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Keywords: electronics cooling
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Proceedings Papers

Proc. ASME. IMECE2020, Volume 11: Heat Transfer and Thermal Engineering, V011T11A028, November 16–19, 2020
Paper No: IMECE2020-24630
... proposed by Jang et al. [12]. CFD analysis electronics cooling energy saving free convection LED lamps heat sinks LOW COST COOLING DEVICE FOR HIGH POWER LED LAMPS Martinez-Vega Pamela 1, Lopez-Badillo Araceli 2, Luviano-Ortiz J. Luis 3, Hernandez-Guerrero Abel 4 University of Guanajuato...
Proceedings Papers

Proc. ASME. IMECE2019, Volume 8: Heat Transfer and Thermal Engineering, V008T09A085, November 11–14, 2019
Paper No: IMECE2019-11777
... two-phase thermosyphon heat transfer heat sink electronics cooling Abstract The trend in miniaturization of power electronic components requires the development of new robust and passive cooling methods to meet increased heat flux demands. Conventional heat sinks encounter inherent...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2869-2875, November 9–15, 2012
Paper No: IMECE2012-89265
... jet impingement nucleate boiling flow boiling surface enhancement porous wire mesh electronics cooling critical heat flux In a previous study, it was shown that water jet impinging on structured-porous surface is a highly efficient way in dissipating high heat flux with small...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1141-1153, November 9–15, 2012
Paper No: IMECE2012-89261
... optimization under uncertainty heat transfer electronics cooling DAKOTA generalized polynomial chaos sensitivity analysis Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition IMECE2012 November 9-15, 2012, Houston, Texas, USA IMECE2012-89261 Optimization Under...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1489-1495, November 9–15, 2012
Paper No: IMECE2012-88627
... geometries and different operating frequencies and amplitudes are studied. A correlation is developed to predict fluidic power consumption at different operating conditions. Synthetic jets Agitated flow Electronics cooling Fluid damping Fluidic power consumption 1 Copyright © 2012 by ASME...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1497-1504, November 9–15, 2012
Paper No: IMECE2012-88638
... Electronics cooling Noise reduction Muffler Synthetic jet Agitation Traditional heat sinks for electronics cooling have become ever more difficult to design to meet the high dissipation rate of modern high-heat-flux electronics. Active devices, especially devices operating at a high...
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 197-208, November 11–17, 2011
Paper No: IMECE2011-63289
... any other pattern of placement of the chips. Keywords: Mixed Convection, Vertical Channel, Electronics Cooling, Protruding Heat Sources 1. INTRODUCTION The high reliability and superior performance of the electronic industry depend on the efficient cooling of its ever shrinking devices such as...
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 905-912, November 11–17, 2011
Paper No: IMECE2011-64558
... Agitation Electronics cooling enhanced heat transfer Most active electronics cooling modules are cooled by forced flow driven by a rotating fan. Recently, a piezoelectrically-driven plate driven in a flapping mode has been proposed as a replacement. This fan gives both flow movement and...
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 913-921, November 11–17, 2011
Paper No: IMECE2011-64574
... on the tip region of a longitudinal fin surface used in an electronics cooling system. Unique to this study are the geometry of the cooled surface and the variations in geometry of the jet nozzle or nozzles. Also unique are measurements in actual-scale systems and in a scaled-up system, and...
Proceedings Papers

Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 1347-1354, November 11–15, 2007
Paper No: IMECE2007-41275
... cooling potential and Coefficient of Performance, (COP), achievable with three distinct meso-scale cooling technologies, applicable to a wide range of electronics cooling challenges. The thermo-fluid and thermodynamic characteristics of synthetic jets, piezo-driven vibrating blades, and compact muffin...
Proceedings Papers

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 87-94, November 11–15, 2007
Paper No: IMECE2007-42971
... rejecting more thermal energy with less pressure drop through flow optimization and geometry modification. Electronics Cooling Microchannel Computational Fluid Dynamics Laser Diodes Photonics K F I Proceedings of IMECE2007 2007 ASME International Mechanical Engineering Congress and Exposition...
Proceedings Papers

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 179-193, November 17–22, 2002
Paper No: IMECE2002-39244
... diameter. Surprisingly, the dependence of the thermal resistance on the pin height and clearance ratio was shown to be mild at low Re , and to vanish at high Re number. pin fin heat sinks impinging jet electronics cooling natio f the an A A tional and M rsity o , AZ 20) 62 a@u.a used to blow...
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 741-751, November 15–21, 2003
Paper No: IMECE2003-42444
... Heat pipe flat heat pipe discrete heat sources dryout transient analysis electronics cooling high heat flux A three-dimensional model has been developed to analyze the transient and steady-state performance of flat heat pipes with discrete heat sources. Three-dimensional flow and...
Proceedings Papers

Proc. ASME. IMECE2003, Heat Transfer, Volume 1, 245-251, November 15–21, 2003
Paper No: IMECE2003-42068
... flow and energy simulations. Thermo Electric Cooler TEC model Electronics cooling CFD Proceedings of IMECE: 2003 ASME International Mechanical Engineering Congress current parameter was posed as an unknown variable in the UDF and is attaine impleme software with the was solv between can be...
Proceedings Papers

Proc. ASME. IMECE2004, Microelectromechanical Systems, 225-232, November 13–19, 2004
Paper No: IMECE2004-61516
..., 200μm, 750μm, 2mm, and 4mm respectively. Micro loop heat pipe CFD modeling electronics cooling passive cooling a o in geometry were studied. For a heat transport distance of 10 separating the two. The reservoir plays the same role as it does Proceedings of IMECE04 2004 ASME International...
Proceedings Papers

Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 83-89, November 13–19, 2004
Paper No: IMECE2004-61062
... heat sink spreading resistance base plate fin array electronics cooling In the paper an analytical steady-state solution for heat transfer in a heat sink is presented. The heat sink consists of an array of fins and a base plate. The array is cooled by forced convection. There is a...
Proceedings Papers

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 23-28, November 13–19, 2004
Paper No: IMECE2004-59811
... electronics cooling. A number ytical methods are available in literature to predict plate fin heat ermal performance and pressure drop. Teertstra et al. [3] ed a composite model by combining the fully-developed and ing flow to predict the thermal performance. A heat transfer ent was performed to validate this...
Proceedings Papers

Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 47-51, November 13–19, 2004
Paper No: IMECE2004-59503
... Discrete heat sources Electronics cooling Transient heat transfer K r a 2 regime. Greek symbols Key coo NO A B Bi C Fo g H Hc h k kc l m Nul n Proceedings of IMECE04 2004 ASME International Mechanical Engineering Congress and Exposition November 13-20, 2004, Anaheim, California USA words thermal...
Proceedings Papers

Proc. ASME. IMECE2005, Advanced Energy Systems, 157-170, November 5–11, 2005
Paper No: IMECE2005-82865
... on Boiling Heat Transfer, Montague Bay, Jamaica, May 4–8, 2003. Darabi J. , Ohadi M. , DeVoe D. L. , An electrohydrodynamic polarization micropump for electronic cooling applications , J. MEMS , v. 10 , n. 1 , p. 98 – 106 , 2001 . Di Marco P., Grassi W., Iakovlev I., Single...
Proceedings Papers

Proc. ASME. IMECE2005, Heat Transfer, Part A, 807-811, November 5–11, 2005
Paper No: IMECE2005-82595
... . boiling enhancement mesh screen electronics cooling The boiling performance of the dielectric fluorocarbon liquid PF 5060 was measured on submerged 0.9 cm square tin-plated copper and bronze wire meshes soldered to a copper block. Three mesh sizes were tested: 8 wires/cm (20 wires/inch) with 406...
Topics: Boiling, Wire