In most cases of molding process with glass or optical polymer, it is inevitable to avoid birefringence arisen due to residual internal mechanical stress in a molded material. Even though distribution of the residual stress can be annealed by slow cooling, it has a disadvantage on shape accuracy and manufacturing time. This study mainly analyzes variation in optical performance considering optical phase delay and difference in orientation angles between two principal optical axes due to birefringence. And the simulated optical characteristics are compared with experimental spot profiles from the image forming lens of a laser scan unit, which has specific degree of generation of birefringence. Through this study, we are going to clarify birefringence condition of the image forming lens for a LSU (Laser Scan Unit) to induce degradation in optical performance.
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ASME 2017 Conference on Information Storage and Processing Systems collocated with the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 29–30, 2017
San Francisco, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-5810-3
PROCEEDINGS PAPER
Analysis on Effect of Birefringence in an Image Forming Lens of a Laser Scan Unit on Optical Characteristics
Wan-Chin Kim,
Wan-Chin Kim
Honam University, Gwangsan-gu, Republic of Korea
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Won-Young Cho
Won-Young Cho
Samsung Electronics Co. Ltd, Suwon, Korea
Search for other works by this author on:
Wan-Chin Kim
Honam University, Gwangsan-gu, Republic of Korea
Won-Young Cho
Samsung Electronics Co. Ltd, Suwon, Korea
Paper No:
ISPS2017-5419, V001T08A002; 3 pages
Published Online:
October 30, 2017
Citation
Kim, W, & Cho, W. "Analysis on Effect of Birefringence in an Image Forming Lens of a Laser Scan Unit on Optical Characteristics." Proceedings of the ASME 2017 Conference on Information Storage and Processing Systems collocated with the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2017 Conference on Information Storage and Processing Systems. San Francisco, California, USA. August 29–30, 2017. V001T08A002. ASME. https://doi.org/10.1115/ISPS2017-5419
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