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Keywords: copper
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Proceedings Papers

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 407-410, November 11–16, 2001
Paper No: IMECE2001/MEMS-23860
... of a non-contact physical mechanism (acoustic streaming) to enhance the convection of chemicals near the substrate and improve the gap fill characteristics for copper microplating process. electroplating copper trenches vias acoustic streaming megasonics Proceedings of 2001 ASME...
Proceedings Papers

Proc. ASME. IMECE2019, Volume 2B: Advanced Manufacturing, V02BT02A018, November 11–14, 2019
Paper No: IMECE2019-10621
... gases. An ongoing work explores different configurations of layered polyimide-copper macroscale hybrids for heat exchanger applications using numerical simulations. This paper explores a manufacturing pathway for producing such layered hybrid tubes that involves directly rolling and bonding tapes made...
Proceedings Papers

Proc. ASME. IMECE2002, Microelectromechanical Systems, 321-326, November 17–22, 2002
Paper No: IMECE2002-33463
... and for wafers with copper (Cu) layer. Polishing pressure (P), speed (V), and back pressure (BP) are used as process parameters in this study. Different pads and slurries are also experimented for copper layer as its properties are different from that of conventional oxide layer. Material removal rate (RR...
Proceedings Papers

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 219-226, November 13–19, 2004
Paper No: IMECE2004-61990
... to optimize interconnect geometry for use with estimated operational conditions. Finite Element Analysis (FEA) and Regression modeling have been used to create macro-models of interconnect behavior to assist in the optimization of the geometric design. Copper and Copper-Molybdenum are considered...
Proceedings Papers

Proc. ASME. IMECE2005, Materials, 505-513, November 5–11, 2005
Paper No: IMECE2005-82092
... Atomistic simulations are used to study dislocation nucleation from <001> tilt bicrystal interfaces in copper subjected to a tensile deformation. Specifically, three interface misorientations are examined, including the Σ5 (310) interface, which has a high density of coincident atomic...
Proceedings Papers

Proc. ASME. IMECE2006, Materials, Nondestructive Evaluation, and Pressure Vessels and Piping, 457-462, November 5–10, 2006
Paper No: IMECE2006-14224
... Carbon nanotubes have received considerable attention because of their excellent mechanical properties. In this study, carbon nanotube - copper composites have been sintered by a mechanical mixing process. The interfacial bonding between nanotubes and the copper matrix was improved by coating...