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Keywords: shear test
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Proceedings Papers

Proc. ASME. ISPS2021, ASME 2021 30th Conference on Information Storage and Processing Systems, V001T01A002, June 2–3, 2021
Paper No: ISPS2021-65058
... Abstract Micro bump in semiconductor devices is an element to connect silicon dies with through-silicon via to be stacked on each other. The failure of these micro bumps is directly related to the reliability of semiconductors. Of the various mechanical tests, a shear test is commonly used...