A computationally efficient five-degree-of-freedom dynamic model was developed to simulate the motion of a magnetic head slider under the conditions of moving-bump collision and of contact due to an expanding protrusion on the slider for thermal flying-height control, with consideration of intermolecular forces. Compared to results obtained without intermolecular forces for a bump on the rotating disk, the intermolecular forces cause a significantly greater normal contact force, a larger roll angle and a larger off-track displacement under nonzero skew. When an expanding protrusion on the slider reaches a position close to the disk surface, the intermolecular forces pull the slider into contact at an earlier time and keep the protrusion in contact for a longer duration, which, with friction under nonzero skew, results in a substantially greater off-track displacement.
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ASME 2016 Conference on Information Storage and Processing Systems
June 20–21, 2016
Santa Clara, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-4988-0
PROCEEDINGS PAPER
A Dynamic Model of the Magnetic Head Slider With Contact and Off-Track Motion due to a Thermally Actuated Protrusion or a Moving Bump Involving Intermolecular Forces
Saurabh Pathak,
Saurabh Pathak
University of Akron, Akron, OH
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Shao Wang
Shao Wang
University of Akron, Akron, OH
Search for other works by this author on:
Saurabh Pathak
University of Akron, Akron, OH
Shao Wang
University of Akron, Akron, OH
Paper No:
ISPS2016-9614, V001T01A016; 3 pages
Published Online:
September 23, 2016
Citation
Pathak, S, & Wang, S. "A Dynamic Model of the Magnetic Head Slider With Contact and Off-Track Motion due to a Thermally Actuated Protrusion or a Moving Bump Involving Intermolecular Forces." Proceedings of the ASME 2016 Conference on Information Storage and Processing Systems. ASME 2016 Conference on Information Storage and Processing Systems. Santa Clara, California, USA. June 20–21, 2016. V001T01A016. ASME. https://doi.org/10.1115/ISPS2016-9614
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