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Proceedings Papers

Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications

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Mitul B. Modi, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 277-282, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39670
https://doi.org/10.1115/IMECE2002-39670
.... Design, preparation, and execution of the MDT are presented. Results of finite element models are used to validate the approach. Results are shown for a Ti/Al 2 O 3 interface. Interfacial Fracture Toughness Thin Films Fracture Test MEMS Microelectronics Proceedings of IMECE 02: 2002 ASME...
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Topics: Fracture (Materials), Fracture toughness, Microelectromechanical systems, Microelectronic devices, Thin films