Owing to the excellent electrical characteristics, multilayer ceramic capacitors (MLCCs) are widely used in a variety of electronic devices nowadays. The accompanying acoustic noise of MLCC related to its vibration is one of the most important factors when selecting MLCCs for specific applications. To evaluate the noise more efficiently, this study investigates a method to build simplified finite element models of MLCC. In addition, vibration analysis has been performed with the simplified model to discuss how structural parameters influence the vibration of MLCC. According to the findings in the study, suggestions and optimized solder design are given to lower the vibration of MLCC. In short, the main aim of this study is to present a new soldering method for MLCC vibration and noise reduction.

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