In heat assisted magnetic recording (HAMR) where near-field light from a head heats up a disk, disk overcoat needs to be heat-resistive and transparent. ta-C (tetrahedral amorphous carbon) films have been considered to be promising for HAMR disk overcoat, because they are denser and harder than diamond-like carbon (DLC) films that have been used as disk overcoat. In the previous study, ta-C did not show any change in the film thickness by heating up to 450 degrees Celsius, approving a heat-resistant high protective film [1]. The purpose of this study is to investigate enhanced ta-C, which is harder, denser and higher-thermostability than those of conventional ta-C in reference to that nanometer-sized diamonds were more stable than graphite by adding the small amount of hydrogen [2]. In this report, ultratrace hydrogenerated ta-C, amorphous films, was investigated to expect similar effect as was observed in the crystalline films.
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ASME 2014 Conference on Information Storage and Processing Systems
June 23–24, 2014
Santa Clara, California, USA
Conference Sponsors:
- Information Storage and Processing Systems Division
ISBN:
978-0-7918-4579-0
PROCEEDINGS PAPER
Tetrahedral Amorphous Carbon With Ultratrace Hydrogen
Hiroshi Inaba,
Hiroshi Inaba
HGST Japan, Ltd., Odawara, Kanagawa, Japan
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Toru Matsumura,
Toru Matsumura
HGST Japan, Ltd., Odawara, Kanagawa, Japan
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Yoko Saito,
Yoko Saito
HGST Japan, Ltd., Odawara, Kanagawa, Japan
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Hiroyuki Matsumoto
Hiroyuki Matsumoto
HGST Japan, Ltd., Odawara, Kanagawa, Japan
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Hiroshi Inaba
HGST Japan, Ltd., Odawara, Kanagawa, Japan
Toru Matsumura
HGST Japan, Ltd., Odawara, Kanagawa, Japan
Yoko Saito
HGST Japan, Ltd., Odawara, Kanagawa, Japan
Hiroyuki Matsumoto
HGST Japan, Ltd., Odawara, Kanagawa, Japan
Paper No:
ISPS2014-6928, V001T01A006; 3 pages
Published Online:
August 15, 2014
Citation
Inaba, H, Matsumura, T, Saito, Y, & Matsumoto, H. "Tetrahedral Amorphous Carbon With Ultratrace Hydrogen." Proceedings of the ASME 2014 Conference on Information Storage and Processing Systems. 2014 Conference on Information Storage and Processing Systems. Santa Clara, California, USA. June 23–24, 2014. V001T01A006. ASME. https://doi.org/10.1115/ISPS2014-6928
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