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Keywords: thermomechanical
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Proceedings Papers

Coupling Smoothed Particle Hydrodynamics With Finite Element Method to Simulate Residual Stresses From Friction Stir Processing

Kranthi Balusu, Lei Li, Kyoo Sil Choi, Ayoub Soulami
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A040, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-93695
https://doi.org/10.1115/IMECE2022-93695
... the low computational expense of FEM. smoothed particle hydrodynamics (SPH) finite element method (FEM) friction stir processing (FSP) thermomechanical viscous heat dissipation frictional heating residual stresses Proceedings of the ASME 2022 International Mechanical Engineering Congress...
View Paper titled, Coupling Smoothed Particle Hydrodynamics With Finite Element Method to Simulate Residual Stresses From Friction Stir Processing
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Topics: Finite element methods, Friction, Heat, Hydrodynamics, Particulate matter, Residual stresses
Proceedings Papers

Thermomechanical Formulation of Freezing Point Depression Behavior of Liquid on Solid Surface With Nanostructure

Y. Hanawa, Y. Sasaki, S. Uchida, T. Funayoshi, M. Otsuji, H. Takahashi, A. Sakuma
Proc. ASME. IMECE2020, Volume 11: Heat Transfer and Thermal Engineering, V011T11A014, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-23759
https://doi.org/10.1115/IMECE2020-23759
... Abstract In this study, we investigated the freezing point depression of liquids in nanostructures using a new thermomechanical method. First, we experimentally determined the freezing points of water, cyclohexane, and a certain organic material (Chem.A) in nanoscale structures using DSC...
View Paper titled, <span class="search-highlight">Thermomechanical</span> Formulation of Freezing Point Depression Behavior of Liquid on Solid Surface With Nanostructure
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Topics: Phase transition temperature, Thermomechanics, Water
Proceedings Papers

Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials

Shashikant Hegde, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 283-290, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39671
https://doi.org/10.1115/IMECE2002-39671
... of the integrated substrate with flip chip assembly. The results from the models have been compared with experimental data and a discussion is presented on the various failure modes. thermomechanical reliability dielectrics resin coated foils substrate cracking warpage HDI/HDW Cop P g o 3...
View Paper titled, Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials
Open the PDF for Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials in another window
Topics: Cracking (Materials), Density, Dielectric materials, Electrical wires, Fracture (Process), Reliability, Thermomechanics, Warping