In this paper, contributions of airborne and structure-borne vibrations to head positioning error of a HDD at high frequencies up to 10 kHz were investigated. The L8 array test was conducted with four two-level factors about vibration isolation between fans and HDDs: A) Removing bracket, B) Attaching foam on backplane, C) Filling foam in the next column, and D) Filling foam in the upper and lower slots. The test results showed there were less interaction between airborne and structure-borne vibration. Then, we set a model of fan vibration transmission and the model parameters were determined so that errors between the estimated and measured values were minimized. As the results, it was confirmed that about 80% of the power of PES was caused by the airborne vibration at the normal case.
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ASME 2017 Conference on Information Storage and Processing Systems collocated with the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 29–30, 2017
San Francisco, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-5810-3
PROCEEDINGS PAPER
Airborne and Structure-Borne Transmission of High Frequency Fan Vibration in a Storage Box
Takehiko Eguchi,
Takehiko Eguchi
HGST Japan, Ltd., Fujisawa, Japan
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Kazuhide Ichikawa,
Kazuhide Ichikawa
HGST Japan, Ltd., Fujisawa, Japan
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Miki Takada
Miki Takada
HGST Japan, Ltd., Fujisawa, Japan
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Takehiko Eguchi
HGST Japan, Ltd., Fujisawa, Japan
Yohei Asai
HGST Japan, Ltd., Fujisawa, Japan
Kazuhide Ichikawa
HGST Japan, Ltd., Fujisawa, Japan
Miki Takada
HGST Japan, Ltd., Fujisawa, Japan
Paper No:
ISPS2017-5406, V001T05A001; 3 pages
Published Online:
October 30, 2017
Citation
Eguchi, T, Asai, Y, Ichikawa, K, & Takada, M. "Airborne and Structure-Borne Transmission of High Frequency Fan Vibration in a Storage Box." Proceedings of the ASME 2017 Conference on Information Storage and Processing Systems collocated with the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2017 Conference on Information Storage and Processing Systems. San Francisco, California, USA. August 29–30, 2017. V001T05A001. ASME. https://doi.org/10.1115/ISPS2017-5406
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