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Proceedings Papers

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards

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Yarom Polsky, I. Charles Ume
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 789-794, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1093
https://doi.org/10.1115/IMECE1998-1093
View Paper titled, Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards
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Topics: Plane strain, Printed circuit boards, Shear (Mechanics), Warping, Deflection, Temperature, Lamination, Materials properties, Mechanical properties, Modeling
Proceedings Papers

Three-Dimensional Simulation of Microchip Encapsulation Processes

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Ruihua Han, Mahesh Gupta
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 757-766, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1090
https://doi.org/10.1115/IMECE1998-1090
View Paper titled, Three-Dimensional Simulation of Microchip Encapsulation Processes
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Topics: Integrated circuits, Simulation, Flow (Dynamics), Fluids, Finite element analysis, Inertia (Mechanics), Pressure
Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

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Sanjeev B. Sathe, Bahgat G. Sammakia
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1089
https://doi.org/10.1115/IMECE1998-1089
View Paper titled, Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks
Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

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Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1092
https://doi.org/10.1115/IMECE1998-1092
View Paper titled, Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Proceedings Papers

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

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Anand M. Deshpande, Ganesh Subbarayan, Dan Rose
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 767-777, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1091
https://doi.org/10.1115/IMECE1998-1091
View Paper titled, A System for First Order Reliability Estimation of Solder Joints in Area Array Packages
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Topics: Reliability, Solder joints, Design, Artificial neural networks, Computers, Fatigue life, Interferometry, Neural network models, Sands
Proceedings Papers

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

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Xiantao Yan
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 735-745, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1088
https://doi.org/10.1115/IMECE1998-1088
View Paper titled, Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Solders, Fracture toughness, Printed circuit boards, Stress, Cracking (Materials), Experimental methods, Fatigue, Flow (Dynamics)