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Proceedings Papers

Numerical Evaluation of Heat Transfer From a Spherical Dimple in a Flat Plate: Development of Appropriate Boundary Conditions

O. Alshroof, J. Reizes, V. Timchenko, E. Leonardi
Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 261-270, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43977
https://doi.org/10.1115/IMECE2007-43977
... study indicate that a single dimple does not enhance heat transfer. 26 05 2009 flat plate laminar boundary layer dimple velocity profile numerical modeling Proceedings of IMECE2007 2007 ASME International Mechanical Engineering Congress and Exposition November 11-15, 2007, Seattle...
View Paper titled, Numerical Evaluation of Heat Transfer From a Spherical <span class="search-highlight">Dimple</span> in a Flat Plate: Development of Appropriate Boundary Conditions
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Topics: Boundary layers, Boundary-value problems, Flat plates, Heat transfer
Proceedings Papers

Application of CFD Technology Analyzing the Three-Dimensional Aerodynamic Behavior of Dimpled Golf Balls

L. L. Ting
Proc. ASME. IMECE2002, Fluids Engineering, 725-733, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32349
https://doi.org/10.1115/IMECE2002-32349
... 23 05 2008 A computational modeling method using the CFD codes GAMBIT and FLUENT jointly has been developed for analyzing the three-dimensional aerodynamic behavior of surface dimpled golf balls. Drag and lift coefficient values and fluid field solutions have been obtained...
View Paper titled, Application of CFD Technology Analyzing the Three-Dimensional Aerodynamic Behavior of <span class="search-highlight">Dimpled</span> Golf Balls
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Topics: Computational fluid dynamics, Drag (Fluid dynamics), Spin (Aerodynamics)
Proceedings Papers

Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling

Carlos Silva, Egidio Marotta, Leroy Fletcher
Proc. ASME. IMECE2005, Heat Transfer, Part A, 697-708, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80163
https://doi.org/10.1115/IMECE2005-80163
... a comparative evaluation of dimple technology for improving heat transfer in microelectronic systems. KEYWORDS: Heat transfer, channel flow, dimple, numerical model, microelectronic cooling. INTRODUCTION Spherical wells, shallow indentations, or dimples, are known to play a key role in the development...
View Paper titled, Flow Structure and Enhanced Heat Transfer in Channel Flow With <span class="search-highlight">Dimpled</span> Surfaces: Application to Heat Sinks in Microelectronic Cooling
Open the PDF for Flow Structure and Enhanced Heat Transfer in Channel Flow With <span class="search-highlight">Dimpled</span> Surfaces: Application to Heat Sinks in Microelectronic Cooling in another window
Topics: Channel flow, Computer simulation, Cooling, Flow (Dynamics), Heat sinks, Heat transfer