For dexterous grasping and manipulation, tactile sensors recognizing contact object are essential. Electronic skin (E-skin) with tactile sensors plays a role as both receiving information for grasping and protecting robot frame. This paper presents a polymer tactile sensor covering large area to fulfill role of E-skin. The sensor has a thin air gap between polymer layers and it is deformed reacting slip input. When slip is occurred, there is relative displacement between surrounding layer and it incurs change of electrode separation. NBR is used to sensor substrate because of its tough and flexible characteristic. Ultrathin aluminum tape is employed for electrodes. There is a changeability of size of the sensor because of its simple but effective working principle and structure. Slip detecting algorithm doesn’t have a post process such as FFT or DWT, so there isn’t delay for processing time. It realizes real-time slip detection reducing reaction time of robot hand.
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ASME 2017 Conference on Information Storage and Processing Systems collocated with the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 29–30, 2017
San Francisco, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-5810-3
PROCEEDINGS PAPER
A New Highly Sensitive Dielectric Slip Detection Sensor for a Robotic Operation
Sung Joon Kim,
Sung Joon Kim
Sungkyunkwan University, Suwon, Korea
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Ja Choon Koo
Ja Choon Koo
Sungkyunkwan University, Suwon, Korea
Search for other works by this author on:
Sung Joon Kim
Sungkyunkwan University, Suwon, Korea
Ja Choon Koo
Sungkyunkwan University, Suwon, Korea
Paper No:
ISPS2017-5403, V001T07A001; 3 pages
Published Online:
October 30, 2017
Citation
Kim, SJ, & Koo, JC. "A New Highly Sensitive Dielectric Slip Detection Sensor for a Robotic Operation." Proceedings of the ASME 2017 Conference on Information Storage and Processing Systems collocated with the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2017 Conference on Information Storage and Processing Systems. San Francisco, California, USA. August 29–30, 2017. V001T07A001. ASME. https://doi.org/10.1115/ISPS2017-5403
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