... Abstract Solidification is a ubiquitous process that is critical in various industries, including semiconductor manufacturing. While extensive research exists on mechanical aspects of sublimation drying, the impact of non-uniform crystal morphology during solidification remains overlooked...

... the solidification process. The cooling provide by the air-mist nozzles on the slab surface is defined using HTC correlation. This study explores the relationship between nozzle clogging and its effects on slab surface temperature, cooling rates, and metallurgical length (ML) in continuous casting. It finds...

.... cooling rate SAC solder molecular dynamics thermomechanical properties solidification Proceedings of the ASME 2023 International Mechanical Engineering Congress and Exposition IMECE2023 October 29-November 2, 2023, New Orleans, Louisiana IMECE2023-114426 EFFECTS OF COOLING RATE ON THE STRESS-STRAIN...

... evolution of the solidification process in WAAM depends on the amount of heat input and the layering sequence. To examine the effect of layering sequences on the development of grain growth, microstructure, and mechanical properties, Inconel 825 alloy was deposited in various sequences for layering by WAAM...

... Abstract An ultrasonic transducer installed facing a pressure transducer in the cavity of a rectangular plaque injection mold shows new sensitivities to the solidification of the polymer in the mold. Features of the amplitude variation of a pulse transmitted twice through the polymer...

... and assemblies, which necessitate the need for high strength solders. This paper presents preliminary results of experiments aimed at understanding the kinetics governing the solidification of solders blended with nanopowders. Composite solder paste was prepared by mechanically mixing nanopowders of either...

... the vast amount of latent heat available at constant temperature during phase change process. The numerical modeling for solidification and melting of PCM is employed in various commercial software and applied for different applications which include the solidification or melting. In the numerical...

... Investment casting processes are influenced by a variety of parameters. Many researches considering viscosity as a constant have been conducted up to this point. In particular, however, viscosity with temperature change has not been much accounted for solidification and heat transfer simulation...

... This paper studies the favorable growth conditions for the III-V and II-VI crystals such as InAs, InSb, GaSe, GaP, PbTe and CdTe by the Bridgman technique. Numerical simulations have been conducted to investigate the flow field, temperature distribution in relation to the solidification...

... 23 05 2008 In this paper, we investigate the effects of laminar double-diffusive natural convection on directional solidification of binary fluids when cooled and solidified from the top. The study is performed using aqueous ammonium chloride solution as the model fluid...

... 23 05 2008 The solidification process of tin, inside a closed cavity, is numerically investigated by the finite volume method. A non-orthogonal system of coordinates is employed to adapt to the irregular geometry, with a moving mesh to account for the changing domain size. The momentum...

... Lead-free solder Sn-Ag Solidification Nanoparticles Cooling Rate This paper presents and discusses the solidification of Sn-Ag eutectic solder and the effect of cooling rate on its microstructure formation with and without addition of nanosized copper powders. The composite solder...

... 31 03 2008 The solidification of binary mixture (NH 4 Cl–H 2 O) inside a trapezoidal cavity is investigated experimentally in this study. The experiments are carried out in a trapezoidal cavity measuring 65 mm × 130 mm × 150 mm with inclined angle of 69°. Solidification of ammonium...

... . Kobayashi R. , 1993 , “ Modeling and Numerical Simulations of Dendritic Crystal Growth ,” Physica D , 63 , pp. 410 – 423 . Karma A. and Rappel W.-J. , 1996 , “ Phase-Field Method for Computationally Efficient Modeling of Solidification with Arbitrary Interface Kinetics ,” Physical...