In order to examine thermo-molecular gas film lubrication (t-MGL) characteristics with a temperature distribution at the disk or slider surfaces for spacings of several nanometers, the free molecular t-MGL equation considering temperature distributions and accommodation coefficients at the boundaries was established. By analyzing pressure generated by the wedge effect (slider inclination) and the thermal wedge effect (boundary temperature distributions), it is revealed that, as the accommodation coefficient, α0, of the running disk or the boundary surface with a temperature distribution decreases, that is, as the ratio of specular reflection increases, the pressure generation decreases, whereas as the accommodation coefficient, α1, of the stationary slider surface or the boundary surface without a temperature distribution decreases, the pressure generation increases.
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ASME 2016 Conference on Information Storage and Processing Systems
June 20–21, 2016
Santa Clara, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-4988-0
PROCEEDINGS PAPER
Thermo-Molecular Gas-Film Lubrication (t-MGL) Analysis in the Free Molecular Limit: Effects of Accommodation Coefficients on Static Pressure
Shigehisa Fukui,
Shigehisa Fukui
Tottori University, Tottori, Japan
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Yuki Okamura,
Yuki Okamura
Tottori University, Tottori, Japan
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Hiroshige Matsuoka
Hiroshige Matsuoka
Tottori University, Tottori, Japan
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Shigehisa Fukui
Tottori University, Tottori, Japan
Yuki Okamura
Tottori University, Tottori, Japan
Hiroshige Matsuoka
Tottori University, Tottori, Japan
Paper No:
ISPS2016-9594, V001T01A012; 3 pages
Published Online:
September 23, 2016
Citation
Fukui, S, Okamura, Y, & Matsuoka, H. "Thermo-Molecular Gas-Film Lubrication (t-MGL) Analysis in the Free Molecular Limit: Effects of Accommodation Coefficients on Static Pressure." Proceedings of the ASME 2016 Conference on Information Storage and Processing Systems. ASME 2016 Conference on Information Storage and Processing Systems. Santa Clara, California, USA. June 20–21, 2016. V001T01A012. ASME. https://doi.org/10.1115/ISPS2016-9594
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