Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-6 of 6
Keywords: microsystems
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A001, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113199
... demonstrated better resolution than Ag due to transmission of UV light. polyimide microsystems thin film photodefinable 0-3 composite Proceedings of the ASME 2023 International Mechanical Engineering Congress and Exposition IMECE2023 October 29-November 2, 2023, New Orleans, Louisiana IMECE2023...
Proceedings Papers
Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A001, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-24408
... Abstract Deep Neural Networks (DNNs) have transformed various fields, yet their application in design of microsystem has been limited. Here, we demonstrate a framework for application of adversarial generative networks in design of microresonators targeting for operation in MHz frequencies...
Proceedings Papers
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A050, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-63044
..., are presented. Examples in MEMS, fuel cells, micro-heat exchangers and micro-structured chemical reactors, are considered. maldistribution nonuniformity microsystems heat exchangers 1 Copyright © 2013 by ASME FLOW MALDISTRIBUTION IN MICROSYSTEMS: DESCRIPTION AND EFFECTS J. Cervantes-de Gortari...
Proceedings Papers
Proc. ASME. IMECE2004, Microelectromechanical Systems, 385-392, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59040
... response of the actuator in air is compared with measured data and a previous analytical model. The effects of pulse width modulation are also investigated using model simulations, which might simplify implementation of the actuator in microsystems. Thermal Actuators Microsystems Tin air...
Proceedings Papers
Proc. ASME. IMECE2005, Microelectromechanical Systems, 377-382, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79197
.... Thermal Actuators Microsystems Comtois, J.H., Bright, V.M., 1997, “Surface Micromachined Polysilicon Thermal Actuator Arrays and Applications,” Technical Digest Solid State Sensor and Actuator workshop, Hilton Head, SC, pp. 174–177. Senturia, S., 2002, Microsystem Design, Kluwer Academic...
Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 35-42, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15517
... 18 01 2008 Development of effective packages for microelectronics, MEMS, as well as for other microsystems and advanced modern devices, is usually based on minimization of thermomechanical effects and maximization of the useful life of a package. Such extremization-analysis depends...