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Proceedings Papers

Prediction of Blind via Hole Quality Based on Stacking Ensemble Learning for Laser Drilling Condition of Printed Circuit Boards

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Nowatari Soma, Nakagawa Masao, Hirogaki Toshiki, Aoyama Eiichi
Proc. ASME. ISFA2024, 2024 International Symposium on Flexible Automation, V001T06A004, July 21–24, 2024
Publisher: American Society of Mechanical Engineers
Paper No: ISFA2024-141002
https://doi.org/10.1115/ISFA2024-141002
View Paper titled, Prediction of Blind via Hole Quality Based on Stacking Ensemble Learning for Laser Drilling Condition of Printed Circuit Boards
Open the PDF for Prediction of Blind via Hole Quality Based on Stacking Ensemble Learning for Laser Drilling Condition of Printed Circuit Boards in another window
Topics: Carbon dioxide lasers, Drilling, Hole quality, Lasers, Printed circuit boards
Proceedings Papers

Practical Formula for Predicting Drill Wear in Micro-Drilling of Printed Circuit Boards Containing High Hardness Fillers

Available to Purchase

Taiji Funabiki, Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Hiroyuki Kodama
Proc. ASME. ISFA2012, ASME/ISCIE 2012 International Symposium on Flexible Automation, 541-547, June 18–20, 2012
Publisher: American Society of Mechanical Engineers
Paper No: ISFA2012-7214
https://doi.org/10.1115/ISFA2012-7214
View Paper titled, Practical Formula for Predicting Drill Wear in Micro-Drilling of Printed Circuit Boards Containing High Hardness Fillers
Open the PDF for Practical Formula for Predicting Drill Wear in Micro-Drilling of Printed Circuit Boards Containing High Hardness Fillers in another window
Topics: Drilling, Drills (Tools), Fillers (Materials), Printed circuit boards, Wear, Thermal conductivity, Temperature, Electric vehicles, Electronics, Heat