... Silicon wafers are the fundamental building blocks for most integrated circuits. Chemical mechanical polishing is used to manufacture silicon wafers as the final material removal process to meet the ever-increasing demand for flatter wafers and lower prices. The polishing pad is one...

... 31 03 2008 As a nondestructive measurement method, laser scattering has been preliminarily applied to detect subsurface damage in silicon wafers, but the quantitative correlation between scatter images and subsurface damage depth has not been established yet. In order to assess...

... 31 01 2008 Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing...