhe, Younes Shabany

InterPACK 2003; 653-657https://doi.org/10.1115/IPACK2003-35307

Abstract

View Articletitled, The Effectiveness of Solar Shield for Outdoor Equipment

PDF

Topics: Solar energy , Temperature , Emissivity , Channel flow , Computational fluid dynamics , Engineering simulation , Flux (Metallurgy) , Heat , Heat flux , Heat transfer

Thermal Issues in Next Generation Integrated Circuits

Siva Gurrum, Shivesh Suman, Yogendra Joshi, Andrei Fedorov

InterPACK 2003; 659-664https://doi.org/10.1115/IPACK2003-35309

Abstract

View Articletitled, Thermal Issues in Next Generation Integrated Circuits

PDF

Topics: Boundary-value problems , Computer cooling , Convection , Cooling , Design , Energy dissipation , Heat , Heat conduction , Integrated circuits , Manufacturing

On the Correlation Between Power Density Distribution and Junction-Case Thermal Resistance for Electronic Packages

Sai Ankireddi, Henry H. Jung, James Jones

InterPACK 2003; 665-674https://doi.org/10.1115/IPACK2003-35310

Abstract

View Articletitled, On the Correlation Between Power Density Distribution and Junction-Case Thermal Resistance for Electronic Packages

PDF

Topics: Electronic packages , Junctions , Power density , Thermal resistance , Dimensions , Simulation , Temperature , Temperature distribution , Testing

Pool Boiling of Water and FC-72 on Copper and Graphite Foams

Saeed Moghaddam, Michael Ohadi, Jianwei Qi

InterPACK 2003; 675-680https://doi.org/10.1115/IPACK2003-35316

Abstract

View Articletitled, Pool Boiling of Water and FC-72 on Copper and Graphite Foams

PDF

Topics: Copper , Foams (Chemistry) , Graphite , Pool boiling , Water , Boiling , Porosity , Heat , Heat transfer , Metals

High Heat Flux Liquid-Cooled Porous Metal Heat Sink

Mark T. North, Wei-Lin Cho

InterPACK 2003; 681-686https://doi.org/10.1115/IPACK2003-35320

Abstract

View Articletitled, High Heat Flux Liquid-Cooled Porous Metal Heat Sink

PDF

Topics: Cooling , Heat flux , Heat sinks , Metals

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

Vadim Gektin, Sai Ankireddi, Jim Jones, Stan Pecavar, Paul Hundt

InterPACK 2003; 687-694https://doi.org/10.1115/IPACK2003-35324

Abstract

View Articletitled, Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

PDF

Topics: Computer cooling , Contact resistance , Thermal conductivity

Thermal Simulation for Outdoor Optical Network Unit

Z. Zack Yu, Ridvan Amir Sahan, X. Howard Sun

InterPACK 2003; 695-698https://doi.org/10.1115/IPACK2003-35348

Abstract

View Articletitled, Thermal Simulation for Outdoor Optical Network Unit

PDF

Topics: Simulation , Telecommunications , Computational fluid dynamics , Cooling , Cables , Curbs (Roads) , Design , Electronics , Fibers , Optics

Entrance and Exit Losses for Developing Flow in Plain Fin Heat Sinks

Ralph L. Webb, Jin Wook Paek

InterPACK 2003; 699-704https://doi.org/10.1115/IPACK2003-35354

Abstract

View Articletitled, Entrance and Exit Losses for Developing Flow in Plain Fin Heat Sinks

PDF

Topics: Flow (Dynamics) , Heat sinks , Pressure drop , Ducts , Errors , Heat exchangers , Plates (structures)

Air Cooled Compact Heat Exchanger Design for Avionics Thermal Management Using Published Test Data

George Hall, James Marthinuss, Jr.

InterPACK 2003; 705-711https://doi.org/10.1115/IPACK2003-35362

Abstract

View Articletitled, Air Cooled Compact Heat Exchanger Design for Avionics Thermal Management Using Published Test Data

PDF

Topics: Avionics , Design , Heat exchangers , Thermal management , Fins , Heat transfer , Electronics , Pressure drop , Aerospace industry , Cooling

Embedded Passives

Ceramic Resistors and Capacitors Embedded in Organic Printed Wiring Boards

William Borland, John J. Felten, Lynne E. Dellis, Saul Ferguson, Diptarka Majumdar, Alton B. Jones, Mark S. Lux, Richard R. Traylor, Marc Doyle

InterPACK 2003; 713-718https://doi.org/10.1115/IPACK2003-35090

Abstract

View Articletitled, Ceramic Resistors and Capacitors Embedded in Organic Printed Wiring Boards

PDF

Topics: Capacitors , Ceramics , Printed circuit boards , Resistors , Thick films

Epoxy/BaTiO₃ Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications

Sungdong Cho, Jin-Gul Hyun, Kuyng-Wook Paik

InterPACK 2003; 719-725https://doi.org/10.1115/IPACK2003-35149

Abstract

View Articletitled, Epoxy/BaTiO<sub>3</sub> Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications

PDF

Topics: Capacitors , Ceramic composites , Composite materials , Epoxy resins

Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology

Albert Chee W. Lu, Wei Fan, Lai L. Wai, Toshiro Yamazaki, Jacinto Jun Jarcia, Jr., Kim H. Chin

InterPACK 2003; 727-733https://doi.org/10.1115/IPACK2003-35221

Abstract

View Articletitled, Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology

PDF

Topics: Design , Optimization , Capacitors , Printed circuit boards , Engineering simulation , Frequency-domain analysis , Lumber , Simulation , Simulation results , Vehicles

Design Optimization of Off-Chip Inductors

Lin Jin, Albert Chee W. Lu, Lai L. Wai, Wei Fan, Aik Chong Tan, Kai Chong Chan

InterPACK 2003; 735-739https://doi.org/10.1115/IPACK2003-35223

Abstract

View Articletitled, Design Optimization of Off-Chip Inductors

PDF

Topics: Design , Inductors , Optimization , Design methodology , Engineering simulation , Manufacturing , Semiconductor wafers , Simulation

New Substrates for Use as Embedded Capacitors

Takuya Yamamoto, John Andresakis

InterPACK 2003; 741-745https://doi.org/10.1115/IPACK2003-35230

Abstract

View Articletitled, New Substrates for Use as Embedded Capacitors

PDF

Topics: Capacitors , Capacitance , Breakdown (Electricity) , Diluents , Epoxy adhesives , Epoxy resins , Laminates , Lumber

Embedded Passives: A Novel Approach Using Ceramic Thick Film Technology

Richard C. Snogren

InterPACK 2003; 747-755https://doi.org/10.1115/IPACK2003-35244

Abstract

View Articletitled, Embedded Passives: A Novel Approach Using Ceramic Thick Film Technology

PDF

Topics: Ceramics , Thick films , Capacitors , Printed circuit boards , Resistors , Design , Manufacturing

A Review of the Economics of Embedded Passives

Peter A. Sandborn

InterPACK 2003; 757-762https://doi.org/10.1115/IPACK2003-35339

Abstract

View Articletitled, A Review of the Economics of Embedded Passives

PDF

Topics: Economics , Manufacturing , Economic analysis , Life cycle costing , Printed circuit boards , Resistors

Airborne, Space and Defense Electronic Systems

Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G_rms)

Ivan Straznicky

InterPACK 2003; 763-766https://doi.org/10.1115/IPACK2003-35056

Abstract

View Articletitled, Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G<sub>rms</sub>)

PDF

Topics: Random vibration , Spectral energy distribution , Damage , Circuits , Defense industry , Electronics , Fatigue damage , Manufacturing , Vehicles , Vibration

Humidity Control Simulation for Electronics Packaging

David G. Myers

InterPACK 2003; 767-777https://doi.org/10.1115/IPACK2003-35057

Abstract

View Articletitled, Humidity Control Simulation for Electronics Packaging

PDF

Topics: Electronic packaging , Leakage , Simulation , Design , Cycles , Diffusion (Physics) , Sealing (Process) , Service life (Equipment) , Simulation results , Temperature

Rugged Portable Grayscale Optical Correlator for Onboard Automatic Target Recognition Applications

Tien-Hsin Chao, George Reyes, Hanying Zhou

InterPACK 2003; 779-782https://doi.org/10.1115/IPACK2003-35235

Abstract

View Articletitled, Rugged Portable Grayscale Optical Correlator for Onboard Automatic Target Recognition Applications

PDF

Topics: Design , Engineering prototypes , Ferroelectric crystals , Jet propulsion , Packaging

Insertion of HDI and Grid Array Technologies Into Military/Space Applications

Jerry D. Keller

InterPACK 2003; 783-788https://doi.org/10.1115/IPACK2003-35248

Abstract

View Articletitled, Insertion of HDI and Grid Array Technologies Into Military/Space Applications

PDF

Topics: Military systems , Aerospace industry , Density , Electronics , Ball-Grid-Array packaging , Defense industry , Durability , Electronic packaging , Packaging , Printed circuit boards

Integrated Avionics System (IAS): Integrating 3D Technology on a Spacecraft Panel

Don J. Hunter

InterPACK 2003; 789-795https://doi.org/10.1115/IPACK2003-35249

Abstract

View Articletitled, Integrated Avionics System (IAS): Integrating 3D Technology on a Spacecraft Panel

PDF

Topics: Avionics , Space vehicles , Packaging , Density , Hardware , Design , Flexible systems , Manufacturing , Packaging density (Electronics)

Development of Reliable Electronic Packaging Solutions for Spacecraft Avionics Miniaturization Using Embedded Passive Devices

Don Schatzel

InterPACK 2003; 797-800https://doi.org/10.1115/IPACK2003-35347

Abstract

View Articletitled, Development of Reliable Electronic Packaging Solutions for Spacecraft Avionics Miniaturization Using Embedded Passive Devices

PDF

Topics: Avionics , Electronic packaging , Space vehicles , Capacitors , Circuits , Reliability , Resistors , Silicon , Temperature , Thin films

Use of Plastic Commercial Off-the-Shelf (COTS) Microcircuits for Space Applications

R. David Gerke, Andrew A. Shapiro, Shri Agawal, David M. Peters, Michael A. Sandor

InterPACK 2003; 801-808https://doi.org/10.1115/IPACK2003-35351

Abstract

View Articletitled, Use of Plastic Commercial Off-the-Shelf (COTS) Microcircuits for Space Applications

PDF

Topics: Aerospace industry , Ceramics , Electronics , Engineers , Hardware , Packaging , Proton exchange membranes , Reliability , Risk , Risk analysis

Packaging Technology

Finite Element Analysis of Laser Welding Induced Alignment Distortion During Pigtail of Pump Lasers

M. Labudovic, M. Cook

InterPACK 2003; 809-812https://doi.org/10.1115/IPACK2003-35001

Abstract

View Articletitled, Finite Element Analysis of Laser Welding Induced Alignment Distortion During Pigtail of Pump Lasers

PDF

Topics: Finite element analysis , Laser welding , Lasers , Pumps

Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer

Chang-Chun Lee, Kuo-Ning Chiang

InterPACK 2003; 813-818https://doi.org/10.1115/IPACK2003-35052

Abstract

View Articletitled, Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer

PDF

Topics: Bubbles , Design , Event history analysis , Polishing equipment , Reliability , Semiconductor wafers

Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun

InterPACK 2003; 819-826https://doi.org/10.1115/IPACK2003-35066

Abstract

View Articletitled, Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

PDF

Topics: Density , Flip-chip , Flip-chip devices , Packaging , Finite element methods , Reliability , Bonding , Deflection , Numerical analysis , Shear stress

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

Liang Chai, Aziz Shaikh, Vern Stygar

InterPACK 2003; 827-831https://doi.org/10.1115/IPACK2003-35134

Abstract

View Articletitled, Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

PDF

Topics: Microwaves , Millimeter waves , Strip transmission lines , Ceramics , Metals , Silver , Arches , Capacitors , Cavities , Imaging

Evaluation of Surface Finish on Build Up Substrate

L. Y. Hung, Y. P. Wang, C. S. Hsiao

InterPACK 2003; 839-843https://doi.org/10.1115/IPACK2003-35153

Abstract

View Articletitled, Evaluation of Surface Finish on Build Up Substrate

PDF

Topics: Finishes , High temperature , Intermetallic compounds , Nickel , Storage , Plating , Solder joints , Shear (Mechanics) , Ball-Grid-Array packaging , Electrons

Development of Film Module With Embedded Actives

Daisuke Sakurai, Norihito Tsukahara, Kazuhiro Nishikawa, Takashi Akiguchi, Kazuto Nishida, Takaya Kobayashi, Mari Saito

InterPACK 2003; 845-852https://doi.org/10.1115/IPACK2003-35162

Abstract

View Articletitled, Development of Film Module With Embedded Actives

PDF

Topics: Compression , Finite element methods , Flow (Dynamics) , Fracture (Materials) , Heat , High pressure (Physics) , High temperature , Manufacturing , Packaging , Pressing

V-PAC: Vertical Packaging for Assembly-Compatible Chip Stacks

Vincent Malba, Leland B. Evans, Christopher D. Harvey, Anthony F. Bernhardt

InterPACK 2003; 853-858https://doi.org/10.1115/IPACK2003-35194

Abstract

View Articletitled, V-PAC: Vertical Packaging for Assembly-Compatible Chip Stacks

PDF

Topics: Manufacturing , Packaging , Adhesives , Density , Electroplating , Epoxy adhesives , Epoxy resins , Flexible electronics , High temperature , Lasers

Low Cycle Fatigue in RF Microwave Module Housings

Terry V. Baughn, Shea Chen

InterPACK 2003; 859-866https://doi.org/10.1115/IPACK2003-35263

Abstract

View Articletitled, Low Cycle Fatigue in RF Microwave Module Housings

PDF

Topics: Low cycle fatigue , Microwaves , Metals , Pressure , Ceramics , Cycles , Electronics , High cycle fatigue , Circuits , Fatigue life

Package and Board Level Study for a Thin Small Outline Package (TSOP) Using Compact Components

Amit Kulkarni, Dereje Agonafer, Steven Groothuis, Humayun Kabir, Scott Johnson

InterPACK 2003; 867-873https://doi.org/10.1115/IPACK2003-35279

Abstract

View Articletitled, Package and Board Level Study for a Thin Small Outline Package (TSOP) Using Compact Components

PDF

Topics: Forced convection , Junctions , Manufacturing , Natural convection , Resistors , Temperature

Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman

InterPACK 2003; 875-886https://doi.org/10.1115/IPACK2003-35342

Abstract

View Articletitled, Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects

PDF

Topics: Diluents , Displacement , Electroplating , Geometry , Integrated circuit fabrication , Manufacturing , Microelectromechanical systems , Optimization , Packaging , Photolithography

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