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Proceedings Papers

Proceedings Volume Cover
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1

Education

Electrical Design, Simulation, and Test

Manufacturing and Test

Materials, Processes, and Technologies

Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics

Modeling and Characterization

Photonics

Topics: Switches

Reliability

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