For injection molding, knock-out pin will leave ejector marks on the parts of product. While making micro-structured components, the pin for normal ejector system is usually bigger than the micro-structured one. It would leave marks while part ejection process and it would even destroy the exterior of micro-structured components sometimes. In order to avoid this situation, this research is to design a Langevin transducer using the theory of Smooth Impact Drive Mechanism (SIDM) as a linear actuator. The dimensions of the Langevin piezoelectric actuator was determined using the Taguchi method to set the first and third minimum impedance frequency ratio at nearly 1:2. The mold equipped with the double layer Langevin transducer could demold the parts without knock-out pin in the plastic injection molding process.
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ASME 2016 Conference on Information Storage and Processing Systems
June 20–21, 2016
Santa Clara, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-4988-0
PROCEEDINGS PAPER
Design of a Dual-Resonance Excitation Langevin Piezoelectric Actuator Using Taguchi Method
Yu-Jen Wang,
Yu-Jen Wang
National Sun Yat-sen University, Kaohsiung, Taiwan
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Shyang-Jye Chang,
Shyang-Jye Chang
National Yunlin University of Science and Technology, Yunlin, Taiwan
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Kuo-Chieh Fu,
Kuo-Chieh Fu
National Sun Yat-sen University, Kaohsiung, Taiwan
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Chien-Erh Weng
Chien-Erh Weng
National Kaohsiung Marine University, Kaohsiung, Taiwan
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Yu-Jen Wang
National Sun Yat-sen University, Kaohsiung, Taiwan
Shyang-Jye Chang
National Yunlin University of Science and Technology, Yunlin, Taiwan
Kuo-Chieh Fu
National Sun Yat-sen University, Kaohsiung, Taiwan
Chien-Erh Weng
National Kaohsiung Marine University, Kaohsiung, Taiwan
Paper No:
ISPS2016-9506, V001T02A002; 3 pages
Published Online:
September 23, 2016
Citation
Wang, Y, Chang, S, Fu, K, & Weng, C. "Design of a Dual-Resonance Excitation Langevin Piezoelectric Actuator Using Taguchi Method." Proceedings of the ASME 2016 Conference on Information Storage and Processing Systems. ASME 2016 Conference on Information Storage and Processing Systems. Santa Clara, California, USA. June 20–21, 2016. V001T02A002. ASME. https://doi.org/10.1115/ISPS2016-9506
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