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Keywords: electronics cooling
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Proceedings Papers

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 43-50, November 11–16, 2001
Paper No: IMECE2001/HTD-24376
... as to experiments conducted as part of this work. contact conductance electronics cooling surface deformation analysis contact resistance metallic contacts Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition November 11-16, 2001, New York, NY HTD-Vol. 369-7 IMECE2001...
Proceedings Papers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 261-268, November 5–10, 2000
Paper No: IMECE2000-2272
... of the heat pipe performance on the heat input at the evaporator, the containing wall thickness, and the porosity of the wick. Heat pipe flat heat pipe transient analysis electronics cooling EEP-Vol. 28, Packaging of Electronic and Photonic Devices ASME 2000 CHARACTERIZATION OF THE PERFORMANCE...
Proceedings Papers

Proc. ASME. IMECE2020, Volume 11: Heat Transfer and Thermal Engineering, V011T11A028, November 16–19, 2020
Paper No: IMECE2020-24630
... analysis, Electronics cooling, Energy saving, Free convection, LED lamps heat sinks. 4 Contact author: abel@ugto.mx NOMENCLATURE cp specific heat, kJ/kgK g gravity, m/s2 k thermal conductivity, W/mK heat flux, W/m2 Q heat, W Patm atmospheric pressure, N/m2 Mw gas molecular weight, kg/kmol Rc universal gas...
Proceedings Papers

Proc. ASME. IMECE2019, Volume 8: Heat Transfer and Thermal Engineering, V008T09A085, November 11–14, 2019
Paper No: IMECE2019-11777
... resulting in a net improvement which can be traded-off for a decrease the overall size or weight of the heat sink. two-phase thermosyphon heat transfer heat sink electronics cooling A COMPACT INTEGRATED THERMOSYPHON HEAT SINK FOR POWER ELECTRONICS COOLING Ahmed Elkholy, Roger Kempers.1...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2869-2875, November 9–15, 2012
Paper No: IMECE2012-89265
... enhancement, porous, wire mesh, electronics cooling, critical heat flux. NOMENCLATURE d wire diameter, mm djet jet diameter, mm Dc diameter of the large cylinder part of the heat flux gauge, mm dc diameter of the small cylinder part of the heat flux gauge, mm dK diameter of the Type-K thermocouple...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1489-1495, November 9–15, 2012
Paper No: IMECE2012-88627
... and different operating frequencies and amplitudes are studied. A correlation is developed to predict fluidic power consumption at different operating conditions. Synthetic jets Agitated flow Electronics cooling Fluid damping Fluidic power consumption 1 Copyright © 2012 by ASME IMECE2012-88627...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1497-1504, November 9–15, 2012
Paper No: IMECE2012-88638
... Electronics cooling Noise reduction Muffler Synthetic jet Agitation Traditional heat sinks for electronics cooling have become ever more difficult to design to meet the high dissipation rate of modern high-heat-flux electronics. Active devices, especially devices operating at a high...
Proceedings Papers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1141-1153, November 9–15, 2012
Paper No: IMECE2012-89261
... optimization under uncertainty heat transfer electronics cooling DAKOTA generalized polynomial chaos sensitivity analysis Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition IMECE2012 November 9-15, 2012, Houston, Texas, USA IMECE2012-89261 Optimization Under...
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 197-208, November 11–17, 2011
Paper No: IMECE2011-63289
... placed in increasing order of their heights in the direction of air flow are cooled better as compared to any other pattern of placement of the chips. 02 08 2012 Mixed Convection Vertical Channel Electronics Cooling Protruding Heat Sources 1 Copyright © 2011 by ASME Proceedings...
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 905-912, November 11–17, 2011
Paper No: IMECE2011-64558
... Most active electronics cooling modules are cooled by forced flow driven by a rotating fan. Recently, a piezoelectrically-driven plate driven in a flapping mode has been proposed as a replacement. This fan gives both flow movement and agitation. To raise effectiveness, reduce size, and otherwise...
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 913-921, November 11–17, 2011
Paper No: IMECE2011-64574
... and computational results that document heat transfer coefficients associated with impinging a round synthetic jet flow on the tip region of a longitudinal fin surface used in an electronics cooling system. Unique to this study are the geometry of the cooled surface and the variations in geometry of the jet nozzle...
Proceedings Papers

Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 1347-1354, November 11–15, 2007
Paper No: IMECE2007-41275
... on the cooling potential and Coefficient of Performance, (COP), achievable with three distinct meso-scale cooling technologies, applicable to a wide range of electronics cooling challenges. The thermo-fluid and thermodynamic characteristics of synthetic jets, piezo-driven vibrating blades, and compact muffin...
Proceedings Papers

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 87-94, November 11–15, 2007
Paper No: IMECE2007-42971
... more thermal energy with less pressure drop through flow optimization and geometry modification. Electronics Cooling Microchannel Computational Fluid Dynamics Laser Diodes Photonics K F I Proceedings of IMECE2007 2007 ASME International Mechanical Engineering Congress and Exposition...
Proceedings Papers

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 179-193, November 17–22, 2002
Paper No: IMECE2002-39244
..., the dependence of the thermal resistance on the pin height and clearance ratio was shown to be mild at low Re , and to vanish at high Re number. 23 05 2008 pin fin heat sinks impinging jet electronics cooling natio f the an A A tional and M rsity o , AZ 20) 62 a@u.a used to blow air...
Proceedings Papers

Proc. ASME. IMECE2003, Heat Transfer, Volume 1, 245-251, November 15–21, 2003
Paper No: IMECE2003-42068
... simulations. 13 05 2008 Thermo Electric Cooler TEC model Electronics cooling CFD Proceedings of IMECE: 2003 ASME International Mechanical Engineering Congress current parameter was posed as an unknown variable in the UDF and is attaine impleme software with the was solv between can...
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 741-751, November 15–21, 2003
Paper No: IMECE2003-42444
... a significant role in determining the axial temperature variation. 13 05 2008 Heat pipe flat heat pipe discrete heat sources dryout transient analysis electronics cooling high heat flux Proceedings of IMECE: ASME international Mechanical Engineering Congress and R&D Expo November 15-21...
Proceedings Papers

Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 83-89, November 13–19, 2004
Paper No: IMECE2004-61062
... flux and is mounted at the center of the bottom of the base plate. The use of the results is illustrated with a couple of simple numerical examples. 31 03 2008 heat sink spreading resistance base plate fin array electronics cooling Proceedings of IMECE2004 2004 ASME...
Proceedings Papers

Proc. ASME. IMECE2004, Microelectromechanical Systems, 225-232, November 13–19, 2004
Paper No: IMECE2004-61516
... respectively. 31 03 2008 Micro loop heat pipe CFD modeling electronics cooling passive cooling a o in geometry were studied. For a heat transport distance of 10 separating the two. The reservoir plays the same role as it does Proceedings of IMECE04 2004 ASME International Mechanical...
Proceedings Papers

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 23-28, November 13–19, 2004
Paper No: IMECE2004-59811
... resistance and pressure drop. Three heat sinks with different fin materials and fin configurations are tested. We conclude by recommending some of the analytical methods for engineering applications by comparing the test data with predictions. 28 03 2008 Heat sinks electronics cooling heat...
Proceedings Papers

Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 47-51, November 13–19, 2004
Paper No: IMECE2004-59503
... heat sources Electronics cooling Transient heat transfer K r a 2 regime. Greek symbols Key coo NO A B Bi C Fo g H Hc h k kc l m Nul n Proceedings of IMECE04 2004 ASME International Mechanical Engineering Congress and Exposition November 13-20, 2004, Anaheim, California USA words thermal...