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Proceedings Papers
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1
Education
Electrical Design, Simulation, and Test
Design Optimization of Via Transitions for Broadband Applications
InterPACK 2003; 17-23https://doi.org/10.1115/IPACK2003-35154
Topics:
Design
,
Optimization
,
Resonance
,
Cavities
,
Engineering simulation
,
Signals
,
Simulation
,
Vehicles
,
Waves
Design and Assembly Methods for Improving High Current Board-Component Connectivity
InterPACK 2003; 25-31https://doi.org/10.1115/IPACK2003-35204
Topics:
Design
,
Manufacturing
,
Solders
,
Signals
,
Ball-Grid-Array packaging
,
Density
,
Optimization
,
Printed circuit boards
,
Separation (Technology)
,
Silicon
A Method for Improving Component Decoupling Using Advanced Capacitor Under Ball Grid Array (ACUB)
InterPACK 2003; 33-36https://doi.org/10.1115/IPACK2003-35207
Topics:
Ball-Grid-Array packaging
,
Capacitors
,
Design
,
Stress
,
Manufacturing
,
Capacitance
,
Transients (Dynamics)
,
Design methodology
,
Engineering prototypes
,
Silicon
Surface Finish Effects on High-Speed Interconnects
InterPACK 2003; 43-46https://doi.org/10.1115/IPACK2003-35332
Topics:
Finishes
,
Signals
,
Finite element methods
,
Strip transmission lines
,
Geometry
,
Printed circuit boards
,
Simulation
,
Skin
,
Solders
,
Waves
Manufacturing and Test
Chip in Polymer: 3D Integration of Active Circuitry in Polymeric Substrate
InterPACK 2003; 47-51https://doi.org/10.1115/IPACK2003-35025
Topics:
Bricks
,
Electronic products
,
Laminates
,
Manufacturing
,
Microelectromechanical systems
,
Polymers
,
Silicon
,
Silicon chips
,
System-in-package
,
Thermal management
Through-Hole Drilling Condition of FR-4 Printed Wiring Boards Based on Preventing Ion Migration
Eiichi Aoyama, Hiromichi Nobe, Tadayuki Ikuta, Tsutao Katayama, Toshiki Hirogaki, Hisahiro Inoue, Katsutoshi Yamauchi
InterPACK 2003; 53-59https://doi.org/10.1115/IPACK2003-35083
Topics:
Drilling
,
Ion migration
,
Printed circuit boards
,
Delamination
,
Glass
,
Textiles
,
Circuits
,
Insulation
,
Packaging density (Electronics)
,
Damage
An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In
InterPACK 2003; 65-71https://doi.org/10.1115/IPACK2003-35137
Topics:
Cooling
,
Semiconductors (Materials)
,
Sprays
,
Thermal management
,
Temperature
,
Junctions
,
Engineering prototypes
,
Failure
,
Flow control
,
Forced convection
Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis
InterPACK 2003; 73-80https://doi.org/10.1115/IPACK2003-35206
Topics:
Cooling
,
Failure analysis
,
Semiconductors (Materials)
,
Sprays
,
Thermal management
,
Temperature
,
Microscopes
,
Silicon
,
Coolants
,
Heat
Materials, Processes, and Technologies
BCB Wafer Bonding Compatible With Bulk Micro Machining
InterPACK 2003; 93-99https://doi.org/10.1115/IPACK2003-35011
Topics:
Bonding
,
Microfluidics
,
Micromachining
,
Polymers
,
Semiconductor wafers
Deformation and Damage in Solder During Fast Cyclic Loading
InterPACK 2003; 101-107https://doi.org/10.1115/IPACK2003-35030
Topics:
Damage
,
Deformation
,
Solders
,
Intermetallic compounds
,
Shear (Mechanics)
,
Failure
,
Modeling
,
Alloys
,
Cracking (Materials)
,
Fatigue
Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages
InterPACK 2003; 109-114https://doi.org/10.1115/IPACK2003-35038
Topics:
Ball-Grid-Array packages
,
Hardening (Curing)
,
Reliability
,
Solder joints
,
Polymers
,
Robustness
,
Thermal properties
Development of Lead-Free Flip Chip Package and Its Reliability
InterPACK 2003; 115-121https://doi.org/10.1115/IPACK2003-35046
Topics:
Flip-chip packages
,
Reliability
,
Semiconductor wafers
,
Solders
,
Failure mechanisms
,
Cycles
,
Temperature
,
Wire bonding
,
Ball-Grid-Array packaging
,
Flip-chip
Analysis of ACF Contact Resistance
InterPACK 2003; 123-130https://doi.org/10.1115/IPACK2003-35061
Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability
InterPACK 2003; 131-136https://doi.org/10.1115/IPACK2003-35087
Topics:
Compressive stress
,
Experimental analysis
,
Flip-chip
,
Flip-chip devices
,
Reliability
,
Shrinkage (Materials)
,
Stress
,
Temperature
,
Heat conduction
,
Bonding
Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy
InterPACK 2003; 141-145https://doi.org/10.1115/IPACK2003-35126
Topics:
Alloys
,
Lead-free solders
,
Phase diagrams
,
Tin
Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints
InterPACK 2003; 147-153https://doi.org/10.1115/IPACK2003-35130
Topics:
Flip-chip
,
Flip-chip devices
,
Solders
,
Manufacturing
,
Brittleness
,
Reliability
,
Shear (Mechanics)
,
Shear strength
,
Testing
,
Tin
Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects
InterPACK 2003; 155-160https://doi.org/10.1115/IPACK2003-35165
Topics:
Fatigue life
,
Flip-chip
,
Flip-chip devices
,
Shear (Mechanics)
,
Silver
,
Tin
Modeling the Laser Ablation Process Using Neural Networks
InterPACK 2003; 161-167https://doi.org/10.1115/IPACK2003-35188
Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes
InterPACK 2003; 169-176https://doi.org/10.1115/IPACK2003-35192
Topics:
Optics
,
Probes
,
Fibers
,
Electronics
,
Packaging
,
Silicon
,
Anisotropy
,
Chemical etching
,
Density
,
Etching
Effect of Reflow Parameters on Solder Wetting
InterPACK 2003; 177-182https://doi.org/10.1115/IPACK2003-35193
Topics:
Solders
,
Wetting
,
Temperature
,
Constitutive equations
,
Cooling
,
Dynamics (Mechanics)
,
Electronics
,
Manufacturing
,
Metals
,
Temperature profiles
Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process
InterPACK 2003; 183-189https://doi.org/10.1115/IPACK2003-35238
Topics:
Adhesives
,
Anisotropy
,
Compression
,
Manufacturing
,
Flow (Dynamics)
,
Particulate matter
,
Resins
,
Actuators
,
Adhesive resins
,
Capacitance
Influence of the Property of the Build-Up Package on Warpage at Flip Chip Assembly Process
Yukihiko Toyoda, Yoichiro Kawamura, Hiroyoshi Hiei, Qiang Yu, Tadahiro Shibutani, Doseop Kim, Haeki Nam
InterPACK 2003; 197-201https://doi.org/10.1115/IPACK2003-35262
Topics:
Flip-chip assemblies
,
Warping
,
Manufacturing
,
Simulation
,
Packaging
,
Reliability
,
Density
Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics
Design of Micro-Arrayed Thin Film Thermocouples (TFTC)
InterPACK 2003; 213-217https://doi.org/10.1115/IPACK2003-35040
Topics:
Design
,
Thermocouples
,
Thin films
,
Copper
,
Aluminum
,
Bulk solids
,
Semiconductor wafers
,
Simulation
,
Heat conduction
,
Junctions
Temperature Measurement by Using Metal Thin Film Thermocouples
InterPACK 2003; 219-223https://doi.org/10.1115/IPACK2003-35042
Topics:
Metals
,
Temperature measurement
,
Thermocouples
,
Thin films
,
Electrons
,
Glass
,
Junctions
,
Diffusion (Physics)
,
Dimensions
,
Film thickness
High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array
InterPACK 2003; 245-249https://doi.org/10.1115/IPACK2003-35203
Topics:
Borosilicate glasses
,
Density
,
Semiconductor wafers
,
Bonding
,
Construction
,
Flip-chip
,
Machining
,
Metals
,
Particle spin
,
Rotation
Calibration Systems and Techniques for Automated Microassembly
InterPACK 2003; 251-255https://doi.org/10.1115/IPACK2003-35208
Topics:
Calibration
,
Microassembling
,
Manufacturing
,
Crystals
,
End effectors
,
Geometry
,
Microelectromechanical systems
,
Nickel
,
Robotics
,
Silicon
MEMS Mirror Switch for Multi-Channel Spectrophotometer
InterPACK 2003; 265-268https://doi.org/10.1115/IPACK2003-35329
Topics:
Microelectromechanical systems
,
Mirrors
,
Reflectometers
,
Switches
,
Torsion
,
Design
,
Fibers
,
Manufacturing
,
Micromachining
,
Optical fiber
Modeling and Characterization
The Role of Fin Geometry in Heat Sink Performance
InterPACK 2003; 279-285https://doi.org/10.1115/IPACK2003-35014
Topics:
Geometry
,
Heat sinks
,
Entropy
,
Drag (Fluid dynamics)
,
Fins
,
Plates (structures)
,
Pressure drop
,
Reynolds number
,
Thermal resistance
,
Thermofluids
Studies With Transient Compact Models of Packages and Heat Sinks
InterPACK 2003; 295-302https://doi.org/10.1115/IPACK2003-35049
Topics:
Algorithms
,
Errors
,
Heat sinks
,
Simulation
,
Simulation experiments
,
Temperature
,
Transients (Dynamics)
Deformation Characteristics of Solder Joints
InterPACK 2003; 303-307https://doi.org/10.1115/IPACK2003-35078
Topics:
Deformation
,
Solder joints
,
Shear (Mechanics)
,
Film thickness
,
Fracture toughness
,
Solders
,
Copper
,
Dislocations
,
Grain size
,
Microelectronic packaging
Thermo-Mechanical Deformation and Stress Analysis of a Flip-Chip BGA
InterPACK 2003; 309-316https://doi.org/10.1115/IPACK2003-35082
Topics:
Ball-Grid-Array packaging
,
Deformation
,
Flip-chip
,
Stress analysis (Engineering)
,
Temperature
,
Thermomechanics
,
Warping
,
Stress
,
Diluents
,
Flip-chip packages
Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes
InterPACK 2003; 317-323https://doi.org/10.1115/IPACK2003-35086
Topics:
Drilling
,
Lasers
,
Temperature
,
Circuits
,
Printed circuit boards
,
Copper foil
,
Heat
,
Absorption
,
Damage
,
Finite element methods
Thermal Characters of Mesh Structure in a Flat Heat Pipe
InterPACK 2003; 325-333https://doi.org/10.1115/IPACK2003-35095
Topics:
Flat heat pipes
,
Heat pipes
,
Thermal resistance
,
Condensation
,
Evaporation
,
Water
,
Computer cooling
,
Condensers (steam plant)
,
Copper
,
Fluids
Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop
InterPACK 2003; 355-361https://doi.org/10.1115/IPACK2003-35138
Topics:
Optimization
,
Silicon
,
Thermal management
,
Condensers (steam plant)
,
Cooling
,
Design
,
Dimensions
,
Energy budget (Physics)
,
Gallium nitride
,
Heat flux
Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds
InterPACK 2003; 371-376https://doi.org/10.1115/IPACK2003-35170
Topics:
Design
,
Simulation
,
Geometry
,
Bonding
,
Heat
,
Stress
,
Computational fluid dynamics
,
Computer software
,
Cycles
,
Energy dissipation
A Hybrid Flow Network-CFD Method for Achieving Any Desired Flow Partitioning Through Floor Tiles of a Raised-Floor Data Center
InterPACK 2003; 377-382https://doi.org/10.1115/IPACK2003-35171
Topics:
Computational fluid dynamics
,
Data centers
,
Flow (Dynamics)
,
Tiles
,
Circuits
,
Air flow
,
Dampers
,
Errors
,
Pressure
,
Simulation
Thermodynamic Efficiency of Porous Glass Electroosmotic Pumps
InterPACK 2003; 383-390https://doi.org/10.1115/IPACK2003-35178
Topics:
Glass
,
Pumps
,
Pressure
,
Flow (Dynamics)
,
Stress
,
Approximation
,
Electrolytes
,
Electroosmosis
,
Geometry
,
Heat exchangers
Creep and Microstructural Evolution in Lead-Free Microelectronic Solder Joints
InterPACK 2003; 417-422https://doi.org/10.1115/IPACK2003-35209
Topics:
Creep
,
Solder joints
,
Testing
,
Alloys
,
Lead-free solders
,
Solders
,
Tin
,
Ball-Grid-Array packaging
,
Flip-chip
,
Flip-chip devices
Compact Thermal Representations for Several Fundamental Shapes in Forced Convection
InterPACK 2003; 431-437https://doi.org/10.1115/IPACK2003-35218
Topics:
Forced convection
,
Shapes
,
Heat sinks
,
Thermal conductivity
,
Fluids
,
Thermal resistance
,
Approximation
,
Computer simulation
,
Cooling
,
Electronic packages
Compact Thermal Representations for Several Fundamental Shapes in Natural Convection
InterPACK 2003; 439-448https://doi.org/10.1115/IPACK2003-35219
Topics:
Natural convection
,
Shapes
,
Heat sinks
,
Thermal conductivity
,
Approximation
,
Fluids
,
Design
,
Engineers
,
Fins
,
Optimization
On the Treatment of Circuit Boards as Thermal Two-Ports
InterPACK 2003; 461-471https://doi.org/10.1115/IPACK2003-35225
Topics:
Gates (Closures)
,
Printed circuit boards
,
Heat
,
Boundary-value problems
,
Temperature
,
Convection
,
Flow (Dynamics)
,
Geometry
,
Heat conduction
,
Heat flux
Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application
InterPACK 2003; 473-483https://doi.org/10.1115/IPACK2003-35232
Topics:
Creep
,
Electronic packaging
,
Mechanical behavior
,
Temperature
,
Testing
,
Thermomechanics
,
Adhesion
,
Solder masks
,
Deformation
,
Stress
Numerical Optimization Study for a Parallel Plate Impingement Heat Sink
InterPACK 2003; 485-495https://doi.org/10.1115/IPACK2003-35236
Topics:
Heat sinks
,
Optimization
,
Fins
,
Design
,
Numerical analysis
,
Pressure drop
,
Shape optimization
Parameter Optimization for a Temperature Estimation Model
InterPACK 2003; 505-512https://doi.org/10.1115/IPACK2003-35254
Topics:
Optimization
,
Temperature
,
Algorithms
,
Computation
,
Design
Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling
InterPACK 2003; 513-519https://doi.org/10.1115/IPACK2003-35277
Topics:
Design
,
Modeling
,
Sensors
,
Thermal systems
,
Thermal properties
,
Manufacturing
,
Signals
,
Silicon
,
Computer simulation
,
Electronics
Multi-Scale Modeling of High Power Density Data Centers
InterPACK 2003; 521-527https://doi.org/10.1115/IPACK2003-35297
Topics:
Data centers
,
Multiscale modeling
,
Power density
Effects of A Rotated Chip Package on Mechanical and Thermal Performances
InterPACK 2003; 529-535https://doi.org/10.1115/IPACK2003-35311
Topics:
Air flow
,
Clamps (Tools)
,
Computers
,
Design engineering
,
Junctions
,
Manufacturing
,
Rotation
,
Silicon
,
Stress
,
Temperature
Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement
InterPACK 2003; 537-542https://doi.org/10.1115/IPACK2003-35325
Topics:
Alloys
,
Shear (Mechanics)
,
Solders
,
Testing
,
Continuum mechanics
,
Deformation
,
Finite element methods
,
Finite element model
,
Geometry
,
Machinery
Compact Modeling of Unshrouded Plate Fin Heat Sinks
InterPACK 2003; 543-550https://doi.org/10.1115/IPACK2003-35327
Topics:
Heat sinks
,
Modeling
,
Pressure drop
,
Thermal conductivity
,
Pressure
,
Temperature
,
Accounting
,
Energy dissipation
,
Flow (Dynamics)
,
Forced convection
Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept
InterPACK 2003; 595-604https://doi.org/10.1115/IPACK2003-35352
Topics:
Event history analysis
,
Failure
,
Cycles
,
Approximation
,
Computers
,
Design
,
Electronic packaging
,
Finite element analysis
,
Modeling
,
Reliability
Photonics
A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components
InterPACK 2003; 621-628https://doi.org/10.1115/IPACK2003-35062
Topics:
Military aircraft
,
Waves
,
Fibers
,
Aircraft
,
Cables
,
Design
,
Flight
,
Testing
,
Signals
,
Aerospace industry
Packaging Friendly Parallel Optical Transceivers
Xiaoqing Wang, Fouad Kiamilev, George Papen, Jeremy Ekman, Ping Gui, Mike Haney, Joseph Deroba, Michael McFadden, Charles Kuznia
InterPACK 2003; 629-637https://doi.org/10.1115/IPACK2003-35111
Topics:
Cavities
,
Errors
,
Lasers
,
Packaging
,
Algorithms
,
Energy consumption
,
Silicon-on-insulator
,
Circuit design
,
Complementary metal oxide semiconductors
,
Density
Arbitrarily Configurable Optical Interconnect Fabric for Intrachip Global Communication
InterPACK 2003; 639-649https://doi.org/10.1115/IPACK2003-35166
Topics:
Optical interconnections
,
Textiles
,
Metals
,
Complementary metal oxide semiconductors
,
Density
,
Design
,
Integrated circuits
,
Silicon
,
Wire
O+-Ion Implantation for Practical InP-Based Digital Optical Switches
Pedro Barrios, Siegfried Janz, Ilya Golub, Philip Poole, Phillip Chow-Chong, Daniel Poitras, Irwin Sproule, Mark Malloy, Andre´ Delaˆge, Ross McKinnon, Barry Syrett, Shawky El-Mougy, Shawkat Abdalla
InterPACK 2003; 651-654https://doi.org/10.1115/IPACK2003-35199
Topics:
Switches
Source Synchronous Double Data Rate (DDR) Parallel Optical Interconnects
Ping Gui, Fouad Kiamilev, Xiaoqing Wang, Michael McFadden, Charlie Kuznia, Jeremy Ekman, Joseph Deroba, Michael Haney
InterPACK 2003; 655-663https://doi.org/10.1115/IPACK2003-35202
Topics:
Optical interconnections
,
Clocks
,
Vacuum
,
Bonding
,
Cavities
,
Circuits
,
Complementary metal oxide semiconductors
,
Design
,
Fibers
,
Flip-chip
Multi-Scale Optical Design for Global Chip-to-Chip Optical Interconnections and Misalignment Tolerant Packaging
InterPACK 2003; 673-680https://doi.org/10.1115/IPACK2003-35287
Topics:
Optical design techniques
,
Optical interconnections
,
Packaging
,
Design
,
Optical elements
,
Lenses (Optics)
,
Multi-chip modules
,
Cavities
,
Diffraction
,
Errors
Planar Waveguide: Utility in Amino Acid Detection
InterPACK 2003; 681-686https://doi.org/10.1115/IPACK2003-35300
Topics:
Waveguides
,
Biomedicine
,
Design
,
Fluorescence
,
Glass
,
DNA
,
Engineering prototypes
,
Excitation
,
Filters
,
Instrumentation
Reliability
Analysis on Acoustic Emission Produced by Strength Test of Bio-Ceramics: Dependency of AE Parameters on the Material Property
InterPACK 2003; 687-691https://doi.org/10.1115/IPACK2003-35012
Topics:
Acoustic emissions
,
Ceramics
,
Materials properties
,
Advanced materials
,
Biocompatibility
,
Mechanical properties
,
Signals
,
Waves
COTS BGA Thermal Fatigue Test for Avionics Applications
InterPACK 2003; 693-699https://doi.org/10.1115/IPACK2003-35017
Topics:
Avionics
,
Ball-Grid-Array packaging
,
Fatigue testing
,
Solder joints
,
Temperature
Three-Dimensional Stress Singularity Analysis Around the Solder Joints in Electronic Packaging Using Eigen Analysis
InterPACK 2003; 709-716https://doi.org/10.1115/IPACK2003-35054
Topics:
Electronic packaging
,
Solder joints
,
Stress singularity
,
Solders
,
Mechanical properties
,
Adhesives
,
Ceramics
,
Displacement
,
Electronic packages
,
Metals
Mechanical Stress-Induced Damage on Breakdown Characteristic of Dielectric Thin Films in MOS Transistors
InterPACK 2003; 729-734https://doi.org/10.1115/IPACK2003-35080
Topics:
Damage
,
Stress
,
Thin films
,
Transistors
,
Electrodes
,
Silicon
,
Bonding
,
Crystals
,
Deformation
,
Density
Newly Developed Real Time Monitoring System for Ionic Migration by Means of Quartz Crystal Microbalance (QCM) and Electrochemical Impedance Spectroscopy (EIS)
InterPACK 2003; 735-739https://doi.org/10.1115/IPACK2003-35081
Topics:
Electrochemical impedance spectroscopy
,
Monitoring systems
,
Quartz crystals
,
Tin
,
Copper
,
Lead-free solders
,
Plating
,
Reliability
,
Solders
,
Iron
Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack
InterPACK 2003; 741-747https://doi.org/10.1115/IPACK2003-35093
Topics:
Flip-chip
,
Flip-chip devices
,
Fracture (Materials)
,
Reliability
,
Stress
,
Electronic packages
,
Packaging
,
Adhesives
,
Anisotropy
,
Delamination
Tackling the Drop Impact Reliability of Electronic Packaging
InterPACK 2003; 757-763https://doi.org/10.1115/IPACK2003-35101
Topics:
Alloys
,
Collaboration
,
Design
,
Electronic packaging
,
Failure
,
Impact strength
,
Impact testing
,
Lead-free solders
,
Microelectronic devices
,
Physics
Nondestructive Inspection of Chip Size Package by Millimeter Waves
InterPACK 2003; 765-768https://doi.org/10.1115/IPACK2003-35118
Topics:
Millimeter waves
,
Nondestructive evaluation
,
Delamination
,
Reflectance
,
Resolution (Optics)
,
Sensors
,
Silicon chips
,
Solders
Wire Flexure Fatigue Model for Asymmetric Bond Height
InterPACK 2003; 769-776https://doi.org/10.1115/IPACK2003-35136
Topics:
Bending (Stress)
,
Fatigue
,
Wire
,
Damage
,
Failure
,
Stress
,
Temperature
,
Cycles
,
Design
,
Displacement
Effect of Package and Board Pad Size on Optimum Flip Chip Ball Grid Array (FCBGA) Package Thermo-Mechanical Performance
InterPACK 2003; 783-790https://doi.org/10.1115/IPACK2003-35143
Topics:
Ball-Grid-Array packaging
,
Flip-chip
,
Flip-chip devices
,
Thermomechanics
,
Design
,
Failure
,
Solder joints
,
Solder masks
,
Ball-Grid-Array packages
,
Modeling
The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure
InterPACK 2003; 799-808https://doi.org/10.1115/IPACK2003-35150
Topics:
Lead-free solders
,
Reliability
,
Solder joints
,
Solders
,
Silver
,
Copper
,
Cycles
,
Electronics
,
Failure
,
Lumber
Reliability of Low Glass Transition Temperature COTS PEM’s for Space Applications
InterPACK 2003; 809-815https://doi.org/10.1115/IPACK2003-35177
Topics:
Glass transition
,
Reliability
,
Molding
,
Proton exchange membranes
,
Temperature
,
Chemistry
,
Epoxy adhesives
,
Epoxy resins
,
Flame retardants
,
Manufacturing
A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly
InterPACK 2003; 817-822https://doi.org/10.1115/IPACK2003-35228
Topics:
Acoustics
,
Ball-Grid-Array packaging
,
Imaging
,
Manufacturing
,
Resolution (Optics)
,
Solder joints
,
Microscopy
,
Ultrasound
,
Semiconductor wafers
,
Signals
BGA Reliability in Automotive Underhood Applications
InterPACK 2003; 823-830https://doi.org/10.1115/IPACK2003-35243
Topics:
Ball-Grid-Array packaging
,
Reliability
,
Crack propagation
,
Damage
,
High temperature
,
Surface mount devices
,
Temperature
,
Errors
,
Fatigue
,
Glass transition
Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint
InterPACK 2003; 837-843https://doi.org/10.1115/IPACK2003-35250
Topics:
Hardening
,
Lead-free solders
,
Finite element methods
,
Stress
,
Fatigue testing
,
Kinematics
,
Solder joints
,
Solders
,
Tin
,
Work hardening
A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die
InterPACK 2003; 845-851https://doi.org/10.1115/IPACK2003-35276
Topics:
Calibration
,
Sensors
,
Stress
,
Semiconductor wafers
,
Strips
,
Design
,
Dimensions
,
Finite element analysis
,
Geometry
,
Integrated circuit fabrication
Qualification and Reliability Testing of a Microchip Laser System for Space Applications
InterPACK 2003; 879-883https://doi.org/10.1115/IPACK2003-35298
Topics:
Accelerated life testing
,
Integrated circuits
,
Lasers
,
Testing
,
Temperature
,
Construction
,
Crystals
,
Fibers
,
Flow (Dynamics)
,
Instrumentation
Life Prediction of SnPb and SnAg Solder Joints in PBGA Packages Using a Severity Metric
InterPACK 2003; 885-895https://doi.org/10.1115/IPACK2003-35303
Topics:
Solder joints
,
Damage
,
Creep
,
Cycles
,
Deformation
,
Design
,
Manufacturing
,
Printed circuit boards
,
Statistical analysis
,
Stress
Measurement of Stress and Delamination in Flip Chip on Laminate Assemblies
InterPACK 2003; 907-921https://doi.org/10.1115/IPACK2003-35319
Topics:
Delamination
,
Flip-chip
,
Flip-chip devices
,
Laminates
,
Stress
,
Manufacturing
,
Silicon
,
Temperature
,
Acoustics
,
Computer simulation
Auditing the Reliability Capability of Electronics Manufacturers
InterPACK 2003; 947-953https://doi.org/10.1115/IPACK2003-35359
Topics:
Electronics
,
Reliability
,
Supply chains
Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders
InterPACK 2003; 955-960https://doi.org/10.1115/IPACK2003-35361
Topics:
Creep
,
Fatigue
,
High temperature
,
Lead-free solders
,
Solders
,
Durability
,
Stress
,
Temperature
,
Alloys
,
Damage