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Proc. ASME. IMECE2005, Microelectromechanical Systems, 307-312, November 5–11, 2005
Paper No: IMECE2005-82724
... In order to determine the influence of the silicon chip substrate on measurement fidelity in a silicon MEMS micro-extensometer, finite element modeling of strain transfer efficiency from a steel beam through a bond layer and silicon chip is investigated over a range of chip and steel beam...
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 233-241, November 5–10, 2006
Paper No: IMECE2006-14830
... infrastructure, and reducing the recurring cost of power. A need exists, therefore for an end to end physical model that can be used to design and manage dense data centers and determine the cost of operating a data center. The chip core to the cooling tower model must capture the power levels and thermo-fluids...